CN101106111A - 集成电路器件封装体及其装配方法 - Google Patents
集成电路器件封装体及其装配方法 Download PDFInfo
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- CN101106111A CN101106111A CNA2007101040241A CN200710104024A CN101106111A CN 101106111 A CN101106111 A CN 101106111A CN A2007101040241 A CNA2007101040241 A CN A2007101040241A CN 200710104024 A CN200710104024 A CN 200710104024A CN 101106111 A CN101106111 A CN 101106111A
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- crystal grain
- sealing cap
- lead
- lead frame
- wire
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
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- Toxicology (AREA)
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Abstract
Description
Claims (10)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US80043306P | 2006-05-16 | 2006-05-16 | |
US60/800,433 | 2006-05-16 | ||
US11/480,579 | 2006-07-05 | ||
US11/480,579 US8183680B2 (en) | 2006-05-16 | 2006-07-05 | No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement |
Publications (2)
Publication Number | Publication Date |
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CN101106111A true CN101106111A (zh) | 2008-01-16 |
CN101106111B CN101106111B (zh) | 2010-12-15 |
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CN2007101040241A Active CN101106111B (zh) | 2006-05-16 | 2007-05-15 | 集成电路器件封装体及其装配方法 |
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US (1) | US8183680B2 (zh) |
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US7714453B2 (en) | 2006-05-12 | 2010-05-11 | Broadcom Corporation | Interconnect structure and formation for package stacking of molded plastic area array package |
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US20070273023A1 (en) * | 2006-05-26 | 2007-11-29 | Broadcom Corporation | Integrated circuit package having exposed thermally conducting body |
US7808087B2 (en) * | 2006-06-01 | 2010-10-05 | Broadcom Corporation | Leadframe IC packages having top and bottom integrated heat spreaders |
US9013035B2 (en) * | 2006-06-20 | 2015-04-21 | Broadcom Corporation | Thermal improvement for hotspots on dies in integrated circuit packages |
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US8169067B2 (en) * | 2006-10-20 | 2012-05-01 | Broadcom Corporation | Low profile ball grid array (BGA) package with exposed die and method of making same |
US20080111219A1 (en) * | 2006-11-14 | 2008-05-15 | Gem Services, Inc. | Package designs for vertical conduction die |
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Also Published As
Publication number | Publication date |
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TWI388047B (zh) | 2013-03-01 |
US20070267734A1 (en) | 2007-11-22 |
EP1858080A2 (en) | 2007-11-21 |
US8183680B2 (en) | 2012-05-22 |
TW200814276A (en) | 2008-03-16 |
CN101106111B (zh) | 2010-12-15 |
EP1858080A3 (en) | 2008-11-05 |
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