WO2024098506A1 - Procédé d'impression à jet d'encre d'une réserve de soudure sur une carte de circuit imprimé - Google Patents

Procédé d'impression à jet d'encre d'une réserve de soudure sur une carte de circuit imprimé Download PDF

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Publication number
WO2024098506A1
WO2024098506A1 PCT/CN2022/139056 CN2022139056W WO2024098506A1 WO 2024098506 A1 WO2024098506 A1 WO 2024098506A1 CN 2022139056 W CN2022139056 W CN 2022139056W WO 2024098506 A1 WO2024098506 A1 WO 2024098506A1
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WO
WIPO (PCT)
Prior art keywords
pcb board
solder mask
printing
code
damming
Prior art date
Application number
PCT/CN2022/139056
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English (en)
Chinese (zh)
Inventor
黄双双
陈春
罗坚
Original Assignee
惠州市金百泽电路科技有限公司
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Application filed by 惠州市金百泽电路科技有限公司 filed Critical 惠州市金百泽电路科技有限公司
Publication of WO2024098506A1 publication Critical patent/WO2024098506A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

Definitions

  • the invention relates to the technical field of PCB boards, and in particular to a method for inkjet printing solder mask on a PCB board and a processing method thereof.
  • PCBs are important electronic components. In the production process of PCBs, in order to improve welding efficiency and avoid damage to parts that do not need welding, these parts need to be protected with solder mask ink. Using inkjet printing to apply solder mask ink on the surface of printed circuit boards (PCBs) has many significant advantages.
  • Step 2 Inkjet Printing
  • the second step is inkjet printing, which uses the printed circuit board solder mask design information to grab the positioning holes or positioning pads on the board as positioning, and inkjet prints the solder mask on the circuit board according to the printed circuit board solder mask design information.
  • solder mask production is completed by inkjet printing the solder mask layer of the circuit board according to the design data, which has the following problems:
  • solder mask opening is offset, such as being too large or too small
  • a method for inkjet printing solder mask on a PCB comprising:
  • the code scanning device is used to identify the first QR code or the first bar code on the process card of the PCB board to be produced, and the production information of the PCB board is obtained and synchronized with the AOI;
  • the inspection data is stored in the same position of the server as the production information and forms a code corresponding to the corresponding second QR code or second bar code;
  • the AOI detection method is:
  • inspection data includes actual graphic data of good PCB board and actual graphic data of defective PCB board;
  • a VSR repair machine is used to determine whether a defective PCB board can be repaired. If so, the repaired PCB board is recorded as a repaired good PCB board, and AOI is used to re-inspect the PCB board and store the actual graphic data of the repaired good PCB board in the corresponding position of the server.
  • the defective PCB board is recorded as a defective PCB board with a scrap unit, and a special scrap mark is marked in a fixed area of the scrap unit.
  • the PCB board is re-inspected using AOI and the actual graphic data of the defective PCB board with the scrap unit is stored in the corresponding position of the server.
  • the method for printing solder mask on a defective PCB board with a scrap unit is as follows:
  • test data at least includes actual graphic information such as line width, pad size, expansion and contraction, and graphic position of the corresponding test PCB board.
  • the inkjet printing method is:
  • the dam printing program includes a circuit dam design and a solder resist window dam design, the circuit dam design is tangent to the edges on both sides of the circuit pattern, and the solder resist window dam design is tangent to the solder resist window pattern.
  • the dam width design can be designed according to the characteristics of the solder resist printing ink and the solder resist thickness requirement, and the dam width is between 100 ⁇ m and 300 ⁇ m.
  • the PCB board and the AOI detection data are made to correspond one to one.
  • the solder mask printing program uses the actual graphic information output by the AOI detection of the PCB board as a reference, and the corresponding damming printing graphics and non-damming area solder mask printing graphics are designed.
  • the damming printing program and the non-damming area solder mask printing program are respectively generated by referring to the damming printing graphics and the non-damming area solder mask printing graphics through computer software.
  • the damming printing program is in front, and the non-damming area solder mask printing program is merged into one solder mask printing program in the back, and then the inkjet solder mask printing is used.
  • the printer uses a high-definition positioning camera to scan the second QR code or the second barcode on the product to be inkjet printed with solder mask, automatically retrieves the solder mask printing program corresponding to the PCB board, and imports it into the inkjet solder mask printer system for inkjet printed solder mask production.
  • the above technical solution can effectively avoid the use of a fixed design solder mask printing program, which does not take into account the actual graphic differences, expansion and shrinkage of PCB board production, resulting in the problem that the solder mask opening window of the inkjet printed solder mask is offset or too large or too small, affecting the client's device welding quality, and the difference between the actual line width of the PCB board and the designed line width, resulting in the undesirable problem of red line edges in the inkjet printed solder mask, which greatly improves the accuracy of the inkjet printed solder mask window.
  • the second damming printing program is in front, and the second non-damming area solder resist printing program is merged into a second solder resist printing program for in
  • FIG. 1 is a schematic flow chart of a method for inkjet printing solder mask on a PCB board according to the present invention.
  • a method for inkjet printing solder mask on a PCB board includes:
  • the code scanning device is used to identify the first QR code or the first bar code on the process card of the PCB board to be produced, and the production information of the PCB board is obtained and synchronized with the AOI;
  • the inspection data is stored in the same position of the server as the production information and forms a code corresponding to the corresponding second QR code or second bar code;
  • the AOI detection method is:
  • inspection data includes actual graphic data of good PCB board and actual graphic data of defective PCB board;
  • a VSR repair machine is used to determine whether a defective PCB board can be repaired. If so, the repaired PCB board is recorded as a repaired good PCB board, and AOI is used to re-inspect the PCB board and store the actual graphic data of the repaired good PCB board in the corresponding position of the server.
  • the defective PCB board is recorded as a defective PCB board with a scrap unit, and a special scrap mark is marked in a fixed area of the scrap unit.
  • the PCB board is re-inspected using AOI and the actual graphic data of the defective PCB board with the scrap unit is stored in the corresponding position of the server.
  • the method for printing solder mask on a defective PCB board with a scrap unit is as follows:
  • test data at least includes actual graphic information such as line width, pad size, expansion and contraction, and graphic position of the corresponding test PCB board.
  • the inkjet printing method is:
  • the dam printing procedure includes a circuit dam design and a solder resist window dam design
  • the circuit dam design is tangent to the edges of both sides of the circuit pattern
  • the solder resist window dam design is tangent to the solder resist window pattern
  • the dam width can be designed according to the characteristics of solder resist printing ink and the solder resist thickness requirement, and the dam width is between 100 ⁇ m and 300 ⁇ m.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the scanning device is used to identify the first QR code or the first bar code on the process card of the PCB board to be produced, and the production information of the PCB board is obtained and synchronized with the AOI.
  • the circuit layer design data of the corresponding PCB board is retrieved through the PCB board number identified by the first QR code or the first bar code;
  • Step 1 Before the graphic is developed, a code scanning device is used to identify the first QR code or the first bar code on the process card of the batch to be produced, and the first QR code or the first bar code is imported into the coding system of the QR code or bar code printer;
  • Step 2 Use the coding system of a QR code printer or bar code printer to generate a different second QR code or second bar code with a serial number for each PCB board after AOI inspection based on the first QR code or the first bar code;
  • AOI detects the corresponding PCB board according to the production information, and stores the inspection data in the same position on the server as the production information and forms a corresponding second two-dimensional code or a code corresponding to the second barcode; after the AOI inspection is normally operated, the inspection data corresponding to the PCB board is output, and the inspection data is encoded according to the model, batch number and serial number of the PCB board corresponding to the second two-dimensional code or the second barcode, and the code is set as the inspection data name, and stored in the file 1 of the specified path on the server, so that the inspection data corresponds to the inspected PCB board one by one;
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • the scanning device is used to identify the first QR code or the first bar code on the process card of the PCB board to be produced, and the production information of the PCB board is obtained and synchronized with the AOI.
  • the circuit layer design data of the corresponding PCB board is retrieved through the PCB board number identified by the first QR code or the first bar code;
  • Step 1 Before the graphic is developed, a code scanning device is used to identify the first QR code or the first bar code on the process card of the batch to be produced, and the first QR code or the first bar code is imported into the coding system of the QR code or bar code printer;
  • Step 2 Use the coding system of a QR code printer or bar code printer to generate a different second QR code or second bar code with a serial number for each PCB board after AOI inspection based on the first QR code or the first bar code;
  • AOI detects the corresponding PCB board according to the production information, and stores the inspection data in the same position on the server as the production information and forms a corresponding second two-dimensional code or a code corresponding to the second barcode; after the AOI inspection is normally operated, the inspection data corresponding to the PCB board is output, and the inspection data is encoded according to the model, batch number and serial number of the PCB board corresponding to the second two-dimensional code or the second barcode, and the code is set as the inspection data name, and stored in the file 1 of the specified path on the server, so that the inspection data corresponds to the inspected PCB board one by one;
  • the second QR code After the PCBs are inspected by the online AOI, they enter the online QR code printing device one by one in the order of inspection.
  • the second QR code with different serial numbers for each PCB board inspected by the AOI is printed at a preset position on the edge of the PCB board.
  • the second QR code or second barcode printing area should be an area that can be captured by the AOI inspection device.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • the scanning device is used to identify the first QR code or the first bar code on the process card of the PCB board to be produced, and the production information of the PCB board is obtained and synchronized with the AOI.
  • the circuit layer design data of the corresponding PCB board is retrieved through the PCB board number identified by the first QR code or the first bar code;
  • Step 1 Before the graphic is developed, a code scanning device is used to identify the first QR code or the first bar code on the process card of the batch to be produced, and the first QR code or the first bar code is imported into the coding system of the QR code or bar code printer;
  • Step 2 Use the coding system of a QR code printer or bar code printer to generate a different second QR code or second bar code with a serial number for each PCB board after AOI inspection based on the first QR code or the first bar code;
  • AOI detects the corresponding PCB board according to the production information, and stores the inspection data in the same position on the server as the production information and forms a corresponding second two-dimensional code or a code corresponding to the second barcode; after the AOI inspection is normally operated, the inspection data corresponding to the PCB board is output, and the inspection data is encoded according to the model, batch number and serial number of the PCB board corresponding to the second two-dimensional code or the second barcode, and the code is set as the inspection data name, and stored in the file 1 of the specified path on the server, so that the inspection data corresponds to the inspected PCB board one by one;
  • the second QR code After the PCBs are inspected by the online AOI, they enter the online QR code printing device one by one in the order of inspection.
  • the second QR code with different serial numbers of each PCB board inspected by AOI is printed at a preset position on the edge of the PCB board.
  • the second QR code or second barcode printing area should be an area that can be captured by the AOI inspection device.
  • the defective PCB board is recorded as a defective PCB board with a scrap unit, and a special scrap mark is marked in a fixed area of the scrap unit.
  • the PCB board is re-inspected using AOI and the actual graphic data of the defective PCB board with the scrap unit is stored in the file 1 of the server;
  • the PCB board and the AOI detection data are made to correspond one to one.
  • the solder mask printing program uses the actual graphic information output by the AOI detection of the PCB board as a reference, and the corresponding damming printing graphics and non-damming area solder mask printing graphics are designed.
  • the damming printing program and the non-damming area solder mask printing program are respectively generated by referring to the damming printing graphics and the non-damming area solder mask printing graphics through computer software.
  • the damming printing program is in front, and the non-damming area solder mask printing program is merged into a solder mask printing program in the back. Then, the high-definition positioning camera of the inkjet solder mask printer is used to scan the second QR code or the second bar code on the product to be inkjet printed with solder mask, and the solder mask printing program corresponding to the PCB board is automatically retrieved.
  • the above technical scheme can effectively avoid the use of fixed design solder mask printing program, which does not consider the actual graphic differences, expansion and shrinkage of PCB board production, resulting in the problem that the solder mask opening of inkjet printing solder mask is offset or too large or too small, affecting the welding quality of the client's device, and the difference between the actual line width of PCB board and the designed line width, resulting in the problem that the line edge of inkjet printing solder mask is red, which greatly improves the accuracy of inkjet printing solder mask opening.
  • the second damming printing program is in front, and the second non-damming area solder resist printing program is merged into a second solder
  • the first actual graphic information of the good PCB board is the actual graphic data of the good PCB board formed in the inspection data after the PCB board is inspected by AOI after graphic development, etching and film stripping;
  • the first actual graphic information of the repaired good PCB board is the actual graphic data of the repaired good PCB board obtained by re-inspecting the repaired PCB board using AOI.
  • Access the file 1 of the specified path on the server by scanning the corresponding second QR code or second barcode on the good PCB board or the repaired good PCB board, grab the name of the inspection data, obtain the first actual graphic information corresponding to the inspected good PCB board or the repaired good PCB board on the inspection data, and generate the first damming print image of the corresponding good PCB board or the repaired good PCB board according to the first actual graphic information; retrieve the solder mask layer image of the good PCB board or the repaired good PCB board and superimpose it with the first damming print image, delete the superimposed area, and generate the first non-damming area solder mask print image; through computer software, grab the first damming print image and the first non-damming area solder mask print image respectively, generate the first damming print program and the first non-damming area solder mask print program respectively, and merge them into the first solder mask print program in the order of the first damming print program first and the first non-damming area solder mask print program later, the name of
  • the method for printing solder mask on a defective PCB board with a scrap unit is as follows:
  • the second actual graphic information is actual graphic data of a defective PCB board having a scrap unit in actual graphic data of a defective PCB board formed in the inspection data after the PCB board is inspected by AOI after graphic development, etching and film stripping.
  • the detection data at this time includes the second actual graphics data.
  • the second actual graphics information is the actual graphics data after the detection. If the result after the PCB board detection is that the defective PCB board has a scrap unit in the defective product that cannot be repaired, for example, the current PCB board is usually made up of multiple boards, and one of the small boards is damaged, then the damaged small board is marked as a scrap unit, and the scrap unit is the third actual graphics information. Then the scrap unit is deleted to form the fourth actual graphics information.
  • the fourth actual graphics information is further operated to obtain the second solder mask printing program. In this way, the scrapped units of the product can be effectively avoided for inkjet printing solder mask, which effectively saves the use of inkjet printing solder mask ink and reduces the cost of product production.
  • the dam printing program includes circuit dam design and solder mask window dam design.
  • the circuit dam design is tangent to the edges on both sides of the circuit pattern;
  • the solder mask window dam design is tangent to the solder mask window position pattern;
  • the dam width design can be designed according to the characteristics of the solder mask printing ink and the solder mask thickness requirements, and the dam width is between 50 ⁇ m and 100 ⁇ m;
  • the non-dam area solder mask design is to dig out the dam solder mask pattern from the product solder mask layer image.
  • the inkjet printing method is:
  • Inkjet printing uses a special solder resist printing ink with a viscosity of 15Pa.s-25mPa.s and a surface tension of 30N/m-40mN/m at room temperature (25°C).
  • a 395nm LED lamp with an energy parameter of 100mJ/ cm2-300mJ / cm2 or a mercury lamp with an energy parameter of 1000mJ/ cm2-1500mJ / cm2 , and perform light irradiation in real time after solder resist printing to achieve synchronous curing with the printed solder resist.
  • Dam printing includes line damming and window damming.
  • Window damming refers to building a solder resist dam around the solder resist window area by solder resist printing to prevent the solder resist ink from flowing into the solder resist window area due to the fluidity of the solder resist ink, thereby forming a protection for the solder resist window area;
  • line damming refers to building a solder resist dam on both sides of the line by solder resist printing to prevent the ink from flowing out of the line edge due to the fluidity of the solder resist ink, and the ink at the line edge is too thin, resulting in the redness of the line edge; non-damming area refers to other solder resist areas except the damming area.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé d'impression à jet d'encre d'une réserve de soudure sur une carte de circuit imprimé. Le procédé comprend : la réalisation d'une conception de code de produit ; l'ajout d'un premier code à réponse rapide ou d'un premier code à barres ; la réalisation d'une fabrication de pré-flux ; l'identification d'informations de produit au moyen d'un balayage de code avant le développement de motif ; la génération d'un second code à réponse rapide ou d'un second code à barres ; la réalisation d'une AOI ; l'impression du second code à réponse rapide ou du second code à barres ; la détermination de la qualité d'une PCB ; la réalisation d'un prétraitement ; la détermination d'un procédé d'impression par réserve de soudure pour une PCB non défectueuse ; la réalisation d'une impression à jet d'encre ; et la réalisation d'un post-durcissement. Au moyen du procédé, le problème d'un décalage de fenêtre de réserve de soudure, c'est-à-dire étant trop grand ou petit, pendant l'impression à jet d'encre d'une réserve de soudure peut être efficacement évité, et le problème défavorable d'un bord de ligne qui est rouge pendant l'impression à jet d'encre de la réserve de soudure est également évité, ce qui permet d'améliorer considérablement la précision de la fenêtre de réserve de soudure pendant l'impression à jet d'encre.
PCT/CN2022/139056 2022-11-10 2022-12-14 Procédé d'impression à jet d'encre d'une réserve de soudure sur une carte de circuit imprimé WO2024098506A1 (fr)

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CN202211401560.9 2022-11-10
CN202211401560.9A CN115460783B (zh) 2022-11-10 2022-11-10 一种pcb板喷墨打印阻焊的方法

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CN115460783B (zh) * 2022-11-10 2023-03-10 惠州市金百泽电路科技有限公司 一种pcb板喷墨打印阻焊的方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107509317A (zh) * 2017-08-02 2017-12-22 深圳市景旺电子股份有限公司 一种pcb防焊处理方法及pcb板
CN107944517A (zh) * 2017-12-13 2018-04-20 广东正业科技股份有限公司 一种产品全流程品质追溯方法
CN108012426A (zh) * 2017-12-13 2018-05-08 广东正业科技股份有限公司 一种多层pcb的品质追溯方法
CN110446334A (zh) * 2019-09-06 2019-11-12 深圳市升达康科技有限公司 X-ray技术在pcb追溯的应用方法及***
CN113573506A (zh) * 2021-06-09 2021-10-29 深圳市升达康科技有限公司 Pcb的生产工艺及pcb线路板
CN115460783A (zh) * 2022-11-10 2022-12-09 惠州市金百泽电路科技有限公司 一种pcb板喷墨打印阻焊的方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201039703A (en) * 2009-04-16 2010-11-01 Unimicron Technology Corp Quality control and inspection process flow for printed circuit board manufacturing
JP5257238B2 (ja) * 2009-05-21 2013-08-07 大日本印刷株式会社 プリント配線基板の製造情報管理方法、プリント配線基板の製造情報管理システム
WO2013001594A1 (fr) * 2011-06-27 2013-01-03 Ｗｉｔ株式会社 Procédé de gestion de l'inspection d'un substrat électronique, appareil pour celui-ci et appareil d'inspection visuelle d'un substrat électronique

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107509317A (zh) * 2017-08-02 2017-12-22 深圳市景旺电子股份有限公司 一种pcb防焊处理方法及pcb板
CN107944517A (zh) * 2017-12-13 2018-04-20 广东正业科技股份有限公司 一种产品全流程品质追溯方法
CN108012426A (zh) * 2017-12-13 2018-05-08 广东正业科技股份有限公司 一种多层pcb的品质追溯方法
CN110446334A (zh) * 2019-09-06 2019-11-12 深圳市升达康科技有限公司 X-ray技术在pcb追溯的应用方法及***
CN113573506A (zh) * 2021-06-09 2021-10-29 深圳市升达康科技有限公司 Pcb的生产工艺及pcb线路板
CN115460783A (zh) * 2022-11-10 2022-12-09 惠州市金百泽电路科技有限公司 一种pcb板喷墨打印阻焊的方法

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