WO2022196392A1 - Composition de résine pour substrat de film de découpage en dés, substrat de film de découpage en dés et film de découpage en dés - Google Patents

Composition de résine pour substrat de film de découpage en dés, substrat de film de découpage en dés et film de découpage en dés Download PDF

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Publication number
WO2022196392A1
WO2022196392A1 PCT/JP2022/009398 JP2022009398W WO2022196392A1 WO 2022196392 A1 WO2022196392 A1 WO 2022196392A1 JP 2022009398 W JP2022009398 W JP 2022009398W WO 2022196392 A1 WO2022196392 A1 WO 2022196392A1
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Prior art keywords
dicing film
resin composition
film substrate
styrene
unsaturated carboxylic
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PCT/JP2022/009398
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English (en)
Japanese (ja)
Inventor
重則 中野
孝一 西嶋
雅巳 佐久間
博樹 ▲高▼岡
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三井・ダウポリケミカル株式会社
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Priority to CN202280021186.1A priority Critical patent/CN117063262A/zh
Priority to JP2023506968A priority patent/JPWO2022196392A1/ja
Priority to KR1020237030144A priority patent/KR20230138017A/ko
Publication of WO2022196392A1 publication Critical patent/WO2022196392A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869—Acids or derivatives thereof
    • C08L23/0876—Neutralised polymers, i.e. ionomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0869—Acids or derivatives thereof
    • C09J123/0876—Neutralised polymers, i.e. ionomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Definitions

  • the present invention relates to a resin composition for a dicing film substrate, a dicing film substrate, and a dicing film.
  • Patent Literature 1 describes a radiation-curable adhesive tape for wafer processing containing an antistatic resin containing a polyether component and the ionomer.
  • Patent Document 2 describes a resin composition for a dicing film substrate containing the ionomer, ethylene, (meth)acrylic acid, and a copolymer of (meth)acrylic acid alkyl ester.
  • the dicing film around the chips stretches sufficiently (hereinafter also referred to as "normal temperature elongation"). If the dicing film is not stretched sufficiently and a plurality of chips are pushed up by the fine pins, a phenomenon may occur in which chips that are not to be picked up are separated from the dicing film. In addition, if the dicing film has low elongation at room temperature, stress may be applied to the chip during the pick-up process, which may cause breakage within the chip. When these problems occur, the product yield decreases and product defects increase.
  • a resin composition containing an ionomer (A), a polyamide (B), and a styrenic resin (C) has good compatibility, and the characteristics of each material can be improved without reducing the homogeneity. It is possible to maintain Each component contained in the resin composition will be described below, and then the physical properties of the resin composition will be described.
  • the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer (hereinafter also simply referred to as "ionomer (A)" is an ethylene/unsaturated carboxylic acid copolymer in which part or all of the acid is a metal ion and has a structure in which a plurality of ethylene-unsaturated carboxylic acid copolymers are crosslinked.
  • the resin composition may contain only one ionomer (A), or may contain two or more kinds of ionomers (A). You can stay.
  • the ethylene/unsaturated carboxylic acid-based copolymer may be a block copolymer or a random copolymer.
  • the ethylene/unsaturated carboxylic acid-based copolymer may also be a graft copolymer obtained by graft-polymerizing a known compound to a random polymer or block polymer.
  • unsaturated carboxylic acid esters include unsaturated carboxylic acid alkyl esters having an alkyl group having 1 to 12 carbon atoms in the ester moiety. The number of carbon atoms in the alkyl group is more preferably 1-8, more preferably 1-4.
  • alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, 2-ethylhexyl, isooctyl groups and the like.
  • ethylene/unsaturated carboxylic acid copolymer examples include binary copolymers such as ethylene/acrylic acid copolymer and ethylene/methacrylic acid copolymer; ethylene/methacrylic acid/acrylic acid Terpolymers such as n-butyl copolymers and ethylene/methacrylic acid/isobutyl acrylate copolymers;
  • the ionomer (A) of the present invention is obtained by cross-linking (neutralizing) the carboxyl groups contained in the ethylene/unsaturated carboxylic acid copolymer with metal ions at an arbitrary ratio.
  • the amount of structural units derived from other monomers is preferably 1% by mass or more and 20% by mass or less, more preferably 5% by mass or more and 15% by mass or less, relative to all the structural units of the unsaturated carboxylic acid-based copolymer.
  • the amount of structural units derived from other monomers is 1% by mass or more, elongation when the resin composition is used as a base material for a dicing film tends to be good.
  • the amount of structural units derived from other monomers is 20% by mass or less
  • the base material is difficult to block, and fusion and the like are also likely to occur. Hard to come by.
  • the content of the ionomer (A) in the resin composition is 30 parts by mass with respect to a total of 100 parts by mass of the ionomer (A), the polyamide (B) described later, and the styrene resin (C) described later.
  • 95 mass parts or less is preferable, 40 mass parts or more and 90 mass parts or less are preferable, and 45 mass parts or more and 90 mass parts or less are more preferable.
  • the amount of the ionomer (A) is 30 parts by mass or more, the elongation at room temperature and the elongation at low temperature of the substrate obtained from the resin composition are improved.
  • the amount of the ionomer (A) is 95 parts by mass or less, the amounts of the polyamide (B) and the styrene resin (C) are relatively large enough, and the substrate obtained from the resin composition And the modulus strength at low temperature and the elongation at normal temperature and low temperature are improved.
  • Polyamide (B) may be a resin containing two or more amide groups.
  • the ionomer (A) described above tends to have a low melting point and low heat resistance. The heat resistance of the substrate for the dicing film becomes very good. Further, when the ionomer (A) and the polyamide (B) are combined, good modulus strength and severability can be obtained when the resin composition is used as a base material for a dicing film.
  • the melting point of the polyamide (B) is preferably 160°C or higher and 250°C or lower, more preferably 170°C or higher and 240°C or lower, and even more preferably 180°C or higher and 235°C or lower.
  • the melting point of the polyamide (B) is measured, for example, by a differential scanning calorimeter (DSC) or the like.
  • styrene-based elastomers examples include block copolymers containing a hard segment composed of a styrene block (styrene polymer) and a soft segment composed of an alkylene block, or hydrogenated products thereof; random copolymers of styrene and alkylene; A polymer or a hydrogenated product thereof; or an acid-modified styrene-based elastomer obtained by acid-modifying the styrene-based elastomer.
  • styrene-based elastomers include block copolymers containing a hard segment composed of a styrene block (styrene polymer) and a soft segment composed of an alkylene block, or hydrogenated products thereof; random copolymers of styrene and alkylene; A polymer or a hydrogenated product thereof; or an acid-modified styrene-based elastomer obtained by acid-modifying the st
  • examples of styrene-based elastomers include random copolymers of styrene and alkylene. Examples include styrene-butadiene random copolymers, styrene-isoprene random copolymers, styrene-ethylene-butylene random copolymers, styrene-ethylene-propylene random copolymers, styrene-isobutylene random copolymers, styrene - including ethylene-isoprene random copolymers.
  • the acid-modified styrene-based elastomer can be obtained by graft-polymerizing the block copolymer, random copolymer, or the like with an unsaturated carboxylic acid or a derivative thereof in the presence of a radical initiator.
  • a radical initiator Any known radical initiator can be used as long as it is used for the graft reaction of polyolefins.
  • UV absorbers examples include benzophenone-based, benzoate-based, benzotriazole-based, cyanoacrylate-based, hindered amine-based, and the like.
  • additives are appropriately selected according to their type.
  • the melt flow rate of the resin composition measured at 230°C and a load of 2160 g is 0.1 g/10 min or more and 30 g/10 min or less. is preferred, 0.2 g/10 min or more and 15 g/10 min or less is more preferred, 0.5 g/10 min or more and 10 g/10 min or less is even more preferred, and 1.0 g/10 min or more and 7 g/10 min or less is even more preferred.
  • the melt flow rate of the resin composition is within this range, the modulus strength at room temperature and low temperature and the elongation at room temperature and low temperature of the substrate obtained from the resin composition tend to be good.
  • the average value of the 25% modulus in the MD direction (machine direction) and the 25% modulus in the TD direction (transverse direction) measured at 23°C of the layer containing the resin composition is preferably 7 MPa or more and 13 MPa or less, and 8 MPa or more and 12 MPa. The following are more preferred.
  • the dicing film substrate tends to have good elongation at room temperature.
  • the above 25% modulus is obtained by preparing a film having a thickness of 100 ⁇ m, a length in the TD direction of 10 mm, and a length in the MD direction of 180 mm, which has the same composition as the layer containing the resin composition. -3: Equivalent to 1995), and is a value measured by a Shimadzu desk-top precision universal testing machine AG-X, which is a measuring device.
  • the test speed shall be 300 mm/min.
  • ethylene/unsaturated carboxylic acid/unsaturated carboxylic acid alkyl ester terpolymer or its ionomer ethylene/unsaturated carboxylic acid alkyl ester copolymer, ethylene/vinyl ester copolymer, ethylene/unsaturated carboxylic acid alkyl ester Layers containing ester-carbon monoxide copolymers, unsaturated carboxylic acid grafts thereof, polyvinyl chloride and the like are included.
  • the other resin layer may contain only one type of the above resin, or may contain two or more types thereof.
  • the thickness of the other resin layer is not particularly limited, it is preferably 10 ⁇ m or more and 100 ⁇ m or less, more preferably 15 ⁇ m or more and 80 ⁇ m or less, from the viewpoint of not impairing the modulus strength and elongation of the layer containing the resin composition.
  • the thickness of the entire dicing film substrate is preferably 50 ⁇ m or more from the viewpoint of frame retention during dicing, and 200 ⁇ m or less from the viewpoint of extensibility (expandability), considering that it is used as a constituent member of the dicing film.
  • the dicing film substrate is a laminate of a layer containing the above resin composition and another resin layer
  • either one of the layer containing the above resin composition and the other resin layer is Alternatively, one layer may be formed first, and the other layer may be formed on the one layer by using a T-die film forming machine, an extrusion coating forming machine, or the like, and laminated.
  • the dicing film of the present invention only needs to comprise the above-described dicing film substrate and an adhesive layer laminated on at least one surface thereof, and may contain other configurations as necessary. .
  • the dicing film substrate is composed of multiple layers, it is preferable that the layer containing the resin composition in the dicing film substrate and the adhesive layer are laminated.
  • the adhesive that constitutes the adhesive layer can be the adhesive for the adhesive layer of a general dicing film.
  • adhesives include rubber-based, acrylic-based, silicone-based, and polyvinyl ether-based adhesives; radiation-curable adhesives; heat-foaming adhesives, and the like.
  • the adhesive layer preferably contains a radiation-curable adhesive, and more preferably contains an ultraviolet-curable adhesive.
  • UV-curable adhesives usually contain a radically polymerizable compound (which may be a monomer, an oligomer, or a polymer) and a photopolymerization initiator, and optionally a crosslinking agent, a tackifier, and a filler. agents, anti-aging agents, and additives such as coloring agents.
  • radically polymerizable compounds include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, (meth)acrylic Monomers or oligomers of (meth)acrylic acid alkyl esters such as isononyl acid; (meth)acrylate hydroxyalkyl esters such as hydroxyethyl (meth)acrylate, hydroxybutyl (meth)acrylate, and hydroxyhexyl (meth)acrylate Monomers or oligomers; the above (meth)acrylic acid alkyl esters and/or (meth)acrylic acid hydroxyalkyl esters and other monomers such as (meth)acrylic acid, itaconic acid, maleic anhydride, (meth)acrylic acid amide, (meth)acrylic acid N-hydroxymethylamide, (meth)acrylic acid alkyl
  • cross-linking agents examples include polyisocyanate compounds, melamine resins, urea resins, polyamines, and carboxyl group-containing polymers.
  • the thickness of the adhesive layer is appropriately selected according to the type of adhesive, preferably 3 to 100 ⁇ m, more preferably 3 to 50 ⁇ m.
  • the adhesive layer of the dicing film may be protected by a separator.
  • the surface of the adhesive layer can be kept smooth.
  • the dicing film can be easily handled and transported, and a label can be processed on the separator. The separator is peeled off when using the dicing film.
  • the method for producing the dicing film is not particularly limited, and for example, it may be produced by applying an adhesive to the above-mentioned dicing base material by a known method.
  • the adhesive can be applied by a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, or the like.
  • an adhesive layer may be formed by applying an adhesive onto a release sheet, and the adhesive layer may be transferred to the dicing film substrate to laminate the dicing film substrate and the adhesive layer.
  • the dicing film base material and the adhesive layer may be formed at the same time by co-extrusion or the like.
  • Styrene resin 1 SEBS (styrene-ethylene-butylene-styrene block copolymer (manufactured by Asahi Kasei Chemicals, SOE S1611 (trade name), JIS K 7210: 1999 (equivalent to ISO 1133: 1997) , MFR measured at 230 ° C., 2160 g load: 12.0 g / 10 minutes, Tan ⁇ peak temperature: 9 ° C.)
  • Styrene resin 2 HSBR (hydrogenated styrene-butadiene random copolymer (manufactured by JSR, DYNARON 1320P (trade name), JIS K 7210: 1999 (equivalent to ISO 1133: 1997), 230 ° C.
  • Styrene resin 3 SEBS (styrene-ethylene-butylene-styrene block copolymer (manufactured by Asahi Kasei Chemicals, Tuftec H1041 (trade name), JIS K 7210: 1999 (equivalent to ISO 1133: 1997), 230 ° C., MFR measured at 2160 g load: 5.0 g/10 min, Tan ⁇ peak temperature: -45 ° C.)
  • Styrene resin 4 acid-modified SEBS (maleic anhydride-modified styrene-ethylene-butylene-styrene block copolymer (manufactured by Asahi Kasei Chemicals, Tuftec M1913 (trade name), acid value: 10 mg CH 3 ONa/g, JIS K 7210 : 1999 (equivalent to ISO 1133:1997), MFR
  • EMAA ethylene/methacrylic acid copolymer (content of structural units derived from ethylene: 91% by mass, content of structural units derived from methacrylic acid: 9% by mass, JIS K 7210: 1999 (ISO 1133: 1997), MFR measured at 190 ° C., 2160 g load: 3 g / 10 minutes)
  • TPU Thermoplastic polyurethane elastomer (manufactured by Tosoh Corporation, Miractran P485RSUI (trade name))
  • Example 1 An ethylene/unsaturated carboxylic acid copolymer ionomer (A), a polyamide (B), and a styrene resin (C) were dry-blended at the ratios (mass ratios) shown in Table 1.
  • the dry-blended mixture was put into the resin inlet of a 30 mm ⁇ twin-screw extruder and melt-kneaded at a die temperature of 230° C. to obtain a resin composition for a dicing film substrate.
  • the obtained resin composition for a dicing film substrate was measured for MFR at 230° C. (190° C. only in Comparative Example 1) under a load of 2160 g in accordance with JIS K 7210:1999 (corresponding to ISO 1133:1997). Table 1 shows the results.
  • the obtained resin composition for a dicing film substrate was molded at a processing temperature of 230° C. using a 40 mm ⁇ T die film molding machine to prepare a T die film having a thickness of 100 ⁇ m.
  • the resulting T-die film was used as a dicing film substrate and evaluated by the following methods. Table 1 shows the results.
  • the 25% modulus in the MD direction and the 25% modulus in the TD direction obtained by the above tests were averaged, and the room temperature modulus strength of the dicing film substrate was evaluated according to the following criteria.
  • the dicing film substrate was cut into strips of 10 mm width ⁇ 180 mm length.
  • JIS K 7127: 1999 (equivalent to ISO 527-3: 1995)
  • the 10% modulus was measured at -15°C.
  • the chuck-to-chuck distance was 100 mm, and the test speed was 500 mm/min.
  • the 10% modulus in the MD direction and the 10% modulus in the TD direction obtained by the above tests were averaged, and the low-temperature modulus strength of the dicing film substrate was evaluated according to the following criteria.
  • the room-temperature elongation of the dicing film substrate was evaluated according to the following criteria.
  • the low-temperature elongation of the dicing film substrate was evaluated according to the following criteria.
  • the dicing film substrate using the resin composition for material was excellent in room-temperature modulus strength, low-temperature modulus strength, room-temperature elongation, and low-temperature elongation.
  • Comparative Example 1 which does not contain polyamide (B) and styrene-based resin (C)
  • Comparative Example 2 which did not contain polyamide (B)
  • the low-temperature modulus strength was low.
  • Comparative Example 3 which does not contain the styrene-based resin (C)
  • both room-temperature elongation and low-temperature elongation were low.
  • Comparative Examples 4 to 7 which did not contain the ionomer (A) of the ethylene/unsaturated carboxylic acid copolymer, both the normal temperature elongation and the low temperature elongation were low.
  • the resin composition for a dicing film substrate of the present invention can realize a dicing film substrate excellent in room-temperature modulus strength, low-temperature modulus strength, room-temperature elongation, and low-temperature elongation. .
  • a dicing film substrate having excellent elongation at room temperature and low temperature and also excellent modulus strength at room temperature and low temperature is realized. Therefore, it is very useful in the field of manufacturing semiconductor devices.

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  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Compositions Of Macromolecular Compounds (AREA)
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Abstract

La présente invention aborde le problème de la fourniture d'une composition de résine pour le découpage en dés de substrats de film qui est apte à former des substrats de film de découpage en dés excellents en termes d'étirabilité à une température ordinaire et à une basse température ainsi qu'en termes de résistance à un module à température ordinaire et à basse température. La composition de résine pour le découpage en dés de substrats de film comprend un ionomère (A) d'un copolymère à base d'éthylène/(acide carboxylique insaturé), un polyamide (B) et une résine à base de styrène (C).
PCT/JP2022/009398 2021-03-18 2022-03-04 Composition de résine pour substrat de film de découpage en dés, substrat de film de découpage en dés et film de découpage en dés WO2022196392A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202280021186.1A CN117063262A (zh) 2021-03-18 2022-03-04 切割膜基材用树脂组合物、切割膜基材、及切割膜
JP2023506968A JPWO2022196392A1 (fr) 2021-03-18 2022-03-04
KR1020237030144A KR20230138017A (ko) 2021-03-18 2022-03-04 다이싱 필름 기재용 수지 조성물, 다이싱 필름 기재, 및 다이싱 필름

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JP2021-044998 2021-03-18
JP2021044998 2021-03-18

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WO2022196392A1 true WO2022196392A1 (fr) 2022-09-22

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JP2017098369A (ja) * 2015-11-20 2017-06-01 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム
WO2018123804A1 (fr) * 2016-12-27 2018-07-05 三井・デュポンポリケミカル株式会社 Base de film de découpage en dés et film de découpage en dés
WO2020031928A1 (fr) * 2018-08-08 2020-02-13 三井・ダウポリケミカル株式会社 Composition de résine pour substrat de film de découpage en dés, substrat de film de découpage en dés et film de découpage en dés

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Publication number Priority date Publication date Assignee Title
JP2011210887A (ja) 2010-03-29 2011-10-20 Furukawa Electric Co Ltd:The 放射線硬化型ウエハ加工用粘着テープ
JP5666875B2 (ja) 2010-10-21 2015-02-12 アキレス株式会社 半導体製造工程用テープの基材フィルム

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2017098369A (ja) * 2015-11-20 2017-06-01 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム
WO2018123804A1 (fr) * 2016-12-27 2018-07-05 三井・デュポンポリケミカル株式会社 Base de film de découpage en dés et film de découpage en dés
WO2020031928A1 (fr) * 2018-08-08 2020-02-13 三井・ダウポリケミカル株式会社 Composition de résine pour substrat de film de découpage en dés, substrat de film de découpage en dés et film de découpage en dés

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