WO2020103349A1 - Oled显示装置及其制作方法 - Google Patents

Oled显示装置及其制作方法

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Publication number
WO2020103349A1
WO2020103349A1 PCT/CN2019/075965 CN2019075965W WO2020103349A1 WO 2020103349 A1 WO2020103349 A1 WO 2020103349A1 CN 2019075965 W CN2019075965 W CN 2019075965W WO 2020103349 A1 WO2020103349 A1 WO 2020103349A1
Authority
WO
WIPO (PCT)
Prior art keywords
oled display
flexible substrate
display panel
layer
oled
Prior art date
Application number
PCT/CN2019/075965
Other languages
English (en)
French (fr)
Inventor
胡妞
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/606,995 priority Critical patent/US11522153B2/en
Publication of WO2020103349A1 publication Critical patent/WO2020103349A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technology, and in particular to an OLED display device and a manufacturing method thereof.
  • flat panel display devices are widely used in mobile phones, TVs, personal digital assistants, digital cameras, notebook computers, desktops due to their advantages of high image quality, power saving, thin body, and wide range of applications.
  • Various consumer electronic products such as computers have become the mainstream in display devices.
  • Organic Light Emitting Display (Organic Light Emitting Display, OLED), because it also has self-illumination, no backlight, high contrast, thin thickness, wide viewing angle, fast response, can be used in flexible panels, wide temperature range, structure And the simple process and other excellent characteristics are considered to be the emerging application technology of the next generation flat panel display.
  • OLED Organic Light Emitting Display
  • OLED display devices generally include: a substrate, an anode provided on the substrate, a hole injection layer provided on the anode, a hole transport layer provided on the hole injection layer, a light emitting layer provided on the hole transport layer, and a device An electron transport layer on the light-emitting layer, an electron injection layer provided on the electron transport layer, and a cathode provided on the electron injection layer.
  • the principle of light emission of an OLED display device is that semiconductor materials and organic light-emitting materials are driven by an electric field to cause light emission through carrier injection and recombination.
  • OLED display devices usually use ITO pixel electrodes and metal electrodes as the anode and cathode of the device, respectively.
  • electrons and holes are injected from the cathode and anode into the electron transport layer and hole transport layer, respectively.
  • the holes migrate to the light-emitting layer through the electron-transport layer and the hole-transport layer, and meet in the light-emitting layer to form excitons and excite the light-emitting molecules, which emit visible light after radiation relaxation.
  • the side is directly bonded to the chip on film (COF) from the original, and has gradually developed into a bending (bending) binding structure, specifically, the binding terminal is formed on the substrate, and the flexible circuit board is bound After it is fixed to the binding terminal, it is bent to the back of the substrate to increase the screen ratio.
  • COF chip on film
  • the bending radius of the flexible circuit board is getting smaller and smaller, and the border of the display panel is also smaller, but due to the wiring structure Restriction, the bending radius needs to be kept within a certain range in practical application, and cannot be infinitely small, and always needs to occupy a certain frame width, because it is also easy to cause poor wire breaks when bending.
  • the object of the present invention is to provide an OLED display device, which can maximize the reduction of the width of the frame, increase the screen ratio and reduce the risk of disconnection without the need for bending.
  • the object of the present invention is also to provide a method for manufacturing an OLED display device, which can maximize the reduction of the width of the bezel without the need for bending, increase the screen ratio, and reduce the risk of disconnection.
  • the present invention provides an OLED display device, including: an OLED display panel, a driving module and a binding terminal;
  • the OLED display panel has a light emitting surface and a non-light emitting surface opposite to the light emitting surface, the binding terminal is provided on the non-light emitting surface, and the driving module is bound to the binding terminal.
  • the OLED display panel includes a flexible substrate, a drive circuit layer provided on the flexible substrate, an OLED layer provided on the drive circuit layer, and a thin film encapsulation layer provided on the OLED layer.
  • the OLED display panel is a bottom-emission type OLED display panel, and its light exit surface is the surface of the flexible substrate away from the thin film encapsulation layer, and the non-light exit surface is the surface of the thin film encapsulation layer away from the flexible substrate
  • the binding terminal is electrically connected to the driving circuit layer through a first via that passes through the thin film encapsulation layer and the OLED layer.
  • the OLED display panel is a top-emission type OLED display panel, and its light exit surface is the side surface of the thin film encapsulation layer away from the flexible substrate, and the non-light exit surface is the side surface of the flexible substrate away from the thin film encapsulation layer ,
  • the binding terminal is electrically connected to the driving circuit layer through a second via that passes through the flexible substrate.
  • a groove is formed on the edge of the non-light emitting surface of the OLED display panel, and the binding terminal is located in the groove.
  • the invention also provides a method for manufacturing an OLED display device, including the following steps:
  • Step S1 Manufacturing an OLED display panel, the OLED display panel having a light exit surface and a non-light exit surface opposite to the light exit surface;
  • Step S2 forming a binding terminal on the non-light emitting surface
  • Step S3 Provide a driving module, and bind the driving module to the binding terminal.
  • the step S1 specifically includes:
  • a thin film encapsulation layer is formed on the OLED layer.
  • the OLED display panel manufactured in step S1 is a bottom-emission type OLED display panel, and its light emitting surface is the surface of the flexible substrate away from the thin film encapsulation layer, and the non-light emitting surface is the thin film packaging layer away from the flexible substrate The side surface of the bottom;
  • the step S2 specifically includes:
  • a binding terminal is formed on a surface of the thin film packaging layer away from the flexible substrate, and the binding terminal is electrically connected to the driving circuit layer through a first via passing through the thin film packaging layer and the OLED layer ;
  • the flexible substrate is peeled from the hard substrate.
  • the OLED display panel produced in the step S1 is a top-emission type OLED display panel, and its light emitting surface is a side surface of the thin film packaging layer away from the flexible substrate, and the non-light emitting surface is the flexible substrate away from the thin film packaging One side surface of the layer;
  • the step S2 specifically includes:
  • a binding terminal is formed on a surface of the flexible substrate away from the thin-film packaging layer, and the binding terminal is electrically connected to the driving circuit layer through a second via that passes through the flexible substrate.
  • the step S2 specifically includes: forming a groove on the edge of the non-light emitting surface of the OLED display panel, and forming a binding terminal in the groove.
  • the present invention provides an OLED display device, including: an OLED display panel, a driving module and a binding terminal; the OLED display panel has a light exit surface and a non-light exit surface opposite to the light exit surface, the The binding terminal is set on the non-light emitting surface, the driving module is bound on the binding terminal, the binding terminal is set on the non-lighting surface of the OLED display panel, and the driving module is bound on the Compared with the prior art, since the binding terminal itself is located on the non-light emitting surface of the OLED display panel, the bound driving module does not need to be bent again, so that the maximum Reduce the width of the border, increase the screen ratio and reduce the risk of disconnection.
  • the invention also provides a manufacturing method of the OLED display device, which can maximize the reduction of the width of the frame, increase the screen ratio and reduce the risk of disconnection without the need for bending.
  • FIG. 1 is a schematic diagram of the OLED display device of the present invention.
  • FIGS. 2 to 3 are schematic diagrams of steps S1 to S2 of the first embodiment of the OLED display device of the present invention.
  • step S3 of the first embodiment of the OLED display device of the present invention is a schematic diagram of step S3 of the first embodiment of the OLED display device of the present invention and a schematic diagram of the first embodiment of the OLED display device of the present invention
  • 5 to 7 are schematic diagrams of steps S1 to S2 of the second embodiment of the OLED display device of the present invention.
  • step S3 of the second embodiment of the OLED display device of the present invention is a schematic diagram of step S3 of the second embodiment of the OLED display device of the present invention and a schematic diagram of the first embodiment of the OLED display device of the present invention
  • FIG. 9 is a flowchart of a method for manufacturing an OLED display device of the present invention.
  • the present invention provides a OLED Display device, including: OLED Display panel 1 , Drive module 2 And binding terminal 3 ;
  • the OLED Display panel 1 Including flexible substrate 10 ⁇ Set on the flexible substrate 10 Driver circuit layer 20 , Located on the drive circuit layer 20 Up OLED Floor 30 And located in the OLED Floor 30 Thin film encapsulation layer 40 .
  • each row TFT Gate is electrically connected to a scan line
  • each column TFT The source electrode is electrically connected to a data line
  • each OLED Both include the driver circuit layer 20 A bottom electrode on the top, a light emitting layer provided on the bottom electrode, and a top electrode provided on the light emitting layer.
  • the OLED Can be divided into top light type OLED And bottom-emitting type OLED ,corresponding OLED
  • the display panel is a top-emitting type OLED Display panel and bottom-emitting type OLED Display panel, of which top-emitting type OLED
  • the top electrode is a transparent electrode
  • the bottom electrode is a reflective electrode
  • the light emitted by the light emitting layer is directly emitted from the top electrode or reflected from the bottom electrode, and then emitted from the top electrode.
  • OLED The top electrode is a reflective electrode
  • the bottom electrode is a transparent electrode. The light emitted by the light emitting layer is directly emitted from the bottom electrode or reflected from the top electrode and then emitted from the bottom electrode.
  • the OLED Display panel 1 Top-emitting type OLED Display panel its light emitting surface 11 Thin film encapsulation layer 40 Away from the flexible substrate 10 Side surface, non-light emitting surface 2 For the flexible substrate 10 Away from the thin film encapsulation layer 40 One side surface, the binding terminal 3 By crossing the flexible substrate 10 Second via 302 With the drive circuit layer 20 Electrical connection.
  • the flexible substrate 10 For transparent, you can choose polyimide ( PI ), Polyetherimide ( PEI ),Polyphenylene sulfide( PPS ) And polyarylate ( PAR ) In one or more combinations.
  • the OLED Display panel 1 Bottom-emitting type OLED Display panel its light emitting surface 11 For the flexible substrate 10 Away from the thin film encapsulation layer 40 Side surface, non-light emitting surface 12 Thin film encapsulation layer 40 Away from the flexible substrate 10 One side surface, the binding terminal 3 By passing through the thin film encapsulation layer 40 and OLED Floor 30 First via 301 With the drive circuit layer 20 Electrical connection.
  • the flexible substrate 10 For opaque, choose polyimide ( PI ), Polyetherimide ( PEI ),Polyphenylene sulfide( PPS ) And polyarylate ( PAR ) In one or more combinations.
  • the non-light emitting surface 12 there is also a protective film on it 70 , Corresponding to the first embodiment, that is, in the thin film encapsulation layer 40 Away from the flexible substrate 10 Has a protective layer on one side 70 , Corresponding to the second embodiment, that is, the flexible substrate 10 Away from the thin film encapsulation layer 40 Has a protective layer on one side 70 .
  • the OLED Display panel 1 Non-glare 12 Has grooves on the edges 121 ,
  • the binding terminal 3 Located in the groove 121 Inside, so that the binding terminal 3 After forming, it will not be from the non-light emitting surface 12 Of the surface is convex, keeping the non-light emitting surface 12 Flatness of the product to avoid increasing the thickness of the product corresponds to the first embodiment, that is, in the thin film encapsulation layer 40 Away from the flexible substrate 10 Has a groove on one side 121 , The groove 121 The depth is less than the film sealing layer 40 The thickness corresponds to the second embodiment, that is, the flexible substrate 10 Away from the thin film encapsulation layer 40 Has a groove on one side 121 , The groove 121 The depth is less than the flexible substrate 10 thickness of.
  • the protective layer 70 The groove is not covered 121 So that the binding terminal 3 Exposed to bind the driver module 2 .
  • the driving module 2 Is a flip chip ( COF ) Or flexible circuit board ( Flexible Printed Circuit , FPC ).
  • the binding terminal is located OLED The non-light-emitting surface of the display panel, so the bound drive module does not need to be bent, which can maximize the reduction of the width of the border, increase the screen ratio and reduce the risk of disconnection.
  • the manufacturing method of the display device includes the following steps:
  • step S1 Production OLED Display panel 1 , Said OLED Display panel 1 With light emitting surface 11 And with the light exit surface 11 Opposite non-light emitting surface 12 .
  • the steps S1 This includes:
  • each row TFT Gate is electrically connected to a scan line
  • each column TFT The source electrode is electrically connected to a data line
  • each OLED Both include the driver circuit layer 20 A bottom electrode on the top, a light emitting layer provided on the bottom electrode, and a top electrode provided on the light emitting layer.
  • the OLED Can be divided into top light type OLED And bottom-emitting type OLED ,corresponding OLED
  • the display panel is a top-emitting type OLED Display panel and bottom-emitting type OLED Display panel, of which top-emitting type OLED
  • the top electrode is a transparent electrode
  • the bottom electrode is a reflective electrode
  • the light emitted by the light emitting layer is directly emitted from the top electrode or reflected from the bottom electrode, and then emitted from the top electrode.
  • OLED The top electrode is a reflective electrode
  • the bottom electrode is a transparent electrode. The light emitted by the light emitting layer is directly emitted from the bottom electrode or reflected from the top electrode and then emitted from the bottom electrode.
  • the OLED Display panel 1 Top-emitting type OLED Display panel its light emitting surface 11 Thin film encapsulation layer 40 Away from the flexible substrate 10 Side surface, non-light emitting surface 2 For the flexible substrate 10 Away from the thin film encapsulation layer 40 Side surface.
  • the flexible substrate 10 For transparent, you can choose polyimide ( PI ), Polyetherimide ( PEI ),Polyphenylene sulfide( PPS ) And polyarylate ( PAR ) In one or more combinations.
  • the OLED Display panel 1 Bottom-emitting type OLED Display panel its light emitting surface 11 For the flexible substrate 10 Away from the thin film encapsulation layer 40 Side surface, non-light emitting surface 12 Thin film encapsulation layer 40 Away from the flexible substrate 10 Side surface.
  • the flexible substrate 10 For opaque, choose polyimide ( PI ), Polyetherimide ( PEI ),Polyphenylene sulfide( PPS ) And polyarylate ( PAR ) In one or more combinations.
  • step S2 On the non-light emitting surface 12 Binding terminal 3 ;
  • the steps S2 This includes:
  • the binding terminal 3 By crossing the flexible substrate 10 Second via 302
  • the driving circuit layer 20 Electrical connection.
  • the steps S2 This includes:
  • the binding terminal 3 By passing through the thin film encapsulation layer 40 and OLED Floor 30 First via 301 With the drive circuit layer 20 Electrical connection
  • the steps S2 Also included in the non-light emitting surface 12 Protective film 70 Corresponding to the first embodiment, that is, in the thin film encapsulation layer 40 Away from the flexible substrate 10 Forming a protective layer on one side 70 , Corresponding to the second embodiment, that is, the flexible substrate 10 Away from the thin film encapsulation layer 40 Forming a protective layer on one side 70 .
  • the OLED Display panel 1 Non-glare 12
  • the edge of the groove 121 , The binding terminal 3 Formed in the groove 121 Inside, so that the binding terminal 3 After forming, it will not be from the non-light emitting surface 12 Of the surface is convex, keeping the non-light emitting surface 12 Flatness of the product to avoid increasing the thickness of the product corresponds to the first embodiment, that is, in the thin film encapsulation layer 40 Away from the flexible substrate 10 Has a groove on one side 121 , The groove 121 The depth is less than the film sealing layer 40
  • the thickness corresponds to the second embodiment, that is, the flexible substrate 10 Away from the thin film encapsulation layer 40 Has a groove on one side 121 , The groove 121 The depth is less than the flexible substrate 10 thickness of.
  • the hard substrate 100 It is a glass substrate or a quartz substrate.
  • the protective layer 70 The groove is not covered 121 So that the binding terminal 3 Expose to complete the subsequent binding drive module 2 .
  • step S3 ⁇ Provide a drive module 2 , The drive module 2 Bound to the binding terminal 3 on.
  • the driving module 2 Is a flip chip ( COF ) Or flexible circuit board ( Flexible Printed Circuit , FPC ).
  • the present invention provides a OLED Display device, including: OLED Display panel, drive module and binding terminals; described OLED
  • the display panel has a light exit surface and a non-light exit surface opposite to the light exit surface, the binding terminal is provided on the non-light exit surface, and the driving module is bound to the binding terminal by binding the binding terminal Set on OLED
  • the non-light-emitting surface of the display panel, and the driving module is bound to the binding terminal on the non-light-emitting surface, compared with the prior art, because the binding terminal itself is located OLED
  • the non-light-emitting surface of the display panel, so the bound drive module does not need to be bent, which can maximize the reduction of the width of the border, increase the screen ratio and reduce the risk of disconnection.
  • the invention also provides a OLED
  • the manufacturing method of the display device can maximize the reduction of the width of the bezel without the need for bending, increase the screen ratio and reduce the risk of disconnection.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明提供一种OLED显示装置及其制作方法。所述OLED显示装置包括：OLED显示面板、驱动模块及绑定端子；所述OLED显示面板具有出光面及与所述出光面相背的非出光面，所述绑定端子设于所述非出光面上，所述驱动模块绑定于所述绑定端子上，通过将绑定端子设于OLED显示面板的非出光面上，并将驱动模块绑定于所述非出光面上的绑定端子上，相比于现有技术，由于绑定端子本身就位于OLED显示面板的非出光面，因此绑定后的驱动模块不需要再进行弯折，从而能够最大化缩减边框宽度，提升屏占比的同时减少断线风险。

Description

OLED显示装置及其制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED显示装置及其制作方法。
 背景技术
随着显示技术的发展，平板显示装置因具有高画质、省电、机身薄及应用范围广等优点，而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品，成为显示装置中的主流。
有机发光二极管显示器件（Organic Light Emitting Display，OLED）由于同时具备自发光，不需背光源、对比度高、厚度薄、视角广、反应速度快、可用于挠曲性面板、使用温度范围广、构造及制程较简单等优异特性，被认为是下一代平面显示器的新兴应用技术。
OLED显示器件通常包括：基板、设于基板上的阳极、设于阳极上的空穴注入层、设于空穴注入层上的空穴传输层、设于空穴传输层上的发光层、设于发光层上的电子传输层、设于电子传输层上的电子注入层、及设于电子注入层上的阴极。OLED显示器件的发光原理为半导体材料和有机发光材料在电场驱动下，通过载流子注入和复合导致发光。具体的，OLED显示器件通常采用ITO像素电极和金属电极分别作为器件的阳极和阴极，在一定电压驱动下，电子和空穴分别从阴极和阳极注入到电子传输层和空穴传输层，电子和空穴分别经过电子传输层和空穴传输层迁移到发光层，并在发光层中相遇，形成激子并使发光分子激发，后者经过辐射弛豫而发出可见光。
随着科技的发展以及人们对产品的要求的提高，在OLED显示装置在追求高分辨率的同时，也在不断提高屏占比，窄边框技术也得到了快速的发展，在绑定（bonding）侧从原有的直接进行覆晶薄膜（Chip On Film， COF）绑定，已经慢慢的发展为弯折（bending）绑定结构，具体为将绑定端子形成在基板上，柔性电路板绑定到绑定端子上之后弯折到基板的背面，以提升屏占比，实际应用时，柔性电路板的弯折半径越来越小，显示面板的边框也越小，但由于走线结构的限制，弯折半径在实际应用时需要保持在一定范围内，并不能无限的小，始终需要占用一定的边框宽度，由于在弯折时，还容易造成断线不良。
 技术问题
本发明的目的在于提供一种OLED显示装置，能够在不需要弯折的前提下，最大化缩减边框宽度，提升屏占比的同时减少断线风险。
本发明的目的还在于提供一种OLED显示装置的制作方法，能够在不需要弯折的前提下，最大化缩减边框宽度，提升屏占比的同时减少断线风险。
 技术解决方案
为实现上述目的，本发明提供了一种OLED显示装置，包括：OLED显示面板、驱动模块及绑定端子；
所述OLED显示面板具有出光面及与所述出光面相背的非出光面，所述绑定端子设于所述非出光面上，所述驱动模块绑定于所述绑定端子上。
所述OLED显示面板包括柔性衬底、设于所述柔性衬底上的驱动电路层、设于所述驱动电路层上的OLED层及设于所述OLED层上的薄膜封装层。
所述OLED显示面板为底发光型OLED显示面板，其出光面为所述柔性衬底远离所述薄膜封装层的一侧表面，非出光面为薄膜封装层远离所述柔性衬底的一侧表面，所述绑定端子通过穿越所述薄膜封装层及OLED层的第一过孔与所述驱动电路层电性连接。
所述OLED显示面板为顶发光型OLED显示面板，其出光面为薄膜封装层远离所述柔性衬底的一侧表面，非出光面为所述柔性衬底远离所述薄膜封装层的一侧表面，所述绑定端子通过穿越所述柔性衬底的第二过孔与所述驱动电路层电性连接。
所述OLED显示面板的非出光面的边缘有形成凹槽，所述绑定端子位于所述凹槽内。
本发明还提供一种OLED显示装置的制作方法，包括如下步骤：
步骤S1、制作OLED显示面板，所述OLED显示面板具有出光面及与所述出光面相背的非出光面；
步骤S2、在所述非出光面上形成绑定端子；
步骤S3、提供一驱动模块，将所述驱动模块绑定于所述绑定端子上。
所述步骤S1具体包括：
提供一硬质基板，在所述硬质基板上形成柔性衬底；
在所述柔性衬底上形成驱动电路层；
在述驱动电路层上形成OLED层；
在所述OLED层上形成薄膜封装层。
所述步骤S1中制作的OLED显示面板为底发光型OLED显示面板，其出光面为所述柔性衬底远离所述薄膜封装层的一侧表面，非出光面为薄膜封装层远离所述柔性衬底的一侧表面；
所述步骤S2具体包括：
在所述薄膜封装层远离所述柔性衬底的一侧表面形成绑定端子，所述绑定端子通过穿越所述薄膜封装层及OLED层的第一过孔与所述驱动电路层电性连接；
将柔性衬底从所述硬质基板剥离。
所述步骤S1中制作的OLED显示面板为顶发光型OLED显示面板，其出光面为薄膜封装层远离所述柔性衬底的一侧表面，非出光面为所述柔性衬底远离所述薄膜封装层的一侧表面；
所述步骤S2具体包括：
将柔性衬底从所述硬质基板剥离；
在所述柔性衬底远离所述薄膜封装层的一侧表面形成绑定端子，所述绑定端子通过穿越所述柔性衬底的第二过孔与所述驱动电路层电性连接。
所述步骤S2具体包括：在所述OLED显示面板的非出光面的边缘形成凹槽，在所述凹槽内形成绑定端子。
 有益效果
本发明的有益效果：本发明提供一种OLED显示装置，包括：OLED显示面板、驱动模块及绑定端子；所述OLED显示面板具有出光面及与所述出光面相背的非出光面，所述绑定端子设于所述非出光面上，所述驱动模块绑定于所述绑定端子上，通过将绑定端子设于OLED显示面板的非出光面上，并将驱动模块绑定于所述非出光面上的绑定端子上，相比于现有技术，由于绑定端子本身就位于OLED显示面板的非出光面，因此绑定后的驱动模块不需要再进行弯折，从而能够最大化缩减边框宽度，提升屏占比的同时减少断线风险。本发明还提供一种OLED显示装置的制作方法，能够在不需要弯折的前提下，最大化缩减边框宽度，提升屏占比的同时减少断线风险。
 附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为本发明OLED显示装置的示意图；
图2至图3为本发明OLED显示装置的第一实施例的步骤S1至S2的示意图；
图4为本发明OLED显示装置的第一实施例的步骤S3的示意图暨本发OLED显示装置的第一实施例的示意图；
图5至图7为本发明OLED显示装置的第二实施例的步骤S1至S2的示意图；
图8为本发明OLED显示装置的第二实施例的步骤S3的示意图暨本发OLED显示装置的第一实施例的示意图；
图9为本发明OLED显示装置的制作方法的流程图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图 1 至图 3 ，本发明提供一种 OLED 显示装置，包括： OLED 显示面板 1 、驱动模块 2 及绑定端子 3 ；
所述 OLED 显示面板 1 具有出光面 11 及与所述出光面 11 相背的非出光面 12 ，所述绑定端子 3 设于所述非出光面 12 上，所述驱动模块 2 绑定于所述绑定端子 3 上。
具体地，如图 4 或图 8 所示，所述 OLED 显示面板 1 包括柔性衬底 10 、设于所述柔性衬底 10 上的驱动电路层 20 、设于所述驱动电路层 20 上的 OLED 层 30 及设于所述 OLED 层 30 上的薄膜封装层 40 。
进一步地，所述驱动电路层 20 包括多个 TFT 、多条扫描线及多条数据线，所述 OLED 层 30 包括多个 OLED ，所述多个 TFT 阵列排布，每一行 TFT 的栅极电性连接一条扫描线，每一列 TFT 的源极电性连接一条数据线，每一个 TFT 的漏极电性连接一个 OLED 。
具体地，每一个 OLED 均包括设于所述驱动电路层 20 上的底电极、设于所述底电极上的发光层及设于所述发光层上顶电极。
根据底电极和顶电极的透光特性的不同，所述 OLED 可分为顶发光型 OLED 和底发光型 OLED ，相应的 OLED 显示面板即为顶发光型 OLED 显示面板和底发光型 OLED 显示面板，其中顶发光型的 OLED 的顶电极为透明电极，底电极为反射电极，发光层发出的光线直接从顶电极射出或经由底电极反射后从顶电极射出，底发光型的 OLED 的顶电极为反射电极，底电极为透明电极，发光层发出的光线直接从底电极射出或经由顶电极反射后从底电极射出。
具体地，如图 4 所示，在本发明的第一实施例中，所述 OLED 显示面板 1 为顶发光型 OLED 显示面板，其出光面 11 为薄膜封装层 40 远离所述柔性衬底 10 的一侧表面，非出光面 2 为所述柔性衬底 10 远离所述薄膜封装层 40 的一侧表面，所述绑定端子 3 通过穿越所述柔性衬底 10 的第二过孔 302 与所述驱动电路层 20 电性连接。
进一步地，在本发明的第一实施例中，所述柔性衬底 10 为透明的，可选择聚酰亚胺（ PI ）、聚醚酰亚胺（ PEI ）、聚苯硫醚（ PPS ）和聚芳酯（ PAR ）中的一种或多种的组合。
具体地，如图 8 所示，在本发明的第二实施例中，所述 OLED 显示面板 1 为底发光型 OLED 显示面板，其出光面 11 为所述柔性衬底 10 远离所述薄膜封装层 40 的一侧表面，非出光面 12 为薄膜封装层 40 远离所述柔性衬底 10 的一侧表面，所述绑定端子 3 通过穿越所述薄膜封装层 40 及 OLED 层 30 的第一过孔 301 与所述驱动电路层 20 电性连接。
进一步地，在本发明的第二实施例中，所述柔性衬底 10 为不透明的，可选择聚酰亚胺（ PI ）、聚醚酰亚胺（ PEI ）、聚苯硫醚（ PPS ）和聚芳酯（ PAR ）中的一种或多种的组合。
具体地，在本发明的 OLED 显示装置中，所述非出光面 12 上还设有保护膜 70 ，对应到第一实施例中，即在所述薄膜封装层 40 远离所述柔性衬底 10 的一侧设有保护层 70 ，对应到第二实施例中，即在所述柔性衬底 10 远离所述薄膜封装层 40 的一侧设有保护层 70 。
优选地，所述 OLED 显示面板 1 的非出光面 12 的边缘形成有凹槽 121 ，所述绑定端子 3 位于所述凹槽 121 内，从而使得所述绑定端子 3 形成后不会从非出光面 12 的表面凸出，保持所述非出光面 12 的平整性，避免增加产品厚度对应到第一实施例中，即在所述薄膜封装层 40 远离所述柔性衬底 10 的一侧设有凹槽 121 ，所述凹槽 121 的深度小于所述薄膜封住层 40 的厚度，对应到第二实施例中，即在所述柔性衬底 10 远离所述薄膜封装层 40 的一侧设有凹槽 121 ，所述凹槽 121 的深度小于所述柔性衬底 10 的厚度。
进一步地，所述保护层 70 未覆盖所述凹槽 121 ，从而使得绑定端子 3 暴露，以绑定驱动模块 2 。
具体地，所述驱动模块 2 为覆晶薄膜（ COF ）或柔性电路板（ Flexible Printed Circuit ， FPC ）。
从而，通过将绑定端子设于 OLED 显示面板的非出光面上，使得驱动模块能够绑定于所述绑定端子上，相比于现有技术，由于绑定端子本身就位于 OLED 显示面板的非出光面，因此绑定后的驱动模块不需要再进行弯折，从而能够最大化缩减边框宽度，提升屏占比的同时减少断线风险。
请参阅图 9 ，本发明提供一种 OLED 显示装置的制作方法，包括如下步骤：
步骤 S1 、制作 OLED 显示面板 1 ，所述 OLED 显示面板 1 具有出光面 11 及与所述出光面 11 相背的非出光面 12 。
具体地，具体地，如图 2 或图 5 所示，所述步骤 S1 具体包括：
提供一硬质基板 100 ，在所述硬质基板 100 上形成柔性衬底 10
在所述柔性衬底 10 上形成驱动电路层 20 ；
在所述驱动电路层 20 上形成 OLED 层 30 ；
在所述 OLED 层 30 上形成薄膜封装层 40 。
进一步地，所述驱动电路层 20 包括多个 TFT 、多条扫描线及多条数据线，所述 OLED 层 30 包括多个 OLED ，所述多个 TFT 阵列排布，每一行 TFT 的栅极电性连接一条扫描线，每一列 TFT 的源极电性连接一条数据线，每一个 TFT 的漏极电性连接一个 OLED 。
具体地，每一个 OLED 均包括设于所述驱动电路层 20 上的底电极、设于所述底电极上的发光层及设于所述发光层上顶电极。
根据底电极和顶电极的透光特性的不同，所述 OLED 可分为顶发光型 OLED 和底发光型 OLED ，相应的 OLED 显示面板即为顶发光型 OLED 显示面板和底发光型 OLED 显示面板，其中顶发光型的 OLED 的顶电极为透明电极，底电极为反射电极，发光层发出的光线直接从顶电极射出或经由底电极反射后从顶电极射出，底发光型的 OLED 的顶电极为反射电极，底电极为透明电极，发光层发出的光线直接从底电极射出或经由顶电极反射后从底电极射出。
具体地，如图 2 所示，在本发明的第一实施例中，所述 OLED 显示面板 1 为顶发光型 OLED 显示面板，其出光面 11 为薄膜封装层 40 远离所述柔性衬底 10 的一侧表面，非出光面 2 为所述柔性衬底 10 远离所述薄膜封装层 40 的一侧表面。
进一步地，在本发明的第一实施例中，所述柔性衬底 10 为透明的，可选择聚酰亚胺（ PI ）、聚醚酰亚胺（ PEI ）、聚苯硫醚（ PPS ）和聚芳酯（ PAR ）中的一种或多种的组合。
具体地，如图 5 所示，在本发明的第二实施例中，所述 OLED 显示面板 1 为底发光型 OLED 显示面板，其出光面 11 为所述柔性衬底 10 远离所述薄膜封装层 40 的一侧表面，非出光面 12 为薄膜封装层 40 远离所述柔性衬底 10 的一侧表面。
进一步地，在本发明的第二实施例中，所述柔性衬底 10 为不透明的，可选择聚酰亚胺（ PI ）、聚醚酰亚胺（ PEI ）、聚苯硫醚（ PPS ）和聚芳酯（ PAR ）中的一种或多种的组合。
步骤 S2 、在所述非出光面 12 上形成绑定端子 3 ；
具体地，如图 2 至图 3 ，在本发明的第一实施例中，所述步骤 S2 具体包括：
将柔性衬底 10 从所述硬质基板 100 剥离；
在所述柔性衬底 10 远离所述薄膜封装层 40 的一侧表面形成绑定端子 3 ，所述绑定端子 3 通过穿越所述柔性衬底 10 的第二过孔 302 所述驱动电路层 20 电性连接。
具体地，通过激光剥离（ Laser lift off ， LLO ）工艺将柔性衬底 10 从所述硬质基板 100 剥离。
具体地，图 5 至图 7 所示，在本发明的第二实施例中，所述步骤 S2 具体包括：
在所述薄膜封装层 40 远离所述柔性衬底 10 的一侧表面形成绑定端子 3 ，所述绑定端子 3 通过穿越所述薄膜封装层 40 及 OLED 层 30 的第一过孔 301 与所述驱动电路层 20 电性连接；
将柔性衬底 10 从所述硬质基板 100 剥离。
具体地，通过激光剥离（ Laser lift off ， LLO ）工艺将柔性衬底 10 从所述硬质基板 100 剥离。
具体地，所述步骤 S2 中还包括在所述非出光面 12 上形成保护膜 70 ，对应到第一实施例中，即在所述薄膜封装层 40 远离所述柔性衬底 10 的一侧形成保护层 70 ，对应到第二实施例中，即在所述柔性衬底 10 远离所述薄膜封装层 40 的一侧形成保护层 70 。
优选地，所述 OLED 显示面板 1 的非出光面 12 的边缘形成凹槽 121 ，所述绑定端子 3 形成于所述凹槽 121 内，从而使得所述绑定端子 3 形成后不会从非出光面 12 的表面凸出，保持所述非出光面 12 的平整性，避免增加产品厚度对应到第一实施例中，即在所述薄膜封装层 40 远离所述柔性衬底 10 的一侧设有凹槽 121 ，所述凹槽 121 的深度小于所述薄膜封住层 40 的厚度，对应到第二实施例中，即在所述柔性衬底 10 远离所述薄膜封装层 40 的一侧设有凹槽 121 ，所述凹槽 121 的深度小于所述柔性衬底 10 的厚度。
具体地，所述硬质基板 100 为玻璃基板或石英基板。
进一步地，所述保护层 70 未覆盖所述凹槽 121 ，从而使得绑定端子 3 暴露，以完成后续绑定驱动模块 2 。
步骤 S3 、提供一驱动模块 2 ，将所述驱动模块 2 绑定于所述绑定端子 3 上。
具体地，所述驱动模块 2 为覆晶薄膜（ COF ）或柔性电路板（ Flexible Printed Circuit ， FPC ）。
综上所述，本发明提供一种 OLED 显示装置，包括： OLED 显示面板、驱动模块及绑定端子；所述 OLED 显示面板具有出光面及与所述出光面相背的非出光面，所述绑定端子设于所述非出光面上，所述驱动模块绑定于所述绑定端子上，通过将绑定端子设于 OLED 显示面板的非出光面上，并将驱动模块绑定于所述非出光面上的绑定端子上，相比于现有技术，由于绑定端子本身就位于 OLED 显示面板的非出光面，因此绑定后的驱动模块不需要再进行弯折，从而能够最大化缩减边框宽度，提升屏占比的同时减少断线风险。本发明还提供一种 OLED 显示装置的制作方法，能够在不需要弯折的前提下，最大化缩减边框宽度，提升屏占比的同时减少断线风险。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (10)

  1. 一种OLED显示装置，包括：OLED显示面板、驱动模块及绑定端子；
    所述OLED显示面板具有出光面及与所述出光面相背的非出光面，所述绑定端子设于所述非出光面上，所述驱动模块绑定于所述绑定端子上。
  2. 如权利要求1所述的OLED显示装置，其中，所述OLED显示面板包括柔性衬底、设于所述柔性衬底上的驱动电路层、设于所述驱动电路层上的OLED层及设于所述OLED层上的薄膜封装层。
  3. 如权利要求2所述的OLED显示装置，其中，所述OLED显示面板为底发光型OLED显示面板，其出光面为所述柔性衬底远离所述薄膜封装层的一侧表面，非出光面为薄膜封装层远离所述柔性衬底的一侧表面，所述绑定端子通过穿越所述薄膜封装层及OLED层的第一过孔与所述驱动电路层电性连接。
  4. 如权利要求2所述的OLED显示装置，其中，所述OLED显示面板为顶发光型OLED显示面板，其出光面为薄膜封装层远离所述柔性衬底的一侧表面，非出光面为所述柔性衬底远离所述薄膜封装层的一侧表面，所述绑定端子通过穿越所述柔性衬底的第二过孔与所述驱动电路层电性连接。
  5. 如权利要求1所述的OLED显示装置，其中，所述OLED显示面板的非出光面的边缘形成有凹槽，所述绑定端子位于所述凹槽内。
  6. 一种OLED显示装置的制作方法，包括如下步骤：
    步骤S1、制作OLED显示面板，所述OLED显示面板具有出光面及与所述出光面相背的非出光面；
    步骤S2、在所述非出光面上形成绑定端子；
    步骤S3、提供一驱动模块，将所述驱动模块绑定于所述绑定端子上。
  7. 如权利要求6所述的OLED显示装置的制作方法，其中，所述步骤S1具体包括：
    提供一硬质基板，在所述硬质基板上形成柔性衬底;
    在所述柔性衬底上形成驱动电路层；
    在所述驱动电路层上形成OLED层；
    在所述OLED层上形成薄膜封装层。
  8. 如权利要求7所述的OLED显示装置的制作方法，其中，所述步骤S1中制作的OLED显示面板为底发光型OLED显示面板，其出光面为所述柔性衬底远离所述薄膜封装层的一侧表面，非出光面为薄膜封装层远离所述柔性衬底的一侧表面；
    所述步骤S2具体包括：
    在所述薄膜封装层远离所述柔性衬底的一侧表面形成绑定端子，所述绑定端子通过穿越所述薄膜封装层及OLED层的第一过孔与所述驱动电路层电性连接；
    将柔性衬底从所述硬质基板剥离。
  9. 如权利要求7所述的OLED显示装置的制作方法，其中，所述步骤S1中制作的OLED显示面板为顶发光型OLED显示面板，其出光面为薄膜封装层远离所述柔性衬底的一侧表面，非出光面为所述柔性衬底远离所述薄膜封装层的一侧表面；
    所述步骤S2具体包括：
    将柔性衬底从所述硬质基板剥离；
    在所述柔性衬底远离所述薄膜封装层的一侧表面形成绑定端子，所述绑定端子通过穿越所述柔性衬底的第二过孔与所述驱动电路层电性连接。
  10. 如权利要求6所述的OLED显示装置的制作方法，其中，所述步骤S2具体包括：在所述OLED显示面板的非出光面的边缘形成凹槽，在所述凹槽内形成绑定端子。
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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110379312B (zh) * 2019-07-23 2022-01-14 广州国显科技有限公司 一种显示装置和显示设备
EP4089733A4 (en) * 2020-01-10 2022-12-28 BOE Technology Group Co., Ltd. DISPLAY PANEL AND DISPLAY DEVICE
CN111403447A (zh) * 2020-03-24 2020-07-10 武汉华星光电半导体显示技术有限公司 一种显示面板、其制备方法以及显示装置
CN111724742B (zh) * 2020-06-11 2022-02-22 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法、显示装置
CN115241261A (zh) * 2022-08-05 2022-10-25 武汉华星光电半导体显示技术有限公司 显示面板与显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170077213A1 (en) * 2015-09-14 2017-03-16 Samsung Display Co., Ltd. Display device
CN107482041A (zh) * 2017-08-16 2017-12-15 武汉天马微电子有限公司 柔性显示面板与柔性显示装置
CN107658330A (zh) * 2017-09-06 2018-02-02 广东欧珀移动通信有限公司 Oled显示面板、移动终端及制造方法
CN107863452A (zh) * 2017-11-02 2018-03-30 武汉华星光电技术有限公司 柔性显示装置
CN107942563A (zh) * 2017-11-28 2018-04-20 武汉天马微电子有限公司 显示模组和显示装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018042284A1 (en) * 2016-08-31 2018-03-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170077213A1 (en) * 2015-09-14 2017-03-16 Samsung Display Co., Ltd. Display device
CN107482041A (zh) * 2017-08-16 2017-12-15 武汉天马微电子有限公司 柔性显示面板与柔性显示装置
CN107658330A (zh) * 2017-09-06 2018-02-02 广东欧珀移动通信有限公司 Oled显示面板、移动终端及制造方法
CN107863452A (zh) * 2017-11-02 2018-03-30 武汉华星光电技术有限公司 柔性显示装置
CN107942563A (zh) * 2017-11-28 2018-04-20 武汉天马微电子有限公司 显示模组和显示装置

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