WO2022034808A1 - Système de traitement, procédé de réglage d'inclinaison et support de stockage informatique - Google Patents

Système de traitement, procédé de réglage d'inclinaison et support de stockage informatique Download PDF

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Publication number
WO2022034808A1
WO2022034808A1 PCT/JP2021/028333 JP2021028333W WO2022034808A1 WO 2022034808 A1 WO2022034808 A1 WO 2022034808A1 JP 2021028333 W JP2021028333 W JP 2021028333W WO 2022034808 A1 WO2022034808 A1 WO 2022034808A1
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WIPO (PCT)
Prior art keywords
unit
holding
processing
distance information
input
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Application number
PCT/JP2021/028333
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English (en)
Japanese (ja)
Inventor
信貴 福永
正和 鎗光
Original Assignee
東京エレクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 東京エレクトロン株式会社 filed Critical 東京エレクトロン株式会社
Priority to CN202180059860.0A priority Critical patent/CN116133792A/zh
Priority to JP2022542796A priority patent/JPWO2022034808A1/ja
Publication of WO2022034808A1 publication Critical patent/WO2022034808A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • This disclosure relates to a processing system, an inclination adjustment method, and a computer storage medium.
  • Patent Document 1 describes a height measuring device mounting portion for mounting a height measuring device for measuring a height position of a holding surface of a chuck table with respect to a support surface supporting a grinding wheel, which is a grinding device for grinding a plate-shaped workpiece. It is disclosed that the height position of the holding surface is measured by scanning the rotation trajectory of the grinding wheel on the holding surface with the height measuring device.
  • the technique according to the present disclosure appropriately determines the relative inclination between the grinding surface of the grinding part for grinding the processing object and the holding surface of the holding part for holding the processing object in the processing system for grinding the processing object. Adjust to.
  • One aspect of the present disclosure is a processing system for a processing target, which is held by a holding portion that holds the processing target on the upper surface, a holding base that holds the holding portion on the upper surface, and the holding portion.
  • a processing portion for processing the processing target an inclination adjusting portion for adjusting the relative inclination between the holding portion or the holding base, and the processing portion, the holding portion, the holding base, and the processing portion.
  • an information display unit that displays information about the tilt adjusting unit, and the information display unit is an input for inputting relative distance information between the holding unit or the holding base and the processing unit.
  • a unit and an instruction unit for starting the operation of the tilt adjusting unit are displayed on the same screen.
  • the relative inclination between the grinding surface of the grinding part for grinding the object to be processed and the holding surface of the holding part for holding the object to be processed is appropriately set. Can be adjusted.
  • a semiconductor substrate (hereinafter referred to as "wafer") in which a plurality of devices such as electronic circuits are formed on the surface is ground to thin the wafer. Is being done.
  • the grinding of the wafer is performed, for example, by bringing the grinding wheel of the grinding means into contact with the grinding surface of the wafer while rotating the holding means while holding the surface opposite to the grinding surface of the wafer by the holding means. ..
  • Patent Document 1 discloses a grinding device that makes adjustments for making the holding surface parallel to the grinding surface with high accuracy.
  • the grinding apparatus disclosed in Patent Document 1 the height of the holding surface of the chuck table with respect to the supporting surface (grinding surface) of the wheel mount by using the height measuring instrument attached to the wheel mount supporting the grinding wheel. The position is measured, and the relative inclination of the holding surface and the grinding surface is adjusted based on the measured value by the height measuring device.
  • a grinding surface of a grinding portion for grinding the object to be processed and a holding portion for holding the object to be processed are provided. Adjust the relative inclination with the holding surface appropriately.
  • the processing apparatus as a processing system according to the present embodiment and the relative inclination adjustment operation between the holding surface and the ground surface (hereinafter, may be simply referred to as “inclination adjustment operation”) will be referred to with reference to the drawings. I will explain while. In the present specification and the drawings, the elements having substantially the same functional configuration are designated by the same reference numerals, so that duplicate description will be omitted.
  • processing for uniformly controlling the in-plane thickness of the wafer W as the processing target specifically, tilt adjustment operation of the holding surface and the grinding surface is performed. More specifically, for example, when grinding a wafer W, the holding surface of the chuck as a holding portion for holding the wafer W and the grinding surface of the grinding portion for processing the wafer W are adjusted in parallel. Further, for example, the chuck can be obtained by adjusting the relative inclination between the holding surface of the new chuck after replacement and the grinding surface of the grinding portion and performing self-grinding of the chuck using the grinding portion in such a state. The wafer W is processed into a desired shape for proper grinding.
  • the processing apparatus 1 has a configuration in which the loading / unloading station 2 and the processing station 3 are integrally connected.
  • a cassette C capable of accommodating a plurality of wafers W is loaded / unloaded from the outside.
  • the processing station 3 includes various processing devices that perform desired processing on the wafer W.
  • the loading / unloading station 2 is provided with a cassette mounting table 10. Further, on the Y-axis positive direction side of the cassette mounting table 10, a wafer transfer area 20 is provided adjacent to the cassette mounting table 10. The wafer transfer region 20 is provided with a wafer transfer device 22 configured to be movable on a transfer path 21 extending in the X-axis direction.
  • the wafer transfer device 22 has a transfer fork 23 that holds and conveys the wafer W.
  • the transport fork 23 is configured to be movable in the horizontal direction, the vertical direction, the horizontal axis, and the vertical axis.
  • the wafer transfer device 22 is configured to be able to transfer the wafer W to the cassette C of the cassette mounting table 10, the alignment unit 50 described later, and the first cleaning unit 60 described later.
  • the processing station 3 includes a transport unit 30 that transports the wafer W, a grinding unit 40 that grinds the wafer W, an alignment unit 50 that adjusts the horizontal orientation of the wafer W before the grinding process, and a wafer W after the grinding process. It has a first cleaning unit 60 and a second cleaning unit 70 for cleaning the wafer.
  • the transport unit 30 is an articulated robot equipped with a plurality of, for example, three arms 31. Each of the three arms 31 is configured to be rotatable. A transport pad 32 that attracts and holds the wafer W is attached to the arm 31 at the tip. Further, the arm 31 at the base end is attached to an elevating mechanism 33 that elevates and elevates the arm 31 in the vertical direction.
  • the transfer unit 30 is configured to be able to transfer the wafer W to the delivery position A0 of the grinding unit 40, the alignment unit 50, the first cleaning unit 60, and the second cleaning unit 70.
  • the grinding unit 40 is provided with a rotary table 41.
  • a rotary table 41 On the rotary table 41, four chucks 42 as holding portions for sucking and holding the wafer W are provided.
  • a porous chuck is used for the chuck 42 to adsorb and hold the surface of the wafer W.
  • the surface of the chuck 42 that is, the holding surface of the wafer W, has a convex shape in which the central portion protrudes from the end portion in the side view.
  • the protrusion of the central portion is minute, in the illustration of the following description, the protrusion of the central portion of the chuck 42 may be shown large for the sake of clarity of the explanation.
  • the chuck 42 is held by the chuck base 43 as a holding base.
  • the chuck base 43 is provided with an inclination adjusting unit 44 for adjusting the relative inclination of each grinding unit (coarse grinding unit 80, medium grinding unit 90, and finish grinding unit 100) and the chuck 42.
  • the tilt adjusting unit 44 has a fixed shaft 45 provided on the lower surface of the chuck base 43 and a plurality of, for example, two elevating shafts 46.
  • Each elevating shaft 46 is configured to be expandable and contractible, and elevates and elevates the chuck base 43.
  • the tilt adjusting portion 44 raises and lowers the other end of the chuck base 43 in the vertical direction by the elevating shaft 46 from one end (position corresponding to the fixed shaft 45) of the outer peripheral portion of the chuck base 43, whereby the chuck 42 and the chuck base are raised and lowered. 43 can be tilted. As a result, the relative inclination between each of the ground parts (grinding surface) at the machining positions A1 to A3 and the surface (holding surface) of the chuck 42 can be adjusted.
  • the configuration of the tilt adjusting unit 44 is not limited to this, and can be arbitrarily selected as long as the relative angle (parallelism) of the surface (holding surface) of the chuck 42 with respect to each grinding unit (grinding surface) can be adjusted. can.
  • the four chucks 42 can be moved to the delivery position A0 and the processing positions A1 to A3 by rotating the rotary table 41. Further, each of the four chucks 42 is configured to be rotatable around a vertical axis by a rotation mechanism (not shown).
  • the wafer W is delivered by the transport unit 30.
  • a rough grinding portion 80 is arranged at the processing position A1 to roughly grind the wafer W.
  • a medium grinding unit 90 is arranged at the processing position A2, and the wafer W is medium-grinded.
  • a finish grinding unit 100 is arranged at the processing position A3 to finish grind the wafer W.
  • the rough grinding portion 80 rotates a rough grinding wheel 81 having an annular rough grinding wheel on the lower surface, a mount 82 for supporting the rough grinding wheel 81, and a rough grinding wheel 81 via the mount 82. It has a spindle 83 to be made to move, and a drive unit 84 including, for example, a motor (not shown). Further, on the outer peripheral surface of the mount 82, a mounting portion 85 for mounting a measuring instrument 110 for measuring the relative distance between the lower surface (grinding surface) of the rough grinding wheel 81 and the surface (holding surface) of the chuck 42 is provided. It is formed. Further, the rough grinding portion 80 is configured to be movable in the vertical direction along the support column 86 shown in FIG.
  • the holding surface of the chuck 42 has a convex shape. Therefore, in the rough grinding process of the wafer W using the rough grinding portion 80, as shown by the thick line portion in FIG. 3, a part of the annular rough grinding wheel comes into contact with the wafer W as a processing point. More specifically, the annular rough grinding wheel and the outer peripheral end portion of the wafer W are in contact with each other in an arcuate shape, and the chuck 42 and the rough grinding wheel 81 are rotated in such a state to rotate the wafer W. The entire surface is ground.
  • the measuring instrument 110 is connected to the mounting portion 85 of the mount 82 with the rough grinding wheel 81 removed from the mount 82.
  • the measurement point of the measuring instrument 110 is set to the same height as the grinding surface height of the rough grinding wheel 81, and the outer edge of the rough grinding wheel 81 shown in FIG. 4 (outer edge of the grinding position) as the mount 82 (spindle 83) rotates.
  • Rotates along an arcuate linear region corresponding to hereinafter, may be referred to as “measurement region R”), whereby the relative distance between the holding surface or the upper surface of the chuck base 43 and the grinding surface is determined. Measure along the measurement area R.
  • the relative distance between the holding surface or the upper surface of the chuck base 43 and the grinding surface measured by the measuring instrument 110 is displayed on, for example, a display unit 110a provided on the measuring instrument 110.
  • the end portion on the upstream side in the rotation direction of the mount 82 in the arcuate measurement region R is the “measurement end portion Ra”
  • the end portion on the downstream side in the rotation direction of the mount 82 is the “measurement other end portion Rb”.
  • the intermediate point (center portion of the chuck 42) between the measurement end portion Ra and the measurement end portion Rb may be referred to as "measurement center Rc", respectively.
  • the type of the measuring instrument 110 attached to the attachment portion 85 is not particularly limited and can be arbitrarily selected.
  • a contact-type measuring instrument that measures the relative distance to the grinding surface by coming into contact with the holding surface can be used.
  • a non-contact measuring instrument that measures the relative distance to the grinding surface by irradiating the holding surface with sensor light and detecting the reflected light from the holding surface of the sensor light may be used. good.
  • the mounting position of the measuring instrument 110 is not limited to the outer peripheral surface of the mount 82 as described above, and if the measurement point can be set to the same height as the grinding surface height of the rough grinding wheel 81, for example, on the lower surface of the mount 82. It may be configured to be mountable.
  • the medium grinding unit 90 has the same configuration as the rough grinding unit 80. That is, the medium grinding unit 90 has a medium grinding wheel 91 including an annular medium grinding wheel, a mount 92, a spindle 93, a driving unit 94, a mounting unit 95, and a support column 96.
  • the grain size of the grindstone of the medium grinding wheel is smaller than the grain size of the grindstone of the coarse grinding wheel.
  • the finish grinding unit 100 has the same configuration as the rough grinding unit 80 and the medium grinding unit 90. That is, the finish grinding unit 100 has a finish grinding wheel 101 including an annular finish grinding wheel, a mount 102, a spindle 103, a drive unit 104, a mounting unit 105, and a support column 106.
  • the grain size of the grindstone of the finish grinding wheel is smaller than the grain size of the grindstone of the medium grinding wheel.
  • the above processing apparatus 1 is provided with a display panel 120 as an information display unit.
  • the display panel 120 is, for example, a monitor or a touch panel, and may be directly attached to the processing apparatus 1 or may be remotely confirmed.
  • the display panel 120 has a display area 121 for displaying various information related to the tilt adjustment operation between the holding surface and the grinding surface, and an input area 122 for inputting various information related to the tilt adjusting operation.
  • Various information displayed in the display area 121, a switching area 123 for switching the operation mode of the tilt adjustment operation, and an instruction area 124 for executing the tilt adjustment operation in the processing apparatus 1 are displayed on the same screen.
  • the display area 121 for example, information on the chuck 42 as an object for tilt adjustment operation, the arrangement of the chuck 42 (machining position A1 in the example of FIG. 5), and the tilt of the chuck base 43 holding the chuck 42. For example, the height position of the elevating shaft 46 of the tilt adjusting unit 44 provided below the chuck base 43 is displayed.
  • the input area 122 as an input unit, for example, information relating to the relative distance between the holding surface and the ground surface measured by the measuring instrument 110, for example, in the example of FIG. 5, the measured value in the measurement center Rc of the measuring region R. , And the measured value at the other end of the measurement Rb is input by the operator.
  • the operation mode of the inclination adjusting operation between the holding surface and the grinding surface is set between the flat mode Mf described later and the self-grinding mode Mg described later. Switch.
  • the instruction area 124 as the instruction unit starts the operation of the inclination adjustment unit 44 in order to execute the inclination adjustment operation between the holding surface and the grinding surface when the instruction area 124 is selected by the operator, for example.
  • the amount of movement of the elevating shaft 46 of the tilt adjusting unit 44 is increased based on the measured value of the measuring instrument 110 input to the input area 122. calculate. Then, the elevating shaft 46 is automatically moved based on the calculated value, and the relative inclination of the holding surface and the grinding surface is automatically adjusted. At this time, the height position of each of the two elevating shafts 46, that is, the inclination of the holding surface is displayed in real time in the display area 121.
  • the information output to the display panel 120 is not limited to this embodiment and can be set arbitrarily.
  • the processing device 1 described above is provided with a control unit 130.
  • the control unit 130 is, for example, a computer equipped with a CPU, a memory, or the like, and has a program storage unit (not shown).
  • the program storage unit stores a program that controls the processing of the wafer W in the processing apparatus 1. Further, the program storage unit further stores a program for controlling the inclination adjusting operation between the grinding surface and the holding surface, which will be described later.
  • the program may be recorded on a storage medium H readable by a computer and may be installed on the control unit 130 from the storage medium H.
  • the processing apparatus 1 is configured as described above. Next, the inclination adjusting operation performed in the processing apparatus 1 will be described.
  • the operation mode of the inclination adjusting operation as described above, for example, an operation for adjusting the holding surface or the upper surface of the chuck base 43 in parallel with the grinding surface (hereinafter referred to as “flat mode Mf”).
  • flat mode Mf an operation for adjusting the holding surface or the upper surface of the chuck base 43 in parallel with the grinding surface
  • self-grinding mode Mg an operation for processing a new chuck 42 after replacement into a desired convex shape
  • each grinding section (rough grinding section 80, middle grinding section 90, and finish grinding section 100) can be adjusted by the same operation, but in the following description, the rough grinding section 80 as the grinding section.
  • the case of adjusting the relative inclination between the grinding surface and the holding surface of the chuck 42 will be described as an example.
  • the measuring instrument 110 (contact type measuring instrument in this embodiment) is attached to the attachment portion 85 (step S1 in FIG. 6).
  • the measuring instrument 110 is attached to the attachment portion 85, the relative inclination between the upper surface of the chuck base 43 and the ground surface is confirmed prior to the holding of the new chuck 42 by the chuck base 43 (FIG. 6).
  • Step S2 the relative inclination between the upper surface of the chuck base 43 and the ground surface is confirmed prior to the holding of the new chuck 42 by the chuck base 43 (FIG. 6).
  • the switching area 123 displayed on the display panel 120 is selected by the operator, and the operation mode of the inclination adjustment operation is determined to be the flat mode Mf. (Step S2-1 in FIG. 6).
  • the relative distance between the upper surface of the chuck base 43 and the ground surface is measured by the measuring instrument 110, and the distance data D1 is acquired (step S2-2 in FIG. 6). Specifically, the rough grinding portion 80 is lowered along the support column 86 to bring the contact terminal (probe) of the measuring instrument 110 into contact with the upper surface of the chuck base 43, and then the spindle 83 (measuring instrument 110) is moved in this state. While rotating, the measuring instrument 110 measures the relative distance between the upper surface of the chuck base 43 and the ground surface at a plurality of points.
  • the measuring instrument 110 connects the measurement one end Ra and the measurement other end Rb of the chuck base 43 so as to correspond to the measurement region R shown in FIG. 4 on the upper surface of the chuck base 43 by the rotation of the spindle 83. Move in an arc line.
  • step S2-2 described above, as shown in FIG. 7B, the measuring instrument 110 moves on the upper surface of the chuck base 43 along the measurement region R following the inclination of the chuck base 43, and is shown in FIG.
  • the distance data D1 is acquired at at least three points corresponding to the measurement one end Ra, the measurement other end Rb, and the measurement center Rc.
  • the distance data D acquired by the measurement one end Ra, the measurement other end Rb, and the measurement center Rc may be referred to as distance data Da, Db, and Dc, respectively.
  • the distance data D1 acquired by the measuring instrument 110 is displayed on, for example, the display unit 110a or the display panel 120 of the measuring instrument 110, and the display is confirmed, for example, visually by the operator.
  • the distance data D1 displayed on the display unit 110a or the like is adjusted to 0 points with the distance data Da1 measured by the measurement end portion Ra as a reference distance.
  • the distance data Db1 and Dc1 are displayed as the difference values from the distance data Da1 adjusted to 0 points, respectively.
  • the chuck base 43 holds the new chuck 42 (step S5 in FIG. 6).
  • Da1 0, Db1 ⁇ 0, Dc1. ⁇ 0.
  • the distance data Db1 and Dc1 measured by the measuring instrument 110 are input to the input area 122 of the display panel 120 by the operator (step S3-1 in FIG. 6), and then the operator. Selects the instruction area 124 of the display panel 120 (step S3-2 in FIG. 6).
  • Step S4 in FIG. 6 After the parallelism between the upper surface of the chuck base 43 and the grinding surface is adjusted, the self-grinding of the chuck 42 that causes the chuck base 43 to hold the relative inclination between the upper surface of the chuck base 43 and the grinding surface is then maintained. (Step S4 in FIG. 6).
  • Step S4-1 in FIG. 6 When adjusting the inclination between the upper surface of the chuck base 43 and the grinding surface, first, the switching area 123 displayed on the display panel 120 is selected by the operator, and the operation mode of the inclination adjusting operation is switched from the flat mode Mf to the self-grind mode Mg. (Step S4-1 in FIG. 6).
  • the relative distance between the upper surface of the chuck base 43 and the ground surface is measured by the measuring instrument 110, and the distance data D2 is acquired (step S4-2 in FIG. 6).
  • the method of acquiring the distance data D2 is the same as the method of acquiring the distance data D1 in step S2-2. That is, after the contact terminal (probe) of the measuring instrument 110 is brought into contact with the upper surface of the chuck base 43, the upper surface of the chuck base 43 is ground by the measuring instrument 110 while rotating the spindle 83 (measuring instrument 110) in this state. Measure the relative distance to the surface at multiple points.
  • the measuring instrument 110 moves on the holding surface of the chuck 42 or the upper surface of the chuck base 43 along the arcuate measurement region R shown in FIG. 4 by the rotation of the spindle 83.
  • step S4-2 as shown in FIG. 7, distance data Da2, Db2, Dc2 at at least three points including the measurement one end Ra, the measurement other end Rb, and the measurement center Rc in the measurement region R. To get.
  • the distance data D2 acquired by the measuring instrument 110 is displayed on, for example, the display unit 110a or the display panel 120 of the measuring instrument 110, and the display is confirmed, for example, visually by the operator.
  • the distance data D2 notified to the operator is adjusted to 0 points with the distance data Da2 measured at one end of the measurement Ra as a reference distance.
  • the distance data Db2 and Dc2 are displayed as the difference values from the distance data Da2 adjusted to 0 points, respectively.
  • the chuck 42 is machined into a substantially conical shape having a convex holding surface, so that the relative inclination between the holding surface and the ground surface is determined by the chuck. It is necessary to adjust to the desired inclination for processing 42. Therefore, in the tilt adjustment operation as the self-grind mode Mg according to the present embodiment, the tilt adjustment of the chuck 42 is performed based on the distance data D2 acquired in step S4-2.
  • the distance data Db2 and Dc2 measured by the measuring instrument 110 are input to the input area 122 of the display panel 120 by the operator (step S4-3 in FIG. 6), and then the display panel 120 by the operator.
  • the designated area 124 is selected (step S4-4 in FIG. 6).
  • the amount of movement (elevation) of the two elevating shafts 46 of the tilt adjusting unit 44 is automatically calculated based on the distance data Db2 and Dc2 input to the input area 122. (Step S4-5 in FIG. 6). Specifically, when the relative inclination between the upper surface of the chuck base 43 and the ground surface becomes the desired inclination shown in FIG. 8, more specifically, the chuck base 43 is arranged at the desired inclination. The amount of movement of the elevating shafts 46 is automatically calculated with the height positions of the two elevating shafts 46 as the target positions. When the amount of movement of the elevating shaft 46 is calculated, the operation of the tilt adjusting unit 44 is started.
  • the measuring instrument 110 is removed from the mounting portion 85, and then the rough grinding wheel 81 is attached to the rough grinding portion 80. After that, as shown in FIGS. 3 and 8A, a part of the annular rough grinding wheel is brought into contact with the holding surface of the chuck 42, and the chuck 42 and the rough grinding wheel 81 are rotated in such a state. Then, as shown in FIGS. 8 (b) and 8 (c), the chuck 42 is processed into a desired substantially conical shape.
  • the chuck 42 is held by the chuck base 43 (step S5 in FIG. 6).
  • the holding timing of the chuck 42 is not limited to this. That is, for example, the parallelism between the upper surface of the chuck base 43 and the grinding surface is adjusted (step S3 in FIG. 6), the chuck 42 is held by the chuck base 43 (step S5 in FIG. 6), and then the chuck 42 is held.
  • the relative inclination of the surface and the ground surface may be adjusted for self-grinding (corresponding to step S4 in FIG. 6).
  • the self-grinding mode Mg is used for the inclination adjustment operation in the processing apparatus 1 has been described as an example.
  • the holding surface of the chuck 42 and the grinding are performed.
  • the tilt adjustment operation as the flat mode Mf for adjusting the surface in parallel can be performed.
  • the tilt adjustment operation as the flat mode Mf for adjusting the holding surface and the grinding surface of the chuck 42 in parallel is the tilt adjusting operation of the upper surface of the chuck base 43 and the grinding surface according to steps S1 to S3 of FIG. 6 described above. It is done by the same method as.
  • step S1 the relative inclination between the holding surface of the chuck 42 held by the chuck base 43 and the ground surface is confirmed (step S2 in FIG. 6).
  • the measurement is performed after the operation mode of the inclination adjustment operation is determined to be the flat mode Mf by selecting the switching area 123 (step S2-1 in FIG. 6).
  • the relative distance between the holding surface and the ground surface is measured by the device 110, and the distance data D3 (distance data Da3, Db3, Dc3) is acquired (step S2-2 in FIG. 6).
  • the distance data D3 acquired by the measuring instrument 110 is displayed on, for example, the display unit 110a or the display panel 120 of the measuring instrument 110, and the display is confirmed by, for example, the operator's visual inspection.
  • the distance data D3 notified to the operator is adjusted to 0 points with the distance data Da3 as a reference distance, and the distance data Db3 and Dc3 are displayed as difference values from the distance data Da3 adjusted to 0 points, respectively.
  • step S3 in FIG. 6 the inclination of the holding surface and the grinding surface of the chuck 42 is adjusted based on the distance data D3 acquired by the measuring instrument 110 (step S3 in FIG. 6).
  • the distance data Db3 and Dc3 measured by the measuring instrument 110 are input to the input area 122 by the operator (step S3- in FIG. 6). 1) Subsequently, the designated area 124 is selected (step S3-2 in FIG. 6).
  • step S3-4 in FIG. 6 the holding surface of the chuck 42 is adjusted in parallel with the grinding surface. In this way, the tilt adjustment operation as a series of flat mode Mf in the processing apparatus 1 is completed.
  • the inclination adjusting operation according to the present embodiment, only by selecting the designated area 124 after inputting the distance data D which is the measured value into the input area 122, the holding surface of the chuck 42 and the ground surface are relative to each other.
  • the target tilt can be automatically adjusted to the desired tilt. Therefore, unlike the conventional tilt adjustment operation, it is not necessary to perform manual adjustment many times until a desired parallelism (tilt) is obtained, and the time required for the tilt adjustment operation can be significantly reduced. .. Further, since the inclination adjustment between the holding surface and the grinding surface can be performed by automatic adjustment without human intervention in this way, it is possible to suppress the occurrence of manual operation mistakes and adjustment mistakes as in the conventional case. ..
  • the distance data Db and Dc of the three points measured by the measuring instrument 110 are adjusted to 0 points by using the distance data Da as the reference distance, so that the distance data Db and Dc are the distance data. It is displayed as a difference value from Da, and the operator inputs only the distance data Db and Dc into the input area 122. That is, it is not necessary to input all the measured values as input values, and the amount of information manually input to the input area 122 at the time of tilt adjustment can be reduced, so that the occurrence of manual input errors can be suppressed.
  • the distance data Da acquired at one end of the measurement Ra is used as the reference distance for zero-point adjustment as described above, but the reference distance data D is the other end of the measurement Rb or the measurement. It may be the distance data Db or Dc acquired at the center Rc.
  • the chuck base 43 (chuck 42) is tilted by the operation of the tilt adjusting unit 44 provided below the chuck base 43 to adjust the relative angle of the holding surface with respect to the grinding surface.
  • the configuration of the tilt adjusting unit is not limited to this. That is, for example, the relative angle of the grinding surface with respect to the holding surface of the chuck 42 may be adjusted by providing the inclination adjusting portion on each grinding portion side. Further, for example, each of the holding surface and the grinding surface of the chuck 42 may be configured to be tiltable.
  • the case of grinding the wafer W, the holding surface of the chuck 42, and the upper surface of the chuck base 43 as an example of the processing in the grinding unit 40 has been described as an example.
  • the processing is not limited to grinding.
  • the wafer W, the holding surface of the chuck 42, and the upper surface of the chuck base 43 may be polished.
  • each of the grinding process described in the above embodiment and the polishing process is included in the "processing process" performed by the processing device 1 according to the present embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Machine Tool Units (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention concerne un système de traitement destiné à un objet à traiter, comprenant : une partie de maintien qui maintient l'objet à traiter sur une surface supérieure ; une base de maintien qui maintient la partie de maintien sur la surface supérieure ; une unité de traitement qui traite l'objet à traiter maintenu par la partie de maintien ; une partie de réglage d'inclinaison qui règle l'inclinaison relative entre la partie de maintien ou la base de maintien et l'unité de traitement ; et une unité d'affichage d'informations qui affiche des informations sur la partie de maintien, la base de maintien, l'unité de traitement, et la partie de réglage d'inclinaison, l'unité d'affichage d'informations affichant, sur le même écran, une unité d'entrée qui entre des informations de distance relative entre la partie de maintien ou la base de maintien et l'unité de traitement, et une unité d'instruction qui démarre le fonctionnement de la partie de réglage d'inclinaison.
PCT/JP2021/028333 2020-08-12 2021-07-30 Système de traitement, procédé de réglage d'inclinaison et support de stockage informatique WO2022034808A1 (fr)

Priority Applications (2)

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CN202180059860.0A CN116133792A (zh) 2020-08-12 2021-07-30 加工***、倾斜调整方法以及计算机存储介质
JP2022542796A JPWO2022034808A1 (fr) 2020-08-12 2021-07-30

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JP2020-136295 2020-08-12
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003053652A (ja) * 2001-08-16 2003-02-26 Seikoh Giken Co Ltd 光ファイバ端面研磨機
JP2013141725A (ja) * 2012-01-11 2013-07-22 Disco Corp 研削装置
WO2018235619A1 (fr) * 2017-06-21 2018-12-27 東京エレクトロン株式会社 Système de traitement de substrat, procédé de traitement de substrat et support de stockage informatique

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003053652A (ja) * 2001-08-16 2003-02-26 Seikoh Giken Co Ltd 光ファイバ端面研磨機
JP2013141725A (ja) * 2012-01-11 2013-07-22 Disco Corp 研削装置
WO2018235619A1 (fr) * 2017-06-21 2018-12-27 東京エレクトロン株式会社 Système de traitement de substrat, procédé de traitement de substrat et support de stockage informatique

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JPWO2022034808A1 (fr) 2022-02-17

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