JP5058766B2 - 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器 - Google Patents
鉛フリー接合用材料を用いてはんだ付けしてなる電子機器 Download PDFInfo
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- JP5058766B2 JP5058766B2 JP2007317175A JP2007317175A JP5058766B2 JP 5058766 B2 JP5058766 B2 JP 5058766B2 JP 2007317175 A JP2007317175 A JP 2007317175A JP 2007317175 A JP2007317175 A JP 2007317175A JP 5058766 B2 JP5058766 B2 JP 5058766B2
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- H—ELECTRICITY
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
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- C21D9/50—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for welded joints
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Description
(1)はんだ合金が鉛フリーの接合用材料であって、元素Aと元素Bからなり、かつ常温平衡状態で安定相であるAmBnと、元素Bからなる組成であって、急冷凝固により元素Aを元素Bからなる常温安定相中に過飽和固溶させることを特徴とする合金で、はんだ付けによる溶解・凝固過程を経た後に平衡状態であるAmBnと、元素Bからなる組成に戻り、再度加熱するときにははんだ付け温度であっても安定相のAmBnにより強度を確保できる合金を用いてはんだ付けすることを特徴とする鉛フリー接合用材料を用いてはんだ付けしてなる電子機器。
但し、元素AはCu,Mn,Niのいずれか1種、元素BはSn,Inのいずれか1種。
(3)前記(1)または(2)に記載の電子機器が基板上に複数の素子をはんだ付けした回路、ないし3層以上の基板をはんだ付けして積層した回路であることを特徴とする鉛フリー接合用材料を用いてはんだ付けしてなる電子機器にある。
本発明に係る元素AはCu,Mn,Niを掲げる。また、元素BはSn,Inを掲げる。したがって、例えば、Cu−Sn系合金、Mn−Sn系合金、Ni−In系合金、Mn−In系合金を掲げることができる。
表1は、図3に示す3層基板のはんだ付け時のはんだ状況及び熱発生による素子の熱劣化状況を示す。表中、はんだ付け性及び熱劣化の評価については、以下のようにした。
2層目と3層目の基板2と基板3をSn系のはんだを用いた場合には、3相分の差分(一例として30℃)を加えた260℃の加熱とはんだ付けを行い、2層目と1層目の基板2と基板1を差分15℃を加えた245℃の加熱とはんだ付け、最後に1層目の基板1上の素子を230℃ではんだ付けする必要であるが、本評価では差分なしに260℃の加熱だけで全ての基板と素子はんだ付けを行い、最も熱影響が大きい2層目と3層目の基板3と基板2の位置のずれや厚さのむらを引き起こし状況で評価した。
4 素子
5 はんだ合金
6 配線
特許出願人 山陽特殊製鋼株式会社 代理人 弁理士 椎 名 彊
Claims (3)
- はんだ合金が鉛フリーの接合用材料であって、元素Aと元素Bからなり、かつ常温平衡状態で安定相であるAmBnと、元素Bからなる組成であって、急冷凝固により元素Aを元素Bからなる常温安定相中に過飽和固溶させることを特徴とする合金で、はんだ付けによる溶解・凝固過程を経た後に平衡状態であるAmBnと、元素Bからなる組成に戻り、再度加熱するときにははんだ付け温度であっても安定相のAmBnにより強度を確保できる合金を用いてはんだ付けすることを特徴とする鉛フリー接合用材料を用いてはんだ付けしてなる電子機器。
但し、元素AはCu,Mn,Niのいずれか1種、元素BはSn,Inのいずれか1種。 - 請求項1に記載の安定相AmBnの融点が元素Bの融点より高く、かつその差が150℃以上であることを特徴とする鉛フリー接合用材料を用いてはんだ付けしてなる電子機器。
- 請求項1または2に記載の電子機器が基板上に複数の素子をはんだ付けした回路、ないし3層以上の基板をはんだ付けして積層した回路であることを特徴とする鉛フリー接合用材料を用いてはんだ付けしてなる電子機器。
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JP2007317175A JP5058766B2 (ja) | 2007-12-07 | 2007-12-07 | 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器 |
CN2007801018091A CN101884254B (zh) | 2007-12-07 | 2007-12-20 | 使用焊接用无铅结合材料生产的电子设备 |
KR1020107012168A KR101362807B1 (ko) | 2007-12-07 | 2007-12-20 | 솔더링을 위해 무연 접합용 재료를 이용하여 제조된 전자기기 |
US12/744,540 US8281978B2 (en) | 2007-12-07 | 2007-12-20 | Electronic apparatus produced using lead-free bonding material for soldering |
PCT/JP2007/074558 WO2009072221A1 (ja) | 2007-12-07 | 2007-12-20 | 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器 |
TW96149943A TW200924899A (en) | 2007-12-07 | 2007-12-25 | Electronic equipment obtained by soldering with lead-free jointing material |
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JP5058766B2 (ja) * | 2007-12-07 | 2012-10-24 | 山陽特殊製鋼株式会社 | 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器 |
WO2010021268A1 (ja) | 2008-08-21 | 2010-02-25 | 株式会社村田製作所 | 電子部品装置およびその製造方法 |
JP5646230B2 (ja) * | 2009-07-22 | 2014-12-24 | 山陽特殊製鋼株式会社 | 鉛フリー接合材料およびその製造方法 |
JP5218383B2 (ja) * | 2009-12-08 | 2013-06-26 | 三菱電機株式会社 | はんだ合金の製造方法 |
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CN101884254A (zh) | 2010-11-10 |
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US8281978B2 (en) | 2012-10-09 |
US20100246148A1 (en) | 2010-09-30 |
KR101362807B1 (ko) | 2014-02-13 |
TW200924899A (en) | 2009-06-16 |
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