WO2007045191A3 - Lead-free solder alloy - Google Patents

Lead-free solder alloy Download PDF

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Publication number
WO2007045191A3
WO2007045191A3 PCT/CZ2006/000067 CZ2006000067W WO2007045191A3 WO 2007045191 A3 WO2007045191 A3 WO 2007045191A3 CZ 2006000067 W CZ2006000067 W CZ 2006000067W WO 2007045191 A3 WO2007045191 A3 WO 2007045191A3
Authority
WO
WIPO (PCT)
Prior art keywords
alloy
lead
free solder
solder alloy
tin
Prior art date
Application number
PCT/CZ2006/000067
Other languages
French (fr)
Other versions
WO2007045191A2 (en
Inventor
Jan Jenik
Original Assignee
Jan Jenik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jan Jenik filed Critical Jan Jenik
Publication of WO2007045191A2 publication Critical patent/WO2007045191A2/en
Publication of WO2007045191A3 publication Critical patent/WO2007045191A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Abstract

The present invention relates to a lead-free solder alloy on base of alloy from a group alloy comprising of an alloy of bismuth and tin, an alloy of copper, nickel and tin, and an alloy of copper, silver and tin, containing 0.005 to 1 wt.% phosphorous.
PCT/CZ2006/000067 2005-10-19 2006-10-16 Lead-free solder alloy WO2007045191A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CZ20050659A CZ297596B6 (en) 2005-10-19 2005-10-19 Lead-free solder
CZPV2005-659 2005-10-19

Publications (2)

Publication Number Publication Date
WO2007045191A2 WO2007045191A2 (en) 2007-04-26
WO2007045191A3 true WO2007045191A3 (en) 2007-11-29

Family

ID=37671988

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CZ2006/000067 WO2007045191A2 (en) 2005-10-19 2006-10-16 Lead-free solder alloy

Country Status (2)

Country Link
CZ (1) CZ297596B6 (en)
WO (1) WO2007045191A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9735126B2 (en) * 2011-06-07 2017-08-15 Infineon Technologies Ag Solder alloys and arrangements
DK3052931T3 (en) 2013-09-30 2023-10-30 Cytiva Sweden Ab Slurry Transfer Procedure
JP2017509489A (en) 2014-02-20 2017-04-06 ハネウェル・インターナショナル・インコーポレーテッド Lead-free solder composition

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0336575A1 (en) * 1988-03-31 1989-10-11 COOKSON GROUP plc Low toxicity alloy compositions for joining and sealing
JPH1034376A (en) * 1996-07-26 1998-02-10 Nippon Genma:Kk Lead-free solder
US5980822A (en) * 1997-02-15 1999-11-09 Samsung Electronics Co., Ltd. Leadless alloy for soldering
JP2000015476A (en) * 1998-06-29 2000-01-18 Ishikawa Kinzoku Kk Lead-free solder
JP2000288772A (en) * 1999-02-02 2000-10-17 Nippon Genma:Kk Lead-free solder
WO2001003878A1 (en) * 1999-07-07 2001-01-18 Multicore Solders Limited Solder alloy
US20020051728A1 (en) * 2000-03-14 2002-05-02 Koji Sato Solder ball and method for producing same
EP1273384A1 (en) * 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Lead-free solder alloy
US20030024733A1 (en) * 2001-03-06 2003-02-06 Hitachi Cable Ltd. Lead-free solder, and connection lead and electrical component using said lead-free solder
WO2005048303A2 (en) * 2003-11-06 2005-05-26 Indium Corporation Of America Anti-tombstoning lead free alloys for surface mount reflow soldering

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
JP4338854B2 (en) * 1999-11-25 2009-10-07 三井金属鉱業株式会社 Tin-bismuth lead-free solder
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0336575A1 (en) * 1988-03-31 1989-10-11 COOKSON GROUP plc Low toxicity alloy compositions for joining and sealing
JPH1034376A (en) * 1996-07-26 1998-02-10 Nippon Genma:Kk Lead-free solder
US5980822A (en) * 1997-02-15 1999-11-09 Samsung Electronics Co., Ltd. Leadless alloy for soldering
JP2000015476A (en) * 1998-06-29 2000-01-18 Ishikawa Kinzoku Kk Lead-free solder
JP2000288772A (en) * 1999-02-02 2000-10-17 Nippon Genma:Kk Lead-free solder
WO2001003878A1 (en) * 1999-07-07 2001-01-18 Multicore Solders Limited Solder alloy
US20020051728A1 (en) * 2000-03-14 2002-05-02 Koji Sato Solder ball and method for producing same
US20030024733A1 (en) * 2001-03-06 2003-02-06 Hitachi Cable Ltd. Lead-free solder, and connection lead and electrical component using said lead-free solder
EP1273384A1 (en) * 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Lead-free solder alloy
WO2005048303A2 (en) * 2003-11-06 2005-05-26 Indium Corporation Of America Anti-tombstoning lead free alloys for surface mount reflow soldering

Also Published As

Publication number Publication date
CZ2005659A3 (en) 2007-01-10
WO2007045191A2 (en) 2007-04-26
CZ297596B6 (en) 2007-01-10

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