CN101388389A - 半导体器件 - Google Patents
半导体器件 Download PDFInfo
- Publication number
- CN101388389A CN101388389A CNA2008102109164A CN200810210916A CN101388389A CN 101388389 A CN101388389 A CN 101388389A CN A2008102109164 A CNA2008102109164 A CN A2008102109164A CN 200810210916 A CN200810210916 A CN 200810210916A CN 101388389 A CN101388389 A CN 101388389A
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- circuit board
- conductive welding
- welding disk
- outside
- chip
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- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
Claims (11)
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JP2007236594 | 2007-09-12 | ||
JP2007236594A JP5222509B2 (ja) | 2007-09-12 | 2007-09-12 | 半導体装置 |
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CN201210331265.0A Division CN102867821B (zh) | 2007-09-12 | 2008-08-12 | 半导体器件 |
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CN101388389A true CN101388389A (zh) | 2009-03-18 |
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US (4) | US8159058B2 (zh) |
JP (1) | JP5222509B2 (zh) |
KR (1) | KR101426568B1 (zh) |
CN (2) | CN102867821B (zh) |
TW (2) | TWI481007B (zh) |
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-
2007
- 2007-09-12 JP JP2007236594A patent/JP5222509B2/ja active Active
-
2008
- 2008-06-25 TW TW097123751A patent/TWI481007B/zh active
- 2008-06-25 TW TW104106919A patent/TWI529908B/zh active
- 2008-08-12 CN CN201210331265.0A patent/CN102867821B/zh active Active
- 2008-08-12 CN CNA2008102109164A patent/CN101388389A/zh active Pending
- 2008-08-25 KR KR1020080082975A patent/KR101426568B1/ko active IP Right Grant
- 2008-09-04 US US12/203,972 patent/US8159058B2/en active Active
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- 2012-03-01 US US13/409,865 patent/US8698299B2/en active Active
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102890970A (zh) * | 2011-07-21 | 2013-01-23 | 广东新岸线计算机***芯片有限公司 | 一种pop封装的soc芯片dram输入/输出测试方法和装置 |
CN105990369A (zh) * | 2014-09-17 | 2016-10-05 | 株式会社东芝 | 半导体存储装置 |
CN105990369B (zh) * | 2014-09-17 | 2019-11-08 | 东芝存储器株式会社 | 半导体存储装置 |
Also Published As
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US8766425B2 (en) | 2014-07-01 |
US20090065773A1 (en) | 2009-03-12 |
TWI481007B (zh) | 2015-04-11 |
CN102867821A (zh) | 2013-01-09 |
KR101426568B1 (ko) | 2014-08-05 |
CN102867821B (zh) | 2015-05-13 |
US8698299B2 (en) | 2014-04-15 |
US20120153282A1 (en) | 2012-06-21 |
US20140070214A1 (en) | 2014-03-13 |
TWI529908B (zh) | 2016-04-11 |
KR20090027573A (ko) | 2009-03-17 |
US8159058B2 (en) | 2012-04-17 |
US9330942B2 (en) | 2016-05-03 |
JP2009070965A (ja) | 2009-04-02 |
JP5222509B2 (ja) | 2013-06-26 |
US20140252357A1 (en) | 2014-09-11 |
TW201523836A (zh) | 2015-06-16 |
TW200919700A (en) | 2009-05-01 |
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