TW200611963A - Phosphor composition and method for producing the same, and light-emitting device using the same - Google Patents
Phosphor composition and method for producing the same, and light-emitting device using the sameInfo
- Publication number
- TW200611963A TW200611963A TW094113213A TW94113213A TW200611963A TW 200611963 A TW200611963 A TW 200611963A TW 094113213 A TW094113213 A TW 094113213A TW 94113213 A TW94113213 A TW 94113213A TW 200611963 A TW200611963 A TW 200611963A
- Authority
- TW
- Taiwan
- Prior art keywords
- same
- light
- emitting device
- producing
- phosphor composition
- Prior art date
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000004907 flux Effects 0.000 abstract 1
- 238000009877 rendering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004131770 | 2004-04-27 | ||
JP2004182797 | 2004-06-21 | ||
JP2004194196 | 2004-06-30 | ||
JP2004250739A JP2005336450A (ja) | 2004-04-27 | 2004-08-30 | 蛍光体組成物とその製造方法、並びにその蛍光体組成物を用いた発光装置 |
JP2004363534A JP4128564B2 (ja) | 2004-04-27 | 2004-12-15 | 発光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200611963A true TW200611963A (en) | 2006-04-16 |
Family
ID=39697774
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098119010A TWI394815B (zh) | 2004-04-27 | 2005-04-26 | 螢光體組成物及其製造方法、使用該螢光體組成物之發光裝置 |
TW094113213A TW200611963A (en) | 2004-04-27 | 2005-04-26 | Phosphor composition and method for producing the same, and light-emitting device using the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098119010A TWI394815B (zh) | 2004-04-27 | 2005-04-26 | 螢光體組成物及其製造方法、使用該螢光體組成物之發光裝置 |
Country Status (4)
Country | Link |
---|---|
JP (8) | JP4128564B2 (zh) |
KR (1) | KR20110016506A (zh) |
AT (2) | ATE546506T1 (zh) |
TW (2) | TWI394815B (zh) |
Cited By (4)
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CN101220272B (zh) * | 2006-12-20 | 2012-08-29 | Nec照明株式会社 | 发红光的氮化物荧光材料及使用其的白光发光装置 |
TWI458805B (zh) * | 2006-09-29 | 2014-11-01 | Dowa Electronics Materials Co | 氮化物螢光體或氧氮化物螢光體之製造方法 |
CN110364598A (zh) * | 2019-06-20 | 2019-10-22 | 华灿光电(苏州)有限公司 | 发光二极管外延片及其制作方法 |
CN116462497A (zh) * | 2023-03-16 | 2023-07-21 | 河北光兴半导体技术有限公司 | 一种Tb3+掺杂的铝酸盐绿色荧光陶瓷及其制备方法和应用 |
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KR100643442B1 (ko) | 1996-06-26 | 2006-11-10 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | 발광 변환 소자를 포함하는 발광 반도체 소자 |
EP2270887B1 (en) | 2003-04-30 | 2020-01-22 | Cree, Inc. | High powered light emitter packages with compact optics |
US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
WO2005103199A1 (en) | 2004-04-27 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd. | Phosphor composition and method for producing the same, and light-emitting device using the same |
JP4128564B2 (ja) * | 2004-04-27 | 2008-07-30 | 松下電器産業株式会社 | 発光装置 |
US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
CN103361046B (zh) | 2005-04-01 | 2016-02-03 | 三菱化学株式会社 | 无机功能材料原料用合金粉末及荧光体 |
JP2007049114A (ja) | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
US7262439B2 (en) | 2005-11-22 | 2007-08-28 | Lumination Llc | Charge compensated nitride phosphors for use in lighting applications |
US7859182B2 (en) | 2005-08-31 | 2010-12-28 | Lumination Llc | Warm white LED-based lamp incoporating divalent EU-activated silicate yellow emitting phosphor |
JP4832995B2 (ja) * | 2005-09-01 | 2011-12-07 | シャープ株式会社 | 発光装置 |
CN101351891B (zh) | 2005-12-22 | 2014-11-19 | 科锐公司 | 照明装置 |
NL2000033C1 (nl) * | 2006-03-20 | 2007-09-21 | Univ Eindhoven Tech | Inrichting voor het omzetten van elektromagnetische stralingsenergie in elektrische energie en werkwijze ter vervaardiging van een dergelijke inrichting. |
JP5239182B2 (ja) * | 2006-03-27 | 2013-07-17 | 三菱化学株式会社 | 蛍光体及びそれを使用した発光装置 |
JP2007312374A (ja) * | 2006-04-19 | 2007-11-29 | Mitsubishi Chemicals Corp | カラー画像表示装置 |
TW200807104A (en) * | 2006-04-19 | 2008-02-01 | Mitsubishi Chem Corp | Color image display device |
EP3422425B1 (en) * | 2006-04-24 | 2022-02-23 | CreeLED, Inc. | Side-view surface mount white led |
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JP5141107B2 (ja) * | 2006-06-27 | 2013-02-13 | 三菱化学株式会社 | 照明装置 |
KR101258229B1 (ko) * | 2006-06-30 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
JP5100059B2 (ja) * | 2006-08-24 | 2012-12-19 | スタンレー電気株式会社 | 蛍光体、その製造方法およびそれを用いた発光装置 |
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TWI458805B (zh) * | 2006-09-29 | 2014-11-01 | Dowa Electronics Materials Co | 氮化物螢光體或氧氮化物螢光體之製造方法 |
CN101220272B (zh) * | 2006-12-20 | 2012-08-29 | Nec照明株式会社 | 发红光的氮化物荧光材料及使用其的白光发光装置 |
CN110364598A (zh) * | 2019-06-20 | 2019-10-22 | 华灿光电(苏州)有限公司 | 发光二极管外延片及其制作方法 |
CN116462497A (zh) * | 2023-03-16 | 2023-07-21 | 河北光兴半导体技术有限公司 | 一种Tb3+掺杂的铝酸盐绿色荧光陶瓷及其制备方法和应用 |
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JP2011155297A (ja) | 2011-08-11 |
JP4559496B2 (ja) | 2010-10-06 |
JP2008016861A (ja) | 2008-01-24 |
JP5604482B2 (ja) | 2014-10-08 |
JP4128564B2 (ja) | 2008-07-30 |
JP2006049799A (ja) | 2006-02-16 |
JP2007027796A (ja) | 2007-02-01 |
JP4558808B2 (ja) | 2010-10-06 |
KR20110016506A (ko) | 2011-02-17 |
ATE539135T1 (de) | 2012-01-15 |
JP3940162B2 (ja) | 2007-07-04 |
JP2008187188A (ja) | 2008-08-14 |
JP2013021339A (ja) | 2013-01-31 |
JP2008169395A (ja) | 2008-07-24 |
ATE546506T1 (de) | 2012-03-15 |
JP2008177592A (ja) | 2008-07-31 |
JP5171981B2 (ja) | 2013-03-27 |
TWI394815B (zh) | 2013-05-01 |
TW200944577A (en) | 2009-11-01 |
JP4094047B2 (ja) | 2008-06-04 |
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