ATE360051T1 - Poliersystem und verfahren zu seiner verwendung - Google Patents

Poliersystem und verfahren zu seiner verwendung

Info

Publication number
ATE360051T1
ATE360051T1 AT00953960T AT00953960T ATE360051T1 AT E360051 T1 ATE360051 T1 AT E360051T1 AT 00953960 T AT00953960 T AT 00953960T AT 00953960 T AT00953960 T AT 00953960T AT E360051 T1 ATE360051 T1 AT E360051T1
Authority
AT
Austria
Prior art keywords
polishing
substrate
acids
layer
metal layer
Prior art date
Application number
AT00953960T
Other languages
English (en)
Inventor
Shumin Wang
Kaufman Vlasta Brusic
Steven K Grumbine
Renjie Zhou
Isaac K Cherian
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE360051T1 publication Critical patent/ATE360051T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT00953960T 1999-08-13 2000-08-10 Poliersystem und verfahren zu seiner verwendung ATE360051T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14881399P 1999-08-13 1999-08-13

Publications (1)

Publication Number Publication Date
ATE360051T1 true ATE360051T1 (de) 2007-05-15

Family

ID=22527505

Family Applications (2)

Application Number Title Priority Date Filing Date
AT00953960T ATE360051T1 (de) 1999-08-13 2000-08-10 Poliersystem und verfahren zu seiner verwendung
AT00952726T ATE292167T1 (de) 1999-08-13 2000-08-10 Poliersystem mit stopmittel und verfahren zu seiner verwendung

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT00952726T ATE292167T1 (de) 1999-08-13 2000-08-10 Poliersystem mit stopmittel und verfahren zu seiner verwendung

Country Status (14)

Country Link
US (1) US6852632B2 (de)
EP (3) EP1218465B1 (de)
JP (5) JP4391715B2 (de)
KR (2) KR100590666B1 (de)
CN (2) CN100368496C (de)
AT (2) ATE360051T1 (de)
AU (2) AU6632100A (de)
CA (2) CA2378790A1 (de)
DE (2) DE60019142T2 (de)
HK (2) HK1046422A1 (de)
IL (2) IL147234A0 (de)
MY (2) MY139997A (de)
TW (2) TW500784B (de)
WO (2) WO2001012741A1 (de)

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KR100844032B1 (ko) 1999-12-14 2008-07-04 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 귀금속 연마용 조성물
JP2001187877A (ja) * 1999-12-28 2001-07-10 Nec Corp 化学的機械的研磨用スラリー

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CA2378790A1 (en) 2001-02-22
JP2009170935A (ja) 2009-07-30
DE60034474T2 (de) 2008-01-10
JP4851174B2 (ja) 2012-01-11
CN1370207A (zh) 2002-09-18
DE60019142T2 (de) 2006-02-09
JP4391715B2 (ja) 2009-12-24
HK1046423A1 (zh) 2003-01-10
EP1218465A1 (de) 2002-07-03
JP2003507896A (ja) 2003-02-25
JP5384994B2 (ja) 2014-01-08
CN100368496C (zh) 2008-02-13
KR20020026953A (ko) 2002-04-12
IL147236A0 (en) 2002-08-14
IL147234A0 (en) 2002-08-14
KR20020020796A (ko) 2002-03-15
CN1370209A (zh) 2002-09-18
WO2001012740A1 (en) 2001-02-22
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CA2378793A1 (en) 2001-02-22
EP1218465B1 (de) 2005-03-30
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