CN105228358A - A kind of method stopping wiring board gong groove leakage gong - Google Patents
A kind of method stopping wiring board gong groove leakage gong Download PDFInfo
- Publication number
- CN105228358A CN105228358A CN201510694615.3A CN201510694615A CN105228358A CN 105228358 A CN105228358 A CN 105228358A CN 201510694615 A CN201510694615 A CN 201510694615A CN 105228358 A CN105228358 A CN 105228358A
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- Prior art keywords
- gong
- wiring board
- gong groove
- groove
- groove region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 30
- 238000001514 detection method Methods 0.000 claims abstract description 19
- 238000005530 etching Methods 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims abstract description 7
- 230000007704 transition Effects 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 238000012360 testing method Methods 0.000 claims description 19
- 238000005259 measurement Methods 0.000 claims description 16
- 230000000007 visual effect Effects 0.000 claims description 7
- 239000000758 substrate Substances 0.000 abstract description 5
- 238000012545 processing Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 101100272964 Arabidopsis thaliana CYP71B15 gene Proteins 0.000 description 3
- 101150030164 PADI3 gene Proteins 0.000 description 3
- 102100035734 Protein-arginine deiminase type-3 Human genes 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Stop the method that wiring board gong groove leaks gong, comprise the steps: the making of S1. internal layer circuit plate, pressing, boring, electric plating of whole board is carried out in the plate face of outer-layer circuit plate; S2. carry out Graphic transitions, exposure, display, etching: if the gong well width in wiring board is at more than 0.8mm, then two fool proof PAD are set in the gong groove region of wiring board, and are communicated with by wire between two fool proof PAD; Otherwise then gong groove region all etches; S3. solder-mask printing ink; Solder mask window process is carried out to gong groove region; S4. the gong groove of wiring board is detected; S5. molded surface process, makes wiring board.The present invention is by the substrate in exposed gong groove region, make gong groove region and wiring board form strong contrast, easily identify that gong is leaked in gong groove region, improve the efficiency that wiring board leaks gong detection, stop the phenomenon that gong is leaked in wiring board gong groove region, improve wiring board detection efficiency.
Description
Technical field
The invention belongs to wiring board processing technique field, be specifically related to a kind of method stopping wiring board gong groove leakage gong.
Background technology
The outer-layer circuit plate of current PCB manufacturing makes and usually adopts following flow process: boring → de-smear/inner hole deposition copper → electric plating of whole board → image transfer → graphic plating → circuit etching → anti-welding silk noil print → word silk noil print → surface treatment (gold/silver/tin) → appearance profile processing → last quality control, finally makes qualified wiring board.For the wiring board of routine, due to the popularity of its scope of application, cause the disunity of its form-factor, the diversification of shape., there is more different size and the gong groove of shape in the factor of wiring board plate internal cause kit even.But in the manufacturing process of reality, gong groove is leaked in the appearance regular because of artificial carelessness.And the gong groove of Lou gong is not detected when detecting, and flow to client, thus cause complaint, the complaint of client, affect company reputation.Therefore, the gong groove how stopping wiring board leaks gong phenomenon, avoids Lou gong wiring board to flow into client, makes troubles, become enterprise's problem demanding prompt solution to client.
Summary of the invention
In view of this, the substrate that the technical problem to be solved in the present invention is to provide a kind of gong groove region is exposed, and the method that wiring board gong groove leaks gong is significantly stopped in contrast, effectively can stop wiring board gong groove and leak gong phenomenon, improve detection efficiency.
In order to solve the problems of the technologies described above, the present invention adopts following scheme to realize: a kind of method stopping wiring board gong groove leakage gong, comprises the steps:
S1. the making of internal layer circuit plate, pressing, boring, electric plating of whole board is carried out in the plate face of outer-layer circuit plate;
S2. carry out Graphic transitions, exposure, display, etching: if the gong well width in wiring board is at more than 0.8mm, then two fool proof PAD are set in the gong groove region of wiring board, and are communicated with by wire between two fool proof PAD; Otherwise then gong groove region all etches;
S3. solder-mask printing ink; Solder mask window process is carried out to gong groove region;
S4. the gong groove of wiring board is detected;
S5. molded surface process, makes wiring board.
Wherein, the size of the fool proof PAD described in step S2 and the size of gong well width match, and the diameter of described fool proof PAD is at more than 0.3mm.
Wherein, the windowed thread 8mil larger than gong groove of the solder mask window described in step S3.
Wherein the concrete steps of step S4 are as follows: if the gong well width in wiring board is greater than 0.8mm, then adopt measurement jig to carry out joint-detection to wiring board test and visual detection; Otherwise, then visual detection is adopted.
Wherein, the corresponding section, two PAD positions in described measurement jig and gong groove is provided with two testing needles, carries out energising test during test to measurement jig.
Compared with prior art, the present invention is by the substrate in exposed gong groove region, gong groove region and wiring board is made to form strong visual contrast, it is leak gong that operating personnel are easy to whether identification circuit plate exists gong groove region, improve the efficiency that wiring board leaks gong detection, stop the phenomenon that gong is leaked in wiring board gong groove region, improve wiring board detection efficiency, and solder mask window exceeds gong groove 8mil, can avoid in the process of gong plate, cause the bad phenomenon such as anti-solder ink bubble, increase the effect of gong groove, reduce the generation of defective products and faulty materials, improve the quality of wiring board.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1.
Fig. 2 is the structural representation of embodiment 2.
Wherein outer-layer circuit plate 1; Gong groove 2; Fool proof PAD3.
Embodiment
In order to allow those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, the present invention is further elaborated.
Embodiment 1 one kinds of gong well widths are in the method stopping wiring board gong groove leakage gong of more than 0.8mm
Stop the method that wiring board gong groove leaks gong, comprise the steps:
S1. make the making of internal layer circuit plate, pressing, boring, electric plating of whole board is carried out in the plate face of outer-layer circuit plate, makes outer-layer circuit plate 1.
S2. Graphic transitions, exposure, display, etching is carried out.
Gong groove 2 according to outer-layer circuit plate distributes, and makes film egative film and carries out Graphic transitions.The film egative film identical with outer-layer circuit plate size is selected to make.When making film egative film, gong groove region is lightproof part, and two fool proof PAD3 in gong groove region and the circuit connected between two fool proof PAD are light transmission part.One deck dry film is pasted in the plate face of sandwich circuit board outside, then paste that film picture carries out exposing, the dry film in wiring board plate face of developing, etch, remove, to make in the gong groove region in the wiring board plate face after etching except two fool proof PAD and the circuit connected between two fool proof PAD are not etched, other regions are etched, two fool proof PAD are communicated with by circuit, and the substrate in gong groove region is exposed.Wiring board after etching carries out clear drying, then carries out profile measurement and wireline inspection to wiring board, when detecting defective products, by wiring board reject do over again, if the profile of wiring board qualified after carry out next step produce.
Wherein the size of fool proof PAD3 is determined according to the size of gong groove 2 width, but the diameter of fool proof PAD must ensure at more than 0.3mm, just can guarantee that the testing needle in measurement jig can carry out energising test to fool proof PAD.When the diameter of fool proof PAD is less than 0.3mm, because the testing needle in measurement jig is comparatively large, testing needle is difficult to contraposition, increases position aligning time, reduces testing efficiency.
S3. solder-mask printing ink.
Carry out the process of plate face to the wiring board of a upper operation, the removing oil in wiring board plate face and the oxide of copper face, be then printed on the plate face of wiring board, adopt whole plate face to print during solder-mask printing ink by anti-solder ink by screen printer.The wiring board of solder-mask printing ink is put into 70 ~ 75 Du tunnel road ovens to process, make the anti-solder ink being printed on wiring board plate face be in the state of semi-solid preparation.Make exposure film, then exposure film is attached on wiring board plate face, exposes under ultraviolet light, the anti-solder ink being provided with lightproof area is rinsed the most at last.Wherein the gong groove region of exposure film is shading region, and the anti-solder ink in gong groove region is finally rinsed, and the part that other parts are subject to UV-irradiation will be hardened, and be attached to wiring board plate face, finally form solder mask.Adopt sodium carbonate to rinse the wiring board after exposure, develop, the anti-solder ink in the region of shading during exposure is rinsed out, makes the gong groove region realized after developing wiring board carry out solder mask window.The windowed thread 8mil larger than gong groove of solder mask window, makes wiring board can not affect the extra-regional plate face of gong groove when gong groove, causes the first phenomenon of the anti-solder ink bubble in plate face.Wiring board is carried out UV solidification, the anti-solder ink of first handle is tentatively hardened, carries out text printout, finally carry out the baked plate of Gao Wen, anti-solder ink is finally hardened, dries.
Wiring board is carried out surface treatment and sharp processing.During sharp processing, adopt CNC equipment gong except gong groove etc., make it meet customer requirement.
S4. the gong groove of wiring board is detected.
Carry out the detection of gong groove to the wiring board in a upper operation, whether the gong groove in detection line plate plate face, all by gong groove, facilitates wiring board to leak gong phenomenon.When whether the gong groove in wiring board plate face is removed by gong, adopt the mode that artificial visual detects and measurement jig carries out checking to carry out, effectively improve detection efficiency, the gong groove stopping wiring board plate face leaks gong phenomenon.Described measurement jig is provided with two testing needles with the corresponding section, PAD position of two in gong groove, by two testing needles, gong groove is detected.Carry out energising test to measurement jig during test, if measurement jig conducting, then there is gong groove leakage gong in wiring board plate face, if measurement jig not conducting, then the gong groove in wiring board plate face is all by gong groove.After measurement jig tests, then use artificial detection line plate, confirm that the gong groove in wiring board plate face is very by gong groove.
S5. externally sandwich circuit board carries out molded surface process, and the outer-layer circuit plate after shaping carries out Quality Detection, finally obtains finished product wiring board.。
Embodiment 2 one kinds of gong well widths are less than the method stopping wiring board gong groove leakage gong of 0.8mm
Stop the method that wiring board gong groove leaks gong, comprise the steps:
S1. make the making of internal layer circuit plate, pressing, boring, electric plating of whole board is carried out in the plate face of outer-layer circuit plate, makes outer-layer circuit plate 1.
S2. Graphic transitions, exposure, display, etching is carried out.
Gong groove 2 according to outer-layer circuit plate distributes, and makes film egative film and carries out Graphic transitions.The film egative film identical with outer-layer circuit plate size is selected to make.When making film egative film, gong groove region is lightproof part.One deck dry film is pasted in the plate face of sandwich circuit board outside, then pastes that film picture carries out exposing, the dry film in wiring board plate face of develop, etch, remove, and make the gong groove region in the wiring board plate face after etching etched, the substrate in gong groove region is exposed.Wiring board after etching carries out clear drying, then carries out profile measurement and wireline inspection to wiring board, when detecting defective products, by wiring board reject do over again, if the profile of wiring board qualified after carry out next step produce.
S3. solder-mask printing ink.
Carry out the process of plate face to the wiring board of a upper operation, the removing oil in wiring board plate face and the oxide of copper face, be then printed on the plate face of wiring board, adopt whole plate face to print during solder-mask printing ink by anti-solder ink by screen printer.The wiring board of solder-mask printing ink is put into 70 ~ 75 Du tunnel road ovens to process, make the anti-solder ink being printed on wiring board plate face be in the state of semi-solid preparation.Make exposure film, then exposure film is attached on wiring board plate face, exposes under ultraviolet light, the anti-solder ink being provided with lightproof area is rinsed the most at last.Wherein the gong groove region of exposure film is shading region, and the anti-solder ink in gong groove region is finally rinsed, and the part that other parts are subject to UV-irradiation will be hardened, and be attached to wiring board plate face, finally form solder mask.Adopt sodium carbonate to rinse the wiring board after exposure, develop, the anti-solder ink in the region of shading during exposure is rinsed out, makes the gong groove region realized after developing wiring board carry out solder mask window.The windowed thread 8mil larger than gong groove of solder mask window, makes wiring board can not affect the extra-regional plate face of gong groove when gong groove, causes the first phenomenon of the anti-solder ink bubble in plate face.Wiring board is carried out UV solidification, the anti-solder ink of first handle is tentatively hardened, carries out text printout, finally carry out the baked plate of Gao Wen, anti-solder ink is finally hardened, dries.
Wiring board is carried out surface treatment and sharp processing.During sharp processing, adopt CNC equipment gong except gong groove etc., make it meet customer requirement.
S4. the gong groove of wiring board is detected.
Carry out gong groove 2 to the wiring board in a upper operation to detect, whether the gong groove in detection line plate plate face, all by gong groove, facilitates wiring board to leak gong phenomenon.When whether the gong groove in wiring board plate face is removed by gong, the mode adopting artificial visual to detect is carried out, and the gong groove stopping wiring board plate face leaks gong phenomenon.When there is gong groove in wiring board plate face, because the copper in the gong groove region of wiring board is etched, and carry out solder mask window, the gong groove region of wiring board and wiring board plate face is made to form obvious colour-difference, testing staff is easy to tell wiring board plate face and whether there is the gong groove leaking gong, improve detection efficiency, stop the phenomenon that gong groove leaks gong.
S5. externally sandwich circuit board carries out molded surface process, and the outer-layer circuit plate after shaping carries out Quality Detection, finally obtains finished product wiring board.
Above-described embodiment is only wherein specific implementation of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (5)
1. stop the method that wiring board gong groove leaks gong, it is characterized in that, comprise the steps:
S1. the making of internal layer circuit plate, pressing, boring, electric plating of whole board is carried out in the plate face of outer-layer circuit plate;
S2. carry out Graphic transitions, exposure, display, etching: if the gong well width in wiring board is greater than 0.8mm, then two fool proof PAD are set in the gong groove region of wiring board, and are communicated with by wire between two fool proof PAD; Otherwise then gong groove region all etches;
S3. solder-mask printing ink; Solder mask window process is carried out to gong groove region;
S4. the gong groove of wiring board is detected;
S5. molded surface process, makes wiring board.
2. the method stopping wiring board gong groove leakage gong according to claim 1, it is characterized in that, the size of the fool proof PAD described in step S2 and the size of gong well width match, and the diameter of described fool proof PAD is at more than 0.3mm.
3. the method stopping wiring board gong groove leakage gong according to claim 2, is characterized in that, the windowed thread 8mil larger than gong groove of the solder mask window described in step S3.
4. the method stopping wiring board gong groove leakage gong according to claim 3, it is characterized in that, the concrete steps of step S4 are as follows: if the gong well width in wiring board is at more than 0.8mm, then adopt measurement jig to carry out joint-detection to wiring board test and visual detection; Otherwise, then visual detection is adopted.
5. wiring board gong groove of stopping according to claim 4 leaks the method for gong, and it is characterized in that, described measurement jig is provided with two testing needles with the corresponding section, two PAD positions in gong groove, carries out energising test during test to measurement jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510694615.3A CN105228358B (en) | 2015-10-23 | 2015-10-23 | A kind of method for preventing wiring board gong groove leakage gong |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510694615.3A CN105228358B (en) | 2015-10-23 | 2015-10-23 | A kind of method for preventing wiring board gong groove leakage gong |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105228358A true CN105228358A (en) | 2016-01-06 |
| CN105228358B CN105228358B (en) | 2018-01-12 |
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| CN201510694615.3A Active CN105228358B (en) | 2015-10-23 | 2015-10-23 | A kind of method for preventing wiring board gong groove leakage gong |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231784A (en) * | 2016-08-12 | 2016-12-14 | 江门崇达电路技术有限公司 | The leakproof milling groove structure of printed circuit board and leakproof Xiyanping injection method |
| CN106535478A (en) * | 2016-11-12 | 2017-03-22 | 广东科翔电子科技有限公司 | Method of improving milling groove burrs before electroless plating copper operation of PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04132290A (en) * | 1990-09-21 | 1992-05-06 | Sharp Corp | Flexible wiring board |
| CN203117344U (en) * | 2013-02-02 | 2013-08-07 | 汕头超声印制板公司 | On/off tester capable of detecting omitted hole |
| CN103619120A (en) * | 2013-10-31 | 2014-03-05 | 胜宏科技（惠州）股份有限公司 | Connecting finger clamping slot milling omission-preventable circuit board and manufacture method thereof |
-
2015
- 2015-10-23 CN CN201510694615.3A patent/CN105228358B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04132290A (en) * | 1990-09-21 | 1992-05-06 | Sharp Corp | Flexible wiring board |
| CN203117344U (en) * | 2013-02-02 | 2013-08-07 | 汕头超声印制板公司 | On/off tester capable of detecting omitted hole |
| CN103619120A (en) * | 2013-10-31 | 2014-03-05 | 胜宏科技（惠州）股份有限公司 | Connecting finger clamping slot milling omission-preventable circuit board and manufacture method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231784A (en) * | 2016-08-12 | 2016-12-14 | 江门崇达电路技术有限公司 | The leakproof milling groove structure of printed circuit board and leakproof Xiyanping injection method |
| CN106231784B (en) * | 2016-08-12 | 2019-04-02 | 江门崇达电路技术有限公司 | The leakproof milling groove structure and leakproof Xiyanping injection method of printed circuit board |
| CN106535478A (en) * | 2016-11-12 | 2017-03-22 | 广东科翔电子科技有限公司 | Method of improving milling groove burrs before electroless plating copper operation of PCB |
| CN106535478B (en) * | 2016-11-12 | 2020-06-09 | 广东科翔电子科技股份有限公司 | Method for improving gong groove flash before copper deposition of PCB |
Also Published As
| Publication number | Publication date |
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| CN105228358B (en) | 2018-01-12 |
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Effective date of registration: 20231121 Address after: Xinqiao village Xingcheng science and Technology Park, Danshui Town, Huiyang District, Huizhou City, Guangdong Province Patentee after: VICTORY GIANT TECHNOLOGY (HUIZHOU) Co.,Ltd. Address before: 226000 Haimen Economic and Technological Development Zone, Nantong City, Jiangsu Province, No. 999 Guangzhou Road Patentee before: Nantong Shenghong Technology Co.,Ltd. |
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