CN101656224B - 基板夹持机构 - Google Patents
基板夹持机构 Download PDFInfo
- Publication number
- CN101656224B CN101656224B CN2009100415117A CN200910041511A CN101656224B CN 101656224 B CN101656224 B CN 101656224B CN 2009100415117 A CN2009100415117 A CN 2009100415117A CN 200910041511 A CN200910041511 A CN 200910041511A CN 101656224 B CN101656224 B CN 101656224B
- Authority
- CN
- China
- Prior art keywords
- clamping device
- base plate
- press strip
- clamping
- lower platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100415117A CN101656224B (zh) | 2009-07-29 | 2009-07-29 | 基板夹持机构 |
PCT/CN2009/076039 WO2011011953A1 (zh) | 2009-07-29 | 2009-12-25 | 基板夹持机构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100415117A CN101656224B (zh) | 2009-07-29 | 2009-07-29 | 基板夹持机构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101656224A CN101656224A (zh) | 2010-02-24 |
CN101656224B true CN101656224B (zh) | 2011-09-07 |
Family
ID=41710435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009100415117A Expired - Fee Related CN101656224B (zh) | 2009-07-29 | 2009-07-29 | 基板夹持机构 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101656224B (zh) |
WO (1) | WO2011011953A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103187541B (zh) * | 2011-12-28 | 2017-05-17 | 上海大学 | Oled器件封装夹持装置 |
CN105833536B (zh) * | 2016-04-28 | 2018-07-03 | 侯沐朗 | 一种发射机构及多级水火箭 |
CN110640324B (zh) * | 2019-09-02 | 2022-06-10 | 中芯集成电路(宁波)有限公司 | 一种晶圆双面制作*** |
CN114914186B (zh) * | 2022-04-27 | 2024-01-05 | 智汇轩田智能***(杭州)有限公司 | 一种dbc板夹紧定位机构 |
CN115026185B (zh) * | 2022-08-09 | 2022-11-08 | 明日能源(苏州)有限公司 | 能源监测装置零件加工装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06143249A (ja) * | 1992-11-06 | 1994-05-24 | Toshiba Ceramics Co Ltd | スライシングマシンにおけるブレードクランプ装置 |
US6753534B2 (en) * | 2000-12-08 | 2004-06-22 | Nikon Corporation | Positioning stage with stationary and movable magnet tracks |
US6415843B1 (en) * | 2001-01-10 | 2002-07-09 | Anadigics, Inc. | Spatula for separation of thinned wafer from mounting carrier |
CN2884528Y (zh) * | 2005-12-19 | 2007-03-28 | 邓朝旭 | 用于生产发光二极管的夹具组 |
-
2009
- 2009-07-29 CN CN2009100415117A patent/CN101656224B/zh not_active Expired - Fee Related
- 2009-12-25 WO PCT/CN2009/076039 patent/WO2011011953A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2011011953A1 (zh) | 2011-02-03 |
CN101656224A (zh) | 2010-02-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PP01 | Preservation of patent right |
Effective date of registration: 20131205 Granted publication date: 20110907 |
|
RINS | Preservation of patent right or utility model and its discharge | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20140905 Granted publication date: 20110907 |
|
PP01 | Preservation of patent right |
Effective date of registration: 20140905 Granted publication date: 20110907 |
|
RINS | Preservation of patent right or utility model and its discharge | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20141205 Granted publication date: 20110907 |
|
RINS | Preservation of patent right or utility model and its discharge | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110907 Termination date: 20130729 |