CN101122613A - 用于探测器的承载盘 - Google Patents
用于探测器的承载盘 Download PDFInfo
- Publication number
- CN101122613A CN101122613A CNA2007101371988A CN200710137198A CN101122613A CN 101122613 A CN101122613 A CN 101122613A CN A2007101371988 A CNA2007101371988 A CN A2007101371988A CN 200710137198 A CN200710137198 A CN 200710137198A CN 101122613 A CN101122613 A CN 101122613A
- Authority
- CN
- China
- Prior art keywords
- carrier
- dish
- semiconductor packages
- semiconductor wafer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 222
- 238000012360 testing method Methods 0.000 claims abstract description 45
- 239000011159 matrix material Substances 0.000 claims description 19
- 238000000465 moulding Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 13
- 239000011810 insulating material Substances 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 72
- 238000005259 measurement Methods 0.000 description 31
- 238000012423 maintenance Methods 0.000 description 11
- 230000003321 amplification Effects 0.000 description 10
- 238000003199 nucleic acid amplification method Methods 0.000 description 10
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-216579 | 2006-08-09 | ||
JP2006216579 | 2006-08-09 | ||
JP2006216579A JP4832207B2 (ja) | 2006-08-09 | 2006-08-09 | プローバ装置用搬送トレイ |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101122613A true CN101122613A (zh) | 2008-02-13 |
CN101122613B CN101122613B (zh) | 2010-12-29 |
Family
ID=39050116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101371988A Expired - Fee Related CN101122613B (zh) | 2006-08-09 | 2007-08-09 | 用于探测器的承载盘 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7652467B2 (zh) |
JP (1) | JP4832207B2 (zh) |
KR (1) | KR100847284B1 (zh) |
CN (1) | CN101122613B (zh) |
TW (1) | TWI348024B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103730376A (zh) * | 2012-10-15 | 2014-04-16 | 华邦电子股份有限公司 | 封装测试方法 |
CN106290990A (zh) * | 2015-06-10 | 2017-01-04 | 鸿劲科技股份有限公司 | 可同时多颗电子元件定位的定位装置及其应用的作业设备 |
CN108107349A (zh) * | 2017-12-26 | 2018-06-01 | 上海华岭集成电路技术股份有限公司 | 一种晶圆和成品测试通用承载板 |
CN110018405A (zh) * | 2018-01-04 | 2019-07-16 | 京元电子股份有限公司 | 半导体元件测试载盘及其测试装置与设备 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010243314A (ja) * | 2009-04-06 | 2010-10-28 | Syswave Corp | 半導体チップ素子試験治具及び自動試験装置 |
US8518749B2 (en) | 2009-06-22 | 2013-08-27 | Stats Chippac, Ltd. | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die |
US8587331B2 (en) * | 2009-12-31 | 2013-11-19 | Tommie E. Berry | Test systems and methods for testing electronic devices |
JP4765127B1 (ja) * | 2010-07-30 | 2011-09-07 | 合同会社Pleson | トレーユニットおよび半導体デバイスの検査装置 |
JP5648809B2 (ja) * | 2011-10-28 | 2015-01-07 | 株式会社島津製作所 | Tftアレイ検査装置 |
KR102257256B1 (ko) | 2013-05-14 | 2021-05-28 | 폼팩터, 인크. | 교환 가능한 프로브 헤드의 자동화 부착 및 탈착 |
US10317460B2 (en) | 2013-06-07 | 2019-06-11 | Maxim Integrated Products, Inc. | Precision alignment unit for semiconductor trays |
KR101611922B1 (ko) * | 2014-05-12 | 2016-04-14 | 참엔지니어링(주) | 기판 검사 장치 및 기판 검사 방법 |
US9527731B2 (en) * | 2014-10-15 | 2016-12-27 | Nxp Usa, Inc. | Methodology and system for wafer-level testing of MEMS pressure sensors |
US20160116361A1 (en) * | 2014-10-28 | 2016-04-28 | Freescale Semiconductor, Inc. | System for wafer-level testing of mems pressure sensors |
JP6424719B2 (ja) * | 2015-04-06 | 2018-11-21 | 三菱電機株式会社 | 半導体試験治具、半導体装置の試験方法 |
US9885748B2 (en) * | 2015-06-09 | 2018-02-06 | International Business Machines Corporation | Module testing utilizing wafer probe test equipment |
WO2018135707A1 (ko) * | 2017-01-17 | 2018-07-26 | 주식회사 네패스 | 반도체 패키지 제조용 트레이 |
KR101901987B1 (ko) * | 2017-01-17 | 2018-09-27 | 주식회사 네패스 | 반도체 패키지의 제조 방법 |
TWI741715B (zh) * | 2020-08-03 | 2021-10-01 | 矽品精密工業股份有限公司 | 承載裝置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0210752A (ja) * | 1988-06-29 | 1990-01-16 | Tokyo Electron Ltd | 半導体素子の検査装置 |
JPH0669296A (ja) * | 1992-08-19 | 1994-03-11 | Tokyo Electron Ltd | 試験装置 |
JP3183591B2 (ja) * | 1993-07-02 | 2001-07-09 | 三菱電機株式会社 | 半導体デバイスのテストシステム、半導体デバイスのテスト方法、半導体デバイス挿抜ステーション及びテスト用チャンバ |
JPH07244116A (ja) * | 1994-03-07 | 1995-09-19 | Hitachi Chem Co Ltd | 半導体特性測定用治具とその製造法並びにその使用方法 |
US5456360A (en) * | 1994-09-30 | 1995-10-10 | The Perkin-Elmer Corporation | Holder assembly for reaction tubes |
JPH08179007A (ja) | 1994-12-22 | 1996-07-12 | Advantest Corp | Icテスタ用ハンドラのチェンジキットの構造 |
JP2625395B2 (ja) * | 1995-01-17 | 1997-07-02 | 東京エレクトロン株式会社 | Icハンドラ及びicプロービング方法 |
JPH08248095A (ja) * | 1995-03-14 | 1996-09-27 | Tokyo Electron Ltd | 検査装置 |
DE19631340C2 (de) * | 1995-08-04 | 2000-11-30 | Advantest Corp | Anordnung zum Testen von ICs |
KR20000043520A (ko) * | 1998-12-29 | 2000-07-15 | 윤종용 | 테스트 캐리어 |
JP2000327070A (ja) * | 1999-05-18 | 2000-11-28 | Hitachi Ltd | 梱包方法および搬送方法ならびに半導体装置の製造方法 |
JP2001113420A (ja) * | 1999-10-19 | 2001-04-24 | Sharp Corp | 位置決め方法及びその装置 |
JP2002202346A (ja) * | 2000-12-28 | 2002-07-19 | Yokogawa Electric Corp | 位置固定方法、位置固定装置及び位置固定装置を用いたハンドラ |
KR100465372B1 (ko) * | 2002-05-14 | 2005-01-13 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러용 캐리어 모듈 |
JP2004160627A (ja) | 2002-11-15 | 2004-06-10 | Shinko Electric Ind Co Ltd | 位置決め方法及びその装置 |
JP2004177202A (ja) * | 2002-11-26 | 2004-06-24 | Yokogawa Electric Corp | 搬送装置 |
JP2005055244A (ja) * | 2003-08-01 | 2005-03-03 | Yokogawa Electric Corp | テストトレイ |
JP2005345262A (ja) * | 2004-06-03 | 2005-12-15 | Niigata Seimitsu Kk | 半導体検査装置およびこれに用いる被検査部品トレー |
JP4403458B2 (ja) * | 2004-10-28 | 2010-01-27 | 東洋精密工業株式会社 | チップトレイ |
-
2006
- 2006-08-09 JP JP2006216579A patent/JP4832207B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-30 TW TW096127793A patent/TWI348024B/zh active
- 2007-08-08 KR KR1020070079829A patent/KR100847284B1/ko not_active IP Right Cessation
- 2007-08-09 CN CN2007101371988A patent/CN101122613B/zh not_active Expired - Fee Related
- 2007-08-09 US US11/836,327 patent/US7652467B2/en not_active Expired - Fee Related
-
2009
- 2009-12-09 US US12/634,513 patent/US8022719B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103730376A (zh) * | 2012-10-15 | 2014-04-16 | 华邦电子股份有限公司 | 封装测试方法 |
CN103730376B (zh) * | 2012-10-15 | 2018-04-03 | 华邦电子股份有限公司 | 封装测试方法 |
CN106290990A (zh) * | 2015-06-10 | 2017-01-04 | 鸿劲科技股份有限公司 | 可同时多颗电子元件定位的定位装置及其应用的作业设备 |
CN108107349A (zh) * | 2017-12-26 | 2018-06-01 | 上海华岭集成电路技术股份有限公司 | 一种晶圆和成品测试通用承载板 |
CN110018405A (zh) * | 2018-01-04 | 2019-07-16 | 京元电子股份有限公司 | 半导体元件测试载盘及其测试装置与设备 |
CN110018405B (zh) * | 2018-01-04 | 2021-10-15 | 京元电子股份有限公司 | 半导体元件测试载盘及其测试装置与设备 |
Also Published As
Publication number | Publication date |
---|---|
CN101122613B (zh) | 2010-12-29 |
JP2008039666A (ja) | 2008-02-21 |
US20100085070A1 (en) | 2010-04-08 |
US8022719B2 (en) | 2011-09-20 |
JP4832207B2 (ja) | 2011-12-07 |
TW200815760A (en) | 2008-04-01 |
TWI348024B (en) | 2011-09-01 |
US20080036482A1 (en) | 2008-02-14 |
KR100847284B1 (ko) | 2008-07-21 |
US7652467B2 (en) | 2010-01-26 |
KR20080013820A (ko) | 2008-02-13 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: FUJITSU MICROELECTRONICS CO., LTD. Free format text: FORMER OWNER: FUJITSU LIMITED Effective date: 20081024 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20081024 Address after: Tokyo, Japan, Japan Applicant after: Fujitsu Microelectronics Ltd. Address before: Kanagawa Applicant before: Fujitsu Ltd. |
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C14 | Grant of patent or utility model | ||
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Owner name: SUOSI FUTURE CO., LTD. Free format text: FORMER OWNER: FUJITSU SEMICONDUCTOR CO., LTD. Effective date: 20150519 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20150519 Address after: Kanagawa Patentee after: Co., Ltd. Suo Si future Address before: Kanagawa Patentee before: Fujitsu Semiconductor Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |