CN101814586B - 夹持式基板翻转装置 - Google Patents
夹持式基板翻转装置 Download PDFInfo
- Publication number
- CN101814586B CN101814586B CN2009102469107A CN200910246910A CN101814586B CN 101814586 B CN101814586 B CN 101814586B CN 2009102469107 A CN2009102469107 A CN 2009102469107A CN 200910246910 A CN200910246910 A CN 200910246910A CN 101814586 B CN101814586 B CN 101814586B
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Presses And Accessory Devices Thereof (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009102469107A CN101814586B (zh) | 2009-12-01 | 2009-12-01 | 夹持式基板翻转装置 |
PCT/CN2009/076114 WO2011066701A1 (zh) | 2009-12-01 | 2009-12-28 | 夹持式基板翻转装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009102469107A CN101814586B (zh) | 2009-12-01 | 2009-12-01 | 夹持式基板翻转装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101814586A CN101814586A (zh) | 2010-08-25 |
CN101814586B true CN101814586B (zh) | 2011-09-28 |
Family
ID=42621757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009102469107A Expired - Fee Related CN101814586B (zh) | 2009-12-01 | 2009-12-01 | 夹持式基板翻转装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101814586B (zh) |
WO (1) | WO2011066701A1 (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101972501B (zh) * | 2010-10-18 | 2012-09-12 | 迈柯唯医疗设备(苏州)有限公司 | 一种智能闭环识别复位反馈装置 |
CN103871947A (zh) * | 2012-12-14 | 2014-06-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 夹持装置及等离子体加工设备 |
JP6005007B2 (ja) * | 2013-07-31 | 2016-10-12 | 株式会社 ハリーズ | 透明板清掃システム |
JP5799059B2 (ja) * | 2013-07-31 | 2015-10-21 | 株式会社 ハリーズ | 薄板移送装置及び薄板清掃システム |
CN104772642B (zh) * | 2014-01-14 | 2017-02-15 | 鸿富锦精密工业(深圳)有限公司 | 翻转装置 |
CN104761155B (zh) * | 2015-03-27 | 2017-05-17 | 广东韦达尔科技有限公司 | 贴膜机的配合旋转机构 |
CN104828602B (zh) * | 2015-03-27 | 2017-08-25 | 广东韦达尔科技有限公司 | 贴膜机的翻面机构 |
CN104816519B (zh) * | 2015-03-27 | 2017-05-17 | 广东韦达尔科技有限公司 | 贴膜机的夹紧装置 |
CN104843469B (zh) * | 2015-04-27 | 2018-01-26 | 歌尔股份有限公司 | 工装翻转装置及其翻转方法 |
CN105527469A (zh) * | 2016-01-06 | 2016-04-27 | 珠海格力电器股份有限公司 | 一种用于更换fct测试设备天板的夹持结构 |
CN105784724B (zh) * | 2016-03-07 | 2018-12-21 | 京东方科技集团股份有限公司 | 平板产品检测装置 |
CN107322711A (zh) * | 2017-08-25 | 2017-11-07 | 湖州民阁木业有限公司 | 一种旋转式木板拼接机 |
CN107894518A (zh) * | 2017-11-09 | 2018-04-10 | 奥士康科技股份有限公司 | 一种双幅料基板检验车 |
CN110540037A (zh) * | 2018-08-21 | 2019-12-06 | 蓝思智能机器人(长沙)有限公司 | 热弯成型设备及其模具翻转机构 |
CN109454504A (zh) * | 2018-12-28 | 2019-03-12 | 天津时代创业科技有限公司 | 餐刀打磨用自动上料*** |
CN110039470B (zh) * | 2019-05-20 | 2020-09-25 | 昆明理工大学 | 一种装配生产线上的多功能专用夹具 |
CN110491817B (zh) * | 2019-09-03 | 2024-04-26 | 罗博特科智能科技股份有限公司 | 一种可调式翻片装置 |
PL3989270T3 (pl) * | 2020-10-20 | 2023-01-16 | Semsysco Gmbh | Mechanizm zaciskowy do mocowania podłoża w celu przeprowadzenia obróbki powierzchni podłoża |
CN112753788B (zh) * | 2021-01-15 | 2022-11-22 | 湖北小稀藤茶叶有限公司 | 一种带有自动翻转的茶叶烘烤机 |
CN115948720B (zh) * | 2023-03-14 | 2023-06-02 | 上海陛通半导体能源科技股份有限公司 | 薄膜沉积设备 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002050863A1 (fr) * | 2000-12-19 | 2002-06-27 | Advantest Corporation | Mecanisme de fixation de support d'echantillons |
GB2392309B (en) * | 2002-08-22 | 2004-10-27 | Leica Microsys Lithography Ltd | Substrate loading and unloading apparatus |
CN100390954C (zh) * | 2004-05-09 | 2008-05-28 | 郑光镐 | 平板夹持装置 |
JP4467367B2 (ja) * | 2004-06-22 | 2010-05-26 | 大日本スクリーン製造株式会社 | 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法 |
CN101510523B (zh) * | 2009-03-19 | 2010-08-25 | 友达光电股份有限公司 | 基板翻转平台与翻转基板的方法 |
-
2009
- 2009-12-01 CN CN2009102469107A patent/CN101814586B/zh not_active Expired - Fee Related
- 2009-12-28 WO PCT/CN2009/076114 patent/WO2011066701A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN101814586A (zh) | 2010-08-25 |
WO2011066701A1 (zh) | 2011-06-09 |
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