ATE546506T1 - Lichtemittierende vorrichtung - Google Patents
Lichtemittierende vorrichtungInfo
- Publication number
- ATE546506T1 ATE546506T1 AT08010928T AT08010928T ATE546506T1 AT E546506 T1 ATE546506 T1 AT E546506T1 AT 08010928 T AT08010928 T AT 08010928T AT 08010928 T AT08010928 T AT 08010928T AT E546506 T1 ATE546506 T1 AT E546506T1
- Authority
- AT
- Austria
- Prior art keywords
- light
- phosphor
- luminous element
- emitting device
- red phosphor
- Prior art date
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 11
- 230000005284 excitation Effects 0.000 abstract 2
- 150000002500 ions Chemical class 0.000 abstract 2
- 229910000323 aluminium silicate Inorganic materials 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 238000004020 luminiscence type Methods 0.000 abstract 1
- 150000004767 nitrides Chemical class 0.000 abstract 1
- 238000009877 rendering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004131770 | 2004-04-27 | ||
JP2004182797 | 2004-06-21 | ||
JP2004194196 | 2004-06-30 | ||
JP2004250739A JP2005336450A (ja) | 2004-04-27 | 2004-08-30 | 蛍光体組成物とその製造方法、並びにその蛍光体組成物を用いた発光装置 |
JP2004363534A JP4128564B2 (ja) | 2004-04-27 | 2004-12-15 | 発光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE546506T1 true ATE546506T1 (de) | 2012-03-15 |
Family
ID=39697774
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT09007211T ATE539135T1 (de) | 2004-04-27 | 2005-04-26 | Phosphorzusammensetzung und lichtemittierende vorrichtung damit |
AT08010928T ATE546506T1 (de) | 2004-04-27 | 2005-04-26 | Lichtemittierende vorrichtung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT09007211T ATE539135T1 (de) | 2004-04-27 | 2005-04-26 | Phosphorzusammensetzung und lichtemittierende vorrichtung damit |
Country Status (4)
Country | Link |
---|---|
JP (8) | JP4128564B2 (de) |
KR (1) | KR20110016506A (de) |
AT (2) | ATE539135T1 (de) |
TW (2) | TWI394815B (de) |
Families Citing this family (135)
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KR100537349B1 (ko) | 1996-06-26 | 2006-02-28 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | 발광 변환 소자를 포함하는 발광 반도체 소자 |
KR101148332B1 (ko) | 2003-04-30 | 2012-05-25 | 크리, 인코포레이티드 | 콤팩트 광학 특성을 지닌 높은 전력의 발광 소자 패키지 |
US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
KR100887489B1 (ko) | 2004-04-27 | 2009-03-10 | 파나소닉 주식회사 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
JP4128564B2 (ja) * | 2004-04-27 | 2008-07-30 | 松下電器産業株式会社 | 発光装置 |
US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
CN104759615A (zh) | 2005-04-01 | 2015-07-08 | 三菱化学株式会社 | 无机功能材料原料用合金粉末及荧光体 |
JP2007049114A (ja) | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
US7262439B2 (en) | 2005-11-22 | 2007-08-28 | Lumination Llc | Charge compensated nitride phosphors for use in lighting applications |
US7859182B2 (en) | 2005-08-31 | 2010-12-28 | Lumination Llc | Warm white LED-based lamp incoporating divalent EU-activated silicate yellow emitting phosphor |
JP4832995B2 (ja) * | 2005-09-01 | 2011-12-07 | シャープ株式会社 | 発光装置 |
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NL2000033C1 (nl) * | 2006-03-20 | 2007-09-21 | Univ Eindhoven Tech | Inrichting voor het omzetten van elektromagnetische stralingsenergie in elektrische energie en werkwijze ter vervaardiging van een dergelijke inrichting. |
JP5239182B2 (ja) * | 2006-03-27 | 2013-07-17 | 三菱化学株式会社 | 蛍光体及びそれを使用した発光装置 |
JP2007312374A (ja) * | 2006-04-19 | 2007-11-29 | Mitsubishi Chemicals Corp | カラー画像表示装置 |
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JP2009534866A (ja) | 2006-04-24 | 2009-09-24 | クリー, インコーポレイティッド | 横向き平面実装白色led |
EP2043165B1 (de) | 2006-06-27 | 2014-12-03 | Mitsubishi Chemical Corporation | Beleuchtungseinrichtung |
JP5141107B2 (ja) * | 2006-06-27 | 2013-02-13 | 三菱化学株式会社 | 照明装置 |
KR101258229B1 (ko) * | 2006-06-30 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
JP5100059B2 (ja) * | 2006-08-24 | 2012-12-19 | スタンレー電気株式会社 | 蛍光体、その製造方法およびそれを用いた発光装置 |
KR100771772B1 (ko) * | 2006-08-25 | 2007-10-30 | 삼성전기주식회사 | 백색 led 모듈 |
JP5378644B2 (ja) * | 2006-09-29 | 2013-12-25 | Dowaホールディングス株式会社 | 窒化物蛍光体または酸窒化物蛍光体の製造方法 |
EP2080235B1 (de) * | 2006-10-12 | 2013-12-04 | Panasonic Corporation | Lichtemittierendes Bauelement |
KR100862695B1 (ko) * | 2006-10-17 | 2008-10-10 | 삼성전기주식회사 | 백색 발광 다이오드 |
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JP2008116849A (ja) | 2006-11-07 | 2008-05-22 | Sony Corp | 表示装置 |
JP5367218B2 (ja) | 2006-11-24 | 2013-12-11 | シャープ株式会社 | 蛍光体の製造方法および発光装置の製造方法 |
JP4520972B2 (ja) * | 2006-11-28 | 2010-08-11 | Dowaエレクトロニクス株式会社 | 発光装置及びその製造方法 |
JP4228012B2 (ja) * | 2006-12-20 | 2009-02-25 | Necライティング株式会社 | 赤色発光窒化物蛍光体およびそれを用いた白色発光素子 |
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JP4824600B2 (ja) * | 2007-02-21 | 2011-11-30 | 富士フイルム株式会社 | 面状照明装置、面状照明装置の評価方法及びこれを用いる製造方法 |
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JP2011155297A (ja) | 2011-08-11 |
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JP2008169395A (ja) | 2008-07-24 |
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ATE539135T1 (de) | 2012-01-15 |
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JP2008187188A (ja) | 2008-08-14 |
JP5171981B2 (ja) | 2013-03-27 |
KR20110016506A (ko) | 2011-02-17 |
TWI394815B (zh) | 2013-05-01 |
JP4559496B2 (ja) | 2010-10-06 |
JP2008177592A (ja) | 2008-07-31 |
JP5604482B2 (ja) | 2014-10-08 |
JP2008016861A (ja) | 2008-01-24 |
TW200944577A (en) | 2009-11-01 |
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