CN102741372A - 导热性压敏胶粘剂组合物、导热性压敏胶粘性片和电子器件 - Google Patents
导热性压敏胶粘剂组合物、导热性压敏胶粘性片和电子器件 Download PDFInfo
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- CN102741372A CN102741372A CN2011800090271A CN201180009027A CN102741372A CN 102741372 A CN102741372 A CN 102741372A CN 2011800090271 A CN2011800090271 A CN 2011800090271A CN 201180009027 A CN201180009027 A CN 201180009027A CN 102741372 A CN102741372 A CN 102741372A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/08—Homopolymers or copolymers of acrylic acid esters
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C09J7/00—Adhesives in the form of films or foils
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
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- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K3/016—Flame-proofing or flame-retarding additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Optics & Photonics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2010034662 | 2010-02-19 | ||
JP2010-034662 | 2010-02-19 | ||
PCT/JP2011/050742 WO2011102170A1 (ja) | 2010-02-19 | 2011-01-18 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品 |
Publications (1)
Publication Number | Publication Date |
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CN102741372A true CN102741372A (zh) | 2012-10-17 |
Family
ID=44482772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2011800090271A Pending CN102741372A (zh) | 2010-02-19 | 2011-01-18 | 导热性压敏胶粘剂组合物、导热性压敏胶粘性片和电子器件 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5713000B2 (ja) |
KR (1) | KR20120138735A (ja) |
CN (1) | CN102741372A (ja) |
WO (1) | WO2011102170A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103236221A (zh) * | 2013-04-10 | 2013-08-07 | 深圳市法鑫忠信新材料有限公司 | 导热阻燃商标膜及制作方法 |
CN104046299A (zh) * | 2013-03-14 | 2014-09-17 | 莱尔德技术股份有限公司 | 阻燃导电粘合材料、其制造方法及包括该材料的带 |
CN104212375A (zh) * | 2013-06-04 | 2014-12-17 | 日东电工株式会社 | 粘接片、及切割/芯片接合薄膜 |
CN105623333A (zh) * | 2014-11-26 | 2016-06-01 | 日立麦克赛尔株式会社 | 粘着组合物和粘着片及它们的制造方法、粘着组合物前体 |
CN107779107A (zh) * | 2017-11-10 | 2018-03-09 | 扬州鑫晶光伏科技有限公司 | 太阳能光伏电池用密封胶及其制备方法和使用方法 |
CN107779167A (zh) * | 2016-08-31 | 2018-03-09 | 佛山市三水金戈新型材料有限公司 | 一种低比重导热有机硅胶黏剂及其制备方法 |
CN108302973A (zh) * | 2017-12-24 | 2018-07-20 | 湛江正信科技服务有限公司 | 一种阻燃相变散热结构及其制作方法 |
CN108307606A (zh) * | 2017-12-24 | 2018-07-20 | 湛江正信科技服务有限公司 | 一种相变散热结构及其制作方法 |
CN109312215A (zh) * | 2016-08-05 | 2019-02-05 | 神岛化学工业株式会社 | 稀土类硫氧化物蓄冷材料 |
CN117551405A (zh) * | 2024-01-11 | 2024-02-13 | 宁波长阳科技股份有限公司 | 一种导电聚丙烯酸酯压敏胶及其制备方法 |
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JP5556433B2 (ja) * | 2010-06-25 | 2014-07-23 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着剤組成物の製造方法、熱伝導性感圧接着性シート、及び電子部品 |
CN103562334A (zh) * | 2011-09-28 | 2014-02-05 | 日本瑞翁株式会社 | 导热性压敏粘接剂组合物、导热性压敏粘接性片状成型体、它们的制造方法及电子部件 |
KR20140088092A (ko) * | 2011-10-28 | 2014-07-09 | 제온 코포레이션 | 열전도성 감압 접착제 조성물, 열전도성 감압 접착성 시트상 성형체, 이들의 제조 방법, 및 전자 부품 |
JPWO2013084750A1 (ja) * | 2011-12-06 | 2015-04-27 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子機器 |
JP6047052B2 (ja) * | 2012-03-30 | 2016-12-21 | 積水化学工業株式会社 | 緩衝材 |
JPWO2013175950A1 (ja) * | 2012-05-23 | 2016-01-12 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子機器 |
WO2013183389A1 (ja) * | 2012-06-04 | 2013-12-12 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子機器 |
CN102807876A (zh) * | 2012-07-11 | 2012-12-05 | 苏州萃智新技术开发有限公司 | 一种木质、纤维、纸质产品专用阻燃剂及其制备方法 |
CN102807877A (zh) * | 2012-07-18 | 2012-12-05 | 苏州萃智新技术开发有限公司 | 一种防腐阻燃剂 |
CN102775998A (zh) * | 2012-07-19 | 2012-11-14 | 苏州萃智新技术开发有限公司 | 一种环保阻燃剂 |
CN103666312B (zh) * | 2012-09-26 | 2016-01-06 | 上海晶华胶粘新材料股份有限公司 | 导电阻燃胶带 |
KR102084393B1 (ko) * | 2013-07-12 | 2020-03-04 | 엘지디스플레이 주식회사 | 유기발광 다이오드 디스플레이장치 |
WO2015060092A1 (ja) * | 2013-10-24 | 2015-04-30 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子機器 |
WO2015060090A1 (ja) * | 2013-10-25 | 2015-04-30 | 日本ゼオン株式会社 | 熱伝導性積層シート、熱伝導性積層シートの製造方法、及び電子機器 |
JP2017533285A (ja) | 2014-08-28 | 2017-11-09 | シーカ テクノロジー アクチェンゲゼルシャフト | 裸火なしで活性化可能であり、且つホットメルト接着剤被覆を有する封止ウェブ、及び前記封止ウェブを貼る方法 |
JP6486192B2 (ja) * | 2015-05-19 | 2019-03-20 | マクセルホールディングス株式会社 | 粘着組成物前駆体、粘着組成物及びその製造方法、粘着シート及びその製造方法、並びに粘着シートを含む電子機器 |
EP3362531A4 (en) * | 2015-10-15 | 2019-07-03 | 3M Innovative Properties Company | NON-HALOGENATED FLAME RETARDANT ADHESIVE COMPOSITION AND TAPE COMPRISING THE SAME |
JP7020788B2 (ja) * | 2017-03-22 | 2022-02-16 | 積水化学工業株式会社 | 感圧性粘着剤層、及びこれを用いた粘着テープ及び構造物 |
KR102363748B1 (ko) * | 2019-10-07 | 2022-02-16 | 주식회사 동양일러스트산업 | 웨어러블 온열 치료 장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1803957A (zh) * | 2005-01-11 | 2006-07-19 | 日东电工株式会社 | 粘合带和用于粘合带的基材 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5255762B2 (ja) * | 2005-12-29 | 2013-08-07 | アキレス株式会社 | アクリル系樹脂組成物及びそれを用いたシート状成形体 |
JP5004538B2 (ja) * | 2006-09-12 | 2012-08-22 | 日立化成ポリマー株式会社 | 熱伝導性湿気硬化型接着剤、及びその施工方法 |
JP5169292B2 (ja) * | 2008-02-20 | 2013-03-27 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、及び、熱伝導性感圧接着性シート |
JP5621592B2 (ja) * | 2008-06-25 | 2014-11-12 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物及び熱伝導性感圧接着性シート |
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JP5544823B2 (ja) * | 2009-10-28 | 2014-07-09 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品 |
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- 2011-01-18 CN CN2011800090271A patent/CN102741372A/zh active Pending
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CN104046299B (zh) * | 2013-03-14 | 2016-08-17 | 莱尔德电子材料(深圳)有限公司 | 阻燃导电粘合材料、其制造方法及包括该材料的带 |
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Also Published As
Publication number | Publication date |
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KR20120138735A (ko) | 2012-12-26 |
JPWO2011102170A1 (ja) | 2013-06-17 |
JP5713000B2 (ja) | 2015-05-07 |
WO2011102170A1 (ja) | 2011-08-25 |
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