WO2023097727A1 - 柔性双面显示屏及其制作方法 - Google Patents

柔性双面显示屏及其制作方法 Download PDF

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Publication number
WO2023097727A1
WO2023097727A1 PCT/CN2021/136690 CN2021136690W WO2023097727A1 WO 2023097727 A1 WO2023097727 A1 WO 2023097727A1 CN 2021136690 W CN2021136690 W CN 2021136690W WO 2023097727 A1 WO2023097727 A1 WO 2023097727A1
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Prior art keywords
light
flexible
display devices
manufacturing
display
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PCT/CN2021/136690
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English (en)
French (fr)
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胡小波
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深圳市华星光电半导体显示技术有限公司
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Priority to US17/620,673 priority Critical patent/US20240047628A1/en
Publication of WO2023097727A1 publication Critical patent/WO2023097727A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/128—Active-matrix OLED [AMOLED] displays comprising two independent displays, e.g. for emitting information from two major sides of the display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/176—Passive-matrix OLED displays comprising two independent displays, e.g. for emitting information from two major sides of the display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs

Definitions

  • the present application relates to the technical field of display screens, in particular to a flexible double-sided display screen and a manufacturing method thereof.
  • double-sided display is required in some scenarios, so that people can not only view the displayed content from the front of the display screen, but also view the displayed content from the back of the display screen.
  • two display screens are usually bonded together to form a double-sided display screen, but this solution is costly and thick, and the double-sided display screen is not flexible, so it cannot adapt to thinning and flexibility the trend of.
  • the present application provides a flexible double-sided display screen and a manufacturing method thereof, so as to solve the problem that the double-sided display screen in the prior art is relatively thick and has no flexibility.
  • the embodiment of the present application provides a method for manufacturing a flexible double-sided display, including:
  • Two display devices are provided, and the display devices include a first support plate, a flexible substrate disposed on the first support plate, a light emitting device layer disposed on the flexible substrate, and a light emitting device layer disposed on the flexible substrate and the flexible substrate.
  • the manufacturing method before laminating the flexible substrates of the two display devices, the manufacturing method further includes:
  • the light emitting device layer includes a plurality of mini light emitting diode chips.
  • the plurality of mini LED chips in the two display devices are arranged in a mirror image.
  • the light-emitting device layer includes a plurality of sub-light-emitting devices arranged at intervals, and the sub-light-emitting devices include an anode layer, a cathode layer, and a layer formed between the anode layer and the A layer of organic light-emitting material between the cathode layers.
  • a plurality of the sub-light-emitting devices in the two display devices are arranged in a mirror image.
  • the bonding of the flexible substrates of the two display devices includes:
  • the peeling off the first support plate of the two display devices includes:
  • the first support plates of the two display devices are peeled off by using a laser lift-off process.
  • the peeling off the second support plate of the two display devices includes:
  • the second support plates of the two display devices are peeled off by using a laser lift-off process.
  • the embodiment of the present application also provides a flexible double-sided display screen, including: two display devices;
  • the display device includes a flexible substrate, a light emitting device layer disposed on the flexible substrate, and an encapsulation layer disposed on the flexible substrate and the light emitting device layer;
  • the flexible substrates of the two display devices are attached to each other.
  • the embodiment of the present application also provides a method for manufacturing a flexible double-sided display, including:
  • Two display devices are provided, and the display devices include a first support plate, a flexible substrate disposed on the first support plate, a light emitting device layer disposed on the flexible substrate, and a light emitting device layer disposed on the flexible substrate and the flexible substrate.
  • the second support plates of the two display devices are peeled off by using a laser lift-off process.
  • the manufacturing method before laminating the flexible substrates of the two display devices, the manufacturing method further includes:
  • the light emitting device layer includes a plurality of mini light emitting diode chips.
  • the plurality of mini LED chips in the two display devices are arranged in a mirror image.
  • the flexible substrate further has a plurality of light-shielding layers, and the plurality of light-shielding layers are respectively located directly under the plurality of mini light-emitting diode chips.
  • the light-emitting device layer includes a plurality of sub-light-emitting devices arranged at intervals, and the sub-light-emitting devices include an anode layer, a cathode layer, and a layer formed between the anode layer and the A layer of organic light-emitting material between the cathode layers.
  • a plurality of the sub-light-emitting devices in the two display devices are arranged in a mirror image.
  • the flexible substrate further has a plurality of light-shielding layers, and the plurality of light-shielding layers are respectively located directly under the plurality of sub-light-emitting devices.
  • the manufacturing method of the flexible double-sided display screen is to bond two second support plates on the encapsulation layers of the two display devices respectively, and then peel off the first support plates of the two display devices. plate to expose the flexible substrate, at this time, the rigid second support plate can support the display device, so as to bond the flexible substrates of the two display devices, and finally peel off the second support plate of the two display devices, that is A flexible double-sided display can be formed.
  • the flexible double-sided display screen does not have the first support plate and the second support plate, so it can have flexible characteristics, and reduce the thickness and cost of the flexible double-sided display screen.
  • Fig. 1 is a flowchart of a method for manufacturing a flexible double-sided display screen provided by an embodiment of the present application
  • Fig. 2 is a schematic diagram of a method for manufacturing a flexible double-sided display screen provided by an embodiment of the present application
  • Fig. 3 is a schematic diagram of a manufacturing method of a flexible double-sided display screen provided by another embodiment of the present application.
  • Fig. 4 is a schematic diagram of a flexible double-sided display screen provided by an embodiment of the present application.
  • Fig. 5 is a schematic diagram of a flexible double-sided display screen provided by another embodiment of the present application.
  • first and second are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • a feature defined as “first” or “second” may explicitly or implicitly include one or more of said features.
  • “plurality” means two or more, unless otherwise specifically defined.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.
  • a first feature being "on” or “under” a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them.
  • “above”, “above” and “above” the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.
  • “Below”, “beneath” and “under” the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
  • the embodiment of the present application provides a method for manufacturing a flexible double-sided display screen, including:
  • Step S1 providing two display devices 1, the display device 1 includes a first support plate 11, a flexible substrate 12 disposed on the first support plate 11, a light emitting device layer 13 disposed on the flexible substrate 12, and a light emitting device layer 13 disposed on the flexible substrate 12 and the encapsulation layer 14 on the light emitting device layer 13;
  • Step S2 laminating two second support plates 15 on the encapsulation layers 14 of the two display devices 1 respectively;
  • Step S3 peeling off the first support plates 11 of the two display devices 1;
  • Step S4 laminating the flexible substrates 12 of the two display devices 1;
  • Step S5 peeling off the second support plates 15 of the two display devices 1 .
  • the display device 1 provided in step S1 has already completed the fabrication of the light-emitting device layer 13 , and the two display devices 1 can be laminated to form a flexible double-sided display screen.
  • the rigid first support plate 11 can support the display device 1, so that two second support plates 15 can be respectively bonded on the packaging layer 14 of the two display devices 1, and then Peel off the first support plate 11 of the two display devices 1 to expose the flexible substrate 12, at this time, the rigid second support plate 15 can support the display device 1, so that the flexible substrate 12 of the two display devices 1 bonding, and finally peeling off the second support plate 15 of the two display devices 1 to form a flexible double-sided display screen.
  • the flexible double-sided display does not have the first support plate 11 and the second support plate 15, so it can have a flexible property and reduce the thickness and cost of the flexible double-sided display.
  • each display device 1 is the direction away from the flexible substrate 12, that is, each display device 1 emits light in a direction away from the flexible substrate 12.
  • the light emitting directions of the two display devices 1 can be arranged opposite to each other to realize double-sided display.
  • the embodiment of the present application does not specifically limit the application of flexible double-sided display screens, which can be televisions, notebook computers, tablet computers, wearable display devices (such as smart bracelets, smart watches, etc.), mobile phones, virtual reality devices, Augmented reality equipment, vehicle displays, advertising light boxes and any other products or components with display functions.
  • flexible double-sided display screens which can be televisions, notebook computers, tablet computers, wearable display devices (such as smart bracelets, smart watches, etc.), mobile phones, virtual reality devices, Augmented reality equipment, vehicle displays, advertising light boxes and any other products or components with display functions.
  • the material of the first support plate 11 and the second support plate 15 may be glass.
  • the first support plate 11 and the second support plate 15 can also be made of other rigid materials, which is not limited in this application.
  • the material of the encapsulation layer 14 is silica gel, so that the encapsulation layer 14 has a high light transmittance and a good ability to isolate water and oxygen, which can effectively prevent external water vapor from invading the light-emitting device layer 13, and improve the light-emitting device layer 13. service life, and at the same time, the light-transmitting material will not cause light loss in the light-emitting device layer 13 .
  • the flexible substrate 12 may include a flexible substrate and a thin film transistor circuit disposed on the flexible substrate.
  • the flexible substrate can be a polydimethylsiloxane substrate or a polyimide substrate, so that the flexible substrate has good flexibility and can realize flexible bending of the display device 1 .
  • the flexible substrate may also be made of other materials, which is not limited in this application.
  • the thin film transistor circuit may include several thin film transistor units, and the thin film transistor units include P-type low-temperature polysilicon thin film transistors or N-type low-temperature polysilicon thin film transistors.
  • the thin film transistor circuit also includes a plurality of scanning lines extending along the row direction, a plurality of single-ended signal lines and a plurality of data lines extending along the column direction, and the plurality of scanning lines and the plurality of data lines are mutually insulated and intersected.
  • the thin film transistor unit includes a gate, a source and a drain, wherein the gate of the thin film transistor unit is connected to the scan line, the source of the thin film transistor is connected to the data line, and a plurality of single-ended signal lines are insulated from the scan line and the data line .
  • the thin film transistor unit may be connected with the light emitting device layer 13 to control the light emitting device layer 13 .
  • the manufacturing method before laminating the flexible substrates 12 of the two display devices 1 in step S4, the manufacturing method further includes: making at least one alignment mark on the two second support plates 15 respectively, The alignment marks of the two support plates 15 are aligned, so that the lamination accuracy of the flexible substrates 12 of the two display devices 1 can be improved, and the display areas of the two display devices 1 can be correspondingly arranged as mirror images, and the two display devices can also be arranged in a mirror image.
  • the non-display area of the display device 1 is correspondingly arranged in a mirror image to improve the transmittance of the flexible double-sided display screen.
  • the light emitting device layer 13 includes a plurality of mini light emitting diode (Mini-LED) chips 131 . That is, the display device 1 can be a Mini-LED display device, and then the flexible double-sided display screen of the present application is a flexible double-sided Mini-LED display screen.
  • the mini light-emitting diode shrinks the size of the traditional LED chip to 100-300um, and has the advantages of high brightness, good luminous efficiency, and thinness, so that the flexible double-sided display screen of this application has the advantages of flexibility, bendability, double-sided display, and high brightness. , good luminous efficiency and light and thin.
  • a plurality of mini LED chips 131 may be arranged in an array.
  • the plurality of mini LED chips 131 may include red mini LED chips that emit red light, green mini LED chips that emit green light, and blue mini LED chips that emit blue light.
  • a red mini LED chip, a green mini LED chip and a blue mini LED chip can form a pixel unit to realize full-color display of the flexible double-sided display and improve the display quality of the flexible double-sided display.
  • the number of the above thin film transistor units can be the same as the number of mini light emitting diode chips 131, and each thin film transistor unit is connected to a mini light emitting diode chip 131, so as to achieve the purpose of controlling a single mini light emitting diode chip 131, and can realize the Shaded display.
  • the multiple mini LED chips 131 in the two display devices 1 are arranged in a mirror image. That is, the multiple mini LED chips 131 in the first display device 1 are arranged in a mirror image with the multiple mini LED chips 131 in the second display device 1 along the bonding positions of the flexible substrates 12 of the two display devices 1 , then the gap between two adjacent mini light-emitting diode chips 131 in the first display device 1 is also along the bonding position of the flexible substrate 12 of the two display devices 1, and the gap between the adjacent mini LED chips 131 in the second display device 1
  • the gap between the two mini light-emitting diode chips 131 is set as a mirror image, and the flexible substrate 12 can be light-transmissive, thereby improving the transmittance of the flexible double-sided display, making the transmittance of the flexible double-sided display equal to that of traditional The transmittance of the single-sided display to improve the product quality of the flexible double-sided display.
  • the flexible substrate 12 of the display device 1 also has a plurality of light-shielding layers 121, and the plurality of light-shielding layers 121 are respectively located on a plurality of mini LED chips.
  • a shading layer 121 can block at least one mini LED chip 131, and the orthographic projection of each mini LED chip 131 on the flexible substrate 12 overlaps with the orthographic projection of a shading layer 121 on the flexible substrate 12 .
  • there is a light-shielding layer 121 between the mini LED chips 131 in the two display devices 1 so as to prevent the light from the two display devices 1 from interfering with each other to reduce the display effect.
  • the light emitting device layer 13 includes a plurality of sub-light emitting devices 132 arranged at intervals, and the sub-light emitting devices 132 include an anode layer, a cathode layer, and an organic light-emitting material formed between the anode layer and the cathode layer. layer.
  • the display device 1 may be an OLED (organic light-emitting) display device, and the flexible double-sided display screen of the present application is a flexible double-sided OLED display screen.
  • the OLED display device 1 has many advantages such as self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, nearly 180° viewing angle, wide operating temperature range and large-area full-color display, etc., making the present application
  • the flexible double-sided display screen has flexible and bendable, double-sided display and many advantages mentioned above.
  • the material of the anode layer may be indium tin oxide (ITO) or a stack of indium tin oxide/silver/indium tin oxide (ITO/Ag/ITO).
  • the organic luminescent material layer includes a hole injection layer arranged on the anode, a hole transport layer placed on the hole injection layer, a light emitting layer placed on the hole transport layer, an electron transport layer placed on the light emitting layer, and An electron injection layer placed on the electron transport layer.
  • the material of the cathode layer may be metal materials such as silver (Ag), gold (Au), aluminum (Al) or titanium (Ti).
  • a plurality of sub-light emitting devices 132 may be arranged in an array.
  • a pixel definition layer 6 may also be disposed on the flexible substrate 12, and the pixel definition layer 6 has multiple pixel definition regions, and each sub-light-emitting device 132 is located in a pixel definition region.
  • the number of TFT units mentioned above may be the same as the number of sub-light emitting devices 132, and each TFT unit is connected to one sub-light-emitting device 132 to achieve the purpose of controlling a single sub-light-emitting device 132, and realize bright and dark display per unit area.
  • the plurality of sub-light-emitting devices 132 in the two display devices 1 are arranged in a mirror image. That is, the multiple sub-light-emitting devices 132 in the first display device 1 are arranged in a mirror image with the multiple sub-light-emitting devices 132 in the second display device 1 along the bonding positions of the flexible substrates 12 of the two display devices 1, then the first The gap between two adjacent sub-light-emitting devices 132 in the first display device 1 is also along the bonding position of the flexible substrate 12 of the two display devices 1, and the gap between the adjacent two sub-light-emitting devices 132 in the second display device 1 The gap between them is set as a mirror image, and the flexible substrate 12 can be transparent, thereby improving the transmittance of the flexible double-sided display, so that the transmittance of the flexible double-sided display is equivalent to that of the traditional single-sided display. rate to improve the product quality of flexible double-sided displays.
  • the flexible substrate 12 of the display device 1 since the flexible substrate 12 is light-transmitting, the flexible substrate 12 of the display device 1 also has a plurality of light-shielding layers 121 , and the plurality of light-shielding layers 121 are respectively located on the sides of the plurality of sub-light-emitting devices 132.
  • a light-shielding layer 121 can block a sub-light-emitting device 132 , and the orthographic projection of each sub-light-emitting device 132 on the flexible substrate 12 overlaps with the orthographic projection of a light-shielding layer 121 on the flexible substrate 12 .
  • step S4 bonding the flexible substrates 12 of the two display devices 1 includes: bonding the flexible substrates 12 of the two display devices 1 with optical glue 16 .
  • the optical adhesive 16 has a high transmittance (above 95%), so as to increase the transmittance of the flexible double-sided display to improve the product quality of the flexible double-sided display.
  • the flexible substrates 12 of the two display devices 1 can also be bonded by other adhesive materials, such as heat-sensitive adhesive, which is not limited in this application.
  • peeling off the first support plates 11 of the two display devices 1 includes: peeling off the first support plates 11 of the two display devices 1 by using a laser lift-off process.
  • the laser lift-off process is to irradiate between the first support plate 11 and the flexible substrate 12 with pulsed laser, ablate the first support plate 11 and/or the flexible substrate 12, and peel the first support plate 11 and the flexible substrate 12.
  • the laser lift-off technology has the characteristics of high energy input efficiency and small device damage, which reduces damage to the flexible substrate 12 .
  • peeling off the second support plates 15 of the two display devices 1 includes: peeling off the second support plates 15 of the two display devices 1 by using a laser lift-off process.
  • the laser lift-off process is to irradiate between the second support plate 15 and the encapsulation layer 14 with a pulsed laser, ablate the second support plate 15 and/or the encapsulation layer 14, and peel the second support plate 15 from the encapsulation layer 14.
  • the laser lift-off technology has the characteristics of high energy input efficiency and small device damage, which reduces damage to the encapsulation layer 14 .
  • the embodiment of the present application also provides a flexible double-sided display screen, including: two display devices 1;
  • the display device 1 includes a flexible substrate 12, a light emitting device layer 13 disposed on the flexible substrate 12, and an encapsulation layer 14 disposed on the flexible substrate 12 and the light emitting device layer 13;
  • the flexible substrates 12 of the two display devices 1 are attached to each other.
  • the flexible double-sided display does not have the first support plate 11 and the second support plate 15, so that it can have a flexible property and reduce the thickness and cost of the flexible double-sided display.
  • the light output direction of each display device 1 is the direction away from the flexible substrate 12, that is, each display device 1 emits light in a direction away from the flexible substrate 12.
  • the light emitting directions of the two display devices 1 can be arranged opposite to each other to realize double-sided display.
  • the flexible substrates 12 of the two display devices 1 can be bonded together using optical glue 16 .
  • the optical adhesive 16 has a high transmittance (above 95%), so as to increase the transmittance of the flexible double-sided display to improve the product quality of the flexible double-sided display.
  • the flexible substrates 12 of the two display devices 1 can also be bonded by other adhesive materials, such as heat-sensitive adhesive, which is not limited in this application.
  • each embodiment has their own emphases, and for parts not described in detail in a certain embodiment, reference may be made to relevant descriptions of other embodiments.
  • each of the above units or structures can be implemented as an independent entity, or can be combined arbitrarily as the same or several entities.

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Abstract

一种柔性双面显示屏及其制作方法，通过在两个显示器件（1）的封装层（14）上分别贴合两个第二支撑板（15），再剥离两个显示器件（1）的第一支撑板（11），以暴露出柔性基板（12），此时，刚性的第二支撑板（15）可以支撑住显示器件（1），以便于将两个显示器件（1）的柔性基板（12）进行贴合，最后剥离两个显示器件（1）的第二支撑板（15），即可形成柔性双面显示屏。这种柔性双面显示屏不具有第一支撑板（11）和第二支撑板（15），从而可以具有柔性特性，且降低柔性双面显示屏的厚度和成本。

Description

柔性双面显示屏及其制作方法 技术领域
本申请涉及显示屏技术领域，尤其涉及一种柔性双面显示屏及其制作方法。
背景技术
传统的显示屏应用于商业显示领域中时，在部分场景中需要进行双面显示，使人们不仅可以从显示屏的正面观看显示的内容，还可以从显示屏的背面观看显示的内容。现有技术通常是将两个显示屏贴合在一起，形成双面显示屏，但此方案成本较高、厚度较厚，且双面显示屏也不具有柔性特性，无法适应薄型化和柔性化的趋势。
技术问题
本申请提供一种柔性双面显示屏及其制作方法，以解决现有技术的双面显示屏厚度较厚且不具有柔性特性的问题。
技术解决方案
第一方面，本申请实施例提供一种柔性双面显示屏的制作方法，包括：
提供两个显示器件，所述显示器件包括第一支撑板、设于所述第一支撑板上的柔性基板、设于所述柔性基板上的发光器件层，及设于所述柔性基板和所述发光器件层上的封装层；
在两个所述显示器件的所述封装层上分别贴合两个第二支撑板；
剥离两个所述显示器件的所述第一支撑板；
将两个所述显示器件的所述柔性基板进行贴合；
剥离两个所述显示器件的所述第二支撑板。
在所述的柔性双面显示屏的制作方法中，所述将两个所述显示器件的所述柔性基板进行贴合之前，所述制作方法还包括：
分别在两个所述第二支撑板上制作至少一个对位标记；
将两个所述第二支撑板的对位标记进行对位。
在所述的柔性双面显示屏的制作方法中，所述发光器件层包括多个迷你发 光二极管芯片。
在所述的柔性双面显示屏的制作方法中，两个所述显示器件中的多个所述迷你发光二极管芯片呈镜像设置。
在所述的柔性双面显示屏的制作方法中，所述发光器件层包括多个间隔设置的子发光器件，所述子发光器件包括阳极层、阴极层及形成于所述阳极层和所述阴极层之间的有机发光材料层。
在所述的柔性双面显示屏的制作方法中，两个所述显示器件中的多个所述子发光器件呈镜像设置。
在所述的柔性双面显示屏的制作方法中，所述将两个所述显示器件的所述柔性基板进行贴合，包括：
采用光学胶贴合两个所述显示器件的所述柔性基板。
在所述的柔性双面显示屏的制作方法中，所述剥离两个所述显示器件的所述第一支撑板，包括：
采用激光剥离工艺剥离两个所述显示器件的所述第一支撑板。
在所述的柔性双面显示屏的制作方法中，所述剥离两个所述显示器件的所述第二支撑板，包括：
采用激光剥离工艺剥离两个所述显示器件的所述第二支撑板。
第二方面，本申请实施例还提供一种柔性双面显示屏，包括：两个显示器件；
所述显示器件包括柔性基板、设于所述柔性基板上的发光器件层，及设于所述柔性基板和所述发光器件层上的封装层；
两个所述显示器件的所述柔性基板相互贴合。
第三方面，本申请实施例还提供一种柔性双面显示屏的制作方法，包括：
提供两个显示器件，所述显示器件包括第一支撑板、设于所述第一支撑板上的柔性基板、设于所述柔性基板上的发光器件层，及设于所述柔性基板和所述发光器件层上的封装层；
在两个所述显示器件的所述封装层上分别贴合两个第二支撑板；
采用激光剥离工艺剥离两个所述显示器件的所述第一支撑板；
将两个所述显示器件的所述柔性基板进行贴合；
采用激光剥离工艺剥离两个所述显示器件的所述第二支撑板。
在所述的柔性双面显示屏的制作方法中，所述将两个所述显示器件的所述柔性基板进行贴合之前，所述制作方法还包括：
分别在两个所述第二支撑板上制作至少一个对位标记；
将两个所述第二支撑板的对位标记进行对位。
在所述的柔性双面显示屏的制作方法中，所述发光器件层包括多个迷你发光二极管芯片。
在所述的柔性双面显示屏的制作方法中，两个所述显示器件中的多个所述迷你发光二极管芯片呈镜像设置。
在所述的柔性双面显示屏的制作方法中，所述柔性基板中还具有多个遮光层，多个所述遮光层分别位于多个所述迷你发光二极管芯片的正下方。
在所述的柔性双面显示屏的制作方法中，所述发光器件层包括多个间隔设置的子发光器件，所述子发光器件包括阳极层、阴极层及形成于所述阳极层和所述阴极层之间的有机发光材料层。
在所述的柔性双面显示屏的制作方法中，两个所述显示器件中的多个所述子发光器件呈镜像设置。
在所述的柔性双面显示屏的制作方法中，所述柔性基板中还具有多个遮光层，多个所述遮光层分别位于多个所述子发光器件的正下方。
有益效果
相较于现有技术，本申请提供的柔性双面显示屏的制作方法，通过在两个显示器件的封装层上分别贴合两个第二支撑板，再剥离两个显示器件的第一支撑板，以暴露出柔性基板，此时，刚性的第二支撑板可以支撑住显示器件，以便于将两个显示器件的柔性基板进行贴合，最后剥离两个显示器件的第二支撑板，即可形成柔性双面显示屏。该柔性双面显示屏不具有第一支撑板和第二支撑板，从而可以具有柔性特性，且降低柔性双面显示屏的厚度和成本。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明 的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请一实施例提供的柔性双面显示屏的制作方法的流程图；
图2是本申请一实施例提供的柔性双面显示屏的制作方法的示意图；
图3是本申请另一实施例提供的柔性双面显示屏的制作方法的示意图；
图4是本申请一实施例提供的柔性双面显示屏的示意图；
图5是本申请另一实施例提供的柔性双面显示屏的示意图。
本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
请参考图1至图5，本申请实施例提供一种柔性双面显示屏的制作方法，包括：
步骤S1、提供两个显示器件1，显示器件1包括第一支撑板11、设于第一支撑板11上的柔性基板12、设于柔性基板12上的发光器件层13，及设于柔性基板12和发光器件层13上的封装层14；
步骤S2、在两个显示器件1的封装层14上分别贴合两个第二支撑板15；
步骤S3、剥离两个显示器件1的第一支撑板11；
步骤S4、将两个显示器件1的柔性基板12进行贴合；
步骤S5、剥离两个显示器件1的第二支撑板15。
需要说明的是，步骤S1中提供的显示器件1已经完成了发光器件层13制作，后续可以将两个显示器件1进行贴合，以形成柔性双面显示屏。在两个显示器件1进行贴合之前，刚性的第一支撑板11可以支撑住显示器件1，以便于在两个显示器件1的封装层14上分别贴合两个第二支撑板15，再剥离两个显示器件1的第一支撑板11，以暴露出柔性基板12，此时，刚性的第二支撑板15可以支撑住显示器件1，以便于将两个显示器件1的柔性基板12进行贴合，最后剥离两个显示器件1的第二支撑板15，即可形成柔性双面显示屏。该柔性双面显示屏不具有第一支撑板11和第二支撑板15，从而可以具有柔性特性，且降低柔性双面显示屏的厚度和成本。
此外，每个显示器件1的出光方向为远离柔性基板12的方向，即每个显示器件1朝远离柔性基板12的方向出光，本申请通过将两个显示器件1的柔性基板12进行贴合，可以使两个显示器件1的出光方向背向设置，以实现双面显示。
本申请实施例对于柔性双面显示屏的适用不做具体限制，其可以是电视机、笔记本电脑、平板电脑、可穿戴显示设备(如智能手环、智能手表等)、手机、虚拟现实设备、增强现实设备、车载显示、广告灯箱等任何具有显示功能的产品或部件。
在一些实施例中，第一支撑板11和第二支撑板15的材料可以为玻璃。当然，第一支撑板11和第二支撑板15还可以为其他刚性材料，本申请在此不做限制。
在一些实施例中，封装层14的材料为硅胶，使封装层14具有高透光率，及良好的隔绝水氧的能力，能够有效避免外界水汽入侵发光器件层13，提高发光器件层13的使用寿命，同时透光材料也不会造成发光器件层13的光损失。
在一些实施例中，柔性基板12可以包括柔性衬底及设于柔性衬底上的薄膜晶体管电路。柔性衬底可以为聚二甲基硅氧烷衬底或聚酰亚胺衬底，使柔性衬底具有良好的柔韧性，能够使显示器件1实现柔性弯折。当然，柔性衬底还可以为其他材料，本申请在此不做限制。
薄膜晶体管电路可以包括若干薄膜晶体管单元，薄膜晶体管单元包括P型低温多晶硅薄膜晶体管或N型低温多晶硅薄膜晶体管。薄膜晶体管电路还包括沿行方向延伸的多条扫描线、多条单端信号线和沿列方向延伸的多条数据线，多条扫描线和多条数据线相互交叉绝缘设置。薄膜晶体管单元包括栅极、源极和漏极，其中，薄膜晶体管单元的栅极与扫描线连接，薄膜晶体管的源极与数据线连接，多条单端信号线与扫描线和数据线绝缘设置。该薄膜晶体管单元可以与发光器件层13连接，以控制发光器件层13。
在一些实施例中，步骤S4中将两个显示器件1的柔性基板12进行贴合之前，制作方法还包括：分别在两个第二支撑板15上制作至少一个对位标记，将两个第二支撑板15的对位标记进行对位，从而可以提高两个显示器件1的柔性基板12的贴合精准度，进而使两个显示器件1的显示区域对应呈镜像设置，也可以使两个显示器件1的非显示区域对应呈镜像设置，提高柔性双面显示屏的透过率。
在一些实施例中，请参考图2，发光器件层13包括多个迷你发光二极管(Mini-LED)芯片131。即显示器件1可以为Mini-LED显示器件，则本申请 的柔性双面显示屏为柔性双面Mini-LED显示屏。迷你发光二极管是将传统LED芯片尺寸微缩至100-300um等级，具有亮度高、发光效率好及轻薄等优势，使本申请的柔性双面显示屏同时具有柔性可弯折、双面显示、亮度高、发光效率好及轻薄等优势。
在该实施例中，多个迷你发光二极管芯片131可以呈阵列排布。多个迷你发光二极管芯片131中可以具有发红光的红色迷你发光二极管芯片、发绿光的绿色迷你发光二极管芯片，及发蓝光的蓝色迷你发光二极管芯片。一个红色迷你发光二极管芯片、一个绿色迷你发光二极管芯片和一个蓝色迷你发光二极管芯片可以组成一个像素单元，以实现柔性双面显示屏的全彩显示，提升柔性双面显示屏的显示质量。
此外，上述的薄膜晶体管单元的数量可以与迷你发光二极管芯片131的数量相同，每个薄膜晶体管单元连接一个迷你发光二极管芯片131，以实现控制单个迷你发光二极管芯片131的目的，可以实现单位面积的明暗显示。
在该实施例中，请参考图2，两个显示器件1中的多个迷你发光二极管芯片131呈镜像设置。即第一个显示器件1中的多个迷你发光二极管芯片131沿两个显示器件1的柔性基板12的贴合位置，与第二个显示器件1中的多个迷你发光二极管芯片131呈镜像设置，则第一个显示器件1中的相邻两个迷你发光二极管芯片131之间的间隙也沿两个显示器件1的柔性基板12的贴合位置，与第二个显示器件1中的相邻两个迷你发光二极管芯片131之间的间隙呈镜像设置，并且柔性基板12可以是透光的，从而提高柔性双面显示屏的透过率，使柔性双面显示屏的透过率相当于传统的单面显示屏的透过率，以提高柔性双面显示屏的产品质量。
在该实施例中，请参考图4，由于柔性基板12是透光的，因此显示器件1的柔性基板12中还具有多个遮光层121，多个遮光层121分别位于多个迷你发光二极管芯片131的正下方，即一个遮光层121可以遮挡至少一个迷你发光二极管芯片131，每个迷你发光二极管芯片131在柔性基板12上的正投影，与一个遮光层121在柔性基板12上的正投影重叠。则两个显示器件1中的迷你发光二极管芯片131之间具有遮光层121，避免两个显示器件1的光线互相影响而降低显示效果。
在一些实施例中，请参考图3，发光器件层13包括多个间隔设置的子发光器件132，子发光器件132包括阳极层、阴极层及形成于阳极层和阴极层之间的有机发光材料层。即显示器件1可以为OLED(有机发光)显示器件，则本申请的柔性双面显示屏为柔性双面OLED显示屏。即OLED显示器件1具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽与大面积全色显示等诸多优点，使本申请的柔性双面显示屏同时具有柔性可弯折、双面显示和上述的诸多优点。
在该实施例中，阳极层的材料可以为氧化铟锡(ITO)或者氧化铟锡/银/氧化铟锡(ITO/Ag/ITO)的层叠。有机发光材料层包括设于阳极上的空穴注入层、置于空穴注入层上的空穴传输层、置于空穴传输层上的发光层、置于发光层上的电子传输层，及置于电子传输层上的电子注入层。阴极层的材料可以为银(Ag)、金(Au)、铝(Al)或钛(Ti)等金属材料。
在该实施例中，请参考图3，多个子发光器件132可以呈阵列排布。柔性基板12上还可以设置像素定义层6，该像素定义层6中具有多个像素定义区，每个子发光器件132位于一个像素定义区中。
此外，上述的薄膜晶体管单元的数量可以与子发光器件132的数量相同，每个薄膜晶体管单元连接一个子发光器件132，以实现控制单个子发光器件132的目的，可以实现单位面积的明暗显示。
在该实施例中，请参考图3，两个显示器件1中的多个子发光器件132呈镜像设置。即第一个显示器件1中的多个子发光器件132沿两个显示器件1的柔性基板12的贴合位置，与第二个显示器件1中的多个子发光器件132呈镜像设置，则第一个显示器件1中的相邻两个子发光器件132之间的间隙也沿两个显示器件1的柔性基板12的贴合位置，与第二个显示器件1中的相邻两个子发光器件132之间的间隙呈镜像设置，并且柔性基板12可以是透光的，从而提高柔性双面显示屏的透过率，使柔性双面显示屏的透过率相当于传统的单面显示屏的透过率，以提高柔性双面显示屏的产品质量。
在该实施例中，请参考图5，由于柔性基板12是透光的，因此显示器件1的柔性基板12中还具有多个遮光层121，多个遮光层121分别位于多个子发光器件132的正下方，即一个遮光层121可以遮挡一个子发光器件132，每个 子发光器件132在柔性基板12上的正投影，与一个遮光层121在柔性基板12上的正投影重叠。则两个显示器件1中的子发光器件132之间具有遮光层121，避免两个显示器件1的光线互相影响而降低显示效果。
在一些实施例中，请参阅图2和图3，步骤S4中，将两个显示器件1的柔性基板12进行贴合，包括：采用光学胶16贴合两个显示器件1的柔性基板12。光学胶16具有高透过率(95％以上)，从而提高柔性双面显示屏的透过率，以提高柔性双面显示屏的产品质量。当然，也可以通过其他胶材贴合两个显示器件1的柔性基板12，例如热敏胶，本申请在此不做限制。
在一些实施例中，步骤S3中，剥离两个显示器件1的第一支撑板11，包括：采用激光剥离工艺剥离两个显示器件1的第一支撑板11。该激光剥离工艺是通过脉冲激光照射第一支撑板11和柔性基板12之间，烧蚀第一支撑板11和/或柔性基板12，将第一支撑板11与柔性基板12进行剥离，相比于化学剥离或机械剥离等方式，激光剥离技术具有能量输入效率高及器件损伤小的特性，降低对柔性基板12的损害。
在一些实施例中，步骤S5中，剥离两个显示器件1的第二支撑板15，包括：采用激光剥离工艺剥离两个显示器件1的第二支撑板15。该激光剥离工艺是通过脉冲激光照射第二支撑板15和封装层14之间，烧蚀第二支撑板15和/或封装层14，将第二支撑板15与封装层14进行剥离，相比于化学剥离或机械剥离等方式，激光剥离技术具有能量输入效率高及器件损伤小的特性，降低对封装层14的损害。
请参阅图4和图5，基于上述柔性双面显示屏的制作方法，本申请实施例还提供一种柔性双面显示屏，包括：两个显示器件1；
显示器件1包括柔性基板12、设于柔性基板12上的发光器件层13，及设于柔性基板12和发光器件层13上的封装层14；
两个显示器件1的柔性基板12相互贴合。
需要说明的是，该柔性双面显示屏不具有第一支撑板11和第二支撑板15，从而可以具有柔性特性，且降低柔性双面显示屏的厚度和成本。此外，每个显示器件1的出光方向为远离柔性基板12的方向，即每个显示器件1朝远离柔 性基板12的方向出光，本申请通过将两个显示器件1的柔性基板12进行贴合，可以使两个显示器件1的出光方向背向设置，以实现双面显示。
在一些实施例中，可以采用光学胶16贴合两个显示器件1的柔性基板12。光学胶16具有高透过率(95％以上)，从而提高柔性双面显示屏的透过率，以提高柔性双面显示屏的产品质量。当然，也可以通过其他胶材贴合两个显示器件1的柔性基板12，例如热敏胶，本申请在此不做限制。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。具体实施时，以上各个单元或结构可以作为独立的实体来实现，也可以进行任意组合，作为同一或若干个实体来实现，以上各个单元或结构的具体实施可参见前面的方法实施例，在此不再赘述。
以上对本申请实施例所提供的一种柔性双面显示屏及其制作方法进行了详细介绍，本文中应用了具体个例对本申请实施例的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请实施例的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种柔性双面显示屏的制作方法，其中，包括：
    提供两个显示器件，所述显示器件包括第一支撑板、设于所述第一支撑板上的柔性基板、设于所述柔性基板上的发光器件层，及设于所述柔性基板和所述发光器件层上的封装层；
    在两个所述显示器件的所述封装层上分别贴合两个第二支撑板；
    剥离两个所述显示器件的所述第一支撑板；
    将两个所述显示器件的所述柔性基板进行贴合；
    剥离两个所述显示器件的所述第二支撑板。
  2. 根据权利要求1所述的柔性双面显示屏的制作方法，其中，所述将两个所述显示器件的所述柔性基板进行贴合之前，所述制作方法还包括：
    分别在两个所述第二支撑板上制作至少一个对位标记；
    将两个所述第二支撑板的对位标记进行对位。
  3. 根据权利要求1所述的柔性双面显示屏的制作方法，其中，所述发光器件层包括多个迷你发光二极管芯片。
  4. 根据权利要求3所述的柔性双面显示屏的制作方法，其中，两个所述显示器件中的多个所述迷你发光二极管芯片呈镜像设置。
  5. 根据权利要求3所述的柔性双面显示屏的制作方法，所述柔性基板中还具有多个遮光层，多个所述遮光层分别位于多个所述迷你发光二极管芯片的正下方。
  6. 根据权利要求1所述的柔性双面显示屏的制作方法，其中，所述发光器件层包括多个间隔设置的子发光器件，所述子发光器件包括阳极层、阴极层及形成于所述阳极层和所述阴极层之间的有机发光材料层。
  7. 根据权利要求6所述的柔性双面显示屏的制作方法，其中，两个所述显示器件中的多个所述子发光器件呈镜像设置。
  8. 根据权利要求6所述的柔性双面显示屏的制作方法，所述柔性基板中还具有多个遮光层，多个所述遮光层分别位于多个所述子发光器件的正下方。
  9. 根据权利要求1所述的柔性双面显示屏的制作方法，其中，所述将两个所述显示器件的所述柔性基板进行贴合，包括：
    采用光学胶贴合两个所述显示器件的所述柔性基板。
  10. 根据权利要求1所述的柔性双面显示屏的制作方法，其中，所述剥离两个所述显示器件的所述第一支撑板，包括：
    采用激光剥离工艺剥离两个所述显示器件的所述第一支撑板。
  11. 根据权利要求1所述的柔性双面显示屏的制作方法，其中，所述剥离两个所述显示器件的所述第二支撑板，包括：
    采用激光剥离工艺剥离两个所述显示器件的所述第二支撑板。
  12. 一种柔性双面显示屏，其中，包括：两个显示器件；
    所述显示器件包括柔性基板、设于所述柔性基板上的发光器件层，及设于所述柔性基板和所述发光器件层上的封装层；
    两个所述显示器件的所述柔性基板相互贴合。
  13. 一种柔性双面显示屏的制作方法，其中，包括：
    提供两个显示器件，所述显示器件包括第一支撑板、设于所述第一支撑板上的柔性基板、设于所述柔性基板上的发光器件层，及设于所述柔性基板和所述发光器件层上的封装层；
    在两个所述显示器件的所述封装层上分别贴合两个第二支撑板；
    采用激光剥离工艺剥离两个所述显示器件的所述第一支撑板；
    将两个所述显示器件的所述柔性基板进行贴合；
    采用激光剥离工艺剥离两个所述显示器件的所述第二支撑板。
  14. 根据权利要求13所述的柔性双面显示屏的制作方法，其中，所述将两个所述显示器件的所述柔性基板进行贴合之前，所述制作方法还包括：
    分别在两个所述第二支撑板上制作至少一个对位标记；
    将两个所述第二支撑板的对位标记进行对位。
  15. 根据权利要求13所述的柔性双面显示屏的制作方法，其中，所述发光器件层包括多个迷你发光二极管芯片。
  16. 根据权利要求15所述的柔性双面显示屏的制作方法，其中，两个所述显示器件中的多个所述迷你发光二极管芯片呈镜像设置。
  17. 根据权利要求15所述的柔性双面显示屏的制作方法，所述柔性基板中还具有多个遮光层，多个所述遮光层分别位于多个所述迷你发光二极管芯片 的正下方。
  18. 根据权利要求13所述的柔性双面显示屏的制作方法，其中，所述发光器件层包括多个间隔设置的子发光器件，所述子发光器件包括阳极层、阴极层及形成于所述阳极层和所述阴极层之间的有机发光材料层。
  19. 根据权利要求18所述的柔性双面显示屏的制作方法，其中，两个所述显示器件中的多个所述子发光器件呈镜像设置。
  20. 根据权利要求18所述的柔性双面显示屏的制作方法，所述柔性基板中还具有多个遮光层，多个所述遮光层分别位于多个所述子发光器件的正下方。
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