ATE269776T1 - Bleifreies lot - Google Patents

Bleifreies lot

Info

Publication number
ATE269776T1
ATE269776T1 AT99944854T AT99944854T ATE269776T1 AT E269776 T1 ATE269776 T1 AT E269776T1 AT 99944854 T AT99944854 T AT 99944854T AT 99944854 T AT99944854 T AT 99944854T AT E269776 T1 ATE269776 T1 AT E269776T1
Authority
AT
Austria
Prior art keywords
solder
free solder
lead
amount
lead free
Prior art date
Application number
AT99944854T
Other languages
English (en)
Inventor
Tetsuro Nishimura
Original Assignee
Nihon Superior Sha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Sha Co Ltd filed Critical Nihon Superior Sha Co Ltd
Application granted granted Critical
Publication of ATE269776T1 publication Critical patent/ATE269776T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Glass Compositions (AREA)
AT99944854T 1998-10-28 1999-09-28 Bleifreies lot ATE269776T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP32448398 1998-10-28
JP32448298 1998-10-28
JP11069742A JP2000197988A (ja) 1998-03-26 1999-03-16 無鉛はんだ合金
PCT/JP1999/005275 WO2000024544A1 (fr) 1998-10-28 1999-09-28 Brasure sans plomb

Publications (1)

Publication Number Publication Date
ATE269776T1 true ATE269776T1 (de) 2004-07-15

Family

ID=27300127

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99944854T ATE269776T1 (de) 1998-10-28 1999-09-28 Bleifreies lot

Country Status (7)

Country Link
US (1) US6296722B1 (de)
EP (1) EP1043112B1 (de)
JP (1) JP2000197988A (de)
AT (1) ATE269776T1 (de)
DE (1) DE69918261T2 (de)
HK (1) HK1031844A1 (de)
WO (1) WO2000024544A1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4039653B2 (ja) * 1999-11-01 2008-01-30 千住金属工業株式会社 リードメッキ用Ｓｎ合金
EP1439024B1 (de) * 2001-08-30 2005-03-30 Sumida Corporation Bleifreie lötlegierung und diese verwendende elektronischen teile
US7251880B2 (en) * 2001-09-28 2007-08-07 Intel Corporation Method and structure for identifying lead-free solder
US6570260B1 (en) * 2002-02-15 2003-05-27 Delphi Technologies, Inc. Solder process and solder alloy therefor
US6933505B2 (en) * 2002-03-13 2005-08-23 Oy Ajat Ltd Low temperature, bump-bonded radiation imaging device
KR100395438B1 (en) * 2002-05-01 2003-08-21 Ecojoin Co Ltd Lead-free solder alloy composite
KR20040035458A (ko) * 2002-10-22 2004-04-29 희성금속 주식회사 납땜용 무연합금
US7193326B2 (en) * 2003-06-23 2007-03-20 Denso Corporation Mold type semiconductor device
JP4492231B2 (ja) * 2004-07-06 2010-06-30 セイコーエプソン株式会社 鉛フリーはんだ合金
US20060068218A1 (en) * 2004-09-28 2006-03-30 Hooghan Kultaransingh N Whisker-free lead frames
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
JP2006289434A (ja) * 2005-04-11 2006-10-26 Nihon Superior Co Ltd はんだ合金
FR2888253B1 (fr) * 2005-07-07 2007-11-23 Ind Des Poudres Spheriques Sa Alliage d'assemblage sans plomb, a base d'etain et dont l'oxydation a l'air est retardee et utilisation d'un tel alliage.
TWI465312B (zh) 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
CN1803380A (zh) * 2006-01-11 2006-07-19 黄守友 一种无铅焊料及其制备方法
JP4890221B2 (ja) * 2006-12-06 2012-03-07 株式会社日本スペリア社 ダイボンド材
WO2009051181A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
JP5058766B2 (ja) * 2007-12-07 2012-10-24 山陽特殊製鋼株式会社 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器
JP5169354B2 (ja) * 2008-03-18 2013-03-27 富士通株式会社 接合材料及びそれを用いた接合方法
US8367244B2 (en) * 2008-04-17 2013-02-05 Enovix Corporation Anode material having a uniform metal-semiconductor alloy layer
US8220692B2 (en) * 2008-04-23 2012-07-17 Senju Metal Industry Co., Ltd. Lead-free solder
JP2009071315A (ja) * 2008-10-20 2009-04-02 Sumida Corporation コイル部品
CN101412159A (zh) * 2008-11-24 2009-04-22 天津市宏远电子有限公司 热浸镀锡铜线用无铅焊料合金
US8395051B2 (en) * 2008-12-23 2013-03-12 Intel Corporation Doping of lead-free solder alloys and structures formed thereby
JP2011041970A (ja) * 2009-08-24 2011-03-03 Nihon Superior Co Ltd 鉛フリーはんだ接合材料
CN101862921B (zh) * 2010-06-25 2012-02-15 南京航空航天大学 含Pr、Sr和Ga的Sn-Cu-Ni无铅钎料
EP2695701A4 (de) * 2011-04-08 2014-09-24 Nihon Superior Co Ltd Lötlegierung
JP6292407B2 (ja) * 2011-06-17 2018-03-14 エルジー・ケム・リミテッド ソルダリングコネクター、これを含むバッテリーモジュール、及びバッテリーパック
WO2014084242A1 (ja) * 2012-11-30 2014-06-05 株式会社日本スペリア社 低融点ろう材
CN105189003A (zh) * 2013-03-13 2015-12-23 日本斯倍利亚社股份有限公司 焊剂接合物及焊剂接合方法
KR20160121562A (ko) 2014-02-20 2016-10-19 허니웰 인터내셔날 인코포레이티드 무연 솔더 조성물
AT517762A1 (de) * 2015-10-14 2017-04-15 Voestalpine Prec Strip Gmbh Schneidwerkzeug zum Trennen von Flachmaterialien
TWI820277B (zh) * 2018-12-27 2023-11-01 美商阿爾發金屬化工公司 無鉛焊料組成物
JP6649595B1 (ja) 2019-05-27 2020-02-19 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816219A (en) * 1986-07-18 1989-03-28 Nihon Speriasha Co., Ltd. Low-temperature solder composition
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
JP2667692B2 (ja) * 1988-12-29 1997-10-27 株式会社徳力本店 低融点Ａｇはんだ
JP3186178B2 (ja) * 1992-03-06 2001-07-11 田中電子工業株式会社 半導体素子用のはんだバンプ形成材料
US5837191A (en) 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
ES2224609T3 (es) * 1998-03-26 2005-03-01 Nihon Superior Sha Co., Ltd Aleacion de soldadura exenta de plomo.

Also Published As

Publication number Publication date
EP1043112A4 (de) 2003-01-02
JP2000197988A (ja) 2000-07-18
WO2000024544A1 (fr) 2000-05-04
DE69918261T2 (de) 2004-11-18
DE69918261D1 (de) 2004-07-29
EP1043112A1 (de) 2000-10-11
US6296722B1 (en) 2001-10-02
EP1043112B1 (de) 2004-06-23
HK1031844A1 (en) 2001-06-29

Similar Documents

Publication Publication Date Title
ATE269776T1 (de) Bleifreies lot
CA2288817A1 (en) Lead free solder alloy
MY138347A (en) Solder paste
KR19980068127A (ko) 납땜용 무연 합금
WO2005118213A8 (en) Solder paste and process
ATE324222T1 (de) Bleifreie zink enthaltende weichlotpaste
SG46442A1 (en) Use of silver alloys as cadmium-free brazing solder
WO2003026828A3 (en) Improved compositions, methods and devices for high temperature lead-free solder
JP3299091B2 (ja) 鉛フリーはんだ合金
US6440360B1 (en) Pb-free soldering alloy
ATE166017T1 (de) Verwendung einer kadmiumfreien silberlegierung als hartlot
JPH0994687A (ja) 鉛フリーはんだ合金
TW200519216A (en) Pb-free solder alloy, and solder material and solder joint using same
KR970006527A (ko) 저융점합금 및 그 분말을 이용한 크림땜납
CA2347194A1 (en) Pb-free soldering alloy
GB2367834A (en) Solder alloy
JPH1052791A (ja) 鉛フリーはんだ合金
JPS5770099A (en) Gold brazing filler metal
CN109277721B (zh) 一种含Ga和Nd的Sn-Cu-Ni无铅钎料
JPH09174279A (ja) はんだ合金
JPH0819892A (ja) 鉛無含有半田合金
JPS5767142A (en) Low-temperature aluminum solder
KR100509509B1 (ko) 납땜용 무연합금
JPS56127742A (en) Cu-mn alloy solder material free from generation of pinhole deficiency
CN114535860A (zh) 一种Pr或Sm强化的Sn-58Bi无铅焊料

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties