CN100552464C - 导电图案检查装置 - Google Patents
导电图案检查装置 Download PDFInfo
- Publication number
- CN100552464C CN100552464C CNB2004100691699A CN200410069169A CN100552464C CN 100552464 C CN100552464 C CN 100552464C CN B2004100691699 A CNB2004100691699 A CN B2004100691699A CN 200410069169 A CN200410069169 A CN 200410069169A CN 100552464 C CN100552464 C CN 100552464C
- Authority
- CN
- China
- Prior art keywords
- pattern
- electrode
- conductive pattern
- voltage
- sensor electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007689 inspection Methods 0.000 claims abstract description 53
- 230000008878 coupling Effects 0.000 claims abstract description 34
- 238000010168 coupling process Methods 0.000 claims abstract description 34
- 238000005859 coupling reaction Methods 0.000 claims abstract description 34
- 238000001514 detection method Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 29
- 230000007547 defect Effects 0.000 claims description 18
- 230000002950 deficient Effects 0.000 claims description 17
- 230000007935 neutral effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000011521 glass Substances 0.000 description 17
- 239000000523 sample Substances 0.000 description 8
- 238000000605 extraction Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000006378 damage Effects 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003270954A JP4562358B2 (ja) | 2003-07-04 | 2003-07-04 | 導電パターン検査装置 |
JP2003270954 | 2003-07-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1576870A CN1576870A (zh) | 2005-02-09 |
CN100552464C true CN100552464C (zh) | 2009-10-21 |
Family
ID=34190767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100691699A Expired - Fee Related CN100552464C (zh) | 2003-07-04 | 2004-07-05 | 导电图案检查装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4562358B2 (ja) |
KR (1) | KR101116164B1 (ja) |
CN (1) | CN100552464C (ja) |
TW (1) | TWI289674B (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4629531B2 (ja) * | 2005-08-03 | 2011-02-09 | 日置電機株式会社 | 短絡検査装置および短絡検査方法 |
JP5276774B2 (ja) * | 2005-11-29 | 2013-08-28 | 株式会社日本マイクロニクス | 検査方法及び装置 |
JP5050394B2 (ja) | 2006-04-20 | 2012-10-17 | 日本電産リード株式会社 | 基板検査装置及び基板検査方法 |
JP4915776B2 (ja) * | 2006-04-27 | 2012-04-11 | 日本電産リード株式会社 | 基板検査装置及び基板検査方法 |
JP4730904B2 (ja) * | 2006-04-28 | 2011-07-20 | 日本電産リード株式会社 | 基板検査装置及び基板検査方法 |
JP2008014918A (ja) * | 2006-06-30 | 2008-01-24 | Oht Inc | 回路パターン検査装置及び回路パターン検査方法 |
KR100799161B1 (ko) * | 2006-07-20 | 2008-01-29 | 마이크로 인스펙션 주식회사 | 비접촉 싱글사이드 프로브와 이를 이용한 패턴전극의 단선및 단락 검사장치 및 그 방법 |
JP4291843B2 (ja) * | 2006-10-19 | 2009-07-08 | 株式会社東京カソード研究所 | パターン検査装置 |
JP2009121894A (ja) * | 2007-11-14 | 2009-06-04 | Fujitsu Ltd | 導電体パターンの欠陥検査方法及び欠陥検査装置 |
JP5387818B2 (ja) * | 2008-12-11 | 2014-01-15 | オー・エイチ・ティー株式会社 | 回路パターン検査装置 |
JP5122512B2 (ja) * | 2009-04-17 | 2013-01-16 | オー・エイチ・ティー株式会社 | 回路パターン検査装置 |
JP5391819B2 (ja) * | 2009-05-14 | 2014-01-15 | 日本電産リード株式会社 | タッチパネル検査装置 |
JP5438538B2 (ja) | 2010-02-08 | 2014-03-12 | 日本碍子株式会社 | 異常判定機能付き装置、及び異常判定方法 |
JP5533169B2 (ja) * | 2010-04-13 | 2014-06-25 | 日本電産リード株式会社 | 検査装置 |
JP5305111B2 (ja) * | 2011-01-21 | 2013-10-02 | オー・エイチ・ティー株式会社 | 回路パターン検査装置 |
JP5580247B2 (ja) * | 2011-04-27 | 2014-08-27 | 株式会社ユニオンアロー・テクノロジー | パターン検査装置 |
JP2012238066A (ja) * | 2011-05-10 | 2012-12-06 | Japan Display East Co Ltd | 静電容量方式のタッチパネル、および表示装置 |
CN103308817B (zh) * | 2013-06-20 | 2015-11-25 | 京东方科技集团股份有限公司 | 阵列基板线路检测装置及检测方法 |
KR101537563B1 (ko) * | 2013-11-06 | 2015-07-20 | 마이크로 인스펙션 주식회사 | 비접촉 프로브를 이용한 패턴전극의 결함 위치 검출 방법 |
CN104122689A (zh) * | 2014-07-29 | 2014-10-29 | 深圳市华星光电技术有限公司 | 一种测试装置及其测试方法 |
JP6674842B2 (ja) * | 2016-05-24 | 2020-04-01 | 京セラ株式会社 | センサ基板およびセンサ装置 |
KR101823317B1 (ko) * | 2016-07-01 | 2018-03-14 | 로체 시스템즈(주) | 패널의 배선패턴 검사장치 및 배선패턴 검사방법 |
CN108226695B (zh) * | 2018-01-02 | 2021-10-15 | 京东方科技集团股份有限公司 | 邻近金属线短路的检测及定位装置和方法 |
CN111007432B (zh) * | 2019-12-12 | 2022-06-17 | 芜湖伦丰电子科技有限公司 | 一种寻找银浆开短路位置的方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000227452A (ja) | 1999-02-04 | 2000-08-15 | Hioki Ee Corp | 回路基板検査装置 |
JP4450143B2 (ja) | 2001-05-24 | 2010-04-14 | オー・エイチ・ティー株式会社 | 回路パターン検査装置並びに回路パターン検査方法及び記録媒体 |
-
2003
- 2003-07-04 JP JP2003270954A patent/JP4562358B2/ja not_active Expired - Lifetime
-
2004
- 2004-06-29 TW TW093118973A patent/TWI289674B/zh active
- 2004-06-30 KR KR1020040050394A patent/KR101116164B1/ko active IP Right Grant
- 2004-07-05 CN CNB2004100691699A patent/CN100552464C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200508625A (en) | 2005-03-01 |
CN1576870A (zh) | 2005-02-09 |
KR101116164B1 (ko) | 2012-03-06 |
KR20050004046A (ko) | 2005-01-12 |
JP2005024518A (ja) | 2005-01-27 |
TWI289674B (en) | 2007-11-11 |
JP4562358B2 (ja) | 2010-10-13 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: CO., LTD. ARROW TECHNOLOGY Free format text: FORMER OWNER: TOKYO CATHODE INST K. K. Effective date: 20091204 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20091204 Address after: Okayama County, Japan Patentee after: UNION ARROW TECHNOLOGIES Inc. Address before: Tokyo, Japan Patentee before: TOKYO CATHODE LABORATORY CO.,LTD. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091021 |