ATE463537T1 - Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung - Google Patents
Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtungInfo
- Publication number
- ATE463537T1 ATE463537T1 AT04773343T AT04773343T ATE463537T1 AT E463537 T1 ATE463537 T1 AT E463537T1 AT 04773343 T AT04773343 T AT 04773343T AT 04773343 T AT04773343 T AT 04773343T AT E463537 T1 ATE463537 T1 AT E463537T1
- Authority
- AT
- Austria
- Prior art keywords
- semiconductor device
- per molecule
- aryl group
- group per
- organopolysiloxane
- Prior art date
Links
- 229920001296 polysiloxane Polymers 0.000 title abstract 6
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 125000003118 aryl group Chemical group 0.000 abstract 3
- 125000003342 alkenyl group Chemical group 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000007809 chemical reaction catalyst Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 238000006459 hydrosilylation reaction Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- -1 siloxane units Chemical group 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000002834 transmittance Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003343622A JP4908736B2 (ja) | 2003-10-01 | 2003-10-01 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
PCT/JP2004/013724 WO2005033207A1 (en) | 2003-10-01 | 2004-09-14 | Curable organopolysiloxane composition and semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE463537T1 true ATE463537T1 (de) | 2010-04-15 |
Family
ID=34419307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04773343T ATE463537T1 (de) | 2003-10-01 | 2004-09-14 | Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung |
Country Status (9)
Country | Link |
---|---|
US (1) | US7527871B2 (de) |
EP (1) | EP1670863B1 (de) |
JP (1) | JP4908736B2 (de) |
KR (3) | KR20150006490A (de) |
CN (1) | CN100378172C (de) |
AT (1) | ATE463537T1 (de) |
DE (1) | DE602004026456D1 (de) |
TW (1) | TWI341857B (de) |
WO (1) | WO2005033207A1 (de) |
Cited By (3)
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---|---|---|---|---|
US9593277B2 (en) | 2014-02-04 | 2017-03-14 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
US9909007B2 (en) | 2013-08-29 | 2018-03-06 | Dow Corning Corporation | Curable silicone composition, cured product thereof, and optical semiconductor device |
US9944759B2 (en) | 2014-02-04 | 2018-04-17 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
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- 2004-09-14 KR KR1020147009113A patent/KR101699383B1/ko active IP Right Grant
- 2004-09-14 KR KR1020067006400A patent/KR101499709B1/ko active IP Right Grant
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Cited By (3)
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US9909007B2 (en) | 2013-08-29 | 2018-03-06 | Dow Corning Corporation | Curable silicone composition, cured product thereof, and optical semiconductor device |
US9593277B2 (en) | 2014-02-04 | 2017-03-14 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
US9944759B2 (en) | 2014-02-04 | 2018-04-17 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
Also Published As
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TW200524987A (en) | 2005-08-01 |
KR20140064931A (ko) | 2014-05-28 |
TWI341857B (en) | 2011-05-11 |
KR20060096429A (ko) | 2006-09-11 |
WO2005033207A1 (en) | 2005-04-14 |
JP4908736B2 (ja) | 2012-04-04 |
DE602004026456D1 (de) | 2010-05-20 |
KR101499709B1 (ko) | 2015-03-06 |
JP2005105217A (ja) | 2005-04-21 |
KR101699383B1 (ko) | 2017-01-24 |
US7527871B2 (en) | 2009-05-05 |
EP1670863A1 (de) | 2006-06-21 |
EP1670863B1 (de) | 2010-04-07 |
CN1863875A (zh) | 2006-11-15 |
KR20150006490A (ko) | 2015-01-16 |
US20070112147A1 (en) | 2007-05-17 |
CN100378172C (zh) | 2008-04-02 |
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