WO2023209950A1 - Component push-up device and component mounting device - Google Patents

Component push-up device and component mounting device Download PDF

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Publication number
WO2023209950A1
WO2023209950A1 PCT/JP2022/019281 JP2022019281W WO2023209950A1 WO 2023209950 A1 WO2023209950 A1 WO 2023209950A1 JP 2022019281 W JP2022019281 W JP 2022019281W WO 2023209950 A1 WO2023209950 A1 WO 2023209950A1
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WO
WIPO (PCT)
Prior art keywords
tool
push
head
component
wafer
Prior art date
Application number
PCT/JP2022/019281
Other languages
French (fr)
Japanese (ja)
Inventor
直樹 松下
公久 安間
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2022/019281 priority Critical patent/WO2023209950A1/en
Publication of WO2023209950A1 publication Critical patent/WO2023209950A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • the present invention includes a component pushing-up device that pushes up and peels off the die from below the wafer sheet when picking up a die (bare chip) from a wafer attached to a wafer sheet, and the component pushing-up device.
  • a component pushing-up device that pushes up and peels off the die from below the wafer sheet when picking up a die (bare chip) from a wafer attached to a wafer sheet, and the component pushing-up device.
  • a component mounting apparatus that picks up a die (bare chip) from a diced wafer and mounts it on a substrate.
  • a wafer camera captures an image of the wafer that is carried into a predetermined position (component placement area) inside the machine by a wafer feeder to recognize the wafer, and then the die is picked by a head equipped with a die holding function. This action is repeated.
  • the component mounting apparatus is equipped with a component lifting device that peels the die from the wafer sheet prior to picking the die by lifting the die from below the wafer attached to the wafer sheet.
  • the component push-up device includes a cylindrical suction housing and one or more push-up pins that are retractably installed in the center of the cylindrical suction housing. The die is pushed up from below using a pin.
  • This component push-up device is a type of component push-up device in which a component push-up unit pushes up a die while moving relative to a wafer.
  • the push-up unit is equipped with a push-up head (peeling promotion head mounting part) that can be rotated between vertical and horizontal positions, and the push-up tool is removably attached to the tool mounting part of the push-up head. be done.
  • the standby push-up tool is placed horizontally.
  • the push-up head is displaced from the vertical position to the horizontal position, and the push-up head moves vertically and horizontally to the standby position of the push-up tool.
  • the push-up tool mounted on the tool mounting section is locked by the locking arm, and in this state, the push-up head is moved backward, thereby removing the push-up tool from the tool mounting section.
  • the push-up head moves to the position of the replacement push-up tool, so that the push-up tool is mounted on the tool mounting section.
  • the thrusting head is reset from the horizontal position to the vertical position, thereby completing the replacement of the thrusting tool.
  • the component lifting device of Patent Document 1 uses three axes (X-axis, Y-axis, Z-axis) for linear movement of the lifting head and rotation as a drive system for changing the lifting tool.
  • a total of four axes of drive mechanisms and their control are required, including one axis for this purpose.
  • the same number of locking arms and drive mechanisms as the number of standby push-up tools are required. Therefore, the structure and control of the drive system for exchanging the uplifting tool becomes complicated in general.
  • the present invention has been made in view of the above-mentioned problems, and its purpose is to automatically operate a push-up tool equipped with a suction housing and a push-up pin in a component push-up device with a simpler configuration and control.
  • the purpose is to make it interchangeable.
  • a component pushing-up device is a component pushing-up device that peels a die from a wafer sheet by pushing up a die from below a wafer attached to a wafer sheet, and the component pushing-up device peels the die from the wafer sheet.
  • a plurality of push-up tools each including a suction surface that sucks a lower surface of the sheet under negative pressure and a push-up pin that is provided so as to be able to protrude and retract from the suction surface toward the wafer sheet side; and the plurality of push-up tools selectively and a push-up head that is movable relative to the wafer sheet in a direction along the wafer sheet and in a vertical direction; and a push-up head that is detachably mounted in a vertical direction;
  • a tool storage table capable of supporting each tool in the same posture as the tool is attached to the tool mounting portion; and a holding member capable of holding the uplifting tool; a tool transfer mechanism that transfers the push-up tool between the push-up head and the tool storage table by moving the push-up head in the vertical direction and the horizontal direction; and controlling the push-up head and the tool transfer mechanism.
  • a tool return operation of removing the push-up tool mounted on the tool mounting part by the holding member and returning it to the tool storage table, and/or the push-up tool supported by the tool storage table.
  • a control section that executes a tool mounting operation of holding the tool by the holding member and mounting the tool on the tool mounting section.
  • the component mounting apparatus includes a component supply section in which diced wafers are placed and attached to a wafer sheet, and a component mounting device that picks dies from the wafers placed in the component supply section. and the above-mentioned component pushing device that pushes up the die from below the wafer sheet when the head picks the die.
  • FIG. 1 is a plan view of a main body of a component mounting apparatus according to the present invention (a component mounting apparatus equipped with a component pushing-up device according to the present invention).
  • FIG. 2 is a plan view showing a wafer table and a wafer table drive mechanism.
  • FIG. 3 is a schematic perspective view of the push-up unit and tool storage unit.
  • FIG. 4 is a sectional view of the tip portion of the thrusting head.
  • FIG. 5 is a perspective view of the head main body of the thrust-up head, the thrust-up tool, and the tool storage table.
  • FIG. 6 is a block diagram showing the control system of the component mounting apparatus.
  • FIG. 7 is a flowchart showing control of the push-up tool replacement process.
  • FIG. 8 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • FIG. 9 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • FIG. 10 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • FIG. 11 is a schematic diagram showing an image of the suction surface portion of the thrust-up head (suction housing) acquired by the wafer camera.
  • FIG. 12 is an explanatory diagram of height detection of the push-up tool.
  • FIG. 1 is a top plan view showing the overall configuration of a component mounting apparatus 1 according to an embodiment of the present invention.
  • the component mounting apparatus 1 is a hybrid component mounting apparatus that can mount a die 7a (component) diced from a wafer 7 onto a substrate P in addition to completed components such as transistors and capacitors.
  • the component mounting apparatus 1 includes an apparatus main body 100 and a control section 200 (see FIG. 6). In the figure, XYZ orthogonal coordinates are shown to clarify the directional relationship.
  • the device main body 100 includes a base 2, a conveyor 3, a head unit 4, a component supply section 5, a push-up unit 40, and a tool storage unit 60.
  • the base 2 is a mounting base for various devices included in the device main body 100.
  • the conveyor 3 is a transport line for substrates P installed on the base 2 so as to extend in the X direction.
  • the conveyor 3 carries the board P from outside the machine to a predetermined mounting work position, and after the mounting work, transports the board P from the mounting work position to the outside of the machine. Note that the position where the board P is shown in FIG. 1 is the mounting work position.
  • the component supply units 5 are provided on the ⁇ Y side and the +Y side with the conveyor 3 interposed therebetween.
  • the head unit 4 picks up the components at the component supply section 5, moves to the mounting work position, and mounts the components on the board P.
  • the head unit 4 includes a plurality of heads 4H, each of which is equipped with a suction nozzle that suctions and holds the component under negative pressure during the pickup.
  • the head 4H can move forward and backward (up and down) in the Z direction with respect to the head unit 4, and can rotate around an axis.
  • the head unit 4 is equipped with a board recognition camera 12 that takes an image of the board P. The federal mark attached to the board P is recognized by the image taken by the board recognition camera 12.
  • the apparatus main body 100 includes a head unit drive mechanism D1 that allows the head unit 4 to be moved in the horizontal direction (XY direction) between the component supply section 5 and the board P held at the mounting work position.
  • the head unit drive mechanism D1 is installed between a pair of Y-axis rails 13, a Y-axis motor 14, a ball screw shaft 15, and a pair of Y-axis rails 13 on the +X side and -X side provided on the elevated frame 11, respectively.
  • the support frame 16 is provided with a support frame 16.
  • the ball screw shaft 15 is screwed into a nut provided on the support frame 16.
  • the head unit drive mechanism D1 also includes an unillustrated guide member mounted on the support frame 16, an X-axis motor 17, and a ball screw shaft 18. The guide member supports the head unit 4 so as to be movable in the X direction, and the ball screw shaft 18 is screwed into a nut (not shown) provided on the head unit 4.
  • this head unit drive mechanism D1 By the operation of this head unit drive mechanism D1, the head unit 4 moves in the horizontal direction. That is, the ball screw shaft 15 is rotationally driven by the Y-axis motor 14, so that the head unit 4 moves in the Y direction together with the support frame 16, and the ball screw shaft 18 is rotationally driven by the X-axis motor 17. As a result, the head unit 4 moves in the X direction with respect to the support frame 16.
  • the component supply section 5 includes a first component supply section 5A located on the -Y axis of the conveyor 3 and a second component supply section 5B located on the +Y side.
  • a plurality of tape feeders 19 are arranged in parallel along the conveyor 3 in the first component supply section 5A.
  • the tape feeder 19 is a component supply device of a type that feeds a tape containing completed components such as the transistors and capacitors described above at regular intervals while feeding the tape.
  • the second component supply section 5B includes a wafer supply device 6 that supplies a plurality of dies 7a in the form of wafers 7, and a wafer supply device 6 that picks up the dies 7a from the wafer 7 and transfers them to a predetermined delivery position with respect to the head unit 4.
  • a component transfer unit 33, a wafer camera 39, and a component recognition camera 10 are provided.
  • the wafer supply device 6 includes a wafer storage elevator 22, a wafer table 20, and a wafer drawer unit 23.
  • the wafer storage elevator 22 stores the wafer sheets 8a to which the wafers 7 are attached in multiple stages, with the wafer sheets 8a being held by the wafer holders 8.
  • the wafer storage elevator 22 raises and lowers the wafers 7 stored in multiple stages as one, and arranges any wafer 7 at a height corresponding to the height of the wafer table 20.
  • the wafer table 20 is placed on the -Y side of the wafer storage elevator 22.
  • the wafer table 20 is a workbench for taking out parts that holds the wafer holder 8 (wafer 7).
  • the wafer supply device 6 includes a wafer table drive mechanism D2 that allows the wafer table 20 to be moved in the horizontal direction (XY direction).
  • FIG. 2 is a plan view showing the wafer table 20 and the wafer table drive mechanism D2.
  • the wafer table drive mechanism D2 includes a pair of X-axis rails 30 on the +Y side and -Y side, an X-axis motor 31, a ball screw shaft 32, and a plate-shaped support frame 26 installed on the pair of X-axis rails 30. Equipped with.
  • the ball screw shaft 32 is threaded into a nut provided on the support frame 26.
  • the wafer table drive mechanism D2 includes a pair of Y-axis rails 27 provided on the support frame 26 on the +X side and the -X side, a Y-axis motor 28, and a ball screw shaft 32.
  • the ball screw shaft 32 is screwed into a nut provided on the wafer table 20.
  • this wafer table drive mechanism D2 By the operation of this wafer table drive mechanism D2, the wafer table 20 moves in the horizontal direction. That is, the ball screw shaft 32 is rotationally driven by the X-axis motor 31, so that the wafer table 20 moves together with the support frame 26 in the X direction, and the ball screw shaft 29 is rotationally driven by the Y-axis motor 28. As a result, the wafer table 20 moves in the Y direction with respect to the support frame 26.
  • the target die 7a is placed at a predetermined pickup position P1 defined by the XY coordinates by moving the wafer table 20.
  • the wafer drawer unit 23 takes the wafer holder 8 in and out between the wafer storage elevator 22 and the wafer table 20.
  • the wafer drawer unit 23 includes a drawer head 24 that can lock the wafer holder 8, and a drawer head drive device 25 that moves the drawer head 24 in the Y direction.
  • the wafer drawer unit 23 moves the wafer holder 8 by moving the drawer head 24 in the Y direction, with the wafer holder 8 locked by the drawer head 24. That is, the wafer 7 is taken in and out of the wafer storage elevator 22 together with the wafer holder 8 .
  • This loading and unloading of the wafer holder 8 is made possible by arranging the wafer table 20 at a predetermined wafer loading/unloading position that closely opposes the -Y side of the wafer storage elevator 22.
  • the component transfer unit 33 includes a transfer head 34 for picking up the die 7a placed at the pickup position P1 from the wafer 7, a transfer table 38 for delivering the die 7a to the head unit 4, and a transfer head 34. It is provided with a transfer head drive mechanism D3 that allows the transfer head to be moved.
  • the transfer head 34 includes a suction nozzle 34a that holds the die 7a by suctioning it under negative pressure.
  • the transfer head 34 picks up the die 7a by suctioning the die 7a under negative pressure at the pickup position P1.
  • the suction nozzle 34a can move forward and backward (up and down) in the Z direction with respect to the base portion of the transfer head 34, and can rotate around a horizontal axis. By rotating the transfer head 34 around the horizontal axis, it becomes possible to vertically invert the attitude of the die 7a.
  • the negative pressure passage that supplies negative pressure to the suction nozzle 34a is equipped with a negative pressure sensor Se4 (see FIG. 6) that can detect the negative pressure level.
  • the motor (not shown) for moving the transfer head 34 forward and backward has a built-in position sensor Se5 (see FIG. 6) such as an encoder, and the transfer head 34 is adjusted based on the position information detected by the position sensor Se5.
  • the Z coordinate, that is, the height can be detected.
  • the "negative pressure level" detected by the negative pressure sensor Se4 and the "position information" detected by the position sensor Se5 are information that can detect the height of the upthrust tool 45 attached to the upthrust head 41, as described later. be. Therefore, in this example, the negative pressure sensor Se4 and the position sensor Se5 correspond to the "acquisition unit" of the present invention.
  • the transfer table 38 is a transfer table for transferring the die 7a held by the suction nozzle 34a to the head 4H of the head unit 4.
  • the transfer table 38 is arranged at a predetermined transfer position close to the mounting work position.
  • the transfer head drive mechanism D3 includes a rail 37 that movably supports the transfer head 34, a ball screw shaft 36 arranged parallel to the rail 37, and a motor 35.
  • the ball screw shaft 36 is screwed into a nut provided on the transfer head 34.
  • the transfer head drive mechanism D3 moves the transfer head 34 in the space between the pickup position P1 and the transfer table 38 by rotationally driving the ball screw shaft 36 by the motor 35.
  • the wafer camera 39 images a portion of the wafer 7 held on the wafer table 20 at the pickup position P1, that is, the die 7a within the field of view of the camera from above. Based on this captured image, the position of the die 7a to be picked up is recognized.
  • the wafer camera 39 is supported by an elevated frame (not shown) so as to be positioned above the transfer head 34 with the transfer head 34 disposed at the pickup position P1. This avoids interference with the transfer head 34.
  • the component recognition camera 10 is arranged at a position adjacent to the +X side of the transfer table 38.
  • the component recognition camera 10 images the components (the die 7a and the completed component) adsorbed on the head 4H of the head unit 4 from below before mounting on the board P. Based on this captured image, the state of suction of the component by the head 4H is recognized.
  • FIG. 3 is a schematic perspective view of the push-up unit 40 and tool storage unit 60.
  • the push-up unit 40 and the tool storage unit 60 are arranged below the component supply section 5, specifically, below the support frame 26 of the wafer table drive mechanism D2.
  • the wafer table 20 is provided with a circular opening 20a, and the support frame 26 is provided with an unillustrated opening at a position that can overlap with the opening 20a.
  • a push-up unit 40 is arranged below these openings. That is, when the wafer holder 8 is held on the wafer table 20, the wafer 7 is placed inside the opening 20a.
  • the push-up unit 40 pushes up the die 7a through each opening of the support frame 26 and the wafer table 20.
  • the push-up unit 40 includes a push-up head 41 and a push-up head drive mechanism D6. As shown in FIGS. 3 and 4(a), the push-up head 41 includes a shaft-shaped head main body portion 42 extending in the Z direction, and a push-up tool 45 attached to the upper end portion of the head body portion 42. Note that FIG. 4A is a cross-sectional view of the tip portion of the thrusting head 41. As shown in FIG.
  • the thrusting head 41 is arranged so that the head main body portion 42 is located at the pickup position P1.
  • the head main body part 42 has a cylindrical shape and is provided with a thrust main shaft 44 at its center that moves forward and backward (up and down) in the Z direction.
  • the push-up tool 45 includes a suction housing 46 (sometimes referred to as a "suction dome") for suctioning the wafer sheet 8a from below, and a pin holder 48 disposed inside the suction housing 46.
  • the suction housing 46 is a cylindrical member with an open top, which includes a suction surface portion 46a having a circular suction surface in plan view and a cylindrical portion 46b extending downward from the periphery of the suction surface portion 46a to suction the wafer sheet 8a under negative pressure.
  • a plurality of pin holes 47 are formed in the suction surface portion 46a in a predetermined arrangement.
  • a push-up tool 45 is removably attached to the tip (upper end) of the head main body 42 via the suction housing 46.
  • a tool mounting part 43 having a smaller diameter than other parts is formed at the tip of the head main body part 42, and by fitting the cylindrical part 46b of the suction housing 46 into this tool mounting part 43, A push-up tool 45 is attached to the head body portion 42.
  • the thrusting tool 45 is attached to the thrusting head 41.
  • the pin holder 48 is a member in which one or more push-up pins 50 are erected on a disc-shaped pin base 49, and is movable in the Z direction along the inner peripheral surface of the cylindrical portion 46b. is maintained. As shown in FIG. 4(b), the pin holder 48 is pushed up against the suction housing 46 by the forward (upward) movement of the push-up main shaft 44. As a result, the push-up pin 50 projects upward from the suction surface portion 46a through the pin hole 47. When the push-up main shaft 44 moves backward (downward), the pin holder 48 descends with respect to the suction housing 46 by its own weight or by the biasing force of an elastic member (such as a spring) not shown. As a result, the push-up pin 50 is retracted into the suction housing 46 (pin hole 47). That is, the push-up pin 50 is provided so as to be able to protrude and retract upward from the suction surface portion 46a.
  • a tool storage unit 60 which will be described later, holds and stores a plurality of push-up tools 45 having different configurations, and when picking the die 7a, a tool storage unit 60, which will be described later, holds and stores a plurality of push-up tools 45 with different configurations.
  • a thrusting tool 45 is attached to the thrusting head 41.
  • the thrusting head drive mechanism D6 is composed of, for example, a cylinder mechanism using air as a drive source. Due to the operation of the thrust head drive mechanism D6, the thrust head 41 moves forward and backward (up and down) at the pickup position P1. Specifically, a predetermined push-up height position where the suction surface portion 46a comes into contact with the lower surface of the wafer sheet 8a, and a predetermined standby height position (position shown in FIG. 3) that is retracted downward from the push-up height position Move forward and backward between.
  • a first tool detection sensor Se1 capable of detecting the presence or absence of the thrusting tool 45 at the tip of the thrusting head 41 is installed on the ⁇ Y side of the thrusting head 41 disposed at the standby height position. (corresponding to "sensor”) are arranged.
  • the tool storage unit 60 is provided adjacent to the +X side of the push-up unit 40, as shown in FIGS. 2 and 3.
  • the tool storage unit 60 includes a tool storage section 60A and a tool transfer mechanism 60B.
  • the tool storage section 60A holds and stores a plurality of types of push-up tools 45, and the tool transfer mechanism 60B transports the push-up tools 45 between the push-up unit 40 and the tool storage section 60A.
  • the tool storage unit 60A includes a tool storage table 61 that holds the push-up tool 45, a storage table drive mechanism D4 that moves the tool storage table 61, and a code reading sensor Se3.
  • the tool storage table 61 is arranged at a position adjacent to the head body portion 42 of the thrusting head 41 on the +X side.
  • the tool storage table 61 has a rectangular shape in plan view that is elongated in the X direction, and includes a plurality of tool holding sections 62 on the upper surface.
  • the tool holding portion 62 is a circular recess formed on the upper surface of the tool storage table 61.
  • the inner diameter of the tool holding part 62 is set to a size that allows the push-up tool 45 (suction housing 46) to fit therein, and the push-up tool 45 has its lower end loosely fitted into the tool holding part 62. It is supported on a tool storage table 61.
  • the tool storage table 61 is provided with three tool holders 62 arranged in a row at equal intervals in the X direction. As shown in FIG. 2, in plan view, each tool holding portion 62 is provided such that its center is located on a straight line L1 extending in the X direction through the center of the head body portion 42 of the thrusting head 41. It is being The first tool 45A is placed in the tool holding part 62 at the -X side end (hereinafter referred to as a first tool holding part 62A), and the second tool is placed in the middle tool holding part 62 (hereinafter referred to as a second tool holding part 62B).
  • the tool holding part 62 (appropriately, third tool holding part 62C) at the +X side end.
  • the first tool 45A is attached to the push-up head 41, so the first tool holding portion 62A is empty.
  • FIG. 5 is a perspective view showing the head main body portion 42 of the thrusting head 41, the thrusting tool 45, and the tool storage table 61.
  • a positioning convex portion 43a is provided on the outer circumferential surface of the tool mounting portion 43 of the head main body portion 42
  • a positioning recess 56 is provided on the outer circumferential surface of the push-up tool 45 (suction housing 46).
  • the push-up tool 45 is mounted on the tool mounting portion 43 in a state in which it is positioned around the vertical axis by fitting the positioning convex portion 43a and the positioning recess 56.
  • a positioning convex portion 63 is provided on the inner circumferential surface of each tool holding portion 62 of the tool storage table 61, and the push-up tool 45 can be moved vertically by fitting the positioning convex portion 63 and the positioning concave portion 56. It is held by the tool holding part 62 in a state in which it is positioned around the periphery.
  • the positioning convex portion 43a of the head main body portion 42 and each positioning convex portion 63 of each tool holding portion 62 are both on the straight line L in plan view, and are both provided on the ⁇ X side.
  • the push-up tool 45 is held on the tool storage table 61 in the same posture as the head body section 42 is attached to the tool attachment section 43 (in this example, both the vertical direction and the direction around the axis are the same).
  • Ru a second tool detection sensor Se2 is embedded in the inner bottom surface of each tool holding part 62, and the presence or absence of the push-up tool 45 in each tool holding part 62 can be detected.
  • the storage table drive mechanism D4 is composed of, for example, a screw feeding mechanism using a motor as a drive source. Due to the operation of the storage table drive mechanism D4, the tool storage table 61 is moved horizontally in the It is alternatively arranged at the tool insertion/removal position P2 (corresponding to the "holding position" of the present invention). Note that the storage table drive mechanism D4 may be constituted by a cylinder mechanism using air as a drive source.
  • the code reading sensor Se3 (corresponding to the "first reading section” and “second reading section” of the present invention) is a sensor that reads the identification mark of each push-up tool 45 held on the tool storage table 61.
  • the code reading sensor Se3 is arranged on the ⁇ Y side of the tool loading/unloading position P2, and reads the identification information recorded in the identification information recording section provided on the side surface of the push-up tool 45 placed at the tool loading/unloading position P2. .
  • a notch-like flat surface portion 52 for the cord is formed on the outer peripheral portion on the -Y side of the cylindrical portion 46b of the push-up tool 45 (suction housing 46).
  • a one-dimensional or two-dimensional identification code 54 is provided on the code plane part 52 as an identification information recording part.
  • the code reading sensor Se3 reads this identification code 54.
  • the identification mark is not limited to a one-dimensional or two-dimensional identification code, and various sensors capable of reading identification marks can be applied to the code reading sensor Se3.
  • the tool transfer mechanism 60B includes a chuck head 65 and a chuck head drive mechanism D5 that moves the chuck head 65 in the Z direction and the X direction.
  • the chuck head 65 is an electrically or air-driven parallel opening/closing chuck device equipped with a pair of claws 66 that can be opened and closed in the X direction.
  • the chuck head 65 holds the push-up tool 45 by pinching the push-up tool 45 from both sides in the X direction with the pair of claws 66 .
  • the chuck head drive mechanism D5 includes, for example, a slider 72 that moves in the X direction by a screw feed mechanism that uses a motor as a drive source, and a base frame 68 that similarly moves in the Z direction by a screw feed mechanism that uses a motor as a drive source. including.
  • the chuck head 65 is assembled to a base frame 68.
  • the base frame 68 moves in the X direction together with the slider 72, and the base frame 68 moves in the Z direction with respect to the slider 72.
  • the chuck head 65 moves in the X direction and the Z direction.
  • the chuck head drive mechanism D5 may be configured to move the slider 72 and the base frame 68 using a cylinder mechanism using air as a drive source.
  • the pair of claws 66 are arranged at positions intersecting the straight line L, and the chuck head 65 is moved only in the X direction and the Z direction by the operation of the chuck head drive mechanism D5. Moving. Therefore, the chuck head 65 clamps the push-up tool 45 on the straight line L.
  • cutout-shaped chuck flat portions 53 are provided at the outer peripheral portions of the +X side and the ⁇ X axis, respectively.
  • Each chuck flat portion 53 is a plane parallel to each other.
  • each claw 66 has a clamping surface parallel to the flat part 53, and the chuck head 65 clamps the chuck flat part 53 of the push-up tool 45 with the clamping surface of the pair of claws 66. Therefore, the push-up tool 45 is held and conveyed by the chuck head 65 while maintaining the posture placed on the tool holding section 62.
  • the basic operation when mounting the die 7a on the substrate P in the component mounting apparatus 1 described above is as follows. First, the wafer table 20 is placed at the wafer loading/unloading position, and the wafer holder 8 is pulled out from the wafer storage elevator 22 to the wafer table 20 by the wafer pulling unit 23 . As a result, the wafer sheet 8a to which the assembly (wafer 7) of a large number of dies 7a, 7a, . . . is attached is placed on the wafer table 20.
  • the wafer table 20 By moving the wafer table 20, the die 7a to be picked up is placed at the pickup position P1, and the wafer camera 39 images the die 7a. At this time, the transfer head 34 of the component transfer unit 33 retreats from the pickup position P1. The image taken by the wafer camera 39 is for recognizing the die 7a that the transfer head 34 attracts in a later picking operation.
  • the transfer head 34 When the imaging of the die 7a is completed, the transfer head 34 is placed at the pickup position P1, and the suction nozzle 34a picks up the die 7a recognized by the imaging by the wafer camera 39. At this time, the die 7a is pushed up by the push-up head 41. Specifically, the push-up head 41 is displaced (raised) from the standby height position to the push-up height position, and the wafer sheet 8a is suctioned under negative pressure by the suction surface portion 46a. Thereafter, the push-up pin 50 projects from the suction surface portion 46a by the operation of the push-up main shaft 44, and the die 7a is pushed up through the wafer sheet 8a.
  • the transfer head 34 moves from above the wafer table 20 to above the transfer table 38.
  • the die 7a is transferred to the head unit 4 with the suction nozzle 34a in the suction posture, the die 7a is released onto the transfer table 38.
  • the transfer head 34 retreats from above the transfer table 38, and the head unit 4 moves above the transfer table 38, and the head 4H picks up the die 7a from the transfer table 38.
  • the head unit 4 moves above the component recognition camera 10, above the board P at the mounting work position, and descends. Thereby, the die 7a is mounted on the substrate P.
  • the suction nozzle 34a rotates above the transfer table 38, thereby changing the position of the die 7a. Flip it upside down. Thereafter, the head unit 4 moves above the transfer head 34, and the head 4H picks up the die 7a directly from the suction nozzle 34a. After picking the die 7a, similarly to the above, the head unit 4 moves above the component recognition camera 10 and above the board P at the mounting work position. Thereby, the die 7a is mounted on the substrate P.
  • the optimum form of the push-up tool 45 used when picking the die 7a differs depending on the size of the die 7a, the circuit formed therein, etc., as described above. Therefore, when the type of die 7a is changed, the push-up tool 45 attached to the push-up head 41 is replaced accordingly. This point will be explained in detail later.
  • FIG. 6 is a block diagram showing a control system of the component mounting apparatus 1.
  • the component mounting apparatus 1 includes a control section 200 as described above, a display section 90 that displays various information regarding component mounting processing, etc., and an input section 91 that receives input operations for various commands to the control section 200. ing.
  • the control unit 200 includes a CPU, ROM, RAM, peripheral circuits, and the like.
  • the control unit 200 controls the operation of each component of the apparatus main body 100 by having the CPU execute a control program stored in the ROM.
  • the control unit 200 includes a mounting control unit 81, a transport control unit 82, a component supply control unit 83, a component push-up control unit 84, an imaging control unit 85, a storage unit 86, and a display control unit 87 as main functional components.
  • the mounting control unit 81 comprehensively controls the operation of component mounting processing in the apparatus main body 100, mainly the operation of the head unit drive mechanism D1 and the drive mechanism of the head 4H.
  • the conveyance control unit 82 controls the conveyance operation of the substrate P by the conveyor 3.
  • the component supply control unit 83 controls the supply operation of the die 7a. That is, the operation of each part 22, 23, D2 of the wafer supply device 6 and the operation of the component transfer unit 33 are controlled. Further, the component supply control section 83 controls the operation of the tape feeder 19.
  • the component push-up control section 84 centrally controls the operations of the push-up unit 40 and tool storage unit 60.
  • the push-up tool 45 attached to the push-up head 41 is held on the tool storage table 61 in response to the operator's input operation through the input unit 91.
  • the tool exchange process described later is executed to exchange the tool with another push-up tool 45.
  • various determination processes are executed in the tool exchange process based on input signals from the sensors Se1 to Se5.
  • the imaging control unit 85 controls imaging operations by the component recognition camera 10, the board recognition camera 12, and the wafer camera 39.
  • the imaging control section 85 includes an image processing section 85a, and generates a digital image of the subject based on image signals output from each of the cameras 10, 12, and 39. Specifically, a digital image of the component attracted by the head 4H, the fiducial mark of the substrate P, and the die 7a is generated.
  • the storage unit 86 stores various programs executed in component mounting processing and correction data acquisition processing, and various data referenced when executing the programs.
  • the various data include board data and tool data.
  • the board data includes information such as the type of board P, the parts mounted on the board P of each type, and the mounting position (coordinates) of the parts.
  • the tool data (tool information) is information regarding the suction nozzle and the push-up tool 45.
  • This tool data includes data defining the push-up tool 45 (identification information) used for pushing up each type of die 7a, and data such as the number and arrangement of push-up pins 50 provided in each push-up tool 45. is included.
  • the display control section 87 controls the display by the display section 90 (corresponding to the "notification section” of the present invention), and causes the display section 90 to display various information and images according to the status of the component mounting process.
  • the display section 90 consists of a liquid crystal display device, etc.
  • the input section 91 consists of a keyboard and a mouse.
  • the display section 90 and the input section 91 may be integrally configured like a touch panel.
  • the push-up unit 40, tool storage unit 60, and control section 200 mainly correspond to the "component push-up device" of the present invention. .
  • the control shown in FIG. 7 is executed in accordance with the type switching of the die 7a (wafer 7). Specifically, the process is executed after the wafer holder 8 on the wafer table 20 is returned to the wafer storage elevator 22 and before the switched wafer holder 8 is pulled out onto the wafer table 20. In this case, based on the board data and tool data stored in the storage unit 86, the identification information of the push-up tool 45 corresponding to the die 7a after switching and a tool exchange execution button are displayed on the display unit 90. . On the other hand, when the operator operates the execution button via the input unit 91, control according to the flowchart is started. Note that the replacement process of the push-up tool 45 may be started in synchronization with the change of the type of die 7a (wafer 7), regardless of the operator's operation.
  • the control unit 200 determines whether or not the push-up tool 45 is attached to the push-up head 41 based on the output signal from the first tool detection sensor Se1 (step S1). Here, in the case of Yes, the control unit 200 moves the process to step S3. In the case of No, the control unit 200 controls the tool storage unit 60 to return the uplift tool 45 attached to the upthrust head 41 to the tool storage table 61 (tool return process (“tool return” of the present invention). (corresponding to the operation)) is executed (step S21).
  • FIG. 8 is an explanatory diagram of the operation of each part when replacing the push-up tool.
  • (a) is a plan view
  • (b) is a side view from the -Y side, each schematically showing the push-up unit 40 and tool storage unit 60. It shows.
  • the first tool 45A is attached to the push-up head 41, and therefore the first tool holding section 62A of the tool storage table 61 is empty.
  • the tool storage unit 60 is arranged such that the second tool holding section 62B is located at the tool loading/unloading position P2, and the chuck head 65 is located at a standby position above the tool loading/unloading position P2.
  • the thrusting head 41 is arranged at the standby height position.
  • step S21 first, as shown in FIG. 9(a), the chuck head 65 is moved from the standby position to above the push-up head 41, lowered there, and attached to the push-up head 41.
  • the first tool 45A that is present is held between the claws 66. Thereby, the chuck head 65 holds the first tool 45A.
  • the chuck head 65 rises while holding the first tool 45A, moves to the standby position, that is, above the tool loading/unloading position P2, and then lowers.
  • the empty tool holding part 62 (that is, the first tool holding part 62A) is detected depending on the presence or absence of a signal output from the second tool detection sensor Se2, and the empty tool holding part 62 is moved to the tool loading/unloading position P2. If it is not located, the position of the tool storage table 61 is adjusted so that the empty tool holding section 62 is located at the tool loading/unloading position P2.
  • the first tool 45A is held on the chuck head 65 in the same posture as when it is attached to the push-up head 41 by having the flat chuck portion 53 held by the claws 66. Therefore, the first tool 45A returned to the first tool holding section 62A can be positioned by the positioning recess 56 and the positioning protrusion 63, so that the first tool 45A can be mounted on the push-up head 41.
  • the first tool holding portion 62A holds the tool in the same posture as before.
  • step S3 the control unit 200 determines whether recognition of the identification code 54 of each push-up tool 45 has been completed.
  • the control unit 200 moves the process to step S5.
  • the control unit 200 briefly moves the tool storage table 61 in the The code 54 is read by the code reading sensor Se3 (step S23). Thereby, the control unit 200 recognizes which push-up tool 45 (tools 45A to 45C) is held in each of the tool holding parts 62 (62A to 62C) of the tool storage table 61, and It is determined whether the push-up tool 45 is included.
  • step S23 corresponds to the function of the code reading sensor Se3 as the "first reading section" of the present invention.
  • step S5 the control unit 200 controls the tool storage unit 60, and performs a tool mounting process (corresponding to the "tool mounting operation" of the present invention) in which the thrusting tool 45 is mounted on the thrusting head 41 (head main body portion 42). Execute.
  • the operations of each part of the tool storage unit 60 in the tool mounting process in step S5 are as follows.
  • the tool storage table 61 moves in the X direction, and the push-up tool 45 (here, the third tool 45C) to be mounted is placed at the tool loading/unloading position P2.
  • the tool storage table 61 is moved so that the push-up tool 45 to be mounted is placed at the tool insertion/removal position P2 based on the recognition result in step S23.
  • the identification code 54 of the third tool 45C is read by the code reading sensor Se3 and stored.
  • the reading of the identification code 54 here corresponds to the function of the code reading sensor Se3 as the "second reading section" of the present invention.
  • the chuck head 65 descends from the standby position and holds the third tool 45C. Then, as shown in FIG. 10(c), the chuck head 65 rises, moves above the head body portion 42 of the thrust-up head 41, and then descends. Thereby, the third tool 45C is attached to the push-up head 41. After the third tool 45C is attached to the push-up head 41, the chuck head 65 moves to the standby position above the tool insertion/removal position P2, as shown in FIG. 10(d).
  • the control unit 200 determines whether the third tool 45C is attached to the uplift head 41 based on the identification code 54 (identification information) of the third tool 45C read by the code reading sensor Se3 in the process of step S5. It is determined whether the upthrust tool 45 (third tool 45C) is the upthrust tool 45 defined by the tool data, that is, whether it is the upthrust tool 45 corresponding to the die 7a after switching (step S7). .
  • control unit 200 executes predetermined error processing. For example, the control unit 200 displays an error message on the display unit 90, stops the component mounting apparatus 1 (step S25), and ends the control of the flowchart.
  • step S7 determines whether the upthrust tool 45 is normally attached to the upthrust head 41 (head main body 42) based on the signal output from the first tool detection sensor Se1. It is determined whether or not there is one (step S9). Specifically, it is determined whether the push-up tool 45 is detected by the first tool detection sensor Se1. In the case of No here, the control unit 200 moves the process to step S25 and executes the error processing described above.
  • step S9 the control unit 200 controls the wafer camera 39 to image the suction surface portion 46a of the push-up tool 45 attached to the push-up head 41 (step S11).
  • the wafer holder 8 is not held on the wafer table 20 as described above during the push-up tool exchange process. Therefore, the wafer camera 39 can image the suction surface portion 46a of the third tool 45C from above through the openings of the wafer table 20 and the support frame 26.
  • control unit 200 determines whether the push-up pin 50 is appropriate for the push-up tool 45 based on the image data of the suction surface portion 46a acquired in the process of step S11 and the tool data of the push-up tool 45. It is determined whether or not (step S13). Specifically, the control unit 200 recognizes the number and arrangement of the push-up pins 50 from the acquired image, and determines whether the number and arrangement match the tool data. Here, in the case of No, the control unit 200 moves the process to step S25 and executes the error processing described above.
  • the data of the push-up pins 50 of the third tool 45C in the tool data is data such that the push-up pins 50 of the third tool 45C are arranged at four locations around the center O of the suction surface portion 46a as a reference, as shown in FIG. 11(a). Assume that there is. In this case, as shown in FIG. 11(b), the number of push-up pins 50 in the acquired image and the number of push-up pins 50 in the tool data do not match, or as shown in FIG. 11(c), the number of push-up pins 50 in the acquired image If the arrangement of the push-up pins 50 in and the arrangement of the push-up pins 50 in the tool data do not match, the control unit 200 determines No in step S13.
  • step S13 determines whether the control unit 200 controls the wafer supply device 6 and pulls out the wafer holder 8 holding the wafer 7 to be switched onto the wafer table 20. Furthermore, the component transfer unit 33 and the push-up unit 40 are controlled, and the transfer head 34 is used to detect the height of the push-up tool 45 attached to the push-up head 41, that is, the height of the suction surface portion 46a. Execute (step S18).
  • the push-up head 41 is placed at the push-up height position, the wafer sheet 8a is sucked under negative pressure by the suction surface portion 46a of the push-up tool 45, and in this state, the suction nozzle 34a is inserted from above the die 7a. While approaching the die 7a, the height of the third tool 45C is detected based on the output signal from the negative pressure sensor Se4. Specifically, as shown in FIG.
  • the change point of the negative pressure level detected by the negative pressure sensor Se4 that is, the suction nozzle
  • the height of the tip of the suction nozzle 34a at the time when the suction nozzle 34a suctions the die 7a is detected as the height of the thrusting tool 45.
  • the height of the tip of the suction nozzle 34a is determined based on position information detected by the position sensor Se5 (encoder).
  • the control unit 200 determines whether the mounting state of the push-up tool 45 is appropriate based on the height of the third tool 45C detected in the process of step S18. Specifically, it is determined whether the height of the third tool 45C is within the allowable value Ar, that is, whether it is between the upper limit value Uh and the lower limit value Lh shown in FIG.
  • Symbol Sh in FIG. 12 indicates a reference value, which is equal to the upper surface height of the die 7a when the thrusting tool 45 is normally attached to the thrusting head 41.
  • step S19 the control unit 200 moves the process to step S25 and executes the error processing described above.
  • step S19 the control of this flowchart is ended. As a result, a mounting operation for mounting the switched die 7a onto the substrate P is started.
  • the tool storage unit 60 is controlled by the control section 200 to remove the push-up tool 45 attached to the push-up head 41 (tool mounting section 43) and store the tool.
  • a tool return process in which the tool is returned to the table 61, and the push-up tools 45 (45A to 45C) supported by the tool storage table 61 are held by the chuck head 65 and mounted on the push-up head 41 (tool mounting section 43).
  • Tool mounting processing is executed. Therefore, automation of the replacement work of the push-up tool 45 is achieved.
  • the upthrust tool 45 is attached to the upthrust head 41 (tool mounting portion 43) in a vertically removable manner, and is inserted into the tool storage table 61 in the same attitude as when attached to the upthrust head 41.
  • a lifting tool 45 (45A to 45C) is supported.
  • the tool transfer mechanism 60B is configured such that the chuck head 65 moves only in the Z direction and the X direction to transfer the push-up tool 45. Therefore, according to this component mounting apparatus 1, it is possible to automate the replacement work of the push-up tool 45 with a very simple mechanism and control that simply moves the chuck head 65 linearly in the Z direction and the X direction. Become.
  • the tool data stored in the storage unit 86 and the identification code 54 (identification information) read by the code reading sensor Se3 in the process of step S23 are stored in the tool storage table 61.
  • the push-up tool 45 to be mounted is specified from among the plurality of push-up tools 45 (45A to 45C), and the tool mounting process is executed. Therefore, it becomes possible to accurately specify the push-up tool 45 corresponding to the type of die 7a and execute the tool mounting process.
  • the identification code 54 of the push-up tool 45 placed at the tool loading/unloading position P2 is read by the code reading sensor Se3, and the push-up tool 45 is set to the push-up tool 45 determined by the tool data. It is determined whether or not (step S7 in FIG. 7). If there is a difference, an error message is displayed on the display unit 90 and the component mounting apparatus 1 is stopped. Therefore, even if an inappropriate push-up tool 45 is attached to the push-up head 41 in relation to the die 7a after the type change, the picking operation of the die 7a will not be started as is.
  • the component mounting apparatus 1 after the tool mounting process is executed, it is determined whether or not the push-up tool 45 is mounted on the push-up head 41 based on the presence or absence of a signal output from the first tool detection sensor Se1 (In step S9 of FIG. 7), if it is not attached, the error processing described above is executed. Therefore, the picking operation of the die 7a is prevented from being started without the push-up tool 45 being attached to the push-up head 41.
  • the push-up head 41 (suction surface portion 46a) is imaged by the wafer camera 39. Based on the image data, it is determined whether the push-up pins 50 (number and arrangement) provided in the push-up tool 45 are appropriate (steps S11 and S13 in FIG. 7), and if they are not appropriate, The error handling described above is executed. Therefore, it is prevented that the picking operation of the die 7a is started while the push-up tool 45 provided with the inappropriate push-up pin 50 remains attached to the push-up head 41.
  • the height of the push-up tool 45 mounted on the push-up head 41 is detected, and it is determined whether this height is within the allowable value Ar. (Steps S18, S19). If the value is outside the allowable value Ar, the error processing described above is executed. Therefore, it is possible to prevent the picking operation of the die 7a from being started with the push-up tool 45 incompletely attached, such as when the push-up tool 45 is lifted.
  • the component mounting apparatus 1 described above is an example of an embodiment of a component mounting apparatus according to the present invention (a component mounting apparatus equipped with a component pushing-up apparatus of the present invention), and the component mounting apparatus 1 and the component pushing-up apparatus ( The specific configurations of the push-up unit 40 and tool storage unit 60) can be changed as appropriate without departing from the gist of the present invention.
  • the component mounting apparatus 1 of the embodiment picks up the die 7a from the wafer 7 with the transfer head 34 of the component transfer unit 33, and transfers the die 7a indirectly via the transfer table 38 or with the transfer head. 34 directly to the head 4H of the head unit 4.
  • the component mounting apparatus 1 may have a configuration in which, for example, the head 4H of the head unit 4 directly picks up the die 7a from the wafer 7.
  • the processes in steps S18 and S19 in FIG. 7 are performed to determine the negative pressure level of the negative pressure passage for supplying negative pressure to the head 4H and the encoder etc. built in the motor for moving the head 4H up and down. It may also be performed based on position information detected by a position sensor.
  • step S19 in FIG. 7 if it is determined in the process of step S19 in FIG. 7 that the height of the push-up tool 45 is outside the allowable value Ar, an error message is immediately displayed on the display unit 90, and the component mounting device 1 is stopped.
  • a retry operation may be performed. Specifically, the push-up tool 45 is held by the chuck head 65, and the chuck head 65 is once raised and then lowered. Then, after the retry operation, the height detection process of the push-up tool 45 may be performed again, and if the height of the push-up tool 45 is outside the allowable value Ar, the error processing described above may be executed. . According to this configuration, it is possible to automatically correct an incompletely installed state of the push-up tool 45, such as lifting of the push-up tool 45.
  • the height of the uplifting tool 45 attached to the upthrust head 41 is detected based on the information acquired by the negative pressure sensor Se4 and the position sensor Se5, but the height of the upthrust tool 45 attached to the upthrust head 41 is detected by, for example, an optical sensor or the like.
  • the height of the push-up tool 45 attached to the push-up head 41 may be directly detected.
  • the identification code 54 of the push-up tool 45 placed at the tool loading/unloading position P2 is read by the code reading sensor Se3, and based on the identification information recorded in the identification code 54, the push-up tool 45 is It is determined whether or not the push-up tool 45 is defined by the tool data (step S7 in FIG. 7).
  • the identification code 54 for the determination process in step S7 may be read by a code reading sensor different from the code reading sensor Se3.
  • the other code reading sensor (corresponding to the "second reading section" of the present invention) detects the identification at any position within the moving path of the uplifting tool 45 that is held and moved by the chuck head 65. It is only necessary that the code 54 be readable.
  • the push-up head 41 is arranged at the pick-up position P1, and as the wafer 7 moves in the XY direction with respect to the push-up head 41, the die 7a to be picked up is arranged at the pick-up position P1.
  • This is the configuration that will be used.
  • the push-up head 41 side may be moved in the XY direction and placed below the die 7a to be picked up.
  • the push-up head 41 is moved to a predetermined tool exchange area, and a position adjacent to the tool exchange area is set so that the tool exchange is performed on the push-up head 41 placed in this tool exchange area.
  • the tool storage unit 60 may be disposed at.
  • a component pushing-up device is a component pushing-up device that peels a die from a wafer sheet by pushing up a die from below a wafer attached to a wafer sheet, and the component pushing-up device peels the die from the wafer sheet.
  • a plurality of push-up tools each including a suction surface that sucks a lower surface of the sheet under negative pressure and a push-up pin that is provided so as to be able to protrude and retract from the suction surface toward the wafer sheet side; and the plurality of push-up tools selectively and a push-up head that is movable relative to the wafer sheet in a direction along the wafer sheet and in a vertical direction; and a push-up head that is detachably mounted in a vertical direction;
  • a tool storage table capable of supporting each tool in the same posture as the tool is attached to the tool mounting portion; and a holding member capable of holding the uplifting tool; a tool transfer mechanism that transfers the push-up tool between the push-up head and the tool storage table by moving the push-up head in the vertical direction and the horizontal direction; and controlling the push-up head and the tool transfer mechanism.
  • a tool return operation of removing the push-up tool mounted on the tool mounting part by the holding member and returning it to the tool storage table, and/or the push-up tool supported by the tool storage table.
  • a control section that executes a tool mounting operation of holding the tool by the holding member and mounting the tool on the tool mounting section.
  • the control unit controls the lifting head and the tool transfer mechanism to perform a tool return operation in which the lifting tool attached to the lifting head is removed and returned to the tool storage table, and/or A tool mounting operation is performed in which the push-up tool supported on the tool storage table is held by the holding member and mounted on the tool mounting portion of the push-up head.
  • the work of replacing the upthrust tool with respect to the upthrust head can be automated.
  • the lifting tool is attached to the tool mounting part in a vertically removable manner, and the tool storage table supports the lifting tool in the same posture as when it is attached to the tool mounting part. be done.
  • the tool transfer mechanism is configured to transfer the upthrust tool between the upthrust head and the tool storage table by moving the holding member vertically and horizontally while holding the upthrust tool. There is. Therefore, it is possible to automate the replacement work of the push-up tool with a simple mechanism and control that simply moves the holding member linearly.
  • each of the plurality of pushing-up tools includes a recording section in which each identification information is recorded, and the component pushing-up device includes the pushing-up tool supported by the tool storage table. further comprising: a first reading section that can read identification information recorded in the information recording section of the tool; and a storage section that stores tool information that is information regarding each of the uplift tools;
  • the controller includes information that defines a correspondence relationship between die types and push-up tools used for the types, and the control unit stores information in the tool storage table based on the tool information and the identification information read by the first reading unit.
  • a push-up tool to be mounted is identified from among the plurality of supported push-up tools, and the tool mounting operation is executed.
  • the push-up tool corresponding to the die in response to a change in die type, etc., the push-up tool corresponding to the die can be accurately identified from among the plurality of push-up tools supported on the tool storage table. It becomes possible to perform a tool mounting operation.
  • the push-up tool when performing the tool mounting operation, is mounted on the tool mounting portion from a holding position where the push-up tool supported by the tool storage table is held by the holding member.
  • a second reading section capable of reading the identification information is further provided at any position within the moving path of the push-up tool to the position.
  • this component lifting device it is possible to stop the device due to an error based on the reading result of the second reading section. Therefore, it is possible to prevent the die picking operation from being started with an inappropriate push-up tool still attached to the tool mounting portion.
  • a common reading section is provided as the first reading section and the second reading section, and the common reading section is provided so as to be movable relative to the tool storage table. and configured to read the identification information of the uplift tool placed in the holding position.
  • the above-mentioned component lifting device includes a sensor that detects the lifting tool when the tool mounting section is equipped with the lifting tool, and the control unit is configured to:
  • the device may be configured to determine whether the push-up tool is attached to the tool mounting portion based on whether or not the push-up tool is detected by the sensor.
  • the above-mentioned component lifting device further includes an imaging section that images the suction surface of the thrusting tool after the tool mounting operation is performed, and the control section is configured to control the suction surface imaged by the imaging section.
  • the push-up pin may be recognized from the image, and based on the recognition result, the suitability of the push-up pin provided in the push-up tool may be determined.
  • the suitability of the push-up pins provided in the push-up tool is automated. This prevents the die picking operation from starting with a push-up tool equipped with an inappropriate push-up pin still attached.
  • the above-mentioned component lifting device further includes an acquisition unit that acquires information capable of detecting the height of the lifting tool mounted on the lifting head after the tool mounting operation, and the control unit , it may be configured to determine whether the mounting state of the push-up tool is good or bad based on the information acquired by the acquisition unit.
  • the die picking operation can be carried out in that state. It is possible to prevent this from starting.
  • control unit determines that the attachment state of the tool is not good, the control unit executes a retry operation of raising and lowering the holding member while holding the push-up tool by the holding member. You may also do so.
  • the above-mentioned component lifting device further includes a notification unit that notifies an error when there is no lifting tool to be mounted among the plurality of lifting tools supported on the tool storage table. You can leave it there.
  • the component mounting apparatus includes a component supply section in which diced wafers are placed and attached to a wafer sheet, and a component mounting device that picks dies from the wafers placed in the component supply section. and a component lifting device as described above, which pushes up the die from below the wafer sheet when the head picks the die.
  • this component mounting apparatus since it is equipped with the component push-up device as described above, it becomes possible to automate the replacement work of the push-up tool with a simple mechanism and control.

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Abstract

This component push-up device comprises: a plurality of push-up tools each including a wafer sheet-attracting surface and a push-up pin; a movable push-up head comprising a tool attachment portion to which the push-up tools are selectively attached; a tool transfer mechanism which comprises a tool storage table capable of supporting each of the plurality of push-up tools in the same posture as in a state of being attached to the tool attachment portion, and a holding member capable of holding the push-up tools, the tool transfer mechanism transferring the push-up tools in a held state; and a control unit which controls the push-up head and the tool transfer mechanism to perform a tool returning operation for detaching the push-up tools from the push-up head and returning the push-up tools to the tool storage table, and/or a tool attachment operation for attaching the push-up tools being supported on the tool storage table to the tool attachment portion of the push-up head.

Description

部品突上げ装置及び部品実装装置Component lifting device and component mounting device
　本発明は、ウェハシートに貼着されているウェハからダイ（ベアチップ）をピックアップする際に、ウェハシートの下方からダイを突上げて剥離させる部品突上げ装置、及びこの部品突上げ装置を備えた部品実装装置に関する。 The present invention includes a component pushing-up device that pushes up and peels off the die from below the wafer sheet when picking up a die (bare chip) from a wafer attached to a wafer sheet, and the component pushing-up device. Related to component mounting equipment.
　従来、ダイシングされたウェハからダイ（ベアチップ）をピックアップして基板に実装する部品実装装置が知られている。この部品実装装置では、ウェハ供給機によって機内の所定位置（部品配置エリア）に搬入されたウェハを、ウェハカメラが撮像してウェハ認識を行い、次いでダイの保持機能を備えたヘッドでダイをピッキングするという動作が繰り返される。 Conventionally, a component mounting apparatus is known that picks up a die (bare chip) from a diced wafer and mounts it on a substrate. In this component mounting equipment, a wafer camera captures an image of the wafer that is carried into a predetermined position (component placement area) inside the machine by a wafer feeder to recognize the wafer, and then the die is picked by a head equipped with a die holding function. This action is repeated.
　部品実装装置には、ウェハシートに貼着されたウェハの下方からダイを突上げることにより、ダイのピッキングに先立ち、ウェハシートからダイを剥離させる、部品突上げ装置が備えられる。部品突上げ装置は、円柱状の吸着ハウジングと、その中心部分に出没可能に設けられた一乃至複数の突上げピンとを備え、吸着ハウジングでウェハシートを下面から負圧吸着した状態で、突上げピンによってダイを下方から突上げる。 The component mounting apparatus is equipped with a component lifting device that peels the die from the wafer sheet prior to picking the die by lifting the die from below the wafer attached to the wafer sheet. The component push-up device includes a cylindrical suction housing and one or more push-up pins that are retractably installed in the center of the cylindrical suction housing. The die is pushed up from below using a pin.
　ダイのサイズは多種多様であり、ダイのサイズに適した吸着ハウジング及び突上げピンを用いることが必要である。そのため、オペレータが吸着ハウジング及び突上げピンを手作業で交換することが行われている。近年では、特許文献１のように、吸着ハウジング及び突上げピンを備えた、複数種類の突上げツール（剥離促進ヘッド）を待機させておき、突上げユニット（チップ剥離促進ユニット）に対して突上げツールを自動交換する部品突上げ装置も提案されている。 The sizes of dies vary widely, and it is necessary to use suction housings and push-up pins that are suitable for the size of the dies. Therefore, an operator manually replaces the suction housing and the push-up pin. In recent years, as in Patent Document 1, multiple types of push-up tools (peeling promotion heads) equipped with suction housings and push-up pins are kept on standby, and the push-up tools (peeling promotion heads) are kept in standby and are pushed against the push-up unit (chip peeling promotion unit). A component lifting device that automatically replaces lifting tools has also been proposed.
　この部品突上げ装置は、部品突上げユニットがウェハに対して移動しながらダイを突上げるタイプの部品突上げ装置である。突上げユニットには、垂直姿勢と水平姿勢とに回動可能な突上げヘッド（剥離促進ヘッド装着部）が設けられており、突上げツールはこの突上げヘッドのツール装着部に着脱可能に装着される。待機中の突上げツールは横向きで配置されている。突上げツール交換時には、垂直姿勢から水平姿勢に突上げヘッドが変位し、突上げヘッドが上下及び水平方向に移動しながら突上げツールの待機位置に移動する。そして、まず、ツール装着部に装着されている突上げツールが、係止アームにより係止され、この状態で突上げヘッドが後退することによりツール装着部から突上げツールが取り外される。次に、突上げヘッドが交換先の突上げツールの位置に移動することで、当該突上げツールがツール装着部に装着される。その後、突上げヘッドが水平姿勢から垂直姿勢にリセットされ、これにより突上げツールの交換が完了する。 This component push-up device is a type of component push-up device in which a component push-up unit pushes up a die while moving relative to a wafer. The push-up unit is equipped with a push-up head (peeling promotion head mounting part) that can be rotated between vertical and horizontal positions, and the push-up tool is removably attached to the tool mounting part of the push-up head. be done. The standby push-up tool is placed horizontally. When replacing the push-up tool, the push-up head is displaced from the vertical position to the horizontal position, and the push-up head moves vertically and horizontally to the standby position of the push-up tool. First, the push-up tool mounted on the tool mounting section is locked by the locking arm, and in this state, the push-up head is moved backward, thereby removing the push-up tool from the tool mounting section. Next, the push-up head moves to the position of the replacement push-up tool, so that the push-up tool is mounted on the tool mounting section. Thereafter, the thrusting head is reset from the horizontal position to the vertical position, thereby completing the replacement of the thrusting tool.
　特許文献１の部品突上げ装置は、既述の通り、突上げツール交換のための駆動系として、突上げヘッドの直線移動のための３軸（Ｘ軸、Ｙ軸、Ｚ軸）と回動のための１軸を加えた合計４軸の駆動機構とその制御が必要である。また、待機させる突上げツールの数と同数の係止アームやその駆動機構も必要となる。そのため、突上げツール交換のための駆動系の構成や制御が総じて複雑になる。 As mentioned above, the component lifting device of Patent Document 1 uses three axes (X-axis, Y-axis, Z-axis) for linear movement of the lifting head and rotation as a drive system for changing the lifting tool. A total of four axes of drive mechanisms and their control are required, including one axis for this purpose. Furthermore, the same number of locking arms and drive mechanisms as the number of standby push-up tools are required. Therefore, the structure and control of the drive system for exchanging the uplifting tool becomes complicated in general.
特開２００８－２５８５２４号公報JP2008-258524A
　本発明は、上記のような課題に鑑みてなされたものであり、その目的は、部品突上げ装置において、吸着ハウジング及び突上げピンを備えた突上げツールを、より簡素な構成及び制御で自動交換可能にすることにある。 The present invention has been made in view of the above-mentioned problems, and its purpose is to automatically operate a push-up tool equipped with a suction housing and a push-up pin in a component push-up device with a simpler configuration and control. The purpose is to make it interchangeable.
　本発明の一局面に係る部品突上げ装置は、ウェハシートに貼着されたウェハの下方からダイを突上げることにより、当該ダイを前記ウェハシートから剥離させる部品突上げ装置であって、前記ウェハシートの下面を負圧吸着する吸着面、及び前記吸着面からウェハシート側に出没可能に設けられた突上げピンを各々備えた複数の突上げツールと、前記複数の突上げツールが選択的にかつ上下方向に着脱可能に装着されるツール装着部を備え、前記ウェハシートに対して、当該ウェハシートに沿った方向及び上下方向に相対的に移動可能な突上げヘッドと、前記複数の突上げツールの各々を、前記ツール装着部への装着状態と同じ姿勢で支持可能なツール保管テーブルと、前記突上げツールを保持可能な保持部材を備え、前記突上げツールを保持した状態で前記保持部材を上下方向及び水平方向に移動させることにより、前記突上げヘッドと前記ツール保管テーブルとの間で前記突上げツールを移送するツール移送機構と、前記突上げヘッド及び前記ツール移送機構を制御することにより、前記保持部材により前記ツール装着部に装着されている前記突上げツールを取り外して前記ツール保管テーブルに返却するツール返却動作、及び／又は、前記ツール保管テーブルに支持されている前記突上げツールを、前記保持部材により保持して前記ツール装着部に装着するツール装着動作を実行する制御部と、を備えている。 A component pushing-up device according to one aspect of the present invention is a component pushing-up device that peels a die from a wafer sheet by pushing up a die from below a wafer attached to a wafer sheet, and the component pushing-up device peels the die from the wafer sheet. a plurality of push-up tools each including a suction surface that sucks a lower surface of the sheet under negative pressure and a push-up pin that is provided so as to be able to protrude and retract from the suction surface toward the wafer sheet side; and the plurality of push-up tools selectively and a push-up head that is movable relative to the wafer sheet in a direction along the wafer sheet and in a vertical direction; and a push-up head that is detachably mounted in a vertical direction; A tool storage table capable of supporting each tool in the same posture as the tool is attached to the tool mounting portion; and a holding member capable of holding the uplifting tool; a tool transfer mechanism that transfers the push-up tool between the push-up head and the tool storage table by moving the push-up head in the vertical direction and the horizontal direction; and controlling the push-up head and the tool transfer mechanism. a tool return operation of removing the push-up tool mounted on the tool mounting part by the holding member and returning it to the tool storage table, and/or the push-up tool supported by the tool storage table. and a control section that executes a tool mounting operation of holding the tool by the holding member and mounting the tool on the tool mounting section.
　また、本発明の一局面に係る部品実装装置は、ダイシングされてウェハシートに貼着された状態のウェハが配置される部品供給部と、前記部品供給部に配置されたウェハからダイをピッキングして移送するヘッドと、前記ヘッドによるダイのピッキングの際に、前記ウェハシートの下方から前記ダイを突き上げる、上記の部品突上げ装置と、を備える。 Further, the component mounting apparatus according to one aspect of the present invention includes a component supply section in which diced wafers are placed and attached to a wafer sheet, and a component mounting device that picks dies from the wafers placed in the component supply section. and the above-mentioned component pushing device that pushes up the die from below the wafer sheet when the head picks the die.
図１は、本発明に係る部品実装装置（本発明の部品突上げ装置が備えられた部品実装装置）の装置本体の平面図である。FIG. 1 is a plan view of a main body of a component mounting apparatus according to the present invention (a component mounting apparatus equipped with a component pushing-up device according to the present invention). 図２は、ウェハテーブル及びウェハテーブル駆動機構を示す平面図である。FIG. 2 is a plan view showing a wafer table and a wafer table drive mechanism. 図３は、突上げユニット及びツール保管ユニットの概略斜視図である。FIG. 3 is a schematic perspective view of the push-up unit and tool storage unit. 図４は、突上げヘッドの先端部分の断面図である。FIG. 4 is a sectional view of the tip portion of the thrusting head. 図５、突上げヘッドのヘッド本体部、突上げツール及びツール保管テーブルの斜視図である。FIG. 5 is a perspective view of the head main body of the thrust-up head, the thrust-up tool, and the tool storage table. 図６は、部品実装装置の制御系を示すブロック図である。FIG. 6 is a block diagram showing the control system of the component mounting apparatus. 図７は、突上げツール交換処理の制御を示すフローチャートである。FIG. 7 is a flowchart showing control of the push-up tool replacement process. 図８は、突上げツール交換時の各部の動作説明図である。FIG. 8 is an explanatory diagram of the operation of each part when replacing the push-up tool. 図９は、突上げツール交換時の各部の動作説明図である。FIG. 9 is an explanatory diagram of the operation of each part when replacing the push-up tool. 図１０は、突上げツール交換時の各部の動作説明図である。FIG. 10 is an explanatory diagram of the operation of each part when replacing the push-up tool. 図１１は、ウェハカメラが取得した突上げヘッド（吸着ハウジング）の吸着面部の画像を示す模式図である。FIG. 11 is a schematic diagram showing an image of the suction surface portion of the thrust-up head (suction housing) acquired by the wafer camera. 図１２は、突上げツールの高さ検出の説明図である。FIG. 12 is an explanatory diagram of height detection of the push-up tool.
［部品実装装置１の説明］
　図１は、本発明の実施形態に係る部品実装装置１の全体構成を示す、上面視の平面図である。部品実装装置１は、トランジスタやコンデンサ等の完成型の部品に加えて、ウェハ７からダイシングされたダイ７ａ（部品）を基板Ｐに実装することが可能なハイブリッド型の部品実装装置である。部品実装装置１は、装置本体１００と制御部２００（図６参照）とを含む。図中には、方向関係の明確化のためにＸＹＺ直角座標を示している。 [Description of component mounting device 1]
FIG. 1 is a top plan view showing the overall configuration of a component mounting apparatus 1 according to an embodiment of the present invention. The component mounting apparatus 1 is a hybrid component mounting apparatus that can mount a die 7a (component) diced from a wafer 7 onto a substrate P in addition to completed components such as transistors and capacitors. The component mounting apparatus 1 includes an apparatus main body 100 and a control section 200 (see FIG. 6). In the figure, XYZ orthogonal coordinates are shown to clarify the directional relationship.
　装置本体１００は、基台２、コンベア３、ヘッドユニット４、部品供給部５、突上げユニット４０及びツール保管ユニット６０を含む。 The device main body 100 includes a base 2, a conveyor 3, a head unit 4, a component supply section 5, a push-up unit 40, and a tool storage unit 60.
　基台２は、装置本体１００が備える各種機器の搭載ベースである。コンベア３は、基台２上にＸ方向に延びるように設置された、基板Ｐの搬送ラインである。コンベア３は、機外から所定の実装作業位置に基板Ｐを搬入し、実装作業後に基板Ｐを実装作業位置から機外へ搬出する。なお、図１中に基板Ｐが示されている位置が実装作業位置である。部品供給部５は、コンベア３を挟んで－Ｙ側及び＋Ｙ側に各々設けられている。 The base 2 is a mounting base for various devices included in the device main body 100. The conveyor 3 is a transport line for substrates P installed on the base 2 so as to extend in the X direction. The conveyor 3 carries the board P from outside the machine to a predetermined mounting work position, and after the mounting work, transports the board P from the mounting work position to the outside of the machine. Note that the position where the board P is shown in FIG. 1 is the mounting work position. The component supply units 5 are provided on the −Y side and the +Y side with the conveyor 3 interposed therebetween.
　ヘッドユニット４は、部品供給部５において部品をピックアップして、上記実装作業位置へ移動すると共に、基板Ｐに部品を実装する。ヘッドユニット４は、前記ピックアップの際に部品を負圧吸着して保持する吸着ノズルを各々具備した複数のヘッド４Ｈを備える。ヘッド４Ｈは、ヘッドユニット４に対するＺ方向への進退（昇降）移動と、軸回りの回転移動とが可能である。ヘッドユニット４には、基板Ｐを撮像する基板認識カメラ１２が搭載されている。基板認識カメラ１２の撮影画像により、基板Ｐに付されたフェデューシャルマークが認識される。 The head unit 4 picks up the components at the component supply section 5, moves to the mounting work position, and mounts the components on the board P. The head unit 4 includes a plurality of heads 4H, each of which is equipped with a suction nozzle that suctions and holds the component under negative pressure during the pickup. The head 4H can move forward and backward (up and down) in the Z direction with respect to the head unit 4, and can rotate around an axis. The head unit 4 is equipped with a board recognition camera 12 that takes an image of the board P. The federal mark attached to the board P is recognized by the image taken by the board recognition camera 12.
　装置本体１００は、ヘッドユニット４を、部品供給部５と前記実装作業位置で保持された基板Ｐとの間で、水平方向（ＸＹ方向）に移動可能とするヘッドユニット駆動機構Ｄ１を備える。ヘッドユニット駆動機構Ｄ１は、高架フレーム１１上に各々設けられた＋Ｘ側及び－Ｘ側で一対のＹ軸レール１３、Ｙ軸モータ１４及びボールねじ軸１５と、一対のＹ軸レール１３間に架設された支持フレーム１６とを備えている。ボールねじ軸１５は、支持フレーム１６に備えられたナットに螺合している。また、ヘッドユニット駆動機構Ｄ１は、支持フレーム１６に搭載された図略のガイド部材、Ｘ軸モータ１７及びボールねじ軸１８を備える。前記ガイド部材は、ヘッドユニット４をＸ方向に移動可能に支持しており、ボールねじ軸１８は、ヘッドユニット４に備えられた図略のナットに螺合している。 The apparatus main body 100 includes a head unit drive mechanism D1 that allows the head unit 4 to be moved in the horizontal direction (XY direction) between the component supply section 5 and the board P held at the mounting work position. The head unit drive mechanism D1 is installed between a pair of Y-axis rails 13, a Y-axis motor 14, a ball screw shaft 15, and a pair of Y-axis rails 13 on the +X side and -X side provided on the elevated frame 11, respectively. The support frame 16 is provided with a support frame 16. The ball screw shaft 15 is screwed into a nut provided on the support frame 16. The head unit drive mechanism D1 also includes an unillustrated guide member mounted on the support frame 16, an X-axis motor 17, and a ball screw shaft 18. The guide member supports the head unit 4 so as to be movable in the X direction, and the ball screw shaft 18 is screwed into a nut (not shown) provided on the head unit 4.
　このヘッドユニット駆動機構Ｄ１の作動により、ヘッドユニット４が水平方向に移動する。つまり、Ｙ軸モータ１４によりボールねじ軸１５が回転駆動されることにより、ヘッドユニット４が支持フレーム１６と一体にＹ方向に移動し、また、Ｘ軸モータ１７によりボールねじ軸１８が回転駆動されることにより、ヘッドユニット４が支持フレーム１６に対してＸ方向に移動する。 By the operation of this head unit drive mechanism D1, the head unit 4 moves in the horizontal direction. That is, the ball screw shaft 15 is rotationally driven by the Y-axis motor 14, so that the head unit 4 moves in the Y direction together with the support frame 16, and the ball screw shaft 18 is rotationally driven by the X-axis motor 17. As a result, the head unit 4 moves in the X direction with respect to the support frame 16.
　部品供給部５は、コンベア３の－Ｙ軸に位置する第１部品供給部５Ａと、＋Ｙ側に位置する第２部品供給部５Ｂとを含む。第１部品供給部５Ａには、複数のテープフィーダ１９がコンベア３に沿って並設されている。テープフィーダ１９は、既述のトランジスタやコンデンサ等の完成型の部品が一定間隔で収納されたテープを繰り出しながら供給するタイプの部品供給装置である。 The component supply section 5 includes a first component supply section 5A located on the -Y axis of the conveyor 3 and a second component supply section 5B located on the +Y side. A plurality of tape feeders 19 are arranged in parallel along the conveyor 3 in the first component supply section 5A. The tape feeder 19 is a component supply device of a type that feeds a tape containing completed components such as the transistors and capacitors described above at regular intervals while feeding the tape.
　第２部品供給部５Ｂには、複数個のダイ７ａをウェハ７の形態で供給するウェハ供給装置６と、ウェハ７からダイ７ａをピックアップして、前記ヘッドユニット４に対する所定の受け渡し位置に移送する部品移送ユニット３３と、ウェハカメラ３９と、部品認識カメラ１０とが備えられている。 The second component supply section 5B includes a wafer supply device 6 that supplies a plurality of dies 7a in the form of wafers 7, and a wafer supply device 6 that picks up the dies 7a from the wafer 7 and transfers them to a predetermined delivery position with respect to the head unit 4. A component transfer unit 33, a wafer camera 39, and a component recognition camera 10 are provided.
　ウェハ供給装置６は、ウェハ収納エレベータ２２、ウェハテーブル２０及びウェハ引き出しユニット２３を含む。ウェハ収納エレベータ２２は、ウェハ７が貼着されたウェハシート８ａをウェハホルダ８により保持した状態で、上下多段に収納する。ウェハ収納エレベータ２２は、複数段に収納されたウェハ７を一体に昇降させ、任意のウェハ７を、ウェハテーブル２０の高さに対応する高さに配置する。 The wafer supply device 6 includes a wafer storage elevator 22, a wafer table 20, and a wafer drawer unit 23. The wafer storage elevator 22 stores the wafer sheets 8a to which the wafers 7 are attached in multiple stages, with the wafer sheets 8a being held by the wafer holders 8. The wafer storage elevator 22 raises and lowers the wafers 7 stored in multiple stages as one, and arranges any wafer 7 at a height corresponding to the height of the wafer table 20.
　ウェハテーブル２０は、ウェハ収納エレベータ２２の－Ｙ側に配置されている。ウェハテーブル２０は、ウェハホルダ８（ウェハ７）を保持する、部品取出用作業台である。ウェハ供給装置６は、ウェハテーブル２０を水平方向（ＸＹ方向）に移動可能とするウェハテーブル駆動機構Ｄ２を備えている。 The wafer table 20 is placed on the -Y side of the wafer storage elevator 22. The wafer table 20 is a workbench for taking out parts that holds the wafer holder 8 (wafer 7). The wafer supply device 6 includes a wafer table drive mechanism D2 that allows the wafer table 20 to be moved in the horizontal direction (XY direction).
　図２はウェハテーブル２０及びウェハテーブル駆動機構Ｄ２を示す平面図である。ウェハテーブル駆動機構Ｄ２は、＋Ｙ側及び－Ｙ側で一対のＸ軸レール３０と、Ｘ軸モータ３１及びボールねじ軸３２と、前記一対のＸ軸レール３０に架設されたプレート状の支持フレーム２６とを備える。ボールねじ軸３２は、支持フレーム２６に備えられたナットに螺合している。また、ウェハテーブル駆動機構Ｄ２は、支持フレーム２６上に設けられた、＋Ｘ側及び－Ｘ側で一対のＹ軸レール２７と、Ｙ軸モータ２８及びボールねじ軸３２とを備える。ボールねじ軸３２は、前記ウェハテーブル２０に備えられたナットに螺合している。 FIG. 2 is a plan view showing the wafer table 20 and the wafer table drive mechanism D2. The wafer table drive mechanism D2 includes a pair of X-axis rails 30 on the +Y side and -Y side, an X-axis motor 31, a ball screw shaft 32, and a plate-shaped support frame 26 installed on the pair of X-axis rails 30. Equipped with. The ball screw shaft 32 is threaded into a nut provided on the support frame 26. Further, the wafer table drive mechanism D2 includes a pair of Y-axis rails 27 provided on the support frame 26 on the +X side and the -X side, a Y-axis motor 28, and a ball screw shaft 32. The ball screw shaft 32 is screwed into a nut provided on the wafer table 20.
　このウェハテーブル駆動機構Ｄ２の作動により、ウェハテーブル２０が水平方向に移動する。つまり、Ｘ軸モータ３１によりボールねじ軸３２が回転駆動されることにより、ウェハテーブル２０が支持フレーム２６と一体にＸ方向に移動し、また、Ｙ軸モータ２８によりボールねじ軸２９が回転駆動されることにより、ウェハテーブル２０が支持フレーム２６に対してＹ方向に移動する。ヘッド４Ｈによるダイ７ａのピッキングの際には、ウェハテーブル２０の移動により、対象のダイ７ａが、ＸＹ座標で規定される所定のピックアップ位置Ｐ１に配置される。 By the operation of this wafer table drive mechanism D2, the wafer table 20 moves in the horizontal direction. That is, the ball screw shaft 32 is rotationally driven by the X-axis motor 31, so that the wafer table 20 moves together with the support frame 26 in the X direction, and the ball screw shaft 29 is rotationally driven by the Y-axis motor 28. As a result, the wafer table 20 moves in the Y direction with respect to the support frame 26. When the head 4H picks the die 7a, the target die 7a is placed at a predetermined pickup position P1 defined by the XY coordinates by moving the wafer table 20.
　ウェハ引き出しユニット２３は、ウェハ収納エレベータ２２とウェハテーブル２０との間でウェハホルダ８の出し入れを行う。ウェハ引き出しユニット２３は、ウェハホルダ８を係止可能な引出しヘッド２４と、この引出しヘッド２４をＹ方向に移動させる引出しヘッド駆動装置２５とを備える。 The wafer drawer unit 23 takes the wafer holder 8 in and out between the wafer storage elevator 22 and the wafer table 20. The wafer drawer unit 23 includes a drawer head 24 that can lock the wafer holder 8, and a drawer head drive device 25 that moves the drawer head 24 in the Y direction.
　ウェハ引き出しユニット２３は、引出しヘッド２４によりウェハホルダ８を係止した状態で、この引出しヘッド２４をＹ方向に移動させることによりウェハホルダ８を移動させる。つまり、ウェハ７をウェハホルダ８と共にウェハ収納エレベータ２２に対して出し入れする。このウェハホルダ８の出し入れは、ウェハ収納エレベータ２２の－Ｙ側に近接対向する所定のウェハ出し入れ位置にウェハテーブル２０が配置されることにより可能となる。 The wafer drawer unit 23 moves the wafer holder 8 by moving the drawer head 24 in the Y direction, with the wafer holder 8 locked by the drawer head 24. That is, the wafer 7 is taken in and out of the wafer storage elevator 22 together with the wafer holder 8 . This loading and unloading of the wafer holder 8 is made possible by arranging the wafer table 20 at a predetermined wafer loading/unloading position that closely opposes the -Y side of the wafer storage elevator 22.
　部品移送ユニット３３は、前記ピックアップ位置Ｐ１に配置されたダイ７ａをウェハ７からピックアップする移載ヘッド３４と、ダイ７ａをヘッドユニット４に受け渡すための移載テーブル３８と、移載ヘッド３４を移動可能とする移載ヘッド駆動機構Ｄ３とを備えている。 The component transfer unit 33 includes a transfer head 34 for picking up the die 7a placed at the pickup position P1 from the wafer 7, a transfer table 38 for delivering the die 7a to the head unit 4, and a transfer head 34. It is provided with a transfer head drive mechanism D3 that allows the transfer head to be moved.
　移載ヘッド３４は、ダイ７ａを負圧吸着することにより保持する吸着ノズル３４ａを備える。移載ヘッド３４は、前記ピックアップ位置Ｐ１においてダイ７ａを負圧吸着することにより当該ダイ７ａをピックアップする。吸着ノズル３４ａは、移載ヘッド３４のベース部分に対するＺ方向への進退（昇降）移動と、水平軸回りの回転移動とが可能である。移載ヘッド３４が水平軸回りに回転移動することにより、ダイ７ａの姿勢を上下反転させることが可能となる。 The transfer head 34 includes a suction nozzle 34a that holds the die 7a by suctioning it under negative pressure. The transfer head 34 picks up the die 7a by suctioning the die 7a under negative pressure at the pickup position P1. The suction nozzle 34a can move forward and backward (up and down) in the Z direction with respect to the base portion of the transfer head 34, and can rotate around a horizontal axis. By rotating the transfer head 34 around the horizontal axis, it becomes possible to vertically invert the attitude of the die 7a.
　なお、吸着ノズル３４ａに負圧を供給する負圧通路には、負圧レベルを検出可能な負圧センサＳｅ４（図６参照）が備えられている。また、移載ヘッド３４を進退移動させるための図略のモータにはエンコーダなどの位置センサＳｅ５（図６参照）が内蔵され、この位置センサＳｅ５が検出する位置情報に基づいて移載ヘッド３４のＺ座標、すなわち高さが検知可能となっている。負圧センサＳｅ４が検出する「負圧レベル」や位置センサＳｅ５が検出する「位置情報」は、後述する通り、突上げヘッド４１に装着された突上げツール４５の高さを検知可能な情報である。従って、当例では、負圧センサＳｅ４及び位置センサＳｅ５が本発明の「取得部」に相当する。 Note that the negative pressure passage that supplies negative pressure to the suction nozzle 34a is equipped with a negative pressure sensor Se4 (see FIG. 6) that can detect the negative pressure level. Further, the motor (not shown) for moving the transfer head 34 forward and backward has a built-in position sensor Se5 (see FIG. 6) such as an encoder, and the transfer head 34 is adjusted based on the position information detected by the position sensor Se5. The Z coordinate, that is, the height can be detected. The "negative pressure level" detected by the negative pressure sensor Se4 and the "position information" detected by the position sensor Se5 are information that can detect the height of the upthrust tool 45 attached to the upthrust head 41, as described later. be. Therefore, in this example, the negative pressure sensor Se4 and the position sensor Se5 correspond to the "acquisition unit" of the present invention.
　移載テーブル３８は、吸着ノズル３４ａが保持したダイ７ａをヘッドユニット４のヘッド４Ｈに受け渡すための受け渡し台である。移載テーブル３８は、前記実装作業位置に近接した所定の受け渡し位置に配置されている。 The transfer table 38 is a transfer table for transferring the die 7a held by the suction nozzle 34a to the head 4H of the head unit 4. The transfer table 38 is arranged at a predetermined transfer position close to the mounting work position.
　移載ヘッド駆動機構Ｄ３は、移載ヘッド３４を移動可能に支持するレール３７と、このレール３７と平行に配置されたボールねじ軸３６と、モータ３５とを備える。前記ボールねじ軸３６は、移載ヘッド３４に設けられたナットに螺合している。移載ヘッド駆動機構Ｄ３は、モータ３５によりボールねじ軸３６を回転駆動することにより、移載ヘッド３４を前記ピックアップ位置Ｐ１と移載テーブル３８との間の空間で移動させる。 The transfer head drive mechanism D3 includes a rail 37 that movably supports the transfer head 34, a ball screw shaft 36 arranged parallel to the rail 37, and a motor 35. The ball screw shaft 36 is screwed into a nut provided on the transfer head 34. The transfer head drive mechanism D3 moves the transfer head 34 in the space between the pickup position P1 and the transfer table 38 by rotationally driving the ball screw shaft 36 by the motor 35.
　ウェハカメラ３９は、前記ピックアップ位置Ｐ１においてウェハテーブル２０上に保持されたウェハ７の一部分、つまりカメラ視野内のダイ７ａを上方から撮像する。この撮像画像に基づいて、ピックアップ対象のダイ７ａの位置認識が為される。ウェハカメラ３９は、ピックアップ位置Ｐ１に移載ヘッド３４が配置された状態で、当該移載ヘッド３４の上方に位置するように、図略の高架フレームに支持されている。これにより移載ヘッド３４との干渉が回避される。 The wafer camera 39 images a portion of the wafer 7 held on the wafer table 20 at the pickup position P1, that is, the die 7a within the field of view of the camera from above. Based on this captured image, the position of the die 7a to be picked up is recognized. The wafer camera 39 is supported by an elevated frame (not shown) so as to be positioned above the transfer head 34 with the transfer head 34 disposed at the pickup position P1. This avoids interference with the transfer head 34.
　部品認識カメラ１０は、前記移載テーブル３８の＋Ｘ側に隣接する位置に配置されている。部品認識カメラ１０は、ヘッドユニット４のヘッド４Ｈに吸着されている部品（ダイ７ａ及び完成型の部品）を、基板Ｐへの実装前に下側から撮像する。この撮像画像に基づいて、ヘッド４Ｈによる部品の吸着状態が認識される。 The component recognition camera 10 is arranged at a position adjacent to the +X side of the transfer table 38. The component recognition camera 10 images the components (the die 7a and the completed component) adsorbed on the head 4H of the head unit 4 from below before mounting on the board P. Based on this captured image, the state of suction of the component by the head 4H is recognized.
　図３は、突上げユニット４０及びツール保管ユニット６０を概略斜視図である。図２及び図３に示すように、突上げユニット４０及びツール保管ユニット６０は、部品供給部５の下方、具体的には、ウェハテーブル駆動機構Ｄ２の前記支持フレーム２６の下方に配置されている。ウェハテーブル２０には、円形の開口部２０ａが設けられており、支持フレーム２６には、この開口部２０ａと重複し得る位置に、図略の開口部が設けられている。これら開口部の下方に突上げユニット４０が配置されている。つまり、ウェハテーブル２０にウェハホルダ８が保持されると、前記開口部２０ａの内側にウェハ７が配置される。突上げユニット４０は、支持フレーム２６及びウェハテーブル２０の各開口部を通じてダイ７ａを突き上げる。 FIG. 3 is a schematic perspective view of the push-up unit 40 and tool storage unit 60. As shown in FIGS. 2 and 3, the push-up unit 40 and the tool storage unit 60 are arranged below the component supply section 5, specifically, below the support frame 26 of the wafer table drive mechanism D2. . The wafer table 20 is provided with a circular opening 20a, and the support frame 26 is provided with an unillustrated opening at a position that can overlap with the opening 20a. A push-up unit 40 is arranged below these openings. That is, when the wafer holder 8 is held on the wafer table 20, the wafer 7 is placed inside the opening 20a. The push-up unit 40 pushes up the die 7a through each opening of the support frame 26 and the wafer table 20.
　突上げユニット４０は、突上げヘッド４１と突上げヘッド駆動機構Ｄ６とを含む。図３及び図４（ａ）に示すように、突上げヘッド４１は、Ｚ方向に延びる軸状のヘッド本体部４２と、その上端部に装着される突上げツール４５とを備える。なお、図４（ａ）は、突上げヘッド４１の先端部分の断面図である。 The push-up unit 40 includes a push-up head 41 and a push-up head drive mechanism D6. As shown in FIGS. 3 and 4(a), the push-up head 41 includes a shaft-shaped head main body portion 42 extending in the Z direction, and a push-up tool 45 attached to the upper end portion of the head body portion 42. Note that FIG. 4A is a cross-sectional view of the tip portion of the thrusting head 41. As shown in FIG.
　突上げヘッド４１は、ヘッド本体部４２が前記ピックアップ位置Ｐ１に位置するように配置されている。ヘッド本体部４２は円筒形状であり、Ｚ方向に進退（昇降）移動する突上げ主軸４４を中心に備えている。 The thrusting head 41 is arranged so that the head main body portion 42 is located at the pickup position P1. The head main body part 42 has a cylindrical shape and is provided with a thrust main shaft 44 at its center that moves forward and backward (up and down) in the Z direction.
　突上げツール４５は、ウェハシート８ａを下方から吸着するための吸着ハウジング４６（「吸着ドーム」と称される場合もある）と、その内部に配置されるピンホルダ４８とを備える。吸着ハウジング４６は、ウェハシート８ａを負圧吸着するため平面視円形の吸着面を有する吸着面部４６ａとその周囲から下方に延びる円筒部４６ｂとを備えた、有天円筒形状の部材である。吸着面部４６ａには、所定の配列で複数のピン穴４７が形成されている。 The push-up tool 45 includes a suction housing 46 (sometimes referred to as a "suction dome") for suctioning the wafer sheet 8a from below, and a pin holder 48 disposed inside the suction housing 46. The suction housing 46 is a cylindrical member with an open top, which includes a suction surface portion 46a having a circular suction surface in plan view and a cylindrical portion 46b extending downward from the periphery of the suction surface portion 46a to suction the wafer sheet 8a under negative pressure. A plurality of pin holes 47 are formed in the suction surface portion 46a in a predetermined arrangement.
　この吸着ハウジング４６を介してヘッド本体部４２の先端（上端）に突上げツール４５が着脱可能に装着されている。具体的には、ヘッド本体部４２の先端には、他の部分より細径のツール装着部４３が形成されており、このツール装着部４３に吸着ハウジング４６の円筒部４６ｂが嵌められることにより、突上げツール４５がヘッド本体部４２に装着される。なお、以下の説明では、便宜上、突上げヘッド４１に突上げツール４５が装着されると言う場合もある。 A push-up tool 45 is removably attached to the tip (upper end) of the head main body 42 via the suction housing 46. Specifically, a tool mounting part 43 having a smaller diameter than other parts is formed at the tip of the head main body part 42, and by fitting the cylindrical part 46b of the suction housing 46 into this tool mounting part 43, A push-up tool 45 is attached to the head body portion 42. In addition, in the following description, for convenience, it may be said that the thrusting tool 45 is attached to the thrusting head 41.
　ピンホルダ４８は、円盤状のピンベース４９に一乃至複数の突上げピン５０が立設された部材であり、円筒部４６ｂの内周面に沿ってＺ方向に移動可能な状態で、吸着ハウジング４６に保持されている。ピンホルダ４８は、図４（ｂ）に示すように、前記突上げ主軸４４の前進（上昇）移動により、吸着ハウジング４６に対して押し上げられる。これにより突上げピン５０がピン穴４７を通じて吸着面部４６ａから上方に突出する。突上げ主軸４４が後退（下降）移動すると、ピンホルダ４８は、自重で又は図外の弾性部材（ばね等）の付勢力で吸着ハウジング４６に対して下降する。これにより突上げピン５０が吸着ハウジング４６（ピン穴４７）内に退避する。すなわち、突上げピン５０は吸着面部４６ａから上方に出没可能に設けられている。 The pin holder 48 is a member in which one or more push-up pins 50 are erected on a disc-shaped pin base 49, and is movable in the Z direction along the inner peripheral surface of the cylindrical portion 46b. is maintained. As shown in FIG. 4(b), the pin holder 48 is pushed up against the suction housing 46 by the forward (upward) movement of the push-up main shaft 44. As a result, the push-up pin 50 projects upward from the suction surface portion 46a through the pin hole 47. When the push-up main shaft 44 moves backward (downward), the pin holder 48 descends with respect to the suction housing 46 by its own weight or by the biasing force of an elastic member (such as a spring) not shown. As a result, the push-up pin 50 is retracted into the suction housing 46 (pin hole 47). That is, the push-up pin 50 is provided so as to be able to protrude and retract upward from the suction surface portion 46a.
　なお、ダイ７ａのピックアップの際には、ヘッド本体部４２を通じて吸着ハウジング４６内に負圧が供給される。この負圧によりピン穴４７を通じてウェハシート８ａが吸着される。つまり、吸着ハウジング４６の吸着面部４６ａを介してウェハシート８ａを負圧吸着した状態で、吸着面部４６ａから突上げピン５０が突出することにより、ウェハシート８ａを通じてダイ７ａが突き上げられる。 Note that when picking up the die 7a, negative pressure is supplied into the suction housing 46 through the head main body portion 42. The wafer sheet 8a is attracted through the pin holes 47 by this negative pressure. That is, while the wafer sheet 8a is suctioned under negative pressure through the suction surface portion 46a of the suction housing 46, the push-up pin 50 protrudes from the suction surface portion 46a, thereby pushing up the die 7a through the wafer sheet 8a.
　なお、突上げピン５０の数、配置、サイズ（径、長さ）及び先端形状などは、ダイ７ａのサイズやそこに形成される回路等に応じて適した態様が異なる。後述するツール保管ユニット６０には、態様が互いに異なる複数の突上げツール４５が保持、保管されており、ダイ７ａのピッキングの際には、ダイ７ａ（ウェハ７）の品種毎に予め定められた突上げツール４５が突上げヘッド４１に装着される。 Note that the number, arrangement, size (diameter, length), tip shape, etc. of the push-up pins 50 vary depending on the size of the die 7a, the circuit formed therein, etc. A tool storage unit 60, which will be described later, holds and stores a plurality of push-up tools 45 having different configurations, and when picking the die 7a, a tool storage unit 60, which will be described later, holds and stores a plurality of push-up tools 45 with different configurations. A thrusting tool 45 is attached to the thrusting head 41.
　突上げヘッド駆動機構Ｄ６は、例えば、エアを駆動源とするシリンダ機構により構成されている。この突上げヘッド駆動機構Ｄ６の作動により、突上げヘッド４１がピックアップ位置Ｐ１において進退（昇降）移動する。具体的には、ウェハシート８ａの下面に吸着面部４６ａが当接する所定の突上げ高さ位置と、当該突上げ高さ位置から下方に退避した所定の待機高さ位置（図３に示す位置）との間で進退移動する。なお、待機高さ位置に配置された突上げヘッド４１の－Ｙ側には、突上げヘッド４１の先端部分における突上げツール４５の有無を検知可能な、第１ツール検知センサＳｅ１（本発明の「センサ」に相当する）が配置されている。 The thrusting head drive mechanism D6 is composed of, for example, a cylinder mechanism using air as a drive source. Due to the operation of the thrust head drive mechanism D6, the thrust head 41 moves forward and backward (up and down) at the pickup position P1. Specifically, a predetermined push-up height position where the suction surface portion 46a comes into contact with the lower surface of the wafer sheet 8a, and a predetermined standby height position (position shown in FIG. 3) that is retracted downward from the push-up height position Move forward and backward between. A first tool detection sensor Se1 (according to the present invention) capable of detecting the presence or absence of the thrusting tool 45 at the tip of the thrusting head 41 is installed on the −Y side of the thrusting head 41 disposed at the standby height position. (corresponding to "sensor") are arranged.
　ツール保管ユニット６０は、図２及び図３に示すように、突上げユニット４０の＋Ｘ側に隣接して設けられている。ツール保管ユニット６０は、ツール保管部６０Ａとツール移載機構６０Ｂとを含む。ツール保管部６０Ａは、複数品種の突上げツール４５を保持、保管し、ツール移載機構６０Ｂは、突上げユニット４０とツール保管部６０Ａとの間で突上げツール４５を搬送する。 The tool storage unit 60 is provided adjacent to the +X side of the push-up unit 40, as shown in FIGS. 2 and 3. The tool storage unit 60 includes a tool storage section 60A and a tool transfer mechanism 60B. The tool storage section 60A holds and stores a plurality of types of push-up tools 45, and the tool transfer mechanism 60B transports the push-up tools 45 between the push-up unit 40 and the tool storage section 60A.
　ツール保管部６０Ａは、突上げツール４５を保持するツール保管テーブル６１と、ツール保管テーブル６１を移動させる保管テーブル駆動機構Ｄ４と、コード読取りセンサＳｅ３とを備える。 The tool storage unit 60A includes a tool storage table 61 that holds the push-up tool 45, a storage table drive mechanism D4 that moves the tool storage table 61, and a code reading sensor Se3.
　ツール保管テーブル６１は、図２及び図３に示すように、突上げヘッド４１のヘッド本体部４２に対して＋Ｘ側に隣接する位置に配置されている。ツール保管テーブル６１は、Ｘ方向に細長い平面視長方形であり、上面に複数のツール保持部６２を備えている。ツール保持部６２は、ツール保管テーブル６１の上面に形成された円形の凹部である。ツール保持部６２の内径は、突上げツール４５（吸着ハウジング４６）が嵌まる程度の寸法に設定されており、突上げツール４５は、その下端部がツール保持部６２に緩く嵌合する状態でツール保管テーブル６１上に支持される。 As shown in FIGS. 2 and 3, the tool storage table 61 is arranged at a position adjacent to the head body portion 42 of the thrusting head 41 on the +X side. The tool storage table 61 has a rectangular shape in plan view that is elongated in the X direction, and includes a plurality of tool holding sections 62 on the upper surface. The tool holding portion 62 is a circular recess formed on the upper surface of the tool storage table 61. The inner diameter of the tool holding part 62 is set to a size that allows the push-up tool 45 (suction housing 46) to fit therein, and the push-up tool 45 has its lower end loosely fitted into the tool holding part 62. It is supported on a tool storage table 61.
　当例では、ツール保管テーブル６１には、Ｘ方向に等間隔で一列に並ぶ、３つのツール保持部６２が設けられている。図２に示すように、平面視において、各ツール保持部６２は、各々の中心が、突上げヘッド４１のヘッド本体部４２の中心を通ってＸ方向に延びる直線Ｌ１上に位置するように設けられている。そして、－Ｘ側端のツール保持部６２（適宜、第１ツール保持部６２Ａという）に第１ツール４５Ａが、真中のツール保持部６２（適宜、第２ツール保持部６２Ｂという）に第２ツール４５Ｂが、＋Ｘ側端のツール保持部６２（適宜、第３ツール保持部６２Ｃ）に第３ツール４５Ｃが各々保管されている。なお、図２及び図３では、第１ツール４５Ａは、突上げヘッド４１に装着されており、よって第１ツール保持部６２Ａは空である。 In this example, the tool storage table 61 is provided with three tool holders 62 arranged in a row at equal intervals in the X direction. As shown in FIG. 2, in plan view, each tool holding portion 62 is provided such that its center is located on a straight line L1 extending in the X direction through the center of the head body portion 42 of the thrusting head 41. It is being The first tool 45A is placed in the tool holding part 62 at the -X side end (hereinafter referred to as a first tool holding part 62A), and the second tool is placed in the middle tool holding part 62 (hereinafter referred to as a second tool holding part 62B). 45B and a third tool 45C are stored in the tool holding part 62 (appropriately, third tool holding part 62C) at the +X side end. In addition, in FIGS. 2 and 3, the first tool 45A is attached to the push-up head 41, so the first tool holding portion 62A is empty.
　図５は、突上げヘッド４１のヘッド本体部４２と、突上げツール４５と、ツール保管テーブル６１とを示す斜視図である。図５に示すように、ヘッド本体部４２のツール装着部４３の外周面には位置決め凸部４３ａが設けられ、突上げツール４５（吸着ハウジング４６）の外周面には位置決め凹部５６が設けられている。突上げツール４５は、これら位置決め凸部４３ａと位置決め凹部５６との嵌合により垂直軸回りに位置決めされた状態でツール装着部４３に装着される。一方、ツール保管テーブル６１の各ツール保持部６２の内周面には位置決め凸部６３が設けられており、突上げツール４５は、この位置決め凸部６３と位置決め凹部５６との嵌合により垂直軸回りに位置決めされた状態でツール保持部６２に保持される。 FIG. 5 is a perspective view showing the head main body portion 42 of the thrusting head 41, the thrusting tool 45, and the tool storage table 61. As shown in FIG. 5, a positioning convex portion 43a is provided on the outer circumferential surface of the tool mounting portion 43 of the head main body portion 42, and a positioning recess 56 is provided on the outer circumferential surface of the push-up tool 45 (suction housing 46). There is. The push-up tool 45 is mounted on the tool mounting portion 43 in a state in which it is positioned around the vertical axis by fitting the positioning convex portion 43a and the positioning recess 56. On the other hand, a positioning convex portion 63 is provided on the inner circumferential surface of each tool holding portion 62 of the tool storage table 61, and the push-up tool 45 can be moved vertically by fitting the positioning convex portion 63 and the positioning concave portion 56. It is held by the tool holding part 62 in a state in which it is positioned around the periphery.
　ここで、ヘッド本体部４２の位置決め凸部４３ａと各ツール保持部６２の各位置決め凸部６３とは、平面視で共に前記直線Ｌ上であって何れも－Ｘ側に設けられている。つまり、突上げツール４５は、ヘッド本体部４２の前記ツール装着部４３への装着状態と同じ姿勢（当例では、上下方向及び軸回りの向きが共に同じ状態）でツール保管テーブル６１に保持される。なお、各ツール保持部６２の内底面には、第２ツール検知センサＳｅ２が埋設されており、各ツール保持部６２における突上げツール４５の有無が検知可能となっている。 Here, the positioning convex portion 43a of the head main body portion 42 and each positioning convex portion 63 of each tool holding portion 62 are both on the straight line L in plan view, and are both provided on the −X side. In other words, the push-up tool 45 is held on the tool storage table 61 in the same posture as the head body section 42 is attached to the tool attachment section 43 (in this example, both the vertical direction and the direction around the axis are the same). Ru. Note that a second tool detection sensor Se2 is embedded in the inner bottom surface of each tool holding part 62, and the presence or absence of the push-up tool 45 in each tool holding part 62 can be detected.
　保管テーブル駆動機構Ｄ４は、例えば、モータを駆動源とするねじ送り機構により構成されている。この保管テーブル駆動機構Ｄ４の作動により、ツール保管テーブル６１がＸ方向に水平移動することで、ツール保管テーブル６１に保持される突上げツール４５（４５Ａ～４５Ｂ）が、ＸＹ座標で規定される所定のツール出し入れ位置Ｐ２（本発明の「保持位置」に相当する）に択一的に配置される。なお、保管テーブル駆動機構Ｄ４は、エアを駆動源とするシリンダ機構により構成されていてもよい。 The storage table drive mechanism D4 is composed of, for example, a screw feeding mechanism using a motor as a drive source. Due to the operation of the storage table drive mechanism D4, the tool storage table 61 is moved horizontally in the It is alternatively arranged at the tool insertion/removal position P2 (corresponding to the "holding position" of the present invention). Note that the storage table drive mechanism D4 may be constituted by a cylinder mechanism using air as a drive source.
　コード読取りセンサＳｅ３（本発明の「第１読み取り部」、「第２読み取り部」に相当する）は、ツール保管テーブル６１に保持される各突上げツール４５の識別標識を読み取るセンサである。コード読取りセンサＳｅ３は、前記ツール出し入れ位置Ｐ２の－Ｙ側に配置されており、ツール出し入れ位置Ｐ２に配置される突上げツール４５の側面に設けられる識別情報記録部に記録された識別情報を読み取る。 The code reading sensor Se3 (corresponding to the "first reading section" and "second reading section" of the present invention) is a sensor that reads the identification mark of each push-up tool 45 held on the tool storage table 61. The code reading sensor Se3 is arranged on the −Y side of the tool loading/unloading position P2, and reads the identification information recorded in the identification information recording section provided on the side surface of the push-up tool 45 placed at the tool loading/unloading position P2. .
　具体的には、図５に示すように、突上げツール４５（吸着ハウジング４６）の円筒部４６ｂのうち、－Ｙ側の外周部分には切欠き状のコード用平面部５２が形成され、このコード用平面部５２に、例えば識別情報記録部として一次元又は二次元の識別コード５４が設けられている。コード読取りセンサＳｅ３は、この識別コード５４を読み取る。なお、識別標識は一次元や二次元の識別コードには限定されない、また、コード読取りセンサＳｅ３も、識別標識を読取り可能な各種センサを適用可能である。 Specifically, as shown in FIG. 5, a notch-like flat surface portion 52 for the cord is formed on the outer peripheral portion on the -Y side of the cylindrical portion 46b of the push-up tool 45 (suction housing 46). For example, a one-dimensional or two-dimensional identification code 54 is provided on the code plane part 52 as an identification information recording part. The code reading sensor Se3 reads this identification code 54. Note that the identification mark is not limited to a one-dimensional or two-dimensional identification code, and various sensors capable of reading identification marks can be applied to the code reading sensor Se3.
　ツール移載機構６０Ｂは、図２及び図３に示すように、チャックヘッド６５と、このチャックヘッド６５をＺ方向及びＸ方向に移動させるチャックヘッド駆動機構Ｄ５とを含む。チャックヘッド６５は、Ｘ方向に開閉可能な一対の爪６６を備えた、電気駆動式又はエア駆動式の平行開閉型チャック装置である。チャックヘッド６５は、前記一対の爪６６により突上げツール４５をＸ方向の両側から挟持することにより、当該突上げツール４５を保持する。 As shown in FIGS. 2 and 3, the tool transfer mechanism 60B includes a chuck head 65 and a chuck head drive mechanism D5 that moves the chuck head 65 in the Z direction and the X direction. The chuck head 65 is an electrically or air-driven parallel opening/closing chuck device equipped with a pair of claws 66 that can be opened and closed in the X direction. The chuck head 65 holds the push-up tool 45 by pinching the push-up tool 45 from both sides in the X direction with the pair of claws 66 .
　チャックヘッド駆動機構Ｄ５は、例えば、モータを駆動源とするねじ送り機構によりＸ方向に移動するスライダ７２と、同様に、モータを駆動源とするねじ送り機構によりＺ方向に移動するベースフレーム６８とを含む。チャックヘッド６５はベースフレーム６８に組付けられている。チャックヘッド駆動機構Ｄ５の作動により、ベースフレーム６８がスライダ７２と共にＸ方向に移動するとともに、スライダ７２に対してベースフレーム６８がＺ方向に移動する。これにより、Ｘ方向及びＺ方向にチャックヘッド６５が移動する。なお、チャックヘッド駆動機構Ｄ５は、エアを駆動源とするシリンダ機構によりスライダ７２やベースフレーム６８を移動させる構成であってもよい。 The chuck head drive mechanism D5 includes, for example, a slider 72 that moves in the X direction by a screw feed mechanism that uses a motor as a drive source, and a base frame 68 that similarly moves in the Z direction by a screw feed mechanism that uses a motor as a drive source. including. The chuck head 65 is assembled to a base frame 68. By the operation of the chuck head drive mechanism D5, the base frame 68 moves in the X direction together with the slider 72, and the base frame 68 moves in the Z direction with respect to the slider 72. As a result, the chuck head 65 moves in the X direction and the Z direction. Note that the chuck head drive mechanism D5 may be configured to move the slider 72 and the base frame 68 using a cylinder mechanism using air as a drive source.
　図２に示すように、平面視において、前記一対の爪６６は前記直線Ｌと交差する位置に配置されており、チャックヘッド駆動機構Ｄ５の作動により、チャックヘッド６５はＸ方向及びＺ方向にのみ移動する。従って、チャックヘッド６５は、前記直線Ｌ上で突上げツール４５を挟持する。 As shown in FIG. 2, in plan view, the pair of claws 66 are arranged at positions intersecting the straight line L, and the chuck head 65 is moved only in the X direction and the Z direction by the operation of the chuck head drive mechanism D5. Moving. Therefore, the chuck head 65 clamps the push-up tool 45 on the straight line L.
　なお、ツール保持部６２に保持された突上げツール４５の円筒部４６ｂのうち、＋Ｘ側及び－Ｘ軸の外周部分には各々切欠き状のチャック用平面部５３が設けられている。各チャック用平面部５３は互いに平行な面である。一方、各爪６６は、当該平面部５３と平行な挟持面を備えており、チャックヘッド６５は、前記一対の爪６６の当該挟持面で突上げツール４５のチャック用平面部５３を挟持する。従って、突上げツール４５は、ツール保持部６２に載置されている姿勢を保った状態でチャックヘッド６５により保持、搬送される。 Note that, of the cylindrical portion 46b of the push-up tool 45 held by the tool holding portion 62, cutout-shaped chuck flat portions 53 are provided at the outer peripheral portions of the +X side and the −X axis, respectively. Each chuck flat portion 53 is a plane parallel to each other. On the other hand, each claw 66 has a clamping surface parallel to the flat part 53, and the chuck head 65 clamps the chuck flat part 53 of the push-up tool 45 with the clamping surface of the pair of claws 66. Therefore, the push-up tool 45 is held and conveyed by the chuck head 65 while maintaining the posture placed on the tool holding section 62.
　［部品実装装置１の基本動作］
　以上の部品実装装置１においてダイ７ａを基板Ｐに実装する際の基本動作は、次の通りである。まず、ウェハテーブル２０が前記ウェハ出し入れ位置に配置され、ウェハ引き出しユニット２３によってウェハ収納エレベータ２２からウェハテーブル２０にウェハホルダ８が引き出される。これにより、多数のダイ７ａ，７ａ…の集合体（ウェハ７）が貼着されたウェハシート８ａがウェハテーブル２０に配置される。 [Basic operation of component mounting device 1]
The basic operation when mounting the die 7a on the substrate P in the component mounting apparatus 1 described above is as follows. First, the wafer table 20 is placed at the wafer loading/unloading position, and the wafer holder 8 is pulled out from the wafer storage elevator 22 to the wafer table 20 by the wafer pulling unit 23 . As a result, the wafer sheet 8a to which the assembly (wafer 7) of a large number of dies 7a, 7a, . . . is attached is placed on the wafer table 20.
　次に、ウェハテーブル２０の移動により、ピックアップ対象のダイ７ａがピックアップ位置Ｐ１に配置され、ウェハカメラ３９がダイ７ａを撮像する。このとき、部品移送ユニット３３の移載ヘッド３４はピックアップ位置Ｐ１から退避する。ウェハカメラ３９の撮像は、後のピッキング動作で移載ヘッド３４が吸着するダイ７ａの認識のためである。 Next, by moving the wafer table 20, the die 7a to be picked up is placed at the pickup position P1, and the wafer camera 39 images the die 7a. At this time, the transfer head 34 of the component transfer unit 33 retreats from the pickup position P1. The image taken by the wafer camera 39 is for recognizing the die 7a that the transfer head 34 attracts in a later picking operation.
　ダイ７ａの撮像が完了すると、移載ヘッド３４がピックアップ位置Ｐ１に配置され、ウェハカメラ３９による撮像で認識されたダイ７ａを、吸着ノズル３４ａがピックアップする。この際、突上げヘッド４１によりダイ７ａが突き上げられる。詳しくは、突上げヘッド４１が待機高さ位置から突上げ高さ位置まで変位（上昇）し、吸着面部４６ａでウェハシート８ａが負圧吸着される。その後、突上げ主軸４４の作動により、吸着面部４６ａから突上げピン５０が突出し、これによりダイ７ａがウェハシート８ａを通じて突き上げられる。 When the imaging of the die 7a is completed, the transfer head 34 is placed at the pickup position P1, and the suction nozzle 34a picks up the die 7a recognized by the imaging by the wafer camera 39. At this time, the die 7a is pushed up by the push-up head 41. Specifically, the push-up head 41 is displaced (raised) from the standby height position to the push-up height position, and the wafer sheet 8a is suctioned under negative pressure by the suction surface portion 46a. Thereafter, the push-up pin 50 projects from the suction surface portion 46a by the operation of the push-up main shaft 44, and the die 7a is pushed up through the wafer sheet 8a.
　ダイ７ａのピッキング後、移載ヘッド３４がウェハテーブル２０の上方から移載テーブル３８の上方に移動する。ここで、ダイ７ａを吸着ノズル３４ａの吸着姿勢のままヘッドユニット４に受け渡す場合には、移載テーブル３８上にダイ７ａがリリースされる。その後、移載ヘッド３４が移載テーブル３８の上方から退避するとともに、ヘッドユニット４が移載テーブル３８の上方に移動し、ヘッド４Ｈにより移載テーブル３８からダイ７ａをピックアップする。ダイ７ａのピッキング後、ヘッドユニット４が部品認識カメラ１０の上方を経由して実装作業位置の基板Ｐの上方へ移動して下降する。これにより、ダイ７ａが基板Ｐに実装される。 After picking the die 7a, the transfer head 34 moves from above the wafer table 20 to above the transfer table 38. Here, when the die 7a is transferred to the head unit 4 with the suction nozzle 34a in the suction posture, the die 7a is released onto the transfer table 38. Thereafter, the transfer head 34 retreats from above the transfer table 38, and the head unit 4 moves above the transfer table 38, and the head 4H picks up the die 7a from the transfer table 38. After picking the die 7a, the head unit 4 moves above the component recognition camera 10, above the board P at the mounting work position, and descends. Thereby, the die 7a is mounted on the substrate P.
　一方、吸着ノズル３４ａによる吸着姿勢から上下反転した姿勢でダイ７ａをヘッドユニット４に受け渡す場合には、例えば移載テーブル３８の上方で吸着ノズル３４ａが回転移動し、これによりダイ７ａの姿勢を上下反転させる。その後、ヘッドユニット４が移載ヘッド３４の上方に移動し、吸着ノズル３４ａから直接ダイ７ａをヘッド４Ｈでピックアップする。ダイ７ａのピッキング後は、上記と同様に、ヘッドユニット４が部品認識カメラ１０の上方を経由して実装作業位置の基板Ｐの上方へ移動する。これにより、ダイ７ａが基板Ｐに実装される。 On the other hand, when the die 7a is transferred to the head unit 4 in a vertically inverted position from the suction position by the suction nozzle 34a, the suction nozzle 34a rotates above the transfer table 38, thereby changing the position of the die 7a. Flip it upside down. Thereafter, the head unit 4 moves above the transfer head 34, and the head 4H picks up the die 7a directly from the suction nozzle 34a. After picking the die 7a, similarly to the above, the head unit 4 moves above the component recognition camera 10 and above the board P at the mounting work position. Thereby, the die 7a is mounted on the substrate P.
　以降、ピックアップ対象のダイ７ａがピックアップ位置Ｐ１に配置されるようにウェハテーブル２０が移動しながら、移載ヘッド３４によるダイ７ａのピッキング及びヘッド４Ｈによる基板Ｐへのダイ７ａの実装動作が繰り返される。 Thereafter, while the wafer table 20 moves so that the die 7a to be picked up is placed at the pickup position P1, the picking of the die 7a by the transfer head 34 and the mounting operation of the die 7a onto the substrate P by the head 4H are repeated. .
　なお、ダイ７ａのピッキングの際に用いられる突上げツール４５は、既述の通り、ダイ７ａのサイズやそこに形成される回路等に応じて最適な態様が相違する。そのため、ダイ７ａの品種が変更されるときには、これに合せて、突上げヘッド４１に装着されている突上げツール４５の交換が行われる。この点については後に詳述する。 Note that the optimum form of the push-up tool 45 used when picking the die 7a differs depending on the size of the die 7a, the circuit formed therein, etc., as described above. Therefore, when the type of die 7a is changed, the push-up tool 45 attached to the push-up head 41 is replaced accordingly. This point will be explained in detail later.
　［部品実装装置１の制御系の説明］
　図６は、部品実装装置１の制御系を示すブロック図である。部品実装装置１は、既述の通り制御部２００を備えるとともに、部品実装処理等に関する各種情報を表示する表示部９０と、制御部２００に対する各種指令の入力操作を受ける入力部９１とが備えられている。 [Description of control system of component mounting apparatus 1]
FIG. 6 is a block diagram showing a control system of the component mounting apparatus 1. As shown in FIG. The component mounting apparatus 1 includes a control section 200 as described above, a display section 90 that displays various information regarding component mounting processing, etc., and an input section 91 that receives input operations for various commands to the control section 200. ing.
　制御部２００は、ＣＰＵ、ＲＯＭ、ＲＡＭ及び周辺回路等を備えて構成されている。制御部２００は、ＣＰＵがＲＯＭに記憶された制御プログラムを実行することにより、装置本体１００の各構成要素の動作を制御する。制御部２００は、主たる機能構成として、実装制御部８１、搬送制御部８２、部品供給制御部８３、部品突上げ制御部８４、撮像制御部８５、記憶部８６、及び表示制御部８７を含む。 The control unit 200 includes a CPU, ROM, RAM, peripheral circuits, and the like. The control unit 200 controls the operation of each component of the apparatus main body 100 by having the CPU execute a control program stored in the ROM. The control unit 200 includes a mounting control unit 81, a transport control unit 82, a component supply control unit 83, a component push-up control unit 84, an imaging control unit 85, a storage unit 86, and a display control unit 87 as main functional components.
　実装制御部８１は、装置本体１００における部品実装処理の動作、主にヘッドユニット駆動機構Ｄ１やヘッド４Ｈの駆動機構の動作を統括的に制御する。搬送制御部８２は、コンベア３による基板Ｐの搬送動作を制御する。 The mounting control unit 81 comprehensively controls the operation of component mounting processing in the apparatus main body 100, mainly the operation of the head unit drive mechanism D1 and the drive mechanism of the head 4H. The conveyance control unit 82 controls the conveyance operation of the substrate P by the conveyor 3.
　部品供給制御部８３は、ダイ７ａの供給動作を制御する。すなわちウェハ供給装置６の各部２２、２３、Ｄ２の動作、及び部品移送ユニット３３の動作を制御する。また、部品供給制御部８３は、テープフィーダ１９の動作を制御する。 The component supply control unit 83 controls the supply operation of the die 7a. That is, the operation of each part 22, 23, D2 of the wafer supply device 6 and the operation of the component transfer unit 33 are controlled. Further, the component supply control section 83 controls the operation of the tape feeder 19.
　部品突上げ制御部８４は、突上げユニット４０及びツール保管ユニット６０の動作を統括的に制御する。特に、実装対象となるダイ７ａ（ウェハ７）の品種変更時には、入力部９１によるオペレータの入力操作に応じて、突上げヘッド４１に装着されている突上げツール４５をツール保管テーブル６１に保持されている他の突上げツール４５と交換する後記ツール交換処理を実行する。また、前記センサＳｅ１～Ｓｅ５からの入力信号に基づき、ツール交換処理において各種判定処理を実行する。 The component push-up control section 84 centrally controls the operations of the push-up unit 40 and tool storage unit 60. In particular, when changing the type of die 7a (wafer 7) to be mounted, the push-up tool 45 attached to the push-up head 41 is held on the tool storage table 61 in response to the operator's input operation through the input unit 91. The tool exchange process described later is executed to exchange the tool with another push-up tool 45. Furthermore, various determination processes are executed in the tool exchange process based on input signals from the sensors Se1 to Se5.
　撮像制御部８５は、部品認識カメラ１０、基板認識カメラ１２及びウェハカメラ３９による撮像動作を制御する。撮像制御部８５は、画像処理部８５ａを備えており、各カメラ１０、１２、３９から出力される画像信号に基づいて被写体のデジタル画像を生成する。具体的には、ヘッド４Ｈによる吸着部品、基板Ｐのフィデューシャルマーク及びダイ７ａのデジタル画像を生成する。 The imaging control unit 85 controls imaging operations by the component recognition camera 10, the board recognition camera 12, and the wafer camera 39. The imaging control section 85 includes an image processing section 85a, and generates a digital image of the subject based on image signals output from each of the cameras 10, 12, and 39. Specifically, a digital image of the component attracted by the head 4H, the fiducial mark of the substrate P, and the die 7a is generated.
　記憶部８６は、部品実装処理や補正用データ取得処理において実行される各種プログラムや、当該プログラムの実行に際して参照される各種データが記憶されている。各種データには、基板データやツールデータが含まれる。基板データは、基板Ｐの品種と、各品種の基板Ｐに搭載される部品、部品の搭載位置（座標）などの情報を含む。ツールデータ（ツール情報）は、吸着ノズルや突上げツール４５に関する情報である。このツールデータには、ダイ７ａの品種毎にその突き上げに使用する突上げツール４５（識別情報）を定めたデータや、各突上げツール４５に備えられる突上げピン５０の数や配置などのデータが含まれる。 The storage unit 86 stores various programs executed in component mounting processing and correction data acquisition processing, and various data referenced when executing the programs. The various data include board data and tool data. The board data includes information such as the type of board P, the parts mounted on the board P of each type, and the mounting position (coordinates) of the parts. The tool data (tool information) is information regarding the suction nozzle and the push-up tool 45. This tool data includes data defining the push-up tool 45 (identification information) used for pushing up each type of die 7a, and data such as the number and arrangement of push-up pins 50 provided in each push-up tool 45. is included.
　表示制御部８７は、表示部９０（本発明の「報知部」に相当する）による表示を制御し、部品実装処理の状況に応じた各種情報及び画像を表示部９０に表示させる。なお、表示部９０は、液晶表示デバイス等からなり、入力部９１は、キーボードやマウスからなる。なお、表示部９０及び入力部９１は、タッチパネルのように一体に構成されていてもよい。 The display control section 87 controls the display by the display section 90 (corresponding to the "notification section" of the present invention), and causes the display section 90 to display various information and images according to the status of the component mounting process. Note that the display section 90 consists of a liquid crystal display device, etc., and the input section 91 consists of a keyboard and a mouse. Note that the display section 90 and the input section 91 may be integrally configured like a touch panel.
　なお、当例では、部品実装装置１のうち、主に、突上げユニット４０、ツール保管ユニット６０及び制御部２００（部品突上げ制御部８４）が本発明の「部品突上げ装置」に相当する。 In this example, of the component mounting apparatus 1, the push-up unit 40, tool storage unit 60, and control section 200 (component push-up control section 84) mainly correspond to the "component push-up device" of the present invention. .
　［突上げツール交換処理の制御］
　次に、制御部２００による突上げツール４５の交換処理の制御について、図８～図１２を参照しながら、図７のフローチャートに基づいて説明する。 [Control of push-up tool exchange process]
Next, the control of the replacement process of the push-up tool 45 by the control unit 200 will be described based on the flowchart of FIG. 7 with reference to FIGS. 8 to 12.
　図７に示す制御は、ダイ７ａ（ウェハ７）の品種切替えに合せて実行される。具体的には、ウェハテーブル２０上のウェハホルダ８がウェハ収納エレベータ２２に返却された後、切替後のウェハホルダ８がウェハテーブル２０上に引き出される前に実行される。この場合、記憶部８６に記憶されている基板データ及びツールデータに基づき、切替後のダイ７ａに対応する突上げツール４５の識別情報と、ツール交換の実行ボタンとが表示部９０に表示される。これに対して、オペレータが入力部９１を介して実行ボタンを操作すると、当該フローチャートによる制御が開始される。なお、突上げツール４５の交換処理は、オペレータの操作に依らず、ダイ７ａ（ウェハ７）の品種切替えに同期して開始されてもよい。 The control shown in FIG. 7 is executed in accordance with the type switching of the die 7a (wafer 7). Specifically, the process is executed after the wafer holder 8 on the wafer table 20 is returned to the wafer storage elevator 22 and before the switched wafer holder 8 is pulled out onto the wafer table 20. In this case, based on the board data and tool data stored in the storage unit 86, the identification information of the push-up tool 45 corresponding to the die 7a after switching and a tool exchange execution button are displayed on the display unit 90. . On the other hand, when the operator operates the execution button via the input unit 91, control according to the flowchart is started. Note that the replacement process of the push-up tool 45 may be started in synchronization with the change of the type of die 7a (wafer 7), regardless of the operator's operation.
　まず、制御部２００は、第１ツール検知センサＳｅ１からの出力信号に基づき、突上げヘッド４１に突上げツール４５が装着されているか否かを判定する（ステップＳ１）。ここで、Ｙｅｓの場合には、制御部２００は、処理をステップＳ３に移行する。Ｎｏの場合には、制御部２００は、ツール保管ユニット６０を制御し、突上げヘッド４１に装着されている突上げツール４５をツール保管テーブル６１に返却するツール返却処理（本発明の「ツール返却動作）に相当する）を実行する（ステップＳ２１）。 First, the control unit 200 determines whether or not the push-up tool 45 is attached to the push-up head 41 based on the output signal from the first tool detection sensor Se1 (step S1). Here, in the case of Yes, the control unit 200 moves the process to step S3. In the case of No, the control unit 200 controls the tool storage unit 60 to return the uplift tool 45 attached to the upthrust head 41 to the tool storage table 61 (tool return process (“tool return” of the present invention). (corresponding to the operation)) is executed (step S21).
　ツール返却処理におけるツール保管ユニット６０の各部の動作は次の通りである。なお、ここでは、図３及び図８に示すような突上げユニット４０及びツール保管ユニット６０の状態を基準として説明する。図８は、突上げツール交換時の各部の動作説明図であり、（ａ）は平面で、（ｂ）は－Ｙ側からの側面視で、各々突上げユニット４０及びツール保管ユニット６０を模式的に示している。 The operations of each part of the tool storage unit 60 in the tool return process are as follows. Note that the description will be made based on the states of the push-up unit 40 and tool storage unit 60 as shown in FIGS. 3 and 8. FIG. 8 is an explanatory diagram of the operation of each part when replacing the push-up tool. (a) is a plan view, and (b) is a side view from the -Y side, each schematically showing the push-up unit 40 and tool storage unit 60. It shows.
　図３及び図８では、突上げヘッド４１には第１ツール４５Ａが装着されており、よってツール保管テーブル６１の第１ツール保持部６２Ａは空である。ツール保管ユニット６０は、第２ツール保持部６２Ｂがツール出し入れ位置Ｐ２に位置するように配置されており、また、チャックヘッド６５は、ツール出し入れ位置Ｐ２の上方の待機位置に配置されている。突上げヘッド４１は、前記待機高さ位置に配置されている。 In FIGS. 3 and 8, the first tool 45A is attached to the push-up head 41, and therefore the first tool holding section 62A of the tool storage table 61 is empty. The tool storage unit 60 is arranged such that the second tool holding section 62B is located at the tool loading/unloading position P2, and the chuck head 65 is located at a standby position above the tool loading/unloading position P2. The thrusting head 41 is arranged at the standby height position.
　ステップＳ２１の処理では、まず、図９（ａ）に示すように、チャックヘッド６５が待機位置から突上げヘッド４１の上方に移動し、その場で下降して、突上げヘッド４１に装着されている第１ツール４５Ａを爪６６で挟持する。これにより、チャックヘッド６５が第１ツール４５Ａを保持する。次に、図９（ｂ）に示すように、第１ツール４５Ａを保持した状態でチャックヘッド６５が上昇し、前記待機位置、すなわちツール出し入れ位置Ｐ２の上方に移動して下降する。なお、この場合、第２ツール検知センサＳｅ２からの信号出力の有無により空のツール保持部６２（すなわち第１ツール保持部６２Ａ）が検出され、当該空のツール保持部６２がツール出し入れ位置Ｐ２に配置されていない場合には、当該空のツール保持部６２がツール出し入れ位置Ｐ２に配置されるようにツール保管テーブル６１の位置が調整される。 In the process of step S21, first, as shown in FIG. 9(a), the chuck head 65 is moved from the standby position to above the push-up head 41, lowered there, and attached to the push-up head 41. The first tool 45A that is present is held between the claws 66. Thereby, the chuck head 65 holds the first tool 45A. Next, as shown in FIG. 9(b), the chuck head 65 rises while holding the first tool 45A, moves to the standby position, that is, above the tool loading/unloading position P2, and then lowers. In this case, the empty tool holding part 62 (that is, the first tool holding part 62A) is detected depending on the presence or absence of a signal output from the second tool detection sensor Se2, and the empty tool holding part 62 is moved to the tool loading/unloading position P2. If it is not located, the position of the tool storage table 61 is adjusted so that the empty tool holding section 62 is located at the tool loading/unloading position P2.
　次に、図９（ｃ）に示すように、爪６６を開いて第１ツール４５Ａを第１ツール保持部６２Ａにリリースした後、チャックヘッド６５が上昇する。これにより、突上げヘッド４１から第１ツール４５Ａが取り外されてツール保管テーブル６１（第１ツール保持部６２Ａ）に返却される。 Next, as shown in FIG. 9(c), after opening the claw 66 and releasing the first tool 45A to the first tool holding portion 62A, the chuck head 65 rises. As a result, the first tool 45A is removed from the push-up head 41 and returned to the tool storage table 61 (first tool holding section 62A).
　なお、ステップＳ２１の処理では、第１ツール４５Ａは、爪６６によりチャック用平面部５３が挟持されることで、突上げヘッド４１への装着時と同じ姿勢でチャックヘッド６５に保持される。そのため、第１ツール保持部６２Ａへ返却される第１ツール４５Ａは、前記位置決め凹部５６及び位置決め凸部６３による位置決めが可能であり、これにより、第１ツール４５Ａは、突上げヘッド４１への装着時と同じ姿勢で第１ツール保持部６２Ａに保持される。 In addition, in the process of step S21, the first tool 45A is held on the chuck head 65 in the same posture as when it is attached to the push-up head 41 by having the flat chuck portion 53 held by the claws 66. Therefore, the first tool 45A returned to the first tool holding section 62A can be positioned by the positioning recess 56 and the positioning protrusion 63, so that the first tool 45A can be mounted on the push-up head 41. The first tool holding portion 62A holds the tool in the same posture as before.
　ステップＳ２１の処理が終了すると、制御部２００は、処理をステップＳ３に移行する。ステップＳ３では、制御部２００は、各突上げツール４５の識別コード５４の認識が終了しているか否かを判定する。ここで、Ｙｅｓの場合には、制御部２００は、ステップＳ５に処理を移行する。一方、Ｎｏの場合には、制御部２００は、ツール保管テーブル６１を簡潔的にＸ方向に移動させ、各ツール保持部６２Ａ～６２Ｃに保持されている突上げツール４５（４５Ａ～４５Ｃ）の識別コード５４をコード読取りセンサＳｅ３により読み取る（ステップＳ２３）。これにより、制御部２００は、ツール保管テーブル６１のツール保持部６２（６２Ａ～６２Ｃ）の各々に、何れの突上げツール４５（ツール４５Ａ～４５Ｃ）が保持されているかを認識するとともに、装着対象の突上げツール４５が含まれているかを判定する。ここで、装着対象の突上げツール４５が含まれていない場合には、、制御部２００は、後述するステップＳ２５に処理を移行する。なお、ステップＳ２３における識別コード５４の読み取りは、コード読取りセンサＳｅ３による本発明の「第１読み取り部」としての機能に相当する。 Upon completion of the process in step S21, the control unit 200 moves the process to step S3. In step S3, the control unit 200 determines whether recognition of the identification code 54 of each push-up tool 45 has been completed. Here, in the case of Yes, the control unit 200 moves the process to step S5. On the other hand, in the case of No, the control unit 200 briefly moves the tool storage table 61 in the The code 54 is read by the code reading sensor Se3 (step S23). Thereby, the control unit 200 recognizes which push-up tool 45 (tools 45A to 45C) is held in each of the tool holding parts 62 (62A to 62C) of the tool storage table 61, and It is determined whether the push-up tool 45 is included. Here, if the push-up tool 45 to be mounted is not included, the control unit 200 shifts the process to step S25, which will be described later. Note that reading the identification code 54 in step S23 corresponds to the function of the code reading sensor Se3 as the "first reading section" of the present invention.
　ステップＳ５では、制御部２００は、ツール保管ユニット６０を制御し、突上げヘッド４１（ヘッド本体部４２）に突上げツール４５を装着するツール装着処理（本発明の「ツール装着動作」に相当）を実行する。ステップＳ５のツール装着処理におけるツール保管ユニット６０の各部の動作は次の通りである。 In step S5, the control unit 200 controls the tool storage unit 60, and performs a tool mounting process (corresponding to the "tool mounting operation" of the present invention) in which the thrusting tool 45 is mounted on the thrusting head 41 (head main body portion 42). Execute. The operations of each part of the tool storage unit 60 in the tool mounting process in step S5 are as follows.
　まず、図１０（ａ）に示すように、ツール保管テーブル６１がＸ方向に移動し、装着対象の突上げツール４５（ここでは第３ツール４５Ｃ）がツール出し入れ位置Ｐ２に配置される。この場合、ステップＳ２３の認識結果に基づき装着対象の突上げツール４５がツール出し入れ位置Ｐ２に配置されるようにツール保管テーブル６１が移動する。 First, as shown in FIG. 10(a), the tool storage table 61 moves in the X direction, and the push-up tool 45 (here, the third tool 45C) to be mounted is placed at the tool loading/unloading position P2. In this case, the tool storage table 61 is moved so that the push-up tool 45 to be mounted is placed at the tool insertion/removal position P2 based on the recognition result in step S23.
　第３ツール４５Ｃがツール出し入れ位置Ｐ２に配置されると、当該第３ツール４５Ｃの識別コード５４がコード読取りセンサＳｅ３により読み取られて記憶される。ここでの識別コード５４の読み取りは、コード読取りセンサＳｅ３による本発明の「第２読み取り部」としての機能に相当する。 When the third tool 45C is placed at the tool loading/unloading position P2, the identification code 54 of the third tool 45C is read by the code reading sensor Se3 and stored. The reading of the identification code 54 here corresponds to the function of the code reading sensor Se3 as the "second reading section" of the present invention.
　次に、図１０（ｂ）に示すように、チャックヘッド６５が待機位置から下降して第３ツール４５Ｃを保持する。そして、図１０（ｃ）に示すように、チャックヘッド６５が上昇して、突上げヘッド４１におけるヘッド本体部４２の上方に移動した後、下降する。これにより、突上げヘッド４１に第３ツール４５Ｃに装着される。突上げヘッド４１への第３ツール４５Ｃの装着後、チャックヘッド６５は、図１０（ｄ）に示すように、ツール出し入れ位置Ｐ２上方の前記待機位置に移動する。 Next, as shown in FIG. 10(b), the chuck head 65 descends from the standby position and holds the third tool 45C. Then, as shown in FIG. 10(c), the chuck head 65 rises, moves above the head body portion 42 of the thrust-up head 41, and then descends. Thereby, the third tool 45C is attached to the push-up head 41. After the third tool 45C is attached to the push-up head 41, the chuck head 65 moves to the standby position above the tool insertion/removal position P2, as shown in FIG. 10(d).
　突上げツール４５の交換処理が完了すると、制御部２００は、ステップＳ５の処理でコード読取りセンサＳｅ３が読み取った第３ツール４５Ｃの識別コード５４（識別情報）に基づき、突上げヘッド４１に装着された突上げツール４５（第３ツール４５Ｃ）がツールデータで定められた突上げツール４５か否か、すなわち、切替後のダイ７ａに対応する突上げツール４５か否かを判定する（ステップＳ７）。 When the replacement process for the third tool 45C is completed, the control unit 200 determines whether the third tool 45C is attached to the uplift head 41 based on the identification code 54 (identification information) of the third tool 45C read by the code reading sensor Se3 in the process of step S5. It is determined whether the upthrust tool 45 (third tool 45C) is the upthrust tool 45 defined by the tool data, that is, whether it is the upthrust tool 45 corresponding to the die 7a after switching (step S7). .
　ここでＮｏの場合には、制御部２００は、所定のエラー処理を実行する。例えば、制御部２００は、表示部９０にエラーメッセージを表示するとともに、部品実装装置１を停止させて（ステップＳ２５）、当該フローチャートの制御を終了する。 If the answer is No here, the control unit 200 executes predetermined error processing. For example, the control unit 200 displays an error message on the display unit 90, stops the component mounting apparatus 1 (step S25), and ends the control of the flowchart.
　ステップＳ７でＹｅｓと判定した場合には、制御部２００は、第１ツール検知センサＳｅ１からの信号出力に基づき、突上げヘッド４１（ヘッド本体部４２）に突上げツール４５が正常に装着されているか否かを判定する（ステップＳ９）。具体的には、第１ツール検知センサＳｅ１により突上げツール４５が検知されているか否かを判定する。ここでＮｏの場合には、制御部２００は、ステップＳ２５に処理を移行し、既述のエラー処理を実行する。 If the determination in step S7 is Yes, the control unit 200 determines whether the upthrust tool 45 is normally attached to the upthrust head 41 (head main body 42) based on the signal output from the first tool detection sensor Se1. It is determined whether or not there is one (step S9). Specifically, it is determined whether the push-up tool 45 is detected by the first tool detection sensor Se1. In the case of No here, the control unit 200 moves the process to step S25 and executes the error processing described above.
　ステップＳ９でＹｅｓと判定した場合には、制御部２００は、ウェハカメラ３９を制御し、突上げヘッド４１に装着されている突上げツール４５の吸着面部４６ａを撮像する（ステップＳ１１）。突上げヘッド４１及びウェハカメラ３９は、前記ピックアップ位置Ｐ１に配置されているが、突上げツール交換処理の際には、既述の通り、ウェハテーブル２０にウェハホルダ８は保持されていない。そのため、ウェハカメラ３９は、ウェハテーブル２０及び支持フレーム２６の開口部を通じて上方から第３ツール４５Ｃの吸着面部４６ａを撮像することができる。 If the determination is Yes in step S9, the control unit 200 controls the wafer camera 39 to image the suction surface portion 46a of the push-up tool 45 attached to the push-up head 41 (step S11). Although the push-up head 41 and the wafer camera 39 are arranged at the pickup position P1, the wafer holder 8 is not held on the wafer table 20 as described above during the push-up tool exchange process. Therefore, the wafer camera 39 can image the suction surface portion 46a of the third tool 45C from above through the openings of the wafer table 20 and the support frame 26.
　次に、制御部２００は、ステップＳ１１の処理で取得した吸着面部４６ａの画像データと、当該突上げツール４５のツールデータとに基づき、突上げピン５０が当該突上げツール４５のものとして適切か否かを判定する（ステップＳ１３）。具体的には、制御部２００は、取得した画像から突上げピン５０の数及び配置を認識し、当該数及び配置がツールデータと一致するか否かを判定する。ここで、Ｎｏの場合には、制御部２００は、ステップＳ２５に処理を移行し、既述のエラー処理を実行する。 Next, the control unit 200 determines whether the push-up pin 50 is appropriate for the push-up tool 45 based on the image data of the suction surface portion 46a acquired in the process of step S11 and the tool data of the push-up tool 45. It is determined whether or not (step S13). Specifically, the control unit 200 recognizes the number and arrangement of the push-up pins 50 from the acquired image, and determines whether the number and arrangement match the tool data. Here, in the case of No, the control unit 200 moves the process to step S25 and executes the error processing described above.
　例えば、ツールデータにおける第３ツール４５Ｃの突上げピン５０のデータが、図１１（ａ）に示すように、吸着面部４６ａの中心Ｏを基準としてその周囲の４箇所に配置されるようなデータであると想定する。この場合、図１１（ｂ）に示すように、取得画像における突上げピン５０の数とツールデータにおける突上げピン５０の数が一致しない場合や、図１１（ｃ）に示すように、取得画像における突上げピン５０の配置とツールデータにおける突上げピン５０の配置が一致しない場合には、制御部２００は、ステップＳ１３においてＮｏと判定する。 For example, the data of the push-up pins 50 of the third tool 45C in the tool data is data such that the push-up pins 50 of the third tool 45C are arranged at four locations around the center O of the suction surface portion 46a as a reference, as shown in FIG. 11(a). Assume that there is. In this case, as shown in FIG. 11(b), the number of push-up pins 50 in the acquired image and the number of push-up pins 50 in the tool data do not match, or as shown in FIG. 11(c), the number of push-up pins 50 in the acquired image If the arrangement of the push-up pins 50 in and the arrangement of the push-up pins 50 in the tool data do not match, the control unit 200 determines No in step S13.
　ステップＳ１３でＹｅｓと判定した場合には、制御部２００は、ウェハ供給装置６を制御し、切替え対象のウェハ７が保持されたウェハホルダ８をウェハテーブル２０に引き出す。さらに、部品移送ユニット３３及び突上げユニット４０を制御し、移載ヘッド３４を用いて、突上げヘッド４１に装着されている突上げツール４５の高さ、すなわち吸着面部４６ａの高さ検出処理を実行する（ステップＳ１８）。 If the determination in step S13 is Yes, the control unit 200 controls the wafer supply device 6 and pulls out the wafer holder 8 holding the wafer 7 to be switched onto the wafer table 20. Furthermore, the component transfer unit 33 and the push-up unit 40 are controlled, and the transfer head 34 is used to detect the height of the push-up tool 45 attached to the push-up head 41, that is, the height of the suction surface portion 46a. Execute (step S18).
　具体的には、突上げヘッド４１を前記突上げ高さ位置に配置して突上げツール４５の吸着面部４６ａでウェハシート８ａを負圧吸着し、この状態で、ダイ７ａの上方から吸着ノズル３４ａをダイ７ａに接近させながら負圧センサＳｅ４からの出力信号に基づき第３ツール４５Ｃの高さを検出する。詳しくは、図１２に示すように、ダイ７ａ上方の計測開始高さＳｐから計測終了高さＥｐまで吸着ノズル３４ａを下降させながら、負圧センサＳｅ４の検出負圧レベルの変化点、つまり吸着ノズル３４ａがダイ７ａを吸着する時点の吸着ノズル３４ａの先端高さを突上げツール４５の高さとして検出する。なお、吸着ノズル３４ａの先端高さは、前記位置センサＳｅ５（エンコーダ）により検出される位置情報に基づき求められる。 Specifically, the push-up head 41 is placed at the push-up height position, the wafer sheet 8a is sucked under negative pressure by the suction surface portion 46a of the push-up tool 45, and in this state, the suction nozzle 34a is inserted from above the die 7a. While approaching the die 7a, the height of the third tool 45C is detected based on the output signal from the negative pressure sensor Se4. Specifically, as shown in FIG. 12, while lowering the suction nozzle 34a from the measurement start height Sp above the die 7a to the measurement end height Ep, the change point of the negative pressure level detected by the negative pressure sensor Se4, that is, the suction nozzle The height of the tip of the suction nozzle 34a at the time when the suction nozzle 34a suctions the die 7a is detected as the height of the thrusting tool 45. The height of the tip of the suction nozzle 34a is determined based on position information detected by the position sensor Se5 (encoder).
　次に、制御部２００は、ステップＳ１８の処理で検出した第３ツール４５Ｃの高さに基づき、突上げツール４５の装着状態が適切か否かを判定する。具体的には、第３ツール４５Ｃの高さが許容値Ａｒ内か否か、すなわち、図１２に示す、上限値Ｕｈと下限値Ｌｈとの間か否かを判定する。図１２中の符号Ｓｈは、基準値を示しており、突上げツール４５が突上げヘッド４１に正常に装着されている場合のダイ７ａの上面高さに等しい。 Next, the control unit 200 determines whether the mounting state of the push-up tool 45 is appropriate based on the height of the third tool 45C detected in the process of step S18. Specifically, it is determined whether the height of the third tool 45C is within the allowable value Ar, that is, whether it is between the upper limit value Uh and the lower limit value Lh shown in FIG. Symbol Sh in FIG. 12 indicates a reference value, which is equal to the upper surface height of the die 7a when the thrusting tool 45 is normally attached to the thrusting head 41.
　ステップＳ１９でＮｏの場合には、制御部２００は、ステップＳ２５に処理を移行し、既述のエラー処理を実行する。一方、ステップＳ１９でＹｅｓの場合には、本フローチャートの制御を終了する。これにより、切替え後のダイ７ａを基板Ｐに実装する実装動作が開始される。 In the case of No in step S19, the control unit 200 moves the process to step S25 and executes the error processing described above. On the other hand, in the case of Yes in step S19, the control of this flowchart is ended. As a result, a mounting operation for mounting the switched die 7a onto the substrate P is started.
　［作用効果］
　以上説明した部品実装装置１では、既述の通り、制御部２００によるツール保管ユニット６０の制御により、突上げヘッド４１（ツール装着部４３）に装着されている突上げツール４５を取り外してツール保管テーブル６１に返却するツール返却処理と、ツール保管テーブル６１に支持されている突上げツール４５（４５Ａ～４５Ｃ）を、チャックヘッド６５により保持して突上げヘッド４１（ツール装着部４３）に装着するツール装着処理が実行される。従って、突上げツール４５の交換作業の自動化が達成される。 [Effect]
In the component mounting apparatus 1 described above, the tool storage unit 60 is controlled by the control section 200 to remove the push-up tool 45 attached to the push-up head 41 (tool mounting section 43) and store the tool. A tool return process in which the tool is returned to the table 61, and the push-up tools 45 (45A to 45C) supported by the tool storage table 61 are held by the chuck head 65 and mounted on the push-up head 41 (tool mounting section 43). Tool mounting processing is executed. Therefore, automation of the replacement work of the push-up tool 45 is achieved.
　しかも、突上げツール４５は、突上げヘッド４１（ツール装着部４３）に対して上下方向に着脱可能に装着され、ツール保管テーブル６１には、突上げヘッド４１への装着状態と同じ姿勢で突上げツール４５（４５Ａ～４５Ｃ）が支持される。そして、チャックヘッド６５がＺ方向及びＸ方向にのみ移動して突上げツール４５を移送するようにツール移載機構６０Ｂが構成されている。そのため、この部品実装装置１によると、チャックヘッド６５をＺ方向及びＸ方向に直線的に移動させるだけの非常に簡単な機構及び制御で、突上げツール４５の交換作業を自動化することが可能となる。 In addition, the upthrust tool 45 is attached to the upthrust head 41 (tool mounting portion 43) in a vertically removable manner, and is inserted into the tool storage table 61 in the same attitude as when attached to the upthrust head 41. A lifting tool 45 (45A to 45C) is supported. The tool transfer mechanism 60B is configured such that the chuck head 65 moves only in the Z direction and the X direction to transfer the push-up tool 45. Therefore, according to this component mounting apparatus 1, it is possible to automate the replacement work of the push-up tool 45 with a very simple mechanism and control that simply moves the chuck head 65 linearly in the Z direction and the X direction. Become.
　また、上記部品実装装置１では、記憶部８６に記憶されたツールデータと、ステップＳ２３の処理においてコード読取りセンサＳｅ３が読み取った識別コード５４（識別情報）とに基づき、ツール保管テーブル６１に保持されている複数の突上げツール４５（４５Ａ～４５Ｃ）のうちから装着対象の突上げツール４５が特定されて前記ツール装着処理が実行される。そのため、ダイ７ａの品種に対応した突上げツール４５を正確に特定してツール装処理を実行することが可能となる。 Further, in the component mounting apparatus 1, the tool data stored in the storage unit 86 and the identification code 54 (identification information) read by the code reading sensor Se3 in the process of step S23 are stored in the tool storage table 61. The push-up tool 45 to be mounted is specified from among the plurality of push-up tools 45 (45A to 45C), and the tool mounting process is executed. Therefore, it becomes possible to accurately specify the push-up tool 45 corresponding to the type of die 7a and execute the tool mounting process.
　しかも、ツール装着処理の実行時には、ツール出し入れ位置Ｐ２に配置された突上げツール４５の識別コード５４がコード読取りセンサＳｅ３で読み取られ、当該突上げツール４５がツールデータで定められた突上げツール４５か否かが判定される（図７のステップＳ７）。そして、異なる場合には、表示部９０にエラーメッセージが表示されるとともに、部品実装装置１が停止される。そのため、仮に品種切替後のダイ７ａとの関係で不適当な突上げツール４５が突上げヘッド４１に装着された場合でも、ダイ７ａのピッキング作業がそのまま開始されてしまうことがない。 Moreover, when the tool mounting process is executed, the identification code 54 of the push-up tool 45 placed at the tool loading/unloading position P2 is read by the code reading sensor Se3, and the push-up tool 45 is set to the push-up tool 45 determined by the tool data. It is determined whether or not (step S7 in FIG. 7). If there is a difference, an error message is displayed on the display unit 90 and the component mounting apparatus 1 is stopped. Therefore, even if an inappropriate push-up tool 45 is attached to the push-up head 41 in relation to the die 7a after the type change, the picking operation of the die 7a will not be started as is.
　また、上記部品実装装置１では、ツール装着処理の実行後、第１ツール検知センサＳｅ１からの信号出力の有無により、突上げヘッド４１に突上げツール４５が装着されているか否かが判定され（図７のステップＳ９）、装着されていない場合には、既述のエラー処理が実行される。そのため、突上げヘッド４１に突上げツール４５が装着されないままで、ダイ７ａのピッキング作業が開始されることが防止される。 In addition, in the component mounting apparatus 1, after the tool mounting process is executed, it is determined whether or not the push-up tool 45 is mounted on the push-up head 41 based on the presence or absence of a signal output from the first tool detection sensor Se1 ( In step S9 of FIG. 7), if it is not attached, the error processing described above is executed. Therefore, the picking operation of the die 7a is prevented from being started without the push-up tool 45 being attached to the push-up head 41.
　また、上記部品実装装置１では、ツール装着処理の実行後、突上げヘッド４１（吸着面部４６ａ）がウェハカメラ３９により撮像される。そして、その画像データに基づき、突上げツール４５に備えられている突上げピン５０（数や配置）が適切か否かが判定され（図７のステップＳ１１、Ｓ１３）、適切でない場合には、既述のエラー処理が実行される。そのため、不適当な突上げピン５０を備えた突上げツール４５が突上げヘッド４１に装着されたままで、ダイ７ａのピッキング作業が開始されることが防止される。 Furthermore, in the component mounting apparatus 1, after the tool mounting process is executed, the push-up head 41 (suction surface portion 46a) is imaged by the wafer camera 39. Based on the image data, it is determined whether the push-up pins 50 (number and arrangement) provided in the push-up tool 45 are appropriate (steps S11 and S13 in FIG. 7), and if they are not appropriate, The error handling described above is executed. Therefore, it is prevented that the picking operation of the die 7a is started while the push-up tool 45 provided with the inappropriate push-up pin 50 remains attached to the push-up head 41.
　また、上記部品実装装置１では、ツール装着処理の実行後、突上げヘッド４１に装着された突上げツール４５の高さを検出し、この高さが許容値Ａｒ内にあるか否かが判定される（ステップＳ１８、Ｓ１９）。そして、許容値Ａｒ外であるある場合には、既述のエラー処理が実行される。そのため、突上げツール４５の浮きなど、突上げツール４５に不完全な装着状態が生じたままで、ダイ７ａのピッキング作業が開始されることが防止される。 Further, in the component mounting apparatus 1, after executing the tool mounting process, the height of the push-up tool 45 mounted on the push-up head 41 is detected, and it is determined whether this height is within the allowable value Ar. (Steps S18, S19). If the value is outside the allowable value Ar, the error processing described above is executed. Therefore, it is possible to prevent the picking operation of the die 7a from being started with the push-up tool 45 incompletely attached, such as when the push-up tool 45 is lifted.
　以上説明した部品実装装置１は、本発明に係る部品実装装置（本発明の部品突上げ装置が備えられた部品実装装置）の実施形態の一例であり、部品実装装置１や部品突上げ装置（突上げユニット４０及びツール保管ユニット６０）の具体的な構成は、本発明の要旨を逸脱しない範囲で適宜変更可能である。 The component mounting apparatus 1 described above is an example of an embodiment of a component mounting apparatus according to the present invention (a component mounting apparatus equipped with a component pushing-up apparatus of the present invention), and the component mounting apparatus 1 and the component pushing-up apparatus ( The specific configurations of the push-up unit 40 and tool storage unit 60) can be changed as appropriate without departing from the gist of the present invention.
　例えば、実施形態の部品実装装置１は、部品移送ユニット３３の移載ヘッド３４でウェハ７からダイ７ａをピックアップし、当該ダイ７ａを、移載テーブル３８を介して間接的に、又は移載ヘッド３４から直接、ヘッドユニット４のヘッド４Ｈへ受け渡す構成である。しかし、部品実装装置１は、例えばヘッドユニット４のヘッド４Ｈにより、ウェハ７から直接ダイ７ａをピックアップする構成であってもよい。この場合、図７のステップＳ１８、Ｓ１９の処理は、ヘッド４Ｈルに負圧を供給するための負圧通路の負圧レベルと、ヘッド４Ｈを昇降移動させるためのモータに内蔵されるエンコーダ等の位置センサが検出する位置情報とに基づき行うようにしてもよい。 For example, the component mounting apparatus 1 of the embodiment picks up the die 7a from the wafer 7 with the transfer head 34 of the component transfer unit 33, and transfers the die 7a indirectly via the transfer table 38 or with the transfer head. 34 directly to the head 4H of the head unit 4. However, the component mounting apparatus 1 may have a configuration in which, for example, the head 4H of the head unit 4 directly picks up the die 7a from the wafer 7. In this case, the processes in steps S18 and S19 in FIG. 7 are performed to determine the negative pressure level of the negative pressure passage for supplying negative pressure to the head 4H and the encoder etc. built in the motor for moving the head 4H up and down. It may also be performed based on position information detected by a position sensor.
　また、実施形態では、図７のステップＳ１９の処理において突上げツール４５の高さが許容値Ａｒ外と判定された場合には、直ちに、表示部９０にエラーメッセージが表示されるとともに部品実装装置１が停止される。しかし、突上げツール４５の高さが許容値Ａｒ外と判定された場合にはリトライ動作を実行するようにしてもよい。具体的には、突上げツール４５をチャックヘッド６５で保持し、チャックヘッド６５を一旦上昇させた後に下降させる。そして、リトライ動作後に、突上げツール４５の高さ検出処理を再度行い、突上げツール４５の高さが許容値Ａｒ外であった場合に、既述のエラー処理を実行するようにしてもよい。この構成によれば、突上げツール４５の浮き等、突上げツール４５の不完全な装着状態を自動修正することが可能となる。 Further, in the embodiment, if it is determined in the process of step S19 in FIG. 7 that the height of the push-up tool 45 is outside the allowable value Ar, an error message is immediately displayed on the display unit 90, and the component mounting device 1 is stopped. However, if it is determined that the height of the push-up tool 45 is outside the allowable value Ar, a retry operation may be performed. Specifically, the push-up tool 45 is held by the chuck head 65, and the chuck head 65 is once raised and then lowered. Then, after the retry operation, the height detection process of the push-up tool 45 may be performed again, and if the height of the push-up tool 45 is outside the allowable value Ar, the error processing described above may be executed. . According to this configuration, it is possible to automatically correct an incompletely installed state of the push-up tool 45, such as lifting of the push-up tool 45.
　なお、実施形態では負圧センサＳｅ４及び位置センサＳｅ５が取得する情報に基づいて、突上げヘッド４１に装着された突上げツール４５の高さを検出しているが、例えば、光学式センサなどにより、突上げヘッド４１に装着さえた突上げツール４５の高さを直接検知するようにしてもよい。 In the embodiment, the height of the uplifting tool 45 attached to the upthrust head 41 is detected based on the information acquired by the negative pressure sensor Se4 and the position sensor Se5, but the height of the upthrust tool 45 attached to the upthrust head 41 is detected by, for example, an optical sensor or the like. The height of the push-up tool 45 attached to the push-up head 41 may be directly detected.
　また、実施形態では、ツール出し入れ位置Ｐ２に配置された突上げツール４５の識別コード５４がコード読取りセンサＳｅ３で読み取られ、当該識別コード５４に記録された識別情報に基づき、当該突上げツール４５がツールデータで定められた突上げツール４５か否かが判定されている（図７のステップＳ７）。しかし、ステップＳ７の判定処理のための識別コード５４の読み取りは、コード読取りセンサＳｅ３とは別のコード読取りセンサで行ってもよい。この場合、当該別のコード読取りセンサ（本発明の「第２読取り部」に相当する）は、チャックヘッド６５により保持されて移動する突上げツール４５の移動経路内の何れかの位置で、識別コード５４を読み取り可能に設けられていればよい。 Further, in the embodiment, the identification code 54 of the push-up tool 45 placed at the tool loading/unloading position P2 is read by the code reading sensor Se3, and based on the identification information recorded in the identification code 54, the push-up tool 45 is It is determined whether or not the push-up tool 45 is defined by the tool data (step S7 in FIG. 7). However, the identification code 54 for the determination process in step S7 may be read by a code reading sensor different from the code reading sensor Se3. In this case, the other code reading sensor (corresponding to the "second reading section" of the present invention) detects the identification at any position within the moving path of the uplifting tool 45 that is held and moved by the chuck head 65. It is only necessary that the code 54 be readable.
　また、上記部品実装装置１では、突上げヘッド４１がピックアップ位置Ｐ１に配置され、突上げヘッド４１に対してウェハ７がＸＹ方向に移動することで、ピックアップ対象のダイ７ａがピックアップ位置Ｐ１に配置される構成である。しかし、逆の構成であってもよい。すなわち、固定的に配置されるウェハ７に対して、突上げヘッド４１側がＸＹ方向に移動してピックアップ対象のダイ７ａの下方に配置される構成であってもよい。この場合には、所定のツール交換エリアに突上げヘッド４１を移動させ、このツール交換エリアに配置された突上げヘッド４１に対してツール交換が行われるように、当該ツール交換エリアに隣接した位置にツール保管ユニット６０を配置するようにすればよい。 Furthermore, in the component mounting apparatus 1, the push-up head 41 is arranged at the pick-up position P1, and as the wafer 7 moves in the XY direction with respect to the push-up head 41, the die 7a to be picked up is arranged at the pick-up position P1. This is the configuration that will be used. However, a reverse configuration is also possible. That is, with respect to the wafer 7 that is fixedly placed, the push-up head 41 side may be moved in the XY direction and placed below the die 7a to be picked up. In this case, the push-up head 41 is moved to a predetermined tool exchange area, and a position adjacent to the tool exchange area is set so that the tool exchange is performed on the push-up head 41 placed in this tool exchange area. The tool storage unit 60 may be disposed at.
　［上記実施形態に含まれる発明］
　本発明の一局面に係る部品突上げ装置は、ウェハシートに貼着されたウェハの下方からダイを突上げることにより、当該ダイを前記ウェハシートから剥離させる部品突上げ装置であって、前記ウェハシートの下面を負圧吸着する吸着面、及び前記吸着面からウェハシート側に出没可能に設けられた突上げピンを各々備えた複数の突上げツールと、前記複数の突上げツールが選択的にかつ上下方向に着脱可能に装着されるツール装着部を備え、前記ウェハシートに対して、当該ウェハシートに沿った方向及び上下方向に相対的に移動可能な突上げヘッドと、前記複数の突上げツールの各々を、前記ツール装着部への装着状態と同じ姿勢で支持可能なツール保管テーブルと、前記突上げツールを保持可能な保持部材を備え、前記突上げツールを保持した状態で前記保持部材を上下方向及び水平方向に移動させることにより、前記突上げヘッドと前記ツール保管テーブルとの間で前記突上げツールを移送するツール移送機構と、前記突上げヘッド及び前記ツール移送機構を制御することにより、前記保持部材により前記ツール装着部に装着されている前記突上げツールを取り外して前記ツール保管テーブルに返却するツール返却動作、及び／又は、前記ツール保管テーブルに支持されている前記突上げツールを、前記保持部材により保持して前記ツール装着部に装着するツール装着動作を実行する制御部と、を備えている。 [Inventions included in the above embodiments]
A component pushing-up device according to one aspect of the present invention is a component pushing-up device that peels a die from a wafer sheet by pushing up a die from below a wafer attached to a wafer sheet, and the component pushing-up device peels the die from the wafer sheet. a plurality of push-up tools each including a suction surface that sucks a lower surface of the sheet under negative pressure and a push-up pin that is provided so as to be able to protrude and retract from the suction surface toward the wafer sheet side; and the plurality of push-up tools selectively and a push-up head that is movable relative to the wafer sheet in a direction along the wafer sheet and in a vertical direction; and a push-up head that is detachably mounted in a vertical direction; A tool storage table capable of supporting each tool in the same posture as the tool is attached to the tool mounting portion; and a holding member capable of holding the uplifting tool; a tool transfer mechanism that transfers the push-up tool between the push-up head and the tool storage table by moving the push-up head in the vertical direction and the horizontal direction; and controlling the push-up head and the tool transfer mechanism. a tool return operation of removing the push-up tool mounted on the tool mounting part by the holding member and returning it to the tool storage table, and/or the push-up tool supported by the tool storage table. and a control section that executes a tool mounting operation of holding the tool by the holding member and mounting the tool on the tool mounting section.
　この部品突上げ装置によると、制御部による突上げヘッド及びツール移送機構の制御により、突上げヘッドに装着されている突上げツールを取り外してツール保管テーブルに返却するツール返却動作、及び／又は、ツール保管テーブルに支持されている突上げツールを、保持部材により保持して突上げヘッドのツール装着部に装着するツール装着動作が実行される。つまり、突上げヘッドに対する突上げツールの交換作業の自動化が図られる。 According to this component lifting device, the control unit controls the lifting head and the tool transfer mechanism to perform a tool return operation in which the lifting tool attached to the lifting head is removed and returned to the tool storage table, and/or A tool mounting operation is performed in which the push-up tool supported on the tool storage table is held by the holding member and mounted on the tool mounting portion of the push-up head. In other words, the work of replacing the upthrust tool with respect to the upthrust head can be automated.
　しかも、この部品突上げ装置では、突上げツールがツール装着部に対して上下方向に着脱可能に装着され、ツール保管テーブルには、突上げツールがツール装着部への装着状態と同じ姿勢で支持される。そして、突上げツールを保持した状態で保持部材を上下方向及び水平方向に移動させることにより、突上げヘッドとツール保管テーブルとの間で突上げツールを移送するようにツール移送機構が構成されている。そのため、保持部材を直線的に移動させるだけの簡単な機構及び制御で、突上げツールの交換作業を自動化することが可能となる。 Moreover, in this component lifting device, the lifting tool is attached to the tool mounting part in a vertically removable manner, and the tool storage table supports the lifting tool in the same posture as when it is attached to the tool mounting part. be done. The tool transfer mechanism is configured to transfer the upthrust tool between the upthrust head and the tool storage table by moving the holding member vertically and horizontally while holding the upthrust tool. There is. Therefore, it is possible to automate the replacement work of the push-up tool with a simple mechanism and control that simply moves the holding member linearly.
　上記部品突上げ装置において、前記複数の突上げツールの各々は、各々の識別情報が記録された記録部を備え、当該部品突上げ装置は、前記ツール保管テーブルに支持されている前記突上げツールの前記情報記録部に記録された識別情報を読み取り可能な第１読み取り部と、前記各突上げツールに関する情報であるツール情報が記憶される記憶部と、をさらに備え、前記ツール情報は、前記ダイの品種と当該品種に用いる突上げツールとの対応関係を定めた情報を含み、前記制御部は、前記ツール情報と前記第１読み取り部が読み取った識別情報とに基づき、前記ツール保管テーブルに支持されている前記複数の突上げツールのうちから装着対象の突上げツールを特定して前記ツール装着動作を実行する。 In the above-mentioned component pushing-up device, each of the plurality of pushing-up tools includes a recording section in which each identification information is recorded, and the component pushing-up device includes the pushing-up tool supported by the tool storage table. further comprising: a first reading section that can read identification information recorded in the information recording section of the tool; and a storage section that stores tool information that is information regarding each of the uplift tools; The controller includes information that defines a correspondence relationship between die types and push-up tools used for the types, and the control unit stores information in the tool storage table based on the tool information and the identification information read by the first reading unit. A push-up tool to be mounted is identified from among the plurality of supported push-up tools, and the tool mounting operation is executed.
　この部品突上げ装置の構成によれば、ダイの品種の変更等に応じ、ツール保管テーブルに支持されている複数の突上げツールのなから当該ダイに対応した突上げツールを正確に特定してツール装着動作を実行することが可能となる。 According to the configuration of this component push-up device, in response to a change in die type, etc., the push-up tool corresponding to the die can be accurately identified from among the plurality of push-up tools supported on the tool storage table. It becomes possible to perform a tool mounting operation.
　この場合には、前記ツール装着動作の実行時、前記ツール保管テーブルに支持されている前記突上げツールが前記保持部材に保持される保持位置から当該突上げツールが前記ツール装着部に装着される位置までの当該突上げツールの移動経路内の何れかの位置で、前記識別情報を読み取り可能な第２読み取り部がさらに設けられているのが好適である。 In this case, when performing the tool mounting operation, the push-up tool is mounted on the tool mounting portion from a holding position where the push-up tool supported by the tool storage table is held by the holding member. Preferably, a second reading section capable of reading the identification information is further provided at any position within the moving path of the push-up tool to the position.
　この部品突上げ装置の構成によれば、第２読取り部の読み取り結果に基づき装置をエラー停止させる等することが可能となる。そのため、不適当な突上げツールがツール装着部に装着されたままで、ダイのピッキング作業が開始されてしまうことを防止することが可能となる。 According to the configuration of this component lifting device, it is possible to stop the device due to an error based on the reading result of the second reading section. Therefore, it is possible to prevent the die picking operation from being started with an inappropriate push-up tool still attached to the tool mounting portion.
　また、上記の部品突上げ装置において、前記第１読み取り部及び前記第２読み取り部として共通の読み取り部を備え、当該共通の読取り部は、前記ツール保管テーブルに対して相対的に移動可能に設けられ、前記保持位置に配置される前記突上げツールの前記識別情報を読み取るように構成される。 Further, in the above-mentioned component lifting device, a common reading section is provided as the first reading section and the second reading section, and the common reading section is provided so as to be movable relative to the tool storage table. and configured to read the identification information of the uplift tool placed in the holding position.
　この構成によれば、ツール保管テーブルに支持されている複数の突上げツールの各識別情報を、共通（一つ）の読み取り部で読み取ることが可能となる。 According to this configuration, it is possible to read each identification information of a plurality of push-up tools supported on the tool storage table with a common (one) reading unit.
　また、上記の部品突上げ装置においては、ツール装着部に前記突上げツールが装着されているときに当該突上げツールを検出するセンサを備え、前記制御部は、前記ツール装着動作の実行後、前記センサによる前記突上げツールの検知の有無に基づき、当該突上げツールが前記ツール装着部に装着されたか否かを判定するように構成されていてもよい。 Further, the above-mentioned component lifting device includes a sensor that detects the lifting tool when the tool mounting section is equipped with the lifting tool, and the control unit is configured to: The device may be configured to determine whether the push-up tool is attached to the tool mounting portion based on whether or not the push-up tool is detected by the sensor.
　この構成によれば、ツール装着動作において、突上げツールがツール装着部に装着されたことを確認できるため、突上げツールが未装着のままで、ダイのピッキング作業が開始されることが防止される。 According to this configuration, during the tool mounting operation, it can be confirmed that the push-up tool is attached to the tool mounting section, so it is possible to prevent the die picking operation from starting without the push-up tool being attached. Ru.
　また、上記の部品突上げ装置においては、前記ツール装着動作の実行後に、前記突上げツールにおける前記吸着面を撮像する撮像部をさらに備え、前記制御部は、前記撮像部が撮像した前記吸着面の画像から前記突上げピンを認識し、この認識結果に基づき、前記突上げツールに備えられた突上げピンの適否を判定するように構成されていてもよい。 The above-mentioned component lifting device further includes an imaging section that images the suction surface of the thrusting tool after the tool mounting operation is performed, and the control section is configured to control the suction surface imaged by the imaging section. The push-up pin may be recognized from the image, and based on the recognition result, the suitability of the push-up pin provided in the push-up tool may be determined.
　この構成によれば、突上げツールに備えられる突上げピンの適否、すなわち突上げピンの数や配置などの判定が自動化される。そのため、不適当な突上げピンを備えた突上げツールが装着されたままで、ダイのピッキング作業が開始されることが防止される。 According to this configuration, the suitability of the push-up pins provided in the push-up tool, that is, the determination of the number and arrangement of the push-up pins, etc., is automated. This prevents the die picking operation from starting with a push-up tool equipped with an inappropriate push-up pin still attached.
　また、上記の部品突上げ装置においては、前記ツール装着動作後、前記突上げヘッドに装着された前記突上げツールの高さを検知可能な情報を取得する取得部をさらに備え、前記制御部は、前記取得部が取得した情報に基づき前記突上げツールの装着状態の良否を判定するように構成されていてもよい。 The above-mentioned component lifting device further includes an acquisition unit that acquires information capable of detecting the height of the lifting tool mounted on the lifting head after the tool mounting operation, and the control unit , it may be configured to determine whether the mounting state of the push-up tool is good or bad based on the information acquired by the acquisition unit.
　この構成によれば、ツール装着部に対して突上げツールが浮いている状態など、ツール装着部に対して突上げツールが不完全な装着状態である場合に、そのままの状態でダイのピッキング作業が開始されることを防止することが可能となる。 According to this configuration, when the push-up tool is in an incompletely attached state to the tool mounting part, such as when the push-up tool is floating relative to the tool mounting part, the die picking operation can be carried out in that state. It is possible to prevent this from starting.
　この場合、前記制御部は、前記ツールの装着状態が良好でないと判定した場合には、前記保持部材により当該突上げツールを保持した状態で前記保持部材を一旦上昇させて下降させるリトライ動作を実行するようにしてもよい。 In this case, if the control unit determines that the attachment state of the tool is not good, the control unit executes a retry operation of raising and lowering the holding member while holding the push-up tool by the holding member. You may also do so.
　この構成によれば、突上げツールの不完全な装着状態が検知された場合に、オペレータによる手作業に依存することなく、当該不完全な装着状態を修正することが可能となる。 According to this configuration, when an incompletely installed state of the push-up tool is detected, it becomes possible to correct the incompletely installed state without relying on manual work by an operator.
　なお、上記の部品突上げ装置においては、前記ツール保管テーブルに支持されている前記複数の突上げツールのなかに、装着対象の突上げツールが無い場合に、エラー報知を行う報知部をさらに備えていてもよい。 The above-mentioned component lifting device further includes a notification unit that notifies an error when there is no lifting tool to be mounted among the plurality of lifting tools supported on the tool storage table. You can leave it there.
　この構成によれば、装着対象の突上げツールが無いことをオペレータに報知して、所望の突上げツールを速やかにツール保管テーブルに配置することが可能となる。 According to this configuration, it is possible to inform the operator that there is no push-up tool to be installed, and to promptly arrange the desired push-up tool on the tool storage table.
　なお、本発明の一局面に係る部品実装装置は、ダイシングされてウェハシートに貼着された状態のウェハが配置される部品供給部と、前記部品供給部に配置されたウェハからダイをピッキングして移送するヘッドと、前記ヘッドによるダイのピッキングの際に、前記ウェハシートの下方から前記ダイを突き上げる、上記の何れか一の部品突上げ装置と、を備える。 Note that the component mounting apparatus according to one aspect of the present invention includes a component supply section in which diced wafers are placed and attached to a wafer sheet, and a component mounting device that picks dies from the wafers placed in the component supply section. and a component lifting device as described above, which pushes up the die from below the wafer sheet when the head picks the die.
　この部品実装装置の構成によれば、既述のような部品突上げ装置を備えているため、簡単な機構及び制御で、突上げツールの交換作業を自動化することが可能となる。 According to the configuration of this component mounting apparatus, since it is equipped with the component push-up device as described above, it becomes possible to automate the replacement work of the push-up tool with a simple mechanism and control.

Claims (10)

  1. 　ウェハシートに貼着されたウェハの下方からダイを突上げることにより、当該ダイを前記ウェハシートから剥離させる部品突上げ装置であって、
    　前記ウェハシートの下面を負圧吸着する吸着面、及び前記吸着面からウェハシート側に出没可能に設けられた突上げピンを各々備えた複数の突上げツールと、
    　前記複数の突上げツールが選択的にかつ上下方向に着脱可能に装着されるツール装着部を備え、前記ウェハシートに対して、当該ウェハシートに沿った方向及び上下方向に相対的に移動可能な突上げヘッドと、
    　前記複数の突上げツールの各々を、前記ツール装着部への装着状態と同じ姿勢で支持可能なツール保管テーブルと、
    　前記突上げツールを保持可能な保持部材を備え、前記突上げツールを保持した状態で前記保持部材を上下方向及び水平方向に移動させることにより、前記突上げヘッドと前記ツール保管テーブルとの間で前記突上げツールを移送するツール移送機構と、
    　前記突上げヘッド及び前記ツール移送機構を制御することにより、前記保持部材により前記ツール装着部に装着されている前記突上げツールを取り外して前記ツール保管テーブルに返却するツール返却動作、及び／又は、前記ツール保管テーブルに支持されている前記突上げツールを、前記保持部材により保持して前記ツール装着部に装着するツール装着動作を実行する制御部と、を備えている、ことを特徴とする部品突上げ装置。     A component pushing-up device that peels the die from the wafer sheet by pushing up the die from below a wafer attached to the wafer sheet,
    a plurality of push-up tools each including a suction surface that suctions a lower surface of the wafer sheet under negative pressure, and a push-up pin that is provided so as to be able to protrude and retract from the suction surface toward the wafer sheet;
    The tool mounting part includes a tool mounting part on which the plurality of push-up tools are selectively and removably mounted in the vertical direction, and is movable relative to the wafer sheet in the direction along the wafer sheet and in the vertical direction. A thrusting head,
    a tool storage table capable of supporting each of the plurality of push-up tools in the same posture as the one mounted on the tool mounting section;
    A holding member capable of holding the push-up tool is provided, and by moving the holding member vertically and horizontally while holding the push-up tool, the push-up head is moved between the push-up head and the tool storage table. a tool transfer mechanism that transfers the push-up tool;
    A tool return operation of removing the thrusting tool mounted on the tool mounting part by the holding member and returning it to the tool storage table by controlling the thrusting head and the tool transfer mechanism, and/or A component characterized by comprising: a control section that executes a tool mounting operation of holding the push-up tool supported by the tool storage table by the holding member and mounting it on the tool mounting section. Thrust-up device.
  2. 　請求項１に記載の部品突上げ装置において、
    　前記複数の突上げツールの各々は、各々の識別情報が記録された記録部を備え、
    　当該部品突上げ装置は、前記ツール保管テーブルに支持されている前記突上げツールの前記情報記録部に記録された識別情報を読み取り可能な第１読み取り部と、
    　前記各突上げツールに関する情報であるツール情報が記憶される記憶部と、をさらに備え、
    　前記ツール情報は、前記ダイの品種と当該品種に用いる突上げツールとの対応関係を定めた情報を含み、
    　前記制御部は、前記ツール情報と前記第１読み取り部が読み取った識別情報とに基づき、前記ツール保管テーブルに支持されている前記複数の突上げツールのうちから装着対象の突上げツールを特定して前記ツール装着動作を実行する、ことを特徴とする部品突上げ装置。     The component thrusting device according to claim 1,
    Each of the plurality of push-up tools includes a recording section in which respective identification information is recorded,
    The component pushing-up device includes a first reading unit capable of reading identification information recorded in the information recording unit of the pushing-up tool supported on the tool storage table;
    further comprising a storage unit in which tool information that is information regarding each of the uplift tools is stored;
    The tool information includes information that defines a correspondence relationship between the die type and the push-up tool used for the die type,
    The control unit identifies a push-up tool to be mounted from among the plurality of push-up tools supported on the tool storage table based on the tool information and identification information read by the first reading unit. A component pushing-up device, characterized in that the tool mounting operation is carried out by using a push-up device.
  3. 　請求項２に記載の部品突上げ装置において、
    　前記ツール装着動作の実行時、前記ツール保管テーブルに支持されている前記突上げツールが前記保持部材に保持される保持位置から当該突上げツールが前記ツール装着部に装着される位置までの当該突上げツールの移動経路内の何れかの位置で、前記識別情報を読み取り可能な第２読み取り部がさらに設けられている、ことを特徴とする部品突上げ装置。     The component lifting device according to claim 2,
    When performing the tool mounting operation, the pushing up tool is moved from a holding position where the pushing up tool supported on the tool storage table is held by the holding member to a position where the pushing up tool is mounted on the tool mounting section. A component lifting device, further comprising a second reading section capable of reading the identification information at any position within the moving path of the lifting tool.
  4. 　請求項３に記載の部品突上げ装置において、
    　前記第１読み取り部及び前記第２読み取り部として共通の読み取り部を備え、
    　当該共通の読取り部は、前記ツール保管テーブルに対して相対的に移動可能に設けられ、前記保持位置に配置される前記突上げツールの前記識別情報を読み取る、ことを特徴とする部品突上げ装置。     The component thrusting device according to claim 3,
    A common reading section is provided as the first reading section and the second reading section,
    The component pushing-up device is characterized in that the common reading section is provided movably relative to the tool storage table and reads the identification information of the pushing-up tool placed at the holding position. .
  5. 　請求項１乃至４の何れか一項に記載の部品突上げ装置において、
    　前記ツール装着部に前記突上げツールが装着されているときに当該突上げツールを検出するセンサを備え、
    　前記制御部は、前記ツール装着動作の実行後、前記センサによる前記突上げツールの検知の有無に基づき、当該突上げツールが前記ツール装着部に装着されたか否かを判定する、ことを特徴とする部品突上げ装置。     The component thrusting device according to any one of claims 1 to 4,
    comprising a sensor that detects the push-up tool when the push-up tool is attached to the tool mounting part,
    The control unit is characterized in that, after performing the tool mounting operation, the control unit determines whether or not the push-up tool is mounted on the tool mounting portion based on whether the push-up tool is detected by the sensor. Parts lifting device.
  6. 　請求項１乃至５の何れか一項に記載の部品突上げ装置において、
    　前記ツール装着動作の実行後に、前記突上げツールにおける前記吸着面を撮像する撮像部をさらに備え、
    　前記制御部は、前記撮像部が撮像した前記吸着面の画像から前記突上げピンを認識し、この認識結果に基づき、前記突上げツールに備えられた突上げピンの適否を判定する、ことを特徴とする部品突上げ装置。     The component thrusting device according to any one of claims 1 to 5,
    further comprising an imaging unit that images the suction surface of the push-up tool after performing the tool mounting operation,
    The control unit recognizes the push-up pin from the image of the suction surface taken by the imaging unit, and determines whether or not the push-up pin provided in the push-up tool is appropriate based on the recognition result. Characteristic parts lifting device.
  7. 　請求項１乃至５の何れか一項に記載の部品突上げ装置において、
    　前記ツール装着動作後、前記突上げヘッドに装着された前記突上げツールの高さを検知可能な情報を取得する取得部をさらに備え、
    　前記制御部は、前記取得部が取得した情報に基づき前記突上げツールの装着状態の良否を判定する、ことを特徴とする部品突上げ装置。     The component thrusting device according to any one of claims 1 to 5,
    After the tool mounting operation, the method further includes an acquisition unit that acquires information that allows detection of the height of the uplift tool attached to the upthrust head,
    The device for pushing up parts, wherein the control section determines whether the mounting state of the pushing up tool is good or bad based on the information acquired by the acquisition section.
  8. 　請求項９に記載の部品突上げ装置において、
    　前記制御部は、前記ツールの装着状態が良好でないと判定した場合には、前記保持部材により当該突上げツールを保持した状態で前記保持部材を一旦上昇させて下降させるリトライ動作を実行する、ことを特徴とする部品突上げ装置。     The component thrusting device according to claim 9,
    When the control unit determines that the mounting state of the tool is not good, the control unit executes a retry operation in which the holding member is temporarily raised and then lowered while the holding member holds the push-up tool. A parts lifting device featuring:
  9. 　請求項２乃至４の何れか一項に記載の部品突上げ装置において、
    　前記ツール保管テーブルに支持されている前記複数の突上げツールのなかに、装着対象の突上げツールが無い場合に、エラー報知を行う報知部をさらに備える、ことを特徴とする部品突上げ装置。     The component thrusting device according to any one of claims 2 to 4,
    The device for lifting up a component, further comprising: a notification unit configured to notify an error when there is no uplifting tool to be mounted among the plurality of uplifting tools supported on the tool storage table.
  10. 　ダイシングされてウェハシートに貼着された状態のウェハが配置される部品供給部と、
    　前記部品供給部に配置されたウェハからダイをピッキングして移送するヘッドと、
    　前記ヘッドによるダイのピッキングの際に、前記ウェハシートの下方から前記ダイを突き上げる、請求項１～９の何れか一項に記載の部品突上げ装置と、を備える、部品実装装置。     a parts supply unit in which diced wafers are placed and adhered to wafer sheets;
    a head that picks and transfers dies from a wafer placed in the component supply section;
    10. A component mounting device comprising: a component pushing device according to claim 1, which pushes up the die from below the wafer sheet when the head picks the die.
PCT/JP2022/019281 2022-04-28 2022-04-28 Component push-up device and component mounting device WO2023209950A1 (en)

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JP2013172122A (en) * 2012-02-23 2013-09-02 Hitachi High-Tech Instruments Co Ltd Die bonder
JP2013247314A (en) * 2012-05-29 2013-12-09 Fuji Mach Mfg Co Ltd Push-up height measuring system
WO2014083606A1 (en) * 2012-11-27 2014-06-05 富士機械製造株式会社 Die supply device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135431A (en) * 2006-11-27 2008-06-12 Matsushita Electric Ind Co Ltd Electronic component packaging apparatus, and method of reading/writing information on rf tag for the same
JP2012069733A (en) * 2010-09-24 2012-04-05 Hitachi High-Tech Instruments Co Ltd Tooling management method of die bonder, and die bonder
JP2012156413A (en) * 2011-01-28 2012-08-16 Fuji Mach Mfg Co Ltd Die supply device
JP2013105773A (en) * 2011-11-10 2013-05-30 Fuji Mach Mfg Co Ltd Die pushing-up operation management system
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