JPWO2022034808A1 - - Google Patents
Info
- Publication number
- JPWO2022034808A1 JPWO2022034808A1 JP2022542796A JP2022542796A JPWO2022034808A1 JP WO2022034808 A1 JPWO2022034808 A1 JP WO2022034808A1 JP 2022542796 A JP2022542796 A JP 2022542796A JP 2022542796 A JP2022542796 A JP 2022542796A JP WO2022034808 A1 JPWO2022034808 A1 JP WO2022034808A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Machine Tool Units (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020136295 | 2020-08-12 | ||
PCT/JP2021/028333 WO2022034808A1 (ja) | 2020-08-12 | 2021-07-30 | 加工システム、傾き調整方法及びコンピュータ記憶媒体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022034808A1 true JPWO2022034808A1 (ja) | 2022-02-17 |
JPWO2022034808A5 JPWO2022034808A5 (ja) | 2023-04-14 |
Family
ID=80247209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022542796A Pending JPWO2022034808A1 (ja) | 2020-08-12 | 2021-07-30 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022034808A1 (ja) |
CN (1) | CN116133792A (ja) |
WO (1) | WO2022034808A1 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003053652A (ja) * | 2001-08-16 | 2003-02-26 | Seikoh Giken Co Ltd | 光ファイバ端面研磨機 |
JP5841846B2 (ja) * | 2012-01-11 | 2016-01-13 | 株式会社ディスコ | 研削装置 |
KR102450002B1 (ko) * | 2017-06-21 | 2022-10-04 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템, 기판 처리 방법 및 컴퓨터 기억 매체 |
-
2021
- 2021-07-30 WO PCT/JP2021/028333 patent/WO2022034808A1/ja active Application Filing
- 2021-07-30 CN CN202180059860.0A patent/CN116133792A/zh active Pending
- 2021-07-30 JP JP2022542796A patent/JPWO2022034808A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN116133792A (zh) | 2023-05-16 |
WO2022034808A1 (ja) | 2022-02-17 |
Similar Documents
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