ATE378692T1 - Halbleiterbauelement mit zweifachem gate und dessen herstellungsverfahren - Google Patents

Halbleiterbauelement mit zweifachem gate und dessen herstellungsverfahren

Info

Publication number
ATE378692T1
ATE378692T1 AT01911561T AT01911561T ATE378692T1 AT E378692 T1 ATE378692 T1 AT E378692T1 AT 01911561 T AT01911561 T AT 01911561T AT 01911561 T AT01911561 T AT 01911561T AT E378692 T1 ATE378692 T1 AT E378692T1
Authority
AT
Austria
Prior art keywords
gate
silicon oxide
semiconductor body
production method
oxide layer
Prior art date
Application number
AT01911561T
Other languages
English (en)
Inventor
Youri Ponomarev
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE378692T1 publication Critical patent/ATE378692T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78645Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
    • H01L29/78648Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66545Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Memories (AREA)
  • Junction Field-Effect Transistors (AREA)
AT01911561T 2000-02-29 2001-01-31 Halbleiterbauelement mit zweifachem gate und dessen herstellungsverfahren ATE378692T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00200717 2000-02-29

Publications (1)

Publication Number Publication Date
ATE378692T1 true ATE378692T1 (de) 2007-11-15

Family

ID=8171125

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01911561T ATE378692T1 (de) 2000-02-29 2001-01-31 Halbleiterbauelement mit zweifachem gate und dessen herstellungsverfahren

Country Status (10)

Country Link
US (1) US6621124B2 (de)
EP (1) EP1179218B1 (de)
JP (1) JP2003526210A (de)
KR (1) KR100694331B1 (de)
CN (1) CN1208841C (de)
AT (1) ATE378692T1 (de)
DE (1) DE60131334T2 (de)
MY (1) MY124533A (de)
TW (1) TW478116B (de)
WO (1) WO2001065609A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007504660A (ja) * 2003-09-03 2007-03-01 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ダブルゲート電界効果トランジスタ装置を製造する方法、及びそのようなダブルゲート電界効果トランジスタ装置
TWI248681B (en) * 2004-03-29 2006-02-01 Imec Inter Uni Micro Electr Method for fabricating self-aligned source and drain contacts in a double gate FET with controlled manufacturing of a thin Si or non-Si channel
CN100397597C (zh) * 2004-06-11 2008-06-25 旺宏电子股份有限公司 金属氧化物半导体晶体管的制造方法以及存储器元件的制造方法
US7659169B2 (en) 2004-09-02 2010-02-09 Nxp B.V. Semiconductor device and method of manufacturing thereof
WO2006070310A1 (en) * 2004-12-28 2006-07-06 Koninklijke Philips Electronics N.V. Method for the manufacture of a semiconductor device and a semiconductor device obtained through it
US7709313B2 (en) * 2005-07-19 2010-05-04 International Business Machines Corporation High performance capacitors in planar back gates CMOS
US8017933B2 (en) * 2008-06-30 2011-09-13 Intel Corporation Compositionally-graded quantum-well channels for semiconductor devices
EP2190022B1 (de) * 2008-11-20 2013-01-02 Hitachi Ltd. Spinpolarisierte Ladungsträgervorrichtung
US9466729B1 (en) * 2015-05-08 2016-10-11 Qualcomm Incorporated Etch stop region based fabrication of bonded semiconductor structures
JP7395273B2 (ja) * 2019-07-02 2023-12-11 ローム株式会社 窒化物半導体装置およびその製造方法
US11424262B2 (en) * 2020-03-17 2022-08-23 Micron Technology, Inc. Microelectronic devices including staircase structures, and related memory devices and electronic systems

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04307972A (ja) * 1991-04-05 1992-10-30 Fujitsu Ltd 半導体装置の製造方法
JP2603886B2 (ja) * 1991-05-09 1997-04-23 日本電信電話株式会社 薄層soi型絶縁ゲート型電界効果トランジスタの製造方法
US5302842A (en) * 1992-07-20 1994-04-12 Bell Communications Research, Inc. Field-effect transistor formed over gate electrode
US5461250A (en) * 1992-08-10 1995-10-24 International Business Machines Corporation SiGe thin film or SOI MOSFET and method for making the same
JPH07211916A (ja) * 1994-01-19 1995-08-11 Sony Corp トランジスタ素子及びその作製方法
US5705405A (en) * 1994-09-30 1998-01-06 Sgs-Thomson Microelectronics, Inc. Method of making the film transistor with all-around gate electrode
US5736435A (en) * 1995-07-03 1998-04-07 Motorola, Inc. Process for fabricating a fully self-aligned soi mosfet
JP3409542B2 (ja) * 1995-11-21 2003-05-26 ソニー株式会社 半導体装置の製造方法
JP4332925B2 (ja) * 1999-02-25 2009-09-16 ソニー株式会社 半導体装置およびその製造方法
JP3086906B1 (ja) * 1999-05-28 2000-09-11 工業技術院長 電界効果トランジスタ及びその製造方法

Also Published As

Publication number Publication date
CN1366713A (zh) 2002-08-28
US6621124B2 (en) 2003-09-16
US20010017388A1 (en) 2001-08-30
DE60131334D1 (de) 2007-12-27
KR20010112468A (ko) 2001-12-20
MY124533A (en) 2006-06-30
JP2003526210A (ja) 2003-09-02
KR100694331B1 (ko) 2007-03-12
EP1179218A1 (de) 2002-02-13
CN1208841C (zh) 2005-06-29
DE60131334T2 (de) 2008-09-11
TW478116B (en) 2002-03-01
WO2001065609A1 (en) 2001-09-07
EP1179218B1 (de) 2007-11-14

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