WO2023209950A1 - Dispositif de poussée de composants et dispositif de montage de composants - Google Patents

Dispositif de poussée de composants et dispositif de montage de composants Download PDF

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Publication number
WO2023209950A1
WO2023209950A1 PCT/JP2022/019281 JP2022019281W WO2023209950A1 WO 2023209950 A1 WO2023209950 A1 WO 2023209950A1 JP 2022019281 W JP2022019281 W JP 2022019281W WO 2023209950 A1 WO2023209950 A1 WO 2023209950A1
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WO
WIPO (PCT)
Prior art keywords
tool
push
head
component
wafer
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Application number
PCT/JP2022/019281
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English (en)
Japanese (ja)
Inventor
直樹 松下
公久 安間
Original Assignee
ヤマハ発動機株式会社
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Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2022/019281 priority Critical patent/WO2023209950A1/fr
Publication of WO2023209950A1 publication Critical patent/WO2023209950A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • the present invention includes a component pushing-up device that pushes up and peels off the die from below the wafer sheet when picking up a die (bare chip) from a wafer attached to a wafer sheet, and the component pushing-up device.
  • a component pushing-up device that pushes up and peels off the die from below the wafer sheet when picking up a die (bare chip) from a wafer attached to a wafer sheet, and the component pushing-up device.
  • a component mounting apparatus that picks up a die (bare chip) from a diced wafer and mounts it on a substrate.
  • a wafer camera captures an image of the wafer that is carried into a predetermined position (component placement area) inside the machine by a wafer feeder to recognize the wafer, and then the die is picked by a head equipped with a die holding function. This action is repeated.
  • the component mounting apparatus is equipped with a component lifting device that peels the die from the wafer sheet prior to picking the die by lifting the die from below the wafer attached to the wafer sheet.
  • the component push-up device includes a cylindrical suction housing and one or more push-up pins that are retractably installed in the center of the cylindrical suction housing. The die is pushed up from below using a pin.
  • This component push-up device is a type of component push-up device in which a component push-up unit pushes up a die while moving relative to a wafer.
  • the push-up unit is equipped with a push-up head (peeling promotion head mounting part) that can be rotated between vertical and horizontal positions, and the push-up tool is removably attached to the tool mounting part of the push-up head. be done.
  • the standby push-up tool is placed horizontally.
  • the push-up head is displaced from the vertical position to the horizontal position, and the push-up head moves vertically and horizontally to the standby position of the push-up tool.
  • the push-up tool mounted on the tool mounting section is locked by the locking arm, and in this state, the push-up head is moved backward, thereby removing the push-up tool from the tool mounting section.
  • the push-up head moves to the position of the replacement push-up tool, so that the push-up tool is mounted on the tool mounting section.
  • the thrusting head is reset from the horizontal position to the vertical position, thereby completing the replacement of the thrusting tool.
  • the component lifting device of Patent Document 1 uses three axes (X-axis, Y-axis, Z-axis) for linear movement of the lifting head and rotation as a drive system for changing the lifting tool.
  • a total of four axes of drive mechanisms and their control are required, including one axis for this purpose.
  • the same number of locking arms and drive mechanisms as the number of standby push-up tools are required. Therefore, the structure and control of the drive system for exchanging the uplifting tool becomes complicated in general.
  • the present invention has been made in view of the above-mentioned problems, and its purpose is to automatically operate a push-up tool equipped with a suction housing and a push-up pin in a component push-up device with a simpler configuration and control.
  • the purpose is to make it interchangeable.
  • a component pushing-up device is a component pushing-up device that peels a die from a wafer sheet by pushing up a die from below a wafer attached to a wafer sheet, and the component pushing-up device peels the die from the wafer sheet.
  • a plurality of push-up tools each including a suction surface that sucks a lower surface of the sheet under negative pressure and a push-up pin that is provided so as to be able to protrude and retract from the suction surface toward the wafer sheet side; and the plurality of push-up tools selectively and a push-up head that is movable relative to the wafer sheet in a direction along the wafer sheet and in a vertical direction; and a push-up head that is detachably mounted in a vertical direction;
  • a tool storage table capable of supporting each tool in the same posture as the tool is attached to the tool mounting portion; and a holding member capable of holding the uplifting tool; a tool transfer mechanism that transfers the push-up tool between the push-up head and the tool storage table by moving the push-up head in the vertical direction and the horizontal direction; and controlling the push-up head and the tool transfer mechanism.
  • a tool return operation of removing the push-up tool mounted on the tool mounting part by the holding member and returning it to the tool storage table, and/or the push-up tool supported by the tool storage table.
  • a control section that executes a tool mounting operation of holding the tool by the holding member and mounting the tool on the tool mounting section.
  • the component mounting apparatus includes a component supply section in which diced wafers are placed and attached to a wafer sheet, and a component mounting device that picks dies from the wafers placed in the component supply section. and the above-mentioned component pushing device that pushes up the die from below the wafer sheet when the head picks the die.
  • FIG. 1 is a plan view of a main body of a component mounting apparatus according to the present invention (a component mounting apparatus equipped with a component pushing-up device according to the present invention).
  • FIG. 2 is a plan view showing a wafer table and a wafer table drive mechanism.
  • FIG. 3 is a schematic perspective view of the push-up unit and tool storage unit.
  • FIG. 4 is a sectional view of the tip portion of the thrusting head.
  • FIG. 5 is a perspective view of the head main body of the thrust-up head, the thrust-up tool, and the tool storage table.
  • FIG. 6 is a block diagram showing the control system of the component mounting apparatus.
  • FIG. 7 is a flowchart showing control of the push-up tool replacement process.
  • FIG. 8 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • FIG. 9 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • FIG. 10 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • FIG. 11 is a schematic diagram showing an image of the suction surface portion of the thrust-up head (suction housing) acquired by the wafer camera.
  • FIG. 12 is an explanatory diagram of height detection of the push-up tool.
  • FIG. 1 is a top plan view showing the overall configuration of a component mounting apparatus 1 according to an embodiment of the present invention.
  • the component mounting apparatus 1 is a hybrid component mounting apparatus that can mount a die 7a (component) diced from a wafer 7 onto a substrate P in addition to completed components such as transistors and capacitors.
  • the component mounting apparatus 1 includes an apparatus main body 100 and a control section 200 (see FIG. 6). In the figure, XYZ orthogonal coordinates are shown to clarify the directional relationship.
  • the device main body 100 includes a base 2, a conveyor 3, a head unit 4, a component supply section 5, a push-up unit 40, and a tool storage unit 60.
  • the base 2 is a mounting base for various devices included in the device main body 100.
  • the conveyor 3 is a transport line for substrates P installed on the base 2 so as to extend in the X direction.
  • the conveyor 3 carries the board P from outside the machine to a predetermined mounting work position, and after the mounting work, transports the board P from the mounting work position to the outside of the machine. Note that the position where the board P is shown in FIG. 1 is the mounting work position.
  • the component supply units 5 are provided on the ⁇ Y side and the +Y side with the conveyor 3 interposed therebetween.
  • the head unit 4 picks up the components at the component supply section 5, moves to the mounting work position, and mounts the components on the board P.
  • the head unit 4 includes a plurality of heads 4H, each of which is equipped with a suction nozzle that suctions and holds the component under negative pressure during the pickup.
  • the head 4H can move forward and backward (up and down) in the Z direction with respect to the head unit 4, and can rotate around an axis.
  • the head unit 4 is equipped with a board recognition camera 12 that takes an image of the board P. The federal mark attached to the board P is recognized by the image taken by the board recognition camera 12.
  • the apparatus main body 100 includes a head unit drive mechanism D1 that allows the head unit 4 to be moved in the horizontal direction (XY direction) between the component supply section 5 and the board P held at the mounting work position.
  • the head unit drive mechanism D1 is installed between a pair of Y-axis rails 13, a Y-axis motor 14, a ball screw shaft 15, and a pair of Y-axis rails 13 on the +X side and -X side provided on the elevated frame 11, respectively.
  • the support frame 16 is provided with a support frame 16.
  • the ball screw shaft 15 is screwed into a nut provided on the support frame 16.
  • the head unit drive mechanism D1 also includes an unillustrated guide member mounted on the support frame 16, an X-axis motor 17, and a ball screw shaft 18. The guide member supports the head unit 4 so as to be movable in the X direction, and the ball screw shaft 18 is screwed into a nut (not shown) provided on the head unit 4.
  • this head unit drive mechanism D1 By the operation of this head unit drive mechanism D1, the head unit 4 moves in the horizontal direction. That is, the ball screw shaft 15 is rotationally driven by the Y-axis motor 14, so that the head unit 4 moves in the Y direction together with the support frame 16, and the ball screw shaft 18 is rotationally driven by the X-axis motor 17. As a result, the head unit 4 moves in the X direction with respect to the support frame 16.
  • the component supply section 5 includes a first component supply section 5A located on the -Y axis of the conveyor 3 and a second component supply section 5B located on the +Y side.
  • a plurality of tape feeders 19 are arranged in parallel along the conveyor 3 in the first component supply section 5A.
  • the tape feeder 19 is a component supply device of a type that feeds a tape containing completed components such as the transistors and capacitors described above at regular intervals while feeding the tape.
  • the second component supply section 5B includes a wafer supply device 6 that supplies a plurality of dies 7a in the form of wafers 7, and a wafer supply device 6 that picks up the dies 7a from the wafer 7 and transfers them to a predetermined delivery position with respect to the head unit 4.
  • a component transfer unit 33, a wafer camera 39, and a component recognition camera 10 are provided.
  • the wafer supply device 6 includes a wafer storage elevator 22, a wafer table 20, and a wafer drawer unit 23.
  • the wafer storage elevator 22 stores the wafer sheets 8a to which the wafers 7 are attached in multiple stages, with the wafer sheets 8a being held by the wafer holders 8.
  • the wafer storage elevator 22 raises and lowers the wafers 7 stored in multiple stages as one, and arranges any wafer 7 at a height corresponding to the height of the wafer table 20.
  • the wafer table 20 is placed on the -Y side of the wafer storage elevator 22.
  • the wafer table 20 is a workbench for taking out parts that holds the wafer holder 8 (wafer 7).
  • the wafer supply device 6 includes a wafer table drive mechanism D2 that allows the wafer table 20 to be moved in the horizontal direction (XY direction).
  • FIG. 2 is a plan view showing the wafer table 20 and the wafer table drive mechanism D2.
  • the wafer table drive mechanism D2 includes a pair of X-axis rails 30 on the +Y side and -Y side, an X-axis motor 31, a ball screw shaft 32, and a plate-shaped support frame 26 installed on the pair of X-axis rails 30. Equipped with.
  • the ball screw shaft 32 is threaded into a nut provided on the support frame 26.
  • the wafer table drive mechanism D2 includes a pair of Y-axis rails 27 provided on the support frame 26 on the +X side and the -X side, a Y-axis motor 28, and a ball screw shaft 32.
  • the ball screw shaft 32 is screwed into a nut provided on the wafer table 20.
  • this wafer table drive mechanism D2 By the operation of this wafer table drive mechanism D2, the wafer table 20 moves in the horizontal direction. That is, the ball screw shaft 32 is rotationally driven by the X-axis motor 31, so that the wafer table 20 moves together with the support frame 26 in the X direction, and the ball screw shaft 29 is rotationally driven by the Y-axis motor 28. As a result, the wafer table 20 moves in the Y direction with respect to the support frame 26.
  • the target die 7a is placed at a predetermined pickup position P1 defined by the XY coordinates by moving the wafer table 20.
  • the wafer drawer unit 23 takes the wafer holder 8 in and out between the wafer storage elevator 22 and the wafer table 20.
  • the wafer drawer unit 23 includes a drawer head 24 that can lock the wafer holder 8, and a drawer head drive device 25 that moves the drawer head 24 in the Y direction.
  • the wafer drawer unit 23 moves the wafer holder 8 by moving the drawer head 24 in the Y direction, with the wafer holder 8 locked by the drawer head 24. That is, the wafer 7 is taken in and out of the wafer storage elevator 22 together with the wafer holder 8 .
  • This loading and unloading of the wafer holder 8 is made possible by arranging the wafer table 20 at a predetermined wafer loading/unloading position that closely opposes the -Y side of the wafer storage elevator 22.
  • the component transfer unit 33 includes a transfer head 34 for picking up the die 7a placed at the pickup position P1 from the wafer 7, a transfer table 38 for delivering the die 7a to the head unit 4, and a transfer head 34. It is provided with a transfer head drive mechanism D3 that allows the transfer head to be moved.
  • the transfer head 34 includes a suction nozzle 34a that holds the die 7a by suctioning it under negative pressure.
  • the transfer head 34 picks up the die 7a by suctioning the die 7a under negative pressure at the pickup position P1.
  • the suction nozzle 34a can move forward and backward (up and down) in the Z direction with respect to the base portion of the transfer head 34, and can rotate around a horizontal axis. By rotating the transfer head 34 around the horizontal axis, it becomes possible to vertically invert the attitude of the die 7a.
  • the negative pressure passage that supplies negative pressure to the suction nozzle 34a is equipped with a negative pressure sensor Se4 (see FIG. 6) that can detect the negative pressure level.
  • the motor (not shown) for moving the transfer head 34 forward and backward has a built-in position sensor Se5 (see FIG. 6) such as an encoder, and the transfer head 34 is adjusted based on the position information detected by the position sensor Se5.
  • the Z coordinate, that is, the height can be detected.
  • the "negative pressure level" detected by the negative pressure sensor Se4 and the "position information" detected by the position sensor Se5 are information that can detect the height of the upthrust tool 45 attached to the upthrust head 41, as described later. be. Therefore, in this example, the negative pressure sensor Se4 and the position sensor Se5 correspond to the "acquisition unit" of the present invention.
  • the transfer table 38 is a transfer table for transferring the die 7a held by the suction nozzle 34a to the head 4H of the head unit 4.
  • the transfer table 38 is arranged at a predetermined transfer position close to the mounting work position.
  • the transfer head drive mechanism D3 includes a rail 37 that movably supports the transfer head 34, a ball screw shaft 36 arranged parallel to the rail 37, and a motor 35.
  • the ball screw shaft 36 is screwed into a nut provided on the transfer head 34.
  • the transfer head drive mechanism D3 moves the transfer head 34 in the space between the pickup position P1 and the transfer table 38 by rotationally driving the ball screw shaft 36 by the motor 35.
  • the wafer camera 39 images a portion of the wafer 7 held on the wafer table 20 at the pickup position P1, that is, the die 7a within the field of view of the camera from above. Based on this captured image, the position of the die 7a to be picked up is recognized.
  • the wafer camera 39 is supported by an elevated frame (not shown) so as to be positioned above the transfer head 34 with the transfer head 34 disposed at the pickup position P1. This avoids interference with the transfer head 34.
  • the component recognition camera 10 is arranged at a position adjacent to the +X side of the transfer table 38.
  • the component recognition camera 10 images the components (the die 7a and the completed component) adsorbed on the head 4H of the head unit 4 from below before mounting on the board P. Based on this captured image, the state of suction of the component by the head 4H is recognized.
  • FIG. 3 is a schematic perspective view of the push-up unit 40 and tool storage unit 60.
  • the push-up unit 40 and the tool storage unit 60 are arranged below the component supply section 5, specifically, below the support frame 26 of the wafer table drive mechanism D2.
  • the wafer table 20 is provided with a circular opening 20a, and the support frame 26 is provided with an unillustrated opening at a position that can overlap with the opening 20a.
  • a push-up unit 40 is arranged below these openings. That is, when the wafer holder 8 is held on the wafer table 20, the wafer 7 is placed inside the opening 20a.
  • the push-up unit 40 pushes up the die 7a through each opening of the support frame 26 and the wafer table 20.
  • the push-up unit 40 includes a push-up head 41 and a push-up head drive mechanism D6. As shown in FIGS. 3 and 4(a), the push-up head 41 includes a shaft-shaped head main body portion 42 extending in the Z direction, and a push-up tool 45 attached to the upper end portion of the head body portion 42. Note that FIG. 4A is a cross-sectional view of the tip portion of the thrusting head 41. As shown in FIG.
  • the thrusting head 41 is arranged so that the head main body portion 42 is located at the pickup position P1.
  • the head main body part 42 has a cylindrical shape and is provided with a thrust main shaft 44 at its center that moves forward and backward (up and down) in the Z direction.
  • the push-up tool 45 includes a suction housing 46 (sometimes referred to as a "suction dome") for suctioning the wafer sheet 8a from below, and a pin holder 48 disposed inside the suction housing 46.
  • the suction housing 46 is a cylindrical member with an open top, which includes a suction surface portion 46a having a circular suction surface in plan view and a cylindrical portion 46b extending downward from the periphery of the suction surface portion 46a to suction the wafer sheet 8a under negative pressure.
  • a plurality of pin holes 47 are formed in the suction surface portion 46a in a predetermined arrangement.
  • a push-up tool 45 is removably attached to the tip (upper end) of the head main body 42 via the suction housing 46.
  • a tool mounting part 43 having a smaller diameter than other parts is formed at the tip of the head main body part 42, and by fitting the cylindrical part 46b of the suction housing 46 into this tool mounting part 43, A push-up tool 45 is attached to the head body portion 42.
  • the thrusting tool 45 is attached to the thrusting head 41.
  • the pin holder 48 is a member in which one or more push-up pins 50 are erected on a disc-shaped pin base 49, and is movable in the Z direction along the inner peripheral surface of the cylindrical portion 46b. is maintained. As shown in FIG. 4(b), the pin holder 48 is pushed up against the suction housing 46 by the forward (upward) movement of the push-up main shaft 44. As a result, the push-up pin 50 projects upward from the suction surface portion 46a through the pin hole 47. When the push-up main shaft 44 moves backward (downward), the pin holder 48 descends with respect to the suction housing 46 by its own weight or by the biasing force of an elastic member (such as a spring) not shown. As a result, the push-up pin 50 is retracted into the suction housing 46 (pin hole 47). That is, the push-up pin 50 is provided so as to be able to protrude and retract upward from the suction surface portion 46a.
  • a tool storage unit 60 which will be described later, holds and stores a plurality of push-up tools 45 having different configurations, and when picking the die 7a, a tool storage unit 60, which will be described later, holds and stores a plurality of push-up tools 45 with different configurations.
  • a thrusting tool 45 is attached to the thrusting head 41.
  • the thrusting head drive mechanism D6 is composed of, for example, a cylinder mechanism using air as a drive source. Due to the operation of the thrust head drive mechanism D6, the thrust head 41 moves forward and backward (up and down) at the pickup position P1. Specifically, a predetermined push-up height position where the suction surface portion 46a comes into contact with the lower surface of the wafer sheet 8a, and a predetermined standby height position (position shown in FIG. 3) that is retracted downward from the push-up height position Move forward and backward between.
  • a first tool detection sensor Se1 capable of detecting the presence or absence of the thrusting tool 45 at the tip of the thrusting head 41 is installed on the ⁇ Y side of the thrusting head 41 disposed at the standby height position. (corresponding to "sensor”) are arranged.
  • the tool storage unit 60 is provided adjacent to the +X side of the push-up unit 40, as shown in FIGS. 2 and 3.
  • the tool storage unit 60 includes a tool storage section 60A and a tool transfer mechanism 60B.
  • the tool storage section 60A holds and stores a plurality of types of push-up tools 45, and the tool transfer mechanism 60B transports the push-up tools 45 between the push-up unit 40 and the tool storage section 60A.
  • the tool storage unit 60A includes a tool storage table 61 that holds the push-up tool 45, a storage table drive mechanism D4 that moves the tool storage table 61, and a code reading sensor Se3.
  • the tool storage table 61 is arranged at a position adjacent to the head body portion 42 of the thrusting head 41 on the +X side.
  • the tool storage table 61 has a rectangular shape in plan view that is elongated in the X direction, and includes a plurality of tool holding sections 62 on the upper surface.
  • the tool holding portion 62 is a circular recess formed on the upper surface of the tool storage table 61.
  • the inner diameter of the tool holding part 62 is set to a size that allows the push-up tool 45 (suction housing 46) to fit therein, and the push-up tool 45 has its lower end loosely fitted into the tool holding part 62. It is supported on a tool storage table 61.
  • the tool storage table 61 is provided with three tool holders 62 arranged in a row at equal intervals in the X direction. As shown in FIG. 2, in plan view, each tool holding portion 62 is provided such that its center is located on a straight line L1 extending in the X direction through the center of the head body portion 42 of the thrusting head 41. It is being The first tool 45A is placed in the tool holding part 62 at the -X side end (hereinafter referred to as a first tool holding part 62A), and the second tool is placed in the middle tool holding part 62 (hereinafter referred to as a second tool holding part 62B).
  • the tool holding part 62 (appropriately, third tool holding part 62C) at the +X side end.
  • the first tool 45A is attached to the push-up head 41, so the first tool holding portion 62A is empty.
  • FIG. 5 is a perspective view showing the head main body portion 42 of the thrusting head 41, the thrusting tool 45, and the tool storage table 61.
  • a positioning convex portion 43a is provided on the outer circumferential surface of the tool mounting portion 43 of the head main body portion 42
  • a positioning recess 56 is provided on the outer circumferential surface of the push-up tool 45 (suction housing 46).
  • the push-up tool 45 is mounted on the tool mounting portion 43 in a state in which it is positioned around the vertical axis by fitting the positioning convex portion 43a and the positioning recess 56.
  • a positioning convex portion 63 is provided on the inner circumferential surface of each tool holding portion 62 of the tool storage table 61, and the push-up tool 45 can be moved vertically by fitting the positioning convex portion 63 and the positioning concave portion 56. It is held by the tool holding part 62 in a state in which it is positioned around the periphery.
  • the positioning convex portion 43a of the head main body portion 42 and each positioning convex portion 63 of each tool holding portion 62 are both on the straight line L in plan view, and are both provided on the ⁇ X side.
  • the push-up tool 45 is held on the tool storage table 61 in the same posture as the head body section 42 is attached to the tool attachment section 43 (in this example, both the vertical direction and the direction around the axis are the same).
  • Ru a second tool detection sensor Se2 is embedded in the inner bottom surface of each tool holding part 62, and the presence or absence of the push-up tool 45 in each tool holding part 62 can be detected.
  • the storage table drive mechanism D4 is composed of, for example, a screw feeding mechanism using a motor as a drive source. Due to the operation of the storage table drive mechanism D4, the tool storage table 61 is moved horizontally in the It is alternatively arranged at the tool insertion/removal position P2 (corresponding to the "holding position" of the present invention). Note that the storage table drive mechanism D4 may be constituted by a cylinder mechanism using air as a drive source.
  • the code reading sensor Se3 (corresponding to the "first reading section” and “second reading section” of the present invention) is a sensor that reads the identification mark of each push-up tool 45 held on the tool storage table 61.
  • the code reading sensor Se3 is arranged on the ⁇ Y side of the tool loading/unloading position P2, and reads the identification information recorded in the identification information recording section provided on the side surface of the push-up tool 45 placed at the tool loading/unloading position P2. .
  • a notch-like flat surface portion 52 for the cord is formed on the outer peripheral portion on the -Y side of the cylindrical portion 46b of the push-up tool 45 (suction housing 46).
  • a one-dimensional or two-dimensional identification code 54 is provided on the code plane part 52 as an identification information recording part.
  • the code reading sensor Se3 reads this identification code 54.
  • the identification mark is not limited to a one-dimensional or two-dimensional identification code, and various sensors capable of reading identification marks can be applied to the code reading sensor Se3.
  • the tool transfer mechanism 60B includes a chuck head 65 and a chuck head drive mechanism D5 that moves the chuck head 65 in the Z direction and the X direction.
  • the chuck head 65 is an electrically or air-driven parallel opening/closing chuck device equipped with a pair of claws 66 that can be opened and closed in the X direction.
  • the chuck head 65 holds the push-up tool 45 by pinching the push-up tool 45 from both sides in the X direction with the pair of claws 66 .
  • the chuck head drive mechanism D5 includes, for example, a slider 72 that moves in the X direction by a screw feed mechanism that uses a motor as a drive source, and a base frame 68 that similarly moves in the Z direction by a screw feed mechanism that uses a motor as a drive source. including.
  • the chuck head 65 is assembled to a base frame 68.
  • the base frame 68 moves in the X direction together with the slider 72, and the base frame 68 moves in the Z direction with respect to the slider 72.
  • the chuck head 65 moves in the X direction and the Z direction.
  • the chuck head drive mechanism D5 may be configured to move the slider 72 and the base frame 68 using a cylinder mechanism using air as a drive source.
  • the pair of claws 66 are arranged at positions intersecting the straight line L, and the chuck head 65 is moved only in the X direction and the Z direction by the operation of the chuck head drive mechanism D5. Moving. Therefore, the chuck head 65 clamps the push-up tool 45 on the straight line L.
  • cutout-shaped chuck flat portions 53 are provided at the outer peripheral portions of the +X side and the ⁇ X axis, respectively.
  • Each chuck flat portion 53 is a plane parallel to each other.
  • each claw 66 has a clamping surface parallel to the flat part 53, and the chuck head 65 clamps the chuck flat part 53 of the push-up tool 45 with the clamping surface of the pair of claws 66. Therefore, the push-up tool 45 is held and conveyed by the chuck head 65 while maintaining the posture placed on the tool holding section 62.
  • the basic operation when mounting the die 7a on the substrate P in the component mounting apparatus 1 described above is as follows. First, the wafer table 20 is placed at the wafer loading/unloading position, and the wafer holder 8 is pulled out from the wafer storage elevator 22 to the wafer table 20 by the wafer pulling unit 23 . As a result, the wafer sheet 8a to which the assembly (wafer 7) of a large number of dies 7a, 7a, . . . is attached is placed on the wafer table 20.
  • the wafer table 20 By moving the wafer table 20, the die 7a to be picked up is placed at the pickup position P1, and the wafer camera 39 images the die 7a. At this time, the transfer head 34 of the component transfer unit 33 retreats from the pickup position P1. The image taken by the wafer camera 39 is for recognizing the die 7a that the transfer head 34 attracts in a later picking operation.
  • the transfer head 34 When the imaging of the die 7a is completed, the transfer head 34 is placed at the pickup position P1, and the suction nozzle 34a picks up the die 7a recognized by the imaging by the wafer camera 39. At this time, the die 7a is pushed up by the push-up head 41. Specifically, the push-up head 41 is displaced (raised) from the standby height position to the push-up height position, and the wafer sheet 8a is suctioned under negative pressure by the suction surface portion 46a. Thereafter, the push-up pin 50 projects from the suction surface portion 46a by the operation of the push-up main shaft 44, and the die 7a is pushed up through the wafer sheet 8a.
  • the transfer head 34 moves from above the wafer table 20 to above the transfer table 38.
  • the die 7a is transferred to the head unit 4 with the suction nozzle 34a in the suction posture, the die 7a is released onto the transfer table 38.
  • the transfer head 34 retreats from above the transfer table 38, and the head unit 4 moves above the transfer table 38, and the head 4H picks up the die 7a from the transfer table 38.
  • the head unit 4 moves above the component recognition camera 10, above the board P at the mounting work position, and descends. Thereby, the die 7a is mounted on the substrate P.
  • the suction nozzle 34a rotates above the transfer table 38, thereby changing the position of the die 7a. Flip it upside down. Thereafter, the head unit 4 moves above the transfer head 34, and the head 4H picks up the die 7a directly from the suction nozzle 34a. After picking the die 7a, similarly to the above, the head unit 4 moves above the component recognition camera 10 and above the board P at the mounting work position. Thereby, the die 7a is mounted on the substrate P.
  • the optimum form of the push-up tool 45 used when picking the die 7a differs depending on the size of the die 7a, the circuit formed therein, etc., as described above. Therefore, when the type of die 7a is changed, the push-up tool 45 attached to the push-up head 41 is replaced accordingly. This point will be explained in detail later.
  • FIG. 6 is a block diagram showing a control system of the component mounting apparatus 1.
  • the component mounting apparatus 1 includes a control section 200 as described above, a display section 90 that displays various information regarding component mounting processing, etc., and an input section 91 that receives input operations for various commands to the control section 200. ing.
  • the control unit 200 includes a CPU, ROM, RAM, peripheral circuits, and the like.
  • the control unit 200 controls the operation of each component of the apparatus main body 100 by having the CPU execute a control program stored in the ROM.
  • the control unit 200 includes a mounting control unit 81, a transport control unit 82, a component supply control unit 83, a component push-up control unit 84, an imaging control unit 85, a storage unit 86, and a display control unit 87 as main functional components.
  • the mounting control unit 81 comprehensively controls the operation of component mounting processing in the apparatus main body 100, mainly the operation of the head unit drive mechanism D1 and the drive mechanism of the head 4H.
  • the conveyance control unit 82 controls the conveyance operation of the substrate P by the conveyor 3.
  • the component supply control unit 83 controls the supply operation of the die 7a. That is, the operation of each part 22, 23, D2 of the wafer supply device 6 and the operation of the component transfer unit 33 are controlled. Further, the component supply control section 83 controls the operation of the tape feeder 19.
  • the component push-up control section 84 centrally controls the operations of the push-up unit 40 and tool storage unit 60.
  • the push-up tool 45 attached to the push-up head 41 is held on the tool storage table 61 in response to the operator's input operation through the input unit 91.
  • the tool exchange process described later is executed to exchange the tool with another push-up tool 45.
  • various determination processes are executed in the tool exchange process based on input signals from the sensors Se1 to Se5.
  • the imaging control unit 85 controls imaging operations by the component recognition camera 10, the board recognition camera 12, and the wafer camera 39.
  • the imaging control section 85 includes an image processing section 85a, and generates a digital image of the subject based on image signals output from each of the cameras 10, 12, and 39. Specifically, a digital image of the component attracted by the head 4H, the fiducial mark of the substrate P, and the die 7a is generated.
  • the storage unit 86 stores various programs executed in component mounting processing and correction data acquisition processing, and various data referenced when executing the programs.
  • the various data include board data and tool data.
  • the board data includes information such as the type of board P, the parts mounted on the board P of each type, and the mounting position (coordinates) of the parts.
  • the tool data (tool information) is information regarding the suction nozzle and the push-up tool 45.
  • This tool data includes data defining the push-up tool 45 (identification information) used for pushing up each type of die 7a, and data such as the number and arrangement of push-up pins 50 provided in each push-up tool 45. is included.
  • the display control section 87 controls the display by the display section 90 (corresponding to the "notification section” of the present invention), and causes the display section 90 to display various information and images according to the status of the component mounting process.
  • the display section 90 consists of a liquid crystal display device, etc.
  • the input section 91 consists of a keyboard and a mouse.
  • the display section 90 and the input section 91 may be integrally configured like a touch panel.
  • the push-up unit 40, tool storage unit 60, and control section 200 mainly correspond to the "component push-up device" of the present invention. .
  • the control shown in FIG. 7 is executed in accordance with the type switching of the die 7a (wafer 7). Specifically, the process is executed after the wafer holder 8 on the wafer table 20 is returned to the wafer storage elevator 22 and before the switched wafer holder 8 is pulled out onto the wafer table 20. In this case, based on the board data and tool data stored in the storage unit 86, the identification information of the push-up tool 45 corresponding to the die 7a after switching and a tool exchange execution button are displayed on the display unit 90. . On the other hand, when the operator operates the execution button via the input unit 91, control according to the flowchart is started. Note that the replacement process of the push-up tool 45 may be started in synchronization with the change of the type of die 7a (wafer 7), regardless of the operator's operation.
  • the control unit 200 determines whether or not the push-up tool 45 is attached to the push-up head 41 based on the output signal from the first tool detection sensor Se1 (step S1). Here, in the case of Yes, the control unit 200 moves the process to step S3. In the case of No, the control unit 200 controls the tool storage unit 60 to return the uplift tool 45 attached to the upthrust head 41 to the tool storage table 61 (tool return process (“tool return” of the present invention). (corresponding to the operation)) is executed (step S21).
  • FIG. 8 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • (a) is a plan view
  • (b) is a side view from the -Y side, each schematically showing the push-up unit 40 and tool storage unit 60. It shows.
  • the first tool 45A is attached to the push-up head 41, and therefore the first tool holding section 62A of the tool storage table 61 is empty.
  • the tool storage unit 60 is arranged such that the second tool holding section 62B is located at the tool loading/unloading position P2, and the chuck head 65 is located at a standby position above the tool loading/unloading position P2.
  • the thrusting head 41 is arranged at the standby height position.
  • step S21 first, as shown in FIG. 9(a), the chuck head 65 is moved from the standby position to above the push-up head 41, lowered there, and attached to the push-up head 41.
  • the first tool 45A that is present is held between the claws 66. Thereby, the chuck head 65 holds the first tool 45A.
  • the chuck head 65 rises while holding the first tool 45A, moves to the standby position, that is, above the tool loading/unloading position P2, and then lowers.
  • the empty tool holding part 62 (that is, the first tool holding part 62A) is detected depending on the presence or absence of a signal output from the second tool detection sensor Se2, and the empty tool holding part 62 is moved to the tool loading/unloading position P2. If it is not located, the position of the tool storage table 61 is adjusted so that the empty tool holding section 62 is located at the tool loading/unloading position P2.
  • the first tool 45A is held on the chuck head 65 in the same posture as when it is attached to the push-up head 41 by having the flat chuck portion 53 held by the claws 66. Therefore, the first tool 45A returned to the first tool holding section 62A can be positioned by the positioning recess 56 and the positioning protrusion 63, so that the first tool 45A can be mounted on the push-up head 41.
  • the first tool holding portion 62A holds the tool in the same posture as before.
  • step S3 the control unit 200 determines whether recognition of the identification code 54 of each push-up tool 45 has been completed.
  • the control unit 200 moves the process to step S5.
  • the control unit 200 briefly moves the tool storage table 61 in the The code 54 is read by the code reading sensor Se3 (step S23). Thereby, the control unit 200 recognizes which push-up tool 45 (tools 45A to 45C) is held in each of the tool holding parts 62 (62A to 62C) of the tool storage table 61, and It is determined whether the push-up tool 45 is included.
  • step S23 corresponds to the function of the code reading sensor Se3 as the "first reading section" of the present invention.
  • step S5 the control unit 200 controls the tool storage unit 60, and performs a tool mounting process (corresponding to the "tool mounting operation" of the present invention) in which the thrusting tool 45 is mounted on the thrusting head 41 (head main body portion 42). Execute.
  • the operations of each part of the tool storage unit 60 in the tool mounting process in step S5 are as follows.
  • the tool storage table 61 moves in the X direction, and the push-up tool 45 (here, the third tool 45C) to be mounted is placed at the tool loading/unloading position P2.
  • the tool storage table 61 is moved so that the push-up tool 45 to be mounted is placed at the tool insertion/removal position P2 based on the recognition result in step S23.
  • the identification code 54 of the third tool 45C is read by the code reading sensor Se3 and stored.
  • the reading of the identification code 54 here corresponds to the function of the code reading sensor Se3 as the "second reading section" of the present invention.
  • the chuck head 65 descends from the standby position and holds the third tool 45C. Then, as shown in FIG. 10(c), the chuck head 65 rises, moves above the head body portion 42 of the thrust-up head 41, and then descends. Thereby, the third tool 45C is attached to the push-up head 41. After the third tool 45C is attached to the push-up head 41, the chuck head 65 moves to the standby position above the tool insertion/removal position P2, as shown in FIG. 10(d).
  • the control unit 200 determines whether the third tool 45C is attached to the uplift head 41 based on the identification code 54 (identification information) of the third tool 45C read by the code reading sensor Se3 in the process of step S5. It is determined whether the upthrust tool 45 (third tool 45C) is the upthrust tool 45 defined by the tool data, that is, whether it is the upthrust tool 45 corresponding to the die 7a after switching (step S7). .
  • control unit 200 executes predetermined error processing. For example, the control unit 200 displays an error message on the display unit 90, stops the component mounting apparatus 1 (step S25), and ends the control of the flowchart.
  • step S7 determines whether the upthrust tool 45 is normally attached to the upthrust head 41 (head main body 42) based on the signal output from the first tool detection sensor Se1. It is determined whether or not there is one (step S9). Specifically, it is determined whether the push-up tool 45 is detected by the first tool detection sensor Se1. In the case of No here, the control unit 200 moves the process to step S25 and executes the error processing described above.
  • step S9 the control unit 200 controls the wafer camera 39 to image the suction surface portion 46a of the push-up tool 45 attached to the push-up head 41 (step S11).
  • the wafer holder 8 is not held on the wafer table 20 as described above during the push-up tool exchange process. Therefore, the wafer camera 39 can image the suction surface portion 46a of the third tool 45C from above through the openings of the wafer table 20 and the support frame 26.
  • control unit 200 determines whether the push-up pin 50 is appropriate for the push-up tool 45 based on the image data of the suction surface portion 46a acquired in the process of step S11 and the tool data of the push-up tool 45. It is determined whether or not (step S13). Specifically, the control unit 200 recognizes the number and arrangement of the push-up pins 50 from the acquired image, and determines whether the number and arrangement match the tool data. Here, in the case of No, the control unit 200 moves the process to step S25 and executes the error processing described above.
  • the data of the push-up pins 50 of the third tool 45C in the tool data is data such that the push-up pins 50 of the third tool 45C are arranged at four locations around the center O of the suction surface portion 46a as a reference, as shown in FIG. 11(a). Assume that there is. In this case, as shown in FIG. 11(b), the number of push-up pins 50 in the acquired image and the number of push-up pins 50 in the tool data do not match, or as shown in FIG. 11(c), the number of push-up pins 50 in the acquired image If the arrangement of the push-up pins 50 in and the arrangement of the push-up pins 50 in the tool data do not match, the control unit 200 determines No in step S13.
  • step S13 determines whether the control unit 200 controls the wafer supply device 6 and pulls out the wafer holder 8 holding the wafer 7 to be switched onto the wafer table 20. Furthermore, the component transfer unit 33 and the push-up unit 40 are controlled, and the transfer head 34 is used to detect the height of the push-up tool 45 attached to the push-up head 41, that is, the height of the suction surface portion 46a. Execute (step S18).
  • the push-up head 41 is placed at the push-up height position, the wafer sheet 8a is sucked under negative pressure by the suction surface portion 46a of the push-up tool 45, and in this state, the suction nozzle 34a is inserted from above the die 7a. While approaching the die 7a, the height of the third tool 45C is detected based on the output signal from the negative pressure sensor Se4. Specifically, as shown in FIG.
  • the change point of the negative pressure level detected by the negative pressure sensor Se4 that is, the suction nozzle
  • the height of the tip of the suction nozzle 34a at the time when the suction nozzle 34a suctions the die 7a is detected as the height of the thrusting tool 45.
  • the height of the tip of the suction nozzle 34a is determined based on position information detected by the position sensor Se5 (encoder).
  • the control unit 200 determines whether the mounting state of the push-up tool 45 is appropriate based on the height of the third tool 45C detected in the process of step S18. Specifically, it is determined whether the height of the third tool 45C is within the allowable value Ar, that is, whether it is between the upper limit value Uh and the lower limit value Lh shown in FIG.
  • Symbol Sh in FIG. 12 indicates a reference value, which is equal to the upper surface height of the die 7a when the thrusting tool 45 is normally attached to the thrusting head 41.
  • step S19 the control unit 200 moves the process to step S25 and executes the error processing described above.
  • step S19 the control of this flowchart is ended. As a result, a mounting operation for mounting the switched die 7a onto the substrate P is started.
  • the tool storage unit 60 is controlled by the control section 200 to remove the push-up tool 45 attached to the push-up head 41 (tool mounting section 43) and store the tool.
  • a tool return process in which the tool is returned to the table 61, and the push-up tools 45 (45A to 45C) supported by the tool storage table 61 are held by the chuck head 65 and mounted on the push-up head 41 (tool mounting section 43).
  • Tool mounting processing is executed. Therefore, automation of the replacement work of the push-up tool 45 is achieved.
  • the upthrust tool 45 is attached to the upthrust head 41 (tool mounting portion 43) in a vertically removable manner, and is inserted into the tool storage table 61 in the same attitude as when attached to the upthrust head 41.
  • a lifting tool 45 (45A to 45C) is supported.
  • the tool transfer mechanism 60B is configured such that the chuck head 65 moves only in the Z direction and the X direction to transfer the push-up tool 45. Therefore, according to this component mounting apparatus 1, it is possible to automate the replacement work of the push-up tool 45 with a very simple mechanism and control that simply moves the chuck head 65 linearly in the Z direction and the X direction. Become.
  • the tool data stored in the storage unit 86 and the identification code 54 (identification information) read by the code reading sensor Se3 in the process of step S23 are stored in the tool storage table 61.
  • the push-up tool 45 to be mounted is specified from among the plurality of push-up tools 45 (45A to 45C), and the tool mounting process is executed. Therefore, it becomes possible to accurately specify the push-up tool 45 corresponding to the type of die 7a and execute the tool mounting process.
  • the identification code 54 of the push-up tool 45 placed at the tool loading/unloading position P2 is read by the code reading sensor Se3, and the push-up tool 45 is set to the push-up tool 45 determined by the tool data. It is determined whether or not (step S7 in FIG. 7). If there is a difference, an error message is displayed on the display unit 90 and the component mounting apparatus 1 is stopped. Therefore, even if an inappropriate push-up tool 45 is attached to the push-up head 41 in relation to the die 7a after the type change, the picking operation of the die 7a will not be started as is.
  • the component mounting apparatus 1 after the tool mounting process is executed, it is determined whether or not the push-up tool 45 is mounted on the push-up head 41 based on the presence or absence of a signal output from the first tool detection sensor Se1 (In step S9 of FIG. 7), if it is not attached, the error processing described above is executed. Therefore, the picking operation of the die 7a is prevented from being started without the push-up tool 45 being attached to the push-up head 41.
  • the push-up head 41 (suction surface portion 46a) is imaged by the wafer camera 39. Based on the image data, it is determined whether the push-up pins 50 (number and arrangement) provided in the push-up tool 45 are appropriate (steps S11 and S13 in FIG. 7), and if they are not appropriate, The error handling described above is executed. Therefore, it is prevented that the picking operation of the die 7a is started while the push-up tool 45 provided with the inappropriate push-up pin 50 remains attached to the push-up head 41.
  • the height of the push-up tool 45 mounted on the push-up head 41 is detected, and it is determined whether this height is within the allowable value Ar. (Steps S18, S19). If the value is outside the allowable value Ar, the error processing described above is executed. Therefore, it is possible to prevent the picking operation of the die 7a from being started with the push-up tool 45 incompletely attached, such as when the push-up tool 45 is lifted.
  • the component mounting apparatus 1 described above is an example of an embodiment of a component mounting apparatus according to the present invention (a component mounting apparatus equipped with a component pushing-up apparatus of the present invention), and the component mounting apparatus 1 and the component pushing-up apparatus ( The specific configurations of the push-up unit 40 and tool storage unit 60) can be changed as appropriate without departing from the gist of the present invention.
  • the component mounting apparatus 1 of the embodiment picks up the die 7a from the wafer 7 with the transfer head 34 of the component transfer unit 33, and transfers the die 7a indirectly via the transfer table 38 or with the transfer head. 34 directly to the head 4H of the head unit 4.
  • the component mounting apparatus 1 may have a configuration in which, for example, the head 4H of the head unit 4 directly picks up the die 7a from the wafer 7.
  • the processes in steps S18 and S19 in FIG. 7 are performed to determine the negative pressure level of the negative pressure passage for supplying negative pressure to the head 4H and the encoder etc. built in the motor for moving the head 4H up and down. It may also be performed based on position information detected by a position sensor.
  • step S19 in FIG. 7 if it is determined in the process of step S19 in FIG. 7 that the height of the push-up tool 45 is outside the allowable value Ar, an error message is immediately displayed on the display unit 90, and the component mounting device 1 is stopped.
  • a retry operation may be performed. Specifically, the push-up tool 45 is held by the chuck head 65, and the chuck head 65 is once raised and then lowered. Then, after the retry operation, the height detection process of the push-up tool 45 may be performed again, and if the height of the push-up tool 45 is outside the allowable value Ar, the error processing described above may be executed. . According to this configuration, it is possible to automatically correct an incompletely installed state of the push-up tool 45, such as lifting of the push-up tool 45.
  • the height of the uplifting tool 45 attached to the upthrust head 41 is detected based on the information acquired by the negative pressure sensor Se4 and the position sensor Se5, but the height of the upthrust tool 45 attached to the upthrust head 41 is detected by, for example, an optical sensor or the like.
  • the height of the push-up tool 45 attached to the push-up head 41 may be directly detected.
  • the identification code 54 of the push-up tool 45 placed at the tool loading/unloading position P2 is read by the code reading sensor Se3, and based on the identification information recorded in the identification code 54, the push-up tool 45 is It is determined whether or not the push-up tool 45 is defined by the tool data (step S7 in FIG. 7).
  • the identification code 54 for the determination process in step S7 may be read by a code reading sensor different from the code reading sensor Se3.
  • the other code reading sensor (corresponding to the "second reading section" of the present invention) detects the identification at any position within the moving path of the uplifting tool 45 that is held and moved by the chuck head 65. It is only necessary that the code 54 be readable.
  • the push-up head 41 is arranged at the pick-up position P1, and as the wafer 7 moves in the XY direction with respect to the push-up head 41, the die 7a to be picked up is arranged at the pick-up position P1.
  • This is the configuration that will be used.
  • the push-up head 41 side may be moved in the XY direction and placed below the die 7a to be picked up.
  • the push-up head 41 is moved to a predetermined tool exchange area, and a position adjacent to the tool exchange area is set so that the tool exchange is performed on the push-up head 41 placed in this tool exchange area.
  • the tool storage unit 60 may be disposed at.
  • a component pushing-up device is a component pushing-up device that peels a die from a wafer sheet by pushing up a die from below a wafer attached to a wafer sheet, and the component pushing-up device peels the die from the wafer sheet.
  • a plurality of push-up tools each including a suction surface that sucks a lower surface of the sheet under negative pressure and a push-up pin that is provided so as to be able to protrude and retract from the suction surface toward the wafer sheet side; and the plurality of push-up tools selectively and a push-up head that is movable relative to the wafer sheet in a direction along the wafer sheet and in a vertical direction; and a push-up head that is detachably mounted in a vertical direction;
  • a tool storage table capable of supporting each tool in the same posture as the tool is attached to the tool mounting portion; and a holding member capable of holding the uplifting tool; a tool transfer mechanism that transfers the push-up tool between the push-up head and the tool storage table by moving the push-up head in the vertical direction and the horizontal direction; and controlling the push-up head and the tool transfer mechanism.
  • a tool return operation of removing the push-up tool mounted on the tool mounting part by the holding member and returning it to the tool storage table, and/or the push-up tool supported by the tool storage table.
  • a control section that executes a tool mounting operation of holding the tool by the holding member and mounting the tool on the tool mounting section.
  • the control unit controls the lifting head and the tool transfer mechanism to perform a tool return operation in which the lifting tool attached to the lifting head is removed and returned to the tool storage table, and/or A tool mounting operation is performed in which the push-up tool supported on the tool storage table is held by the holding member and mounted on the tool mounting portion of the push-up head.
  • the work of replacing the upthrust tool with respect to the upthrust head can be automated.
  • the lifting tool is attached to the tool mounting part in a vertically removable manner, and the tool storage table supports the lifting tool in the same posture as when it is attached to the tool mounting part. be done.
  • the tool transfer mechanism is configured to transfer the upthrust tool between the upthrust head and the tool storage table by moving the holding member vertically and horizontally while holding the upthrust tool. There is. Therefore, it is possible to automate the replacement work of the push-up tool with a simple mechanism and control that simply moves the holding member linearly.
  • each of the plurality of pushing-up tools includes a recording section in which each identification information is recorded, and the component pushing-up device includes the pushing-up tool supported by the tool storage table. further comprising: a first reading section that can read identification information recorded in the information recording section of the tool; and a storage section that stores tool information that is information regarding each of the uplift tools;
  • the controller includes information that defines a correspondence relationship between die types and push-up tools used for the types, and the control unit stores information in the tool storage table based on the tool information and the identification information read by the first reading unit.
  • a push-up tool to be mounted is identified from among the plurality of supported push-up tools, and the tool mounting operation is executed.
  • the push-up tool corresponding to the die in response to a change in die type, etc., the push-up tool corresponding to the die can be accurately identified from among the plurality of push-up tools supported on the tool storage table. It becomes possible to perform a tool mounting operation.
  • the push-up tool when performing the tool mounting operation, is mounted on the tool mounting portion from a holding position where the push-up tool supported by the tool storage table is held by the holding member.
  • a second reading section capable of reading the identification information is further provided at any position within the moving path of the push-up tool to the position.
  • this component lifting device it is possible to stop the device due to an error based on the reading result of the second reading section. Therefore, it is possible to prevent the die picking operation from being started with an inappropriate push-up tool still attached to the tool mounting portion.
  • a common reading section is provided as the first reading section and the second reading section, and the common reading section is provided so as to be movable relative to the tool storage table. and configured to read the identification information of the uplift tool placed in the holding position.
  • the above-mentioned component lifting device includes a sensor that detects the lifting tool when the tool mounting section is equipped with the lifting tool, and the control unit is configured to:
  • the device may be configured to determine whether the push-up tool is attached to the tool mounting portion based on whether or not the push-up tool is detected by the sensor.
  • the above-mentioned component lifting device further includes an imaging section that images the suction surface of the thrusting tool after the tool mounting operation is performed, and the control section is configured to control the suction surface imaged by the imaging section.
  • the push-up pin may be recognized from the image, and based on the recognition result, the suitability of the push-up pin provided in the push-up tool may be determined.
  • the suitability of the push-up pins provided in the push-up tool is automated. This prevents the die picking operation from starting with a push-up tool equipped with an inappropriate push-up pin still attached.
  • the above-mentioned component lifting device further includes an acquisition unit that acquires information capable of detecting the height of the lifting tool mounted on the lifting head after the tool mounting operation, and the control unit , it may be configured to determine whether the mounting state of the push-up tool is good or bad based on the information acquired by the acquisition unit.
  • the die picking operation can be carried out in that state. It is possible to prevent this from starting.
  • control unit determines that the attachment state of the tool is not good, the control unit executes a retry operation of raising and lowering the holding member while holding the push-up tool by the holding member. You may also do so.
  • the above-mentioned component lifting device further includes a notification unit that notifies an error when there is no lifting tool to be mounted among the plurality of lifting tools supported on the tool storage table. You can leave it there.
  • the component mounting apparatus includes a component supply section in which diced wafers are placed and attached to a wafer sheet, and a component mounting device that picks dies from the wafers placed in the component supply section. and a component lifting device as described above, which pushes up the die from below the wafer sheet when the head picks the die.
  • this component mounting apparatus since it is equipped with the component push-up device as described above, it becomes possible to automate the replacement work of the push-up tool with a simple mechanism and control.

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Abstract

Ce dispositif de poussée de composants comprend : une pluralité d'outils de poussée comprenant chacun une surface d'attraction de feuille de tranche et une broche de poussée ; une tête de poussée mobile comprenant une partie de fixation d'outil à laquelle les outils de poussée vers le haut sont sélectivement fixés ; un mécanisme de transfert d'outil qui comprend une table de stockage d'outil capable de supporter chaque outil de la pluralité d'outils de poussée dans la même posture que dans un état fixé à la partie de fixation d'outil, et un élément de maintien capable de maintenir les outils de poussée, le mécanisme de transfert d'outil transférant les outils de poussée dans un état maintenu ; et une unité de commande qui commande la tête de poussée vers le haut et le mécanisme de transfert d'outil pour effectuer une opération de retour d'outil et détacher les outils de poussée vers le haut à partir de la tête de poussée vers le haut et renvoyer les outils de poussée vers le plateau de stockage d'outil, et/ou une opération de fixation d'outil pour fixer les outils de poussée sur la table de stockage d'outil à la partie de fixation d'outil de la tête de poussée.
PCT/JP2022/019281 2022-04-28 2022-04-28 Dispositif de poussée de composants et dispositif de montage de composants WO2023209950A1 (fr)

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