PL3989270T3 - Mechanizm zaciskowy do mocowania podłoża w celu przeprowadzenia obróbki powierzchni podłoża - Google Patents

Mechanizm zaciskowy do mocowania podłoża w celu przeprowadzenia obróbki powierzchni podłoża

Info

Publication number
PL3989270T3
PL3989270T3 PL20202781.9T PL20202781T PL3989270T3 PL 3989270 T3 PL3989270 T3 PL 3989270T3 PL 20202781 T PL20202781 T PL 20202781T PL 3989270 T3 PL3989270 T3 PL 3989270T3
Authority
PL
Poland
Prior art keywords
substrate
fastening
surface treatment
clipping mechanism
clipping
Prior art date
Application number
PL20202781.9T
Other languages
English (en)
Inventor
Andreas Gleissner
Ulrich TSCHINDERLE
Original Assignee
Semsysco Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semsysco Gmbh filed Critical Semsysco Gmbh
Publication of PL3989270T3 publication Critical patent/PL3989270T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PL20202781.9T 2020-10-20 2020-10-20 Mechanizm zaciskowy do mocowania podłoża w celu przeprowadzenia obróbki powierzchni podłoża PL3989270T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20202781.9A EP3989270B1 (en) 2020-10-20 2020-10-20 Clipping mechanism for fastening a substrate for a surface treatment of the substrate

Publications (1)

Publication Number Publication Date
PL3989270T3 true PL3989270T3 (pl) 2023-01-16

Family

ID=72964550

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20202781.9T PL3989270T3 (pl) 2020-10-20 2020-10-20 Mechanizm zaciskowy do mocowania podłoża w celu przeprowadzenia obróbki powierzchni podłoża

Country Status (8)

Country Link
US (1) US11942356B2 (pl)
EP (2) EP3989270B1 (pl)
KR (1) KR102590311B1 (pl)
CN (1) CN116438642A (pl)
PL (1) PL3989270T3 (pl)
PT (1) PT3989270T (pl)
TW (1) TWI819396B (pl)
WO (1) WO2022084109A1 (pl)

Family Cites Families (28)

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US6578893B2 (en) * 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
US7611182B2 (en) * 2005-02-25 2009-11-03 Semes Co., Ltd. Wafer transfer apparatus
KR100824544B1 (ko) * 2006-09-18 2008-04-23 (주)에스티아이 식각 장치 및 식각방법
WO2008133149A1 (ja) * 2007-04-23 2008-11-06 Ulvac, Inc. 支持部材およびキャリアと支持方法
DE102007026634B4 (de) * 2007-06-06 2009-04-16 Atotech Deutschland Gmbh Vertikalanlage zur galvanotechnischen Behandlung eines Werkstückes und Verfahren zum Befördern des Werkstückes
KR20080114155A (ko) * 2007-06-27 2008-12-31 삼성전자주식회사 웨이퍼 그리핑 장치
US8695312B2 (en) * 2008-05-28 2014-04-15 Lantech.Com, Llc Film clamp and related methods and apparatuses for wrapping loads
WO2010087218A1 (ja) * 2009-01-28 2010-08-05 富士電機ホールディングス株式会社 可撓性基板の位置制御装置
US20110276082A1 (en) * 2009-09-17 2011-11-10 Fehring Robert G Device for providing therapeutic pressure therapy to parts of the body for treatment of pain
CN101814586B (zh) * 2009-12-01 2011-09-28 东莞宏威数码机械有限公司 夹持式基板翻转装置
JP3166374U (ja) 2010-12-20 2011-03-03 旭硝子株式会社 板状体収納容器
DE102011100235A1 (de) * 2011-05-02 2012-11-08 Trw Automotive Gmbh Befestigungsclip zum Montieren eines Bauteils
US8864753B2 (en) * 2011-12-13 2014-10-21 Covidien Lp Surgical Forceps Connected to Treatment Light Source
KR101388619B1 (ko) 2012-08-29 2014-04-23 주식회사 엠엠테크 글라스 슬리밍 장치
DE102013001625A1 (de) * 2012-09-30 2014-04-03 Cepventures International Corp. Verpackung für kantenempfindliches Transportgut
JP6065722B2 (ja) * 2013-04-10 2017-01-25 日本電気硝子株式会社 保持部付ガラス基板、ガラス基板の熱処理方法、及びガラス基板支持ユニット
JP6234731B2 (ja) * 2013-08-08 2017-11-22 上村工業株式会社 クランパーを備える保持具
KR101553623B1 (ko) 2013-12-16 2015-09-16 주식회사 에스에프에이 캐리어
FR3049941B1 (fr) * 2016-04-06 2018-04-13 Saint- Gobain Glass France Dispositif de convoyage et de maintien pour feuille de verre notamment dans une installation de lavage
WO2017193001A1 (en) * 2016-05-06 2017-11-09 Applied Materials, Inc Systems, apparatus, and methods for an improved substrate handling assembly
US10074554B2 (en) * 2016-06-27 2018-09-11 Tel Nexx, Inc. Workpiece loader for a wet processing system
US10283396B2 (en) * 2016-06-27 2019-05-07 Asm Nexx, Inc. Workpiece holder for a wet processing system
US10483138B2 (en) 2017-03-09 2019-11-19 Himax Technologies Limited Wafer clamp and a method of clamping a wafer
US10720353B2 (en) * 2018-07-04 2020-07-21 Murata Machinery, Ltd. Opener apparatus
TW202038370A (zh) * 2019-03-13 2020-10-16 以色列商核心流有限公司 圓形晶圓側向定位裝置
US20230130419A1 (en) * 2021-10-21 2023-04-27 Asmpt Nexx, Inc. Method for cleaning semiconductor devices
CN115036235A (zh) * 2022-02-11 2022-09-09 宇弘研精密机械(苏州)有限公司 一种芯片清洗循环翻转倒料***

Also Published As

Publication number Publication date
TWI819396B (zh) 2023-10-21
KR20230044029A (ko) 2023-03-31
PT3989270T (pt) 2022-11-10
WO2022084109A1 (en) 2022-04-28
EP3989270B1 (en) 2022-10-05
TW202220096A (zh) 2022-05-16
US20230260823A1 (en) 2023-08-17
CN116438642A (zh) 2023-07-14
US11942356B2 (en) 2024-03-26
EP3989271B1 (en) 2024-06-05
EP3989270A1 (en) 2022-04-27
EP3989271A1 (en) 2022-04-27
KR102590311B1 (ko) 2023-10-16

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