ATE468414T1 - Pulver für interne elektroden von mehrschichtigen keramikkondensatoren - Google Patents

Pulver für interne elektroden von mehrschichtigen keramikkondensatoren

Info

Publication number
ATE468414T1
ATE468414T1 AT08005728T AT08005728T ATE468414T1 AT E468414 T1 ATE468414 T1 AT E468414T1 AT 08005728 T AT08005728 T AT 08005728T AT 08005728 T AT08005728 T AT 08005728T AT E468414 T1 ATE468414 T1 AT E468414T1
Authority
AT
Austria
Prior art keywords
powder
internal electrodes
ceramic capacitors
layer ceramic
weight
Prior art date
Application number
AT08005728T
Other languages
English (en)
Inventor
Cesur Celik
Serge Grenier
Original Assignee
Canadian Electronics Powders C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canadian Electronics Powders C filed Critical Canadian Electronics Powders C
Application granted granted Critical
Publication of ATE468414T1 publication Critical patent/ATE468414T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0433—Nickel- or cobalt-based alloys
AT08005728T 2001-10-18 2002-10-18 Pulver für interne elektroden von mehrschichtigen keramikkondensatoren ATE468414T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA002359347A CA2359347A1 (en) 2001-10-18 2001-10-18 Laminated ceramic capacitor internal electrode material

Publications (1)

Publication Number Publication Date
ATE468414T1 true ATE468414T1 (de) 2010-06-15

Family

ID=4170291

Family Applications (2)

Application Number Title Priority Date Filing Date
AT08005728T ATE468414T1 (de) 2001-10-18 2002-10-18 Pulver für interne elektroden von mehrschichtigen keramikkondensatoren
AT02801272T ATE392488T1 (de) 2001-10-18 2002-10-18 Pulver für die interne elektrode eines laminierten keramikkondensators

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT02801272T ATE392488T1 (de) 2001-10-18 2002-10-18 Pulver für die interne elektrode eines laminierten keramikkondensators

Country Status (9)

Country Link
US (2) US7277268B2 (de)
EP (2) EP1956103B8 (de)
JP (1) JP2005505695A (de)
KR (1) KR100950127B1 (de)
CN (1) CN1324154C (de)
AT (2) ATE468414T1 (de)
CA (3) CA2359347A1 (de)
DE (2) DE60236469D1 (de)
WO (1) WO2003033752A1 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7224570B2 (en) * 2004-06-28 2007-05-29 Kyocera Corporation Process for preparing multilayer ceramic capacitor and the multilayer ceramic capacitor
CA2514491C (en) 2004-09-17 2012-07-03 Sulzer Metco Ag A spray powder
JP2007042688A (ja) * 2005-07-29 2007-02-15 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサ内部電極用ニッケル粉及び該ニッケル粉からなる積層セラミックコンデンサ
US7699944B2 (en) * 2008-05-06 2010-04-20 Honeywell International Inc. Intermetallic braze alloys and methods of repairing engine components
CN101658929B (zh) * 2009-09-06 2011-03-23 宁波广博纳米材料有限公司 用于制备片式多层陶瓷电容器终端电极的铜镍合金粉
JP5527404B2 (ja) * 2010-03-16 2014-06-18 株式会社村田製作所 積層セラミック電子部品
KR101581925B1 (ko) * 2011-02-14 2015-12-31 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 콘덴서 및 적층 세라믹 콘덴서의 제조방법
CN103403822B (zh) 2011-03-03 2016-08-10 株式会社村田制作所 层叠陶瓷电容器
CN103077822A (zh) * 2011-10-26 2013-05-01 东莞华科电子有限公司 导电金属组成物、导电电极以及包含其的积层陶瓷电容器
KR101288151B1 (ko) * 2011-11-25 2013-07-19 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR101532116B1 (ko) * 2011-12-06 2015-06-29 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
JP5817636B2 (ja) * 2012-04-20 2015-11-18 昭栄化学工業株式会社 金属粉末の製造方法
JP6003988B2 (ja) 2012-08-07 2016-10-05 株式会社村田製作所 積層セラミックコンデンサの製造方法
KR101607536B1 (ko) * 2012-08-07 2016-03-30 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 콘덴서 및 적층 세라믹 콘덴서의 제조방법
JP5952149B2 (ja) * 2012-09-27 2016-07-13 住友電気工業株式会社 金属多孔体及びその製造方法
KR101689491B1 (ko) 2012-11-20 2016-12-23 제이에프이미네라르 가부시키가이샤 니켈 분말, 도전 페이스트 및 적층 세라믹 전자 부품
JP6094596B2 (ja) * 2012-12-18 2017-03-15 株式会社村田製作所 積層セラミック電子部品
CN103228110B (zh) * 2013-03-01 2016-01-06 溧阳市新力机械铸造有限公司 印刷电路板的线路阻焊工艺
CN103200783B (zh) * 2013-03-01 2015-11-25 溧阳市新力机械铸造有限公司 印刷电路板的线路阻焊方法
CN103146251B (zh) * 2013-03-01 2014-12-31 溧阳市新力机械铸造有限公司 一种纳米金-锡-铜合金导电油墨的制备方法
CN103146250B (zh) * 2013-03-01 2014-12-31 溧阳市新力机械铸造有限公司 一种纳米银锡铜合金导电油墨的制备方法
CN105793938B (zh) * 2013-12-10 2019-04-12 株式会社村田制作所 层叠陶瓷电容器以及层叠陶瓷电容器的制造方法
JP6099601B2 (ja) 2014-02-17 2017-03-22 国立大学法人高知大学 ニッケル粉の製造方法
CN104332250A (zh) * 2014-10-09 2015-02-04 中国船舶重工集团公司第七一二研究所 一种叠层压电陶瓷扬声器内电极银钯浆料的制备方法
CN107206502B (zh) 2015-01-22 2019-08-09 住友金属矿山株式会社 镍粉的制造方法
RU2732888C2 (ru) * 2015-03-18 2020-09-24 Материон Корпорейшн Магнитные медные сплавы
JP6558084B2 (ja) * 2015-06-05 2019-08-14 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
JP6558083B2 (ja) * 2015-06-05 2019-08-14 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
JP2017155265A (ja) 2016-02-29 2017-09-07 住友金属鉱山株式会社 ニッケル粉の製造方法
US10770227B2 (en) * 2017-11-22 2020-09-08 Samsung Electro-Mechanics Co., Ltd. Capacitor and board having the same
KR102078016B1 (ko) 2018-04-10 2020-04-07 삼성전기주식회사 적층형 커패시터
KR102217288B1 (ko) * 2018-08-16 2021-02-19 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR102140622B1 (ko) 2018-08-23 2020-08-03 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR102147408B1 (ko) 2018-08-23 2020-08-24 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR20190121210A (ko) 2018-10-17 2019-10-25 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
US11557432B2 (en) * 2019-04-22 2023-01-17 Taiyo Yuden Co., Ltd. Ceramic electronic device, circuit substrate and manufacturing method of ceramic electronic device
CN112080666A (zh) * 2019-06-12 2020-12-15 深圳市中科量能科技发展有限公司 一种具有高导电性能的复合材料的制作配方及制作方法
KR20210012444A (ko) 2019-07-25 2021-02-03 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
US11715602B2 (en) * 2019-08-02 2023-08-01 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component
KR20210069280A (ko) * 2019-12-03 2021-06-11 삼성전기주식회사 적층형 전자 부품
CN111041270A (zh) * 2019-12-30 2020-04-21 南通南平电子科技有限公司 一种高稳定高效车载电容导针
CN113345715B (zh) * 2020-03-02 2023-07-21 禾伸堂企业股份有限公司 无引线堆叠陶瓷电容器
WO2021194299A1 (ko) * 2020-03-26 2021-09-30 주식회사 아모그린텍 전극 조성물, 이를 이용한 전자부품 제조방법 및 이로 구현된 전자부품
JP7348890B2 (ja) 2020-10-30 2023-09-21 太陽誘電株式会社 セラミック電子部品およびその製造方法
CN112322926B (zh) * 2020-11-16 2021-12-03 福州大学 一种Cu-Ti-Si-Co-La铜合金材料及其制备方法
KR20220067953A (ko) * 2020-11-18 2022-05-25 삼성전기주식회사 적층형 전자 부품
KR20220068568A (ko) * 2020-11-19 2022-05-26 삼성전기주식회사 적층형 전자 부품
JP2022116729A (ja) * 2021-01-29 2022-08-10 Tdk株式会社 電子部品
KR20220131609A (ko) * 2021-03-22 2022-09-29 삼성전기주식회사 적층 세라믹 전자부품
JP2022157148A (ja) 2021-03-31 2022-10-14 太陽誘電株式会社 セラミック電子部品およびその製造方法
KR20230031623A (ko) 2021-08-27 2023-03-07 삼성전기주식회사 커패시터 부품 및 커패시터 부품의 제조 방법

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3502463A (en) * 1966-01-03 1970-03-24 Iit Res Inst Nickel base alloys and process for their manufacture
US3872360A (en) * 1973-01-08 1975-03-18 Du Pont Capacitors with nickel containing electrodes
US4060663A (en) * 1974-07-24 1977-11-29 Trw Inc. Electrical resistor glaze composition and resistor
DE2655567C2 (de) * 1976-12-08 1986-10-09 Erie Technological Products Inc., Erie, Pa. Einstückiger Schichtkondensator und Verfahren zu seiner Herstellung
US4241378A (en) * 1978-06-12 1980-12-23 Erie Technological Products, Inc. Base metal electrode capacitor and method of making the same
US4692305A (en) * 1985-11-05 1987-09-08 Perkin-Elmer Corporation Corrosion and wear resistant alloy
JPH0320907A (ja) 1989-06-16 1991-01-29 Kawasaki Steel Corp 導電ペースト
JPH0378906A (ja) * 1989-08-23 1991-04-04 Furukawa Electric Co Ltd:The 導電性ペースト
JP2643520B2 (ja) 1990-02-23 1997-08-20 旭化成工業株式会社 銀含有合金粉末ならびに該粉末を用いた導電性ペースト
JPH07109723B2 (ja) 1990-03-19 1995-11-22 旭化成工業株式会社 高温焼成用組成物及びペースト
JPH04185415A (ja) 1990-11-20 1992-07-02 Hitachi Metals Ltd 耐食耐摩耗性焼結合金からなるライニング層を有する複合シリンダ
DE4201937C2 (de) * 1991-01-25 1997-05-22 Murata Manufacturing Co Piezoelektrisches laminiertes Stellglied
JP3223199B2 (ja) * 1991-10-25 2001-10-29 ティーディーケイ株式会社 多層セラミック部品の製造方法および多層セラミック部品
US5319517A (en) 1992-03-27 1994-06-07 Tdk Corporation Multilayer ceramic chip capacitor
US5470373A (en) * 1993-11-15 1995-11-28 The United States Of America As Represented By The Secretary Of The Navy Oxidation resistant copper
US5759230A (en) * 1995-11-30 1998-06-02 The United States Of America As Represented By The Secretary Of The Navy Nanostructured metallic powders and films via an alcoholic solvent process
ATE259000T1 (de) * 1996-06-25 2004-02-15 Castolin Sa Werkstoff in pulver- oder drahtform auf nickelbasis für eine beschichtung sowie verfahren dazu
US6679937B1 (en) * 1997-02-24 2004-01-20 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
EP1007308B1 (de) * 1997-02-24 2003-11-12 Superior Micropowders LLC Aerosolverfahren und -gerät, teilchenförmige produkte, und daraus hergestellte elektronische geräte
JPH11124686A (ja) * 1997-08-13 1999-05-11 Nkk Corp 耐黒変性、耐食性、塗料密着性および潤滑性に優れたクロメート処理亜鉛系めっき鋼板およびその製造方法
JP3874041B2 (ja) * 1997-08-18 2007-01-31 Ｔｄｋ株式会社 Ｃｒ複合電子部品とその製造方法
JP3640511B2 (ja) * 1997-09-05 2005-04-20 Ｊｆｅミネラル株式会社 ニッケル超微粉
JPH1192807A (ja) * 1997-09-19 1999-04-06 Sumitomo Metal Mining Co Ltd ニッケルタングステン合金粉末およびその製造方法
JPH11124606A (ja) 1997-10-22 1999-05-11 Sumitomo Metal Mining Co Ltd ニッケル銅合金粉末およびその製造方法
JP2945644B2 (ja) 1997-12-12 1999-09-06 三井金属鉱業株式会社 ニッケル微粉末及びその製造方法
JP2000269162A (ja) * 1999-03-13 2000-09-29 Tamon Miyakai 集積回路用部材及びその製造方法
US6185087B1 (en) * 1999-04-08 2001-02-06 Kemet Electronics Corp. Multilayer ceramic chip capacitor with high reliability compatible with nickel electrodes
JP3680684B2 (ja) * 2000-03-06 2005-08-10 株式会社村田製作所 絶縁体磁器、セラミック多層基板、セラミック電子部品及び積層セラミック電子部品
SG94805A1 (en) * 2000-05-02 2003-03-18 Shoei Chemical Ind Co Method for preparing metal powder

Also Published As

Publication number Publication date
DE60226169T2 (de) 2009-05-07
EP1956103B8 (de) 2010-12-15
CA2756150A1 (en) 2003-04-24
WO2003033752A1 (en) 2003-04-24
US7277268B2 (en) 2007-10-02
US7857886B2 (en) 2010-12-28
EP1451381B1 (de) 2008-04-16
EP1451381A1 (de) 2004-09-01
CA2463926C (en) 2011-12-20
EP1956103A1 (de) 2008-08-13
JP2005505695A (ja) 2005-02-24
ATE392488T1 (de) 2008-05-15
EP1956103B1 (de) 2010-05-19
CA2463926A1 (en) 2003-04-24
DE60236469D1 (de) 2010-07-01
CN1324154C (zh) 2007-07-04
CA2359347A1 (en) 2003-04-18
DE60226169D1 (de) 2008-05-29
CN1571855A (zh) 2005-01-26
US20040256603A1 (en) 2004-12-23
US20080055818A1 (en) 2008-03-06
KR20040062566A (ko) 2004-07-07
CA2756150C (en) 2013-04-02
KR100950127B1 (ko) 2010-03-30

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