WO2021010073A1 - Electronic-component bonding nozzle - Google Patents

Electronic-component bonding nozzle Download PDF

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Publication number
WO2021010073A1
WO2021010073A1 PCT/JP2020/023322 JP2020023322W WO2021010073A1 WO 2021010073 A1 WO2021010073 A1 WO 2021010073A1 JP 2020023322 W JP2020023322 W JP 2020023322W WO 2021010073 A1 WO2021010073 A1 WO 2021010073A1
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WO
WIPO (PCT)
Prior art keywords
discharge
adhesive
nozzle
electronic components
hole
Prior art date
Application number
PCT/JP2020/023322
Other languages
French (fr)
Japanese (ja)
Inventor
計滋 三重野
Original Assignee
株式会社ワークス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ワークス filed Critical 株式会社ワークス
Priority to CN202080024674.9A priority Critical patent/CN113631280B/en
Publication of WO2021010073A1 publication Critical patent/WO2021010073A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Definitions

  • the present invention relates to an electronic component bonding nozzle that discharges an adhesive when bonding an electronic component to a mounting substrate or the like.
  • a large number of various electronic parts are used in equipment and machines such as electronic equipment, precision equipment, transportation equipment, and machine tools. Alternatively, not only the parts to be incorporated, but also a wide variety of parts to be attached or combined as needed are required. Such electronic components are mounted on a mounting board mounted on an electronic device or a precision device.
  • the electronic components mounted on the mounting substrate are various such as semiconductor elements, LSIs, optical elements, discrete electronic components and electronic elements. At present, these electronic components are extremely miniaturized and have high performance.
  • many sensor elements are mounted on electronic devices in recent years. This applies not only to electronic devices but also to transportation devices such as automobiles and machine tools used in factories and the like. Various machines and devices in recent years have implemented many such sensor elements. This is because many sensor elements are required in many parts in order to realize automatic operation and remote control.
  • these machines and devices are equipped with many electronic components for electronic operation. Many of these electronic components are mounted on mounting boards mounted on machines and equipment. Electronic components are mounted on a mounting substrate with a conductive paste such as solder or various adhesives. At this time, it is necessary to apply a conductive paste or an adhesive for mounting (hereinafter, collectively referred to as “adhesive” as necessary) to the mounting substrate.
  • a conductive paste or an adhesive for mounting hereinafter, collectively referred to as “adhesive” as necessary
  • Patent Document 1 describes a position in which the cleaning member 22 is taken out from the cleaning member feeder mounted on the feeder base of the parts supply unit together with other parts feeders by the mounting head 9 and held in contact with the discharge nozzle 46 of the dispenser unit 6.
  • the mounting head 9 is made to perform a cleaning operation of a predetermined pattern in which the cleaning member 22 is reciprocated horizontally to clean the discharge nozzle 46.
  • Patent Document 1 discloses a technique that enables mounting of electronic components by ejecting an adhesive with a dispenser.
  • Patent Document 1 There was a problem that the conventional techniques such as Patent Document 1 could not respond to such a request. In particular, there is a problem that it is difficult to discharge an appropriate amount of adhesive in a pinpoint and narrow area. Due to this problem, it is difficult to discharge an adhesive for mounting a large number of very small electronic components to perform high-speed mounting.
  • an object of the present invention is to provide a nozzle for adhering electronic components capable of ejecting an optimum amount of adhesive into a narrow region with high accuracy.
  • the electronic component bonding nozzle of the present invention is an electronic component bonding nozzle that ejects an adhesive required for mounting an electronic component.
  • the main body An internal space provided inside the main body and to which the adhesive is supplied, and A discharge through hole provided from the internal space toward the tip of the main body is provided.
  • the discharge through hole has an injection inlet into which the adhesive from the internal space is injected and a discharge outlet in which the adhesive from the internal space is discharged to the outside.
  • the diameter of the discharge outlet is 50 ⁇ m or less.
  • the adhesive supplied to the internal space receives the discharge pressure, is injected into the injection inlet, passes through the discharge through hole, and is discharged from the discharge outlet.
  • the nozzle for adhering electronic components of the present invention can eject an adhesive with high accuracy in a narrow area corresponding to a very small electronic component. At this time, the adhesive can be discharged at the optimum level in the position, region, and amount to be discharged.
  • nozzle for bonding electronic components (hereinafter, abbreviated as "nozzle” if necessary) in the embodiment of the present invention. It is sectional drawing of the nozzle for adhering an electronic component in embodiment of this invention. It is a side view of the nozzle for adhering a long type electronic component in embodiment of this invention. It is sectional drawing of the nozzle for adhering electronic components in embodiment of this invention. It is sectional drawing of the nozzle for adhering electronic components in embodiment of this invention.
  • the nozzle for adhering electronic components is a nozzle for adhering electronic components that ejects an adhesive necessary for mounting an electronic component.
  • the discharge through hole has an injection inlet into which the adhesive from the internal space is injected and a discharge outlet in which the adhesive from the internal space is discharged to the outside.
  • the diameter of the discharge outlet is 50 ⁇ m or less.
  • the adhesive supplied to the internal space receives the discharge pressure, is injected into the injection inlet, passes through the discharge through hole, and is discharged from the discharge outlet.
  • the adhesive can be discharged with a very fine and optimum amount and discharge diameter.
  • small electronic components can be mounted on an electronic substrate at high density.
  • the main body portion is formed of cemented carbide.
  • the main body portion is formed of a sintered body of metal powder.
  • This configuration facilitates the formation of the main body. In addition, the formation accuracy can be improved.
  • the diameter of the discharge outlet in the discharge through hole is larger than the diameter of the injection inlet. small.
  • the discharged adhesive can be discharged to a more pinpoint position in an appropriate amount.
  • the diameter of the injection inlet is 10% or more larger than the diameter of the discharge outlet.
  • the adhesive can be discharged to finer parts.
  • the inner diameter of the discharge through hole gradually decreases from the injection inlet to the discharge outlet.
  • the adhesive can be reliably discharged to the optimum minute position.
  • the diameter of the discharge outlet is 40 ⁇ m or less.
  • the diameter of the discharge outlet is 30 ⁇ m or less.
  • the discharge through hole is formed by perforation by machining.
  • the inner surface of the discharge through hole is subjected to surface treatment for reducing friction. ing.
  • FIG. 1 is a photograph of a nozzle for bonding electronic components (hereinafter, abbreviated as “nozzle” if necessary) according to the embodiment of the present invention.
  • FIG. 1 shows a state in which the nozzle 1 for adhering electronic components is viewed from diagonally above. That is, it shows a state seen from the direction of the internal space 3 provided inside the main body 2.
  • FIG. 2 is a cross-sectional view of the nozzle for bonding electronic components according to the embodiment of the present invention. It is shown as a state in which the nozzle 1 for adhering electronic components is cut by the discharge amount through hole 4 described later.
  • the nozzle 1 for adhering electronic components includes a main body 2, an internal space 3, and a through hole 4 for discharging.
  • the main body 2 forms the outer shape of the nozzle 1 for adhering electronic components. By attaching other elements to the outer shape, the main body 2 can form the nozzle 1 for adhering electronic components.
  • the internal space 3 is a space provided inside the main body 2.
  • the electronic component bonding nozzle 1 receives the supply of the adhesive and discharges the adhesive to realize the bonding (mounting) of the electronic component to the electronic substrate.
  • the internal space 3 is supplied with an adhesive. That is, the adhesive is supplied (filled) to the internal space 3.
  • the internal space 3 is a space for receiving the adhesive.
  • the discharge through hole 4 is a through hole provided from the internal space 3 toward the tip of the main body 2.
  • the discharge through hole 4 discharges the adhesive from the internal space 3.
  • the discharge through hole 4 has an injection inlet 41 into which the adhesive from the internal space 3 is injected and a discharge outlet 42 for discharging the adhesive to the outside.
  • the diameter of the discharge outlet 42 is 50 ⁇ m or less.
  • the nozzle 1 for adhering electronic components is attached to an adhesive supply device. It is also incorporated into a mounting device that mounts electronic components on an electronic board. With such a configuration, the adhesive is supplied to the internal space 3.
  • the supply device applies a discharge pressure to discharge the adhesive in accordance with the supply of the adhesive.
  • the adhesive that has received this discharge pressure is discharged from the internal space 3 to the outside through the discharge through hole 4.
  • the adhesive in the internal space 3 is injected into the injection inlet 41 and passes through the discharge through hole 4. The passed adhesive is discharged to the outside from the discharge outlet 42.
  • the adhesive may be a so-called resin or polymer material adhesive, or may be a conductive metal paste. These may be defined by the specifications for mounting the electronic components on the electronic board.
  • the adhesive discharged through the discharge through hole 4 is finally discharged from the discharge outlet 42.
  • the diameter of the discharge outlet 42 is 50 ⁇ m or less. Therefore, the adhesive can be discharged in a very fine amount and discharge diameter.
  • Electronic components in recent years have become extremely small. Not only electronic components such as semiconductor integrated circuits, but also sensors with various functions are becoming smaller. In particular, automobiles and transportation equipment tend to be equipped with various and large numbers of sensors for the purpose of autonomous driving.
  • the diameter of the discharge outlet 42 is 50 ⁇ m or less, it is possible to discharge the adhesive having a required fine amount and discharge diameter.
  • the nozzle 1 for adhering electronic components of the present invention it becomes possible to realize the mounting of miniaturized electronic components.
  • the main body 2 is preferably formed of cemented carbide.
  • a cemented carbide having tungsten as a main raw material is used. It may be an alloy in which tungsten carbide is bonded with a binder, or an alloy in which titanium carbide or the like is mixed.
  • the main body 2 is made of cemented carbide, the strength and durability of the nozzle 1 for adhering electronic components is increased.
  • the electronic component bonding nozzle 1 is repeatedly used a large number of times in order to bond a large number of electronic components. Also, the operation interval is very short. Therefore, a great load is applied.
  • the discharge pressure is also applied one after another at short intervals.
  • the main body 2 is made of cemented carbide, it can cope with such a large load. Due to its high durability, it can be used under heavy load.
  • the nozzle 1 for bonding electronic components is required to discharge an adhesive having a fine amount and a discharge diameter. Therefore, high accuracy of the inner diameter of the discharge through hole 4 and the discharge shaft is required.
  • the discharge through hole 4 is formed by drilling a predetermined position of the main body portion 2, is formed by laminating or the like, or is formed by molding.
  • the discharge through hole 4 formed in this way can be easily formed with high accuracy because the main body 2 is made of cemented carbide.
  • it since it is a cemented carbide, there is an advantage that its shape and discharge shaft are not easily deformed even after it is formed. In particular, in a situation where it is repeatedly used with a high load, there is a concern that the discharge through hole 4 may be deformed. Even in such a case, if the main body 2 is made of cemented carbide, there is an advantage that the risk of such deformation can be greatly reduced.
  • the main body 2 is formed of a sintered metal powder.
  • the powder of a super steel metal material such as tungsten carbide may be mixed with another powder material and then sintered to form a sintered body.
  • tungsten carbide may be mixed with another powder material and then sintered to form a sintered body.
  • other metal materials may be used.
  • the main body 2 By forming the main body 2 with such a sintered metal powder, the main body 2 can be manufactured with high accuracy. Further, when the sintered body is formed, the discharge through hole 4 may be provided, or after the sintered body is formed, the discharge through hole 4 may be formed by drilling or the like. In either case, the main body 2 is formed of the sintered body, so that the main body 2 can be easily formed.
  • the main body 2 since it is a sintered body, the strength and durability of the main body 2 are increased, and the durability against repeated use with a high load as described above is increased.
  • the main body 2 since it is a sintered body, the main body 2 can be formed into an appropriate shape. For example, as shown in FIG. 3, it may be necessary to manufacture the nozzle 1 for adhering electronic components having a shape in which the tip portion is extended. In such a case, the sintered body makes it possible to form the shape with high accuracy. Of course, it is also possible to form the main body 2 having such a shape even if it is not a sintered body.
  • FIG. 3 is a side view of a long type electronic component bonding nozzle according to the embodiment of the present invention.
  • the left side of FIG. 3 shows an external view of a side surface of a long type electronic component bonding nozzle 1.
  • the right side of FIG. 3 shows a cross-sectional view so that the inside can be seen.
  • the long type electronic component bonding nozzle 1 is also The internal space 3 and the discharge through hole 4 are provided, and the adhesive can be discharged.
  • the adhesive can be discharged more accurately and with high accuracy. Further, when higher density mounting is required, the elongated tip portion makes it possible to discharge the adhesive corresponding to the high density mounting.
  • the internal space 3 is a space provided inside the main body 2.
  • the internal space 3 may be formed at the same time when the main body 2 is formed. Alternatively, the internal space 3 may be formed by cutting the inside of the main body 2 or the like.
  • the electronic component bonding nozzle 1 is used in combination with a device that supplies adhesive and applies discharge pressure.
  • the device supplies the adhesive to the interior space 3. Further, the device applies a discharge pressure to the internal space 3 in accordance with this supply. In response to this application, the internal space 3 discharges the supplied adhesive through the discharge through hole 4 communicating with the internal space 3.
  • the discharge through hole 4 communicating with the internal space 3 is connected to the internal space 3 and the injection inlet 41.
  • the injection inlet 41 is connected to the discharge outlet 42 through the discharge through hole 4.
  • the internal space 3 may have a volume that matches the size of the main body 2. Further, it suffices to have a volume corresponding to the amount of the adhesive to be discharged and the number of times thereof. Alternatively, it may be determined in relation to the device that applies the discharge pressure.
  • the discharge through hole 4 actually discharges the adhesive that receives pressure from the internal space and enters.
  • the discharge destination is the mounting portion of the electronic board on which the electronic component is mounted.
  • the discharge through hole 4 includes an injection inlet 41 into which the adhesive is injected from the internal space 4 and a discharge outlet 42 in which the adhesive is discharged.
  • the adhesive supplied to the internal space 3 receives the discharge pressure and enters the injection inlet 41.
  • the adhesive is discharged from the discharge outlet 42 by receiving the discharge pressure as it is. By this discharge, the adhesive is applied in a mountable state.
  • FIG. 4 is a cross-sectional view of the nozzle for bonding electronic components according to the embodiment of the present invention. The internal structure of the discharge through hole 4 is shown so as to be understood.
  • FIG. 5 is a cross-sectional view of the nozzle for bonding electronic components according to the embodiment of the present invention.
  • the discharge through hole 4 has a two-stage shape, and the diameter of the discharge outlet 42 is smaller than the diameter of the injection inlet 41.
  • the diameter of the discharge outlet 42 is smaller than the diameter of the injection inlet 41, the adhesive discharged through the discharge through hole 4 is likely to be discharged in a fine amount and the discharge diameter.
  • the diameter of the discharge outlet 42 is smaller than the diameter of the injection inlet 41, the adhesive discharged through the discharge through hole 4 is likely to be discharged in a fine amount and the discharge diameter.
  • it is possible to discharge with higher accuracy.
  • it can be more accurately discharged to the discharge portion.
  • the discharge through hole 4 has a structure in which the inner diameter gradually decreases from the injection inlet 41 toward the discharge outlet 42. With such a structure, the adhesive can be more accurately discharged to the position to be discharged in the process of moving through the discharge through hole 4. That is, it will be discharged to the target position.
  • the diameter of the injection inlet 41 is 10% or more larger than the diameter of the discharge outlet 42.
  • the diameter of the discharge outlet 42 is 40 ⁇ m.
  • the diameter of the discharge outlet 42 is 30 ⁇ m.
  • the adhesive that moves from the injection inlet 41 to the discharge outlet 42 and is discharged can be reliably discharged with a fine discharge diameter.
  • the adhesive can be reliably discharged to a fine position. This is because the discharge outlet 42 is smaller than the injection inlet 41 into which the adhesive enters, so that the adhesive is more likely to be discharged to a target position when moving through the discharge through hole 4.
  • the diameter of the discharge outlet 42 is 40 ⁇ m or less.
  • the adhesive is discharged from a discharge outlet 42 having a diameter of 40 ⁇ m or less.
  • the diameter of the discharge outlet 42 is 40 ⁇ m or less, the adhesive corresponding to a portion having a very small area can be discharged.
  • the diameter of the discharge outlet 42 is 30 ⁇ m or less. Furthermore, it is possible to discharge the adhesive to the optimum amount and site required for mounting small electronic components. When the diameter of the discharge outlet 42 is 30 ⁇ m or less, it is possible to discharge an adhesive suitable for mounting smaller electronic components. Alternatively, it is possible to discharge an adhesive suitable for higher density mounting.
  • the discharge through hole 4 is formed by drilling in the main body 2 by machining. After the main body portion 2 is formed, the internal space 3 and the discharge through hole 4 may be formed by machining. Since the discharge through hole 4 is formed by being drilled by machining, the discharge through hole 4 can be formed with high accuracy.
  • the discharge through hole 4 gradually becomes thinner toward the discharge outlet 42. Even in the case of such a shape, it is easy to realize by drilling the discharge through hole 4 by machining. Further, by being formed by machining, a highly durable discharge through hole 4 can be realized. In addition, it is possible to realize a discharge through hole 4 having a very fine diameter.
  • the inner surface of the discharge through hole 4 is surface-treated to reduce friction. This surface treatment makes it easier to discharge the adhesive.
  • the adhesive is less likely to be clogged inside the discharge through hole 4, and the adhesive can be reliably discharged with the optimum amount and discharge diameter. Further, since clogging is less likely to occur, it is effective in extending the durability and life of the nozzle 1 for adhering electronic components.
  • the surface treatment for reducing friction may be realized by various means such as coating treatment and polishing treatment.
  • the nozzle for bonding electronic components described in the embodiment is an example for explaining the gist of the present invention, and includes deformation and modification within a range not deviating from the gist of the present invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nozzles (AREA)
  • Coating Apparatus (AREA)

Abstract

Provided is an electronic-component bonding nozzle capable of discharging an optimal amount of adhesive to a narrow area with high accuracy. The present invention provides an electronic-component bonding nozzle that discharges an adhesive required to mount an electronic component, the nozzle including: a body part; an interior space that is provided inside the body part and to which the adhesive is supplied; and a discharge through-hole that is provided from the interior space toward a distal end of the body part. The discharge through-hole has an injection port into which the adhesive from the interior space is injected and a discharge port from which the adhesive from the interior space is discharged to the outside; the diameter of the discharge port is 50 μm or less; and the adhesive to be supplied to the interior space is subjected to discharge pressure, thereby being injected into the injection port, passing through the discharge through-hole, and being discharged from the discharge port.

Description

電子部品接着用ノズルNozzle for bonding electronic components
　本発明は、電子部品を実装基板などの接着する際に接着剤を吐出する電子部品接着用ノズルに関する。 The present invention relates to an electronic component bonding nozzle that discharges an adhesive when bonding an electronic component to a mounting substrate or the like.
　電子機器、精密機器、輸送機器、工作機械などの機器や機械においては、様々な電子部品が多数用いられる。あるいは、組み込まれる部品だけでなく、必要に応じて取り付けられたり組み合わされたりする多種多様な部品が必要である。このような電子部品は、電子機器や精密機器に装着される実装基板に実装される。 A large number of various electronic parts are used in equipment and machines such as electronic equipment, precision equipment, transportation equipment, and machine tools. Alternatively, not only the parts to be incorporated, but also a wide variety of parts to be attached or combined as needed are required. Such electronic components are mounted on a mounting board mounted on an electronic device or a precision device.
　ここで、実装基板に実装される電子部品は、半導体素子、ＬＳＩ、光学素子、ディスクリートの電子部品や電子素子など様々である。これらの電子部品は、きわめて小型化・高性能化している現状がある。特に、近年の電子機器には多くのセンサー素子が実装される。これは電子機器だけでなく自動車のような輸送機器であったり、工場などで使用される工作機械などであったりしても同様である。近年の様々な機械や機器は、このような多くのセンサー素子を実装している。自動運転や遠隔操作などを実現するために、多くの部位に多くのセンサー素子を必要とするからである。 Here, the electronic components mounted on the mounting substrate are various such as semiconductor elements, LSIs, optical elements, discrete electronic components and electronic elements. At present, these electronic components are extremely miniaturized and have high performance. In particular, many sensor elements are mounted on electronic devices in recent years. This applies not only to electronic devices but also to transportation devices such as automobiles and machine tools used in factories and the like. Various machines and devices in recent years have implemented many such sensor elements. This is because many sensor elements are required in many parts in order to realize automatic operation and remote control.
　また、センサー素子だけでなく、これらの機械や機器は、電子的動作を行うために多くの電子部品を備えている。これらの電子部品の多くは、機械や機器に装着される実装基板に実装される。電子部品は、半田のような導電性ペーストや各種の接着剤で実装基板に実装される。このとき、実装のための導電性ペーストや接着剤（以下、必要に応じて「接着剤」として総称する）を、実装基板に塗布する必要がある。 In addition to sensor elements, these machines and devices are equipped with many electronic components for electronic operation. Many of these electronic components are mounted on mounting boards mounted on machines and equipment. Electronic components are mounted on a mounting substrate with a conductive paste such as solder or various adhesives. At this time, it is necessary to apply a conductive paste or an adhesive for mounting (hereinafter, collectively referred to as “adhesive” as necessary) to the mounting substrate.
　このような接着剤を塗布するには、様々なやり方がある。このような電子部品の実装に必要となる接着剤の塗布について、いくつかの技術が提案されている（例えば、特許文献１参照）。 There are various ways to apply such an adhesive. Several techniques have been proposed for the application of an adhesive required for mounting such electronic components (see, for example, Patent Document 1).
特開２０１８－１０１８１５号公報JP-A-2018-101815
　特許文献１は、部品供給部のフィーダベースに他のパーツフィーダとともに装着された清掃部材フィーダから、搭載ヘッド９によって清掃用部材２２を取り出して保持した状態でディスペンサユニット６の吐出ノズル４６と接する位置に移動させ、清掃用部材２２を水平往復動させる所定パターンの清掃動作を搭載ヘッド９に実行させて吐出ノズル４６の清掃を行う。これにより、ディスペンサユニット６によるペーストＰの塗布を安定させるために必要とされる保守清掃作業を、効率よく適切に行うことができる電子部品実装装置を開示する。 Patent Document 1 describes a position in which the cleaning member 22 is taken out from the cleaning member feeder mounted on the feeder base of the parts supply unit together with other parts feeders by the mounting head 9 and held in contact with the discharge nozzle 46 of the dispenser unit 6. The mounting head 9 is made to perform a cleaning operation of a predetermined pattern in which the cleaning member 22 is reciprocated horizontally to clean the discharge nozzle 46. Thereby, the electronic component mounting device capable of efficiently and appropriately performing the maintenance and cleaning work required for stabilizing the application of the paste P by the dispenser unit 6 is disclosed.
　特許文献１は、ディスペンサーによって接着剤を吐出して、電子部品の実装を可能とする技術を開示している。 Patent Document 1 discloses a technique that enables mounting of electronic components by ejecting an adhesive with a dispenser.
　しかしながら、近年の電子機器や輸送機器においては、非常に多くの電子部品が実装される。また、電子部品の大きさも非常に小型化や微細化しており、実装基板に吐出するべき接着剤も非常に少量である。また、非常にピンポイントな狭小領域に正確に接着剤を吐出する必要がある。この吐出する領域、吐出量、隣接する吐出領域との間隔の確保などについて、よりシビアな精度が求められるようになっている。 However, in recent years, electronic devices and transportation devices are equipped with a large number of electronic components. In addition, the size of electronic components has become extremely small and fine, and the amount of adhesive to be discharged onto the mounting substrate is also very small. In addition, it is necessary to accurately discharge the adhesive into a very pinpoint narrow area. More severe accuracy is required for the discharge area, the discharge amount, the securing of the interval from the adjacent discharge area, and the like.
　このような要望に対して、特許文献１をはじめとした従来技術は、対応できない問題があった。特に、ピンポイントでかつ狭小領域に適切な量の接着剤を吐出することが困難である問題があった。この問題があるために、多数の非常に小型の電子部品を実装するための接着剤を吐出して高速の実装を行うのが難しい問題があった。 There was a problem that the conventional techniques such as Patent Document 1 could not respond to such a request. In particular, there is a problem that it is difficult to discharge an appropriate amount of adhesive in a pinpoint and narrow area. Due to this problem, it is difficult to discharge an adhesive for mounting a large number of very small electronic components to perform high-speed mounting.
　加えて、従来技術では、吐出するノズル部分の精度が低く、吐出用に充てんされる接着剤が目詰まりを起こしてしまう問題もあった。また、接着剤を吐出する貫通孔の微細化ができていないために、吐出される接着剤の量が多くなりすぎてしまい、小型の電子部品の実装に不向きである問題がある。あるいは、電子部品の実装に適した範囲や場所に最適な量の接着剤を吐出することが困難である問題がある。場合によっては、本来吐出するべき位置に接着剤が吐出できないなどの問題があった。 In addition, in the conventional technology, there is a problem that the accuracy of the nozzle portion to be discharged is low and the adhesive filled for discharge is clogged. Further, since the through holes for discharging the adhesive have not been miniaturized, the amount of the adhesive to be discharged becomes too large, which is unsuitable for mounting small electronic components. Alternatively, there is a problem that it is difficult to eject an optimum amount of adhesive to a range or place suitable for mounting electronic components. In some cases, there is a problem that the adhesive cannot be discharged at the position where it should be discharged.
　また、ノズルそのものの耐久性も低い問題があった。このため頻繁にノズルや吐出機構を交換しなければならない問題もあった。この問題により、電子部品の実装に係るコストが増加する問題にもつながっていた。 There was also the problem that the durability of the nozzle itself was low. Therefore, there is also a problem that the nozzle and the discharge mechanism must be replaced frequently. This problem has also led to an increase in the cost of mounting electronic components.
　本発明は、以上の問題に鑑み、高い精度で狭小領域に最適量の接着剤を吐出できる電子部品接着用ノズルを提供することを目的とする。 In view of the above problems, an object of the present invention is to provide a nozzle for adhering electronic components capable of ejecting an optimum amount of adhesive into a narrow region with high accuracy.
　上記課題を解決するために、本発明の電子部品接着用ノズルは、電子部品の実装に必要となる接着剤を吐出する電子部品接着用ノズルであって、
　本体部と、
　前記本体部の内部に設けられて、前記接着剤が供給される内部空間と、
　前記内部空間から前記本体部の先端に向けて設けられた吐出用貫通孔と、を備え、
　前記吐出用貫通孔は、前記内部空間からの接着剤が注入される注入入口と、前記内部空間からの接着剤を外部に吐出する吐出出口とを有し、
　前記吐出出口の直径は、５０μｍ以下であり、
　前記内部空間に供給される前記接着剤は、吐出圧力を受けて、前記注入入口に注入されて前記吐出用貫通孔を通過し、前記吐出出口から吐出される。 In order to solve the above problems, the electronic component bonding nozzle of the present invention is an electronic component bonding nozzle that ejects an adhesive required for mounting an electronic component.
With the main body
An internal space provided inside the main body and to which the adhesive is supplied, and
A discharge through hole provided from the internal space toward the tip of the main body is provided.
The discharge through hole has an injection inlet into which the adhesive from the internal space is injected and a discharge outlet in which the adhesive from the internal space is discharged to the outside.
The diameter of the discharge outlet is 50 μm or less.
The adhesive supplied to the internal space receives the discharge pressure, is injected into the injection inlet, passes through the discharge through hole, and is discharged from the discharge outlet.
　本発明の電子部品接着用ノズルは、非常に小型の電子部品に対応する狭小領域に、高い精度で接着剤を吐出できる。このとき、吐出すべき位置、領域、量において最適なレベルで、接着剤を吐出できる。 The nozzle for adhering electronic components of the present invention can eject an adhesive with high accuracy in a narrow area corresponding to a very small electronic component. At this time, the adhesive can be discharged at the optimum level in the position, region, and amount to be discharged.
　また、高い耐久性を有しているので、繰り返しの使用にも対応できる。結果として、電子部品実装のコストを低減できる。 Also, because it has high durability, it can be used repeatedly. As a result, the cost of mounting electronic components can be reduced.
本発明の実施の形態における電子部品接着用ノズル（以下、必要に応じて「ノズル」と略す）の写真である。It is a photograph of the nozzle for bonding electronic components (hereinafter, abbreviated as "nozzle" if necessary) in the embodiment of the present invention. 本発明の実施の形態における電子部品接着用ノズルの横断面図である。It is sectional drawing of the nozzle for adhering an electronic component in embodiment of this invention. 本発明の実施の形態におけるロングタイプの電子部品接着用ノズルの側面図である。It is a side view of the nozzle for adhering a long type electronic component in embodiment of this invention. 本発明の実施の形態における電子部品接着用ノズルの断面図である。It is sectional drawing of the nozzle for adhering electronic components in embodiment of this invention. 本発明の実施の形態における電子部品接着用ノズルの断面図である。It is sectional drawing of the nozzle for adhering electronic components in embodiment of this invention.
　本発明の第１の発明に係る電子部品接着用ノズルは、電子部品の実装に必要となる接着剤を吐出する電子部品接着用ノズルであって、
　本体部と、
　前記本体部の内部に設けられて、前記接着剤が供給される内部空間と、
　前記内部空間から前記本体部の先端に向けて設けられた吐出用貫通孔と、を備え、
　前記吐出用貫通孔は、前記内部空間からの接着剤が注入される注入入口と、前記内部空間からの接着剤を外部に吐出する吐出出口とを有し、
　前記吐出出口の直径は、５０μｍ以下であり、
　前記内部空間に供給される前記接着剤は、吐出圧力を受けて、前記注入入口に注入されて前記吐出用貫通孔を通過し、前記吐出出口から吐出される。 The nozzle for adhering electronic components according to the first aspect of the present invention is a nozzle for adhering electronic components that ejects an adhesive necessary for mounting an electronic component.
With the main body
An internal space provided inside the main body and to which the adhesive is supplied, and
A discharge through hole provided from the internal space toward the tip of the main body is provided.
The discharge through hole has an injection inlet into which the adhesive from the internal space is injected and a discharge outlet in which the adhesive from the internal space is discharged to the outside.
The diameter of the discharge outlet is 50 μm or less.
The adhesive supplied to the internal space receives the discharge pressure, is injected into the injection inlet, passes through the discharge through hole, and is discharged from the discharge outlet.
　この構成により、非常に微細で最適な量と吐出直径で接着剤を吐出できる。この吐出によって、小型の電子部品を電子基板に高密度に実装することができる。 With this configuration, the adhesive can be discharged with a very fine and optimum amount and discharge diameter. By this ejection, small electronic components can be mounted on an electronic substrate at high density.
　本発明の第２の発明に係る電子部品接着用ノズルでは、第１の発明に加えて、前記本体部は、超硬合金により形成される。 In the nozzle for adhering electronic components according to the second invention of the present invention, in addition to the first invention, the main body portion is formed of cemented carbide.
　この構成により、高い耐久性を実現できる。加えて、吐出用貫通孔の吐出軸の精度も高まり、吐出される接着剤の量や吐出直径の最適化が図られる。 With this configuration, high durability can be achieved. In addition, the accuracy of the discharge shaft of the discharge through hole is improved, and the amount of adhesive to be discharged and the discharge diameter can be optimized.
　本発明の第３の発明に係る電子部品接着用ノズルでは、第１または第２の発明に加えて、前記本体部は、金属紛体の焼結体で形成される。 In the nozzle for adhering electronic components according to the third invention of the present invention, in addition to the first or second invention, the main body portion is formed of a sintered body of metal powder.
　この構成により、本体部の形成が容易となる。また、形成精度も上げることができる。 This configuration facilitates the formation of the main body. In addition, the formation accuracy can be improved.
　本発明の第４の発明に係る電子部品接着用ノズルでは、第１から第３のいずれかの発明に加えて、前記吐出用貫通孔において、前記吐出出口の直径は、前記注入入口の直径より小さい。 In the nozzle for adhering electronic components according to the fourth invention of the present invention, in addition to any one of the first to third inventions, the diameter of the discharge outlet in the discharge through hole is larger than the diameter of the injection inlet. small.
　この構成により、吐出される接着剤をよりピンポイントな位置に適切な量で吐出することができる。 With this configuration, the discharged adhesive can be discharged to a more pinpoint position in an appropriate amount.
　本発明の第５の発明に係る電子部品接着用ノズルでは、前記注入入口の直径は、前記吐出出口の直径よりも１０％以上大きい。 In the nozzle for adhering electronic components according to the fifth aspect of the present invention, the diameter of the injection inlet is 10% or more larger than the diameter of the discharge outlet.
　この構成により、より微細な部位に接着剤を吐出することができる。 With this configuration, the adhesive can be discharged to finer parts.
　本発明の第６の発明に係る電子部品接着用ノズルでは、第５の発明に加えて、前記吐出用貫通孔は、前記注入入口から前記吐出出口にかけて次第に内径が小さくなっていく。 In the nozzle for adhering electronic components according to the sixth aspect of the present invention, in addition to the fifth invention, the inner diameter of the discharge through hole gradually decreases from the injection inlet to the discharge outlet.
　この構成により、最適な微小位置に確実に接着剤を吐出できる。 With this configuration, the adhesive can be reliably discharged to the optimum minute position.
　本発明の第７の発明に係る電子部品接着用ノズルでは、第１から第６のいずれかの発明に加えて、前記吐出出口の直径は、４０μｍ以下である。 In the nozzle for adhering electronic components according to the seventh invention of the present invention, in addition to any one of the first to sixth inventions, the diameter of the discharge outlet is 40 μm or less.
　この構成により、非常に微細な量の接着剤を吐出できる。 With this configuration, a very fine amount of adhesive can be discharged.
　本発明の第８の発明に係る電子部品接着用ノズルでは、第１から第６のいずれかの発明に加えて、前記吐出出口の直径は、３０μｍ以下である。 In the nozzle for adhering electronic components according to the eighth invention of the present invention, in addition to any one of the first to sixth inventions, the diameter of the discharge outlet is 30 μm or less.
　この構成により、非常に微細な量の接着剤を吐出できる。 With this configuration, a very fine amount of adhesive can be discharged.
　本発明の第９の発明に係る電子部品接着用ノズルでは、第１から第８のいずれかの発明に加えて、前記吐出用貫通孔は、機械加工で穿孔されて形成される。 In the nozzle for adhering electronic components according to the ninth invention of the present invention, in addition to any one of the first to eighth inventions, the discharge through hole is formed by perforation by machining.
　この構成により、精度の高い吐出用貫通孔を形成できる。 With this configuration, a highly accurate discharge through hole can be formed.
　本発明の第１０の発明に係る電子部品接着用ノズルでは、第１から第９のいずれかの発明に加えて、前記吐出用貫通孔の内部表面は、摩擦低下のための表面処理が施されている。 In the nozzle for adhering electronic components according to the tenth aspect of the present invention, in addition to any one of the first to ninth inventions, the inner surface of the discharge through hole is subjected to surface treatment for reducing friction. ing.
　この構成により、吐出用貫通孔において接着剤が目詰まりするなどを防止できる。 With this configuration, it is possible to prevent the adhesive from being clogged in the discharge through hole.
　以下、図面を用いて、本発明の実施の形態について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
　（実施の形態） (Embodiment)
　実施の形態について説明する。 The embodiment will be described.
　（全体概要）
　図１は、本発明の実施の形態における電子部品接着用ノズル（以下、必要に応じて「ノズル」と略す）の写真である。図１は、電子部品接着用ノズル１を斜め上から見た状態を示している。すなわち、本体部２の内部に設けられる内部空間３の方向から見た状態を示している。 (Overview)
FIG. 1 is a photograph of a nozzle for bonding electronic components (hereinafter, abbreviated as “nozzle” if necessary) according to the embodiment of the present invention. FIG. 1 shows a state in which the nozzle 1 for adhering electronic components is viewed from diagonally above. That is, it shows a state seen from the direction of the internal space 3 provided inside the main body 2.
　図２は、本発明の実施の形態における電子部品接着用ノズルの横断面図である。電子部品接着用ノズル１を後述する吐出量貫通孔４で切断した状態として示している。 FIG. 2 is a cross-sectional view of the nozzle for bonding electronic components according to the embodiment of the present invention. It is shown as a state in which the nozzle 1 for adhering electronic components is cut by the discharge amount through hole 4 described later.
　電子部品接着用ノズル１は、本体部２、内部空間３、吐出用貫通孔４を備える。本体部２は、電子部品接着用ノズル１の外形を形成する。この外形によって、他の要素を付随させることで、本体部２は、電子部品接着用ノズル１を構成できる。 The nozzle 1 for adhering electronic components includes a main body 2, an internal space 3, and a through hole 4 for discharging. The main body 2 forms the outer shape of the nozzle 1 for adhering electronic components. By attaching other elements to the outer shape, the main body 2 can form the nozzle 1 for adhering electronic components.
　内部空間３は、本体部２の内部に設けられた空間である。電子部品接着用ノズル１は、接着剤の供給を受けてこれを吐出して、電子基板への電子部品の接着（実装）を実現する。この内部空間３は、接着剤の供給を受ける。すなわち、内部空間３に接着剤が供給（充填）される。内部空間３は、接着剤を受ける空間である。 The internal space 3 is a space provided inside the main body 2. The electronic component bonding nozzle 1 receives the supply of the adhesive and discharges the adhesive to realize the bonding (mounting) of the electronic component to the electronic substrate. The internal space 3 is supplied with an adhesive. That is, the adhesive is supplied (filled) to the internal space 3. The internal space 3 is a space for receiving the adhesive.
　吐出用貫通孔４は、内部空間３から本体部２の先端に向けて設けられた貫通孔である。吐出用貫通孔４は、内部空間３からの接着剤を吐出する。このとき、吐出用貫通孔４は、内部空間３からの接着剤が注入される注入入口４１と、この接着剤を外部に吐出する吐出出口４２を有している。 The discharge through hole 4 is a through hole provided from the internal space 3 toward the tip of the main body 2. The discharge through hole 4 discharges the adhesive from the internal space 3. At this time, the discharge through hole 4 has an injection inlet 41 into which the adhesive from the internal space 3 is injected and a discharge outlet 42 for discharging the adhesive to the outside.
　ここで、吐出出口４２の直径は５０μｍ以下である。 Here, the diameter of the discharge outlet 42 is 50 μm or less.
　電子部品接着用ノズル１は、接着剤の供給装置に取り付けられる。また、電子部品を電子基板に実装する実装装置に組み込まれる。このような構成とされた上で、内部空間３に接着剤が供給される。供給装置は、接着剤の供給に合わせてこれを吐出させる吐出圧力を付与する。この吐出圧力を受けた接着剤は、内部空間３から吐出用貫通孔４を通じて外部に吐出される。このとき、内部空間３の接着剤が、注入入口４１に注入されて吐出用貫通孔４を通過する。通過した接着剤は、吐出出口４２から外部に吐出される。 The nozzle 1 for adhering electronic components is attached to an adhesive supply device. It is also incorporated into a mounting device that mounts electronic components on an electronic board. With such a configuration, the adhesive is supplied to the internal space 3. The supply device applies a discharge pressure to discharge the adhesive in accordance with the supply of the adhesive. The adhesive that has received this discharge pressure is discharged from the internal space 3 to the outside through the discharge through hole 4. At this time, the adhesive in the internal space 3 is injected into the injection inlet 41 and passes through the discharge through hole 4. The passed adhesive is discharged to the outside from the discharge outlet 42.
　ここで、電子基板に設定された電子部品の接着位置が存在し、吐出出口４２は、この接着位置に接着剤を吐出する。そのあとで、接着剤の上に電子部品が載せられて電子部品の実装が完了する。このとき、接着剤は、いわゆる樹脂や高分子素材の接着剤でもよいし、導電性の金属ペーストでもよい。これらは、電子部品の電子基板への実装の仕様によって定められれば良い。 Here, there is an adhesive position of the electronic component set on the electronic substrate, and the discharge outlet 42 discharges the adhesive to this adhesive position. After that, the electronic component is placed on the adhesive to complete the mounting of the electronic component. At this time, the adhesive may be a so-called resin or polymer material adhesive, or may be a conductive metal paste. These may be defined by the specifications for mounting the electronic components on the electronic board.
　吐出用貫通孔４を通じて吐出される接着剤は、吐出出口４２から最終的に吐出される。このとき、上述したように、吐出出口４２の直径は５０μｍ以下である。このため、非常に微細な量および吐出直径での接着剤を吐出できる。近年の電子部品は、非常に小型化している。半導体集積回路などの電子部品はもとより、各種機能を有するセンサーが小型化している。特に、自動車や輸送機器などは、自動運転などを目的とした様々かつ大量のセンサーを実装する傾向がある。 The adhesive discharged through the discharge through hole 4 is finally discharged from the discharge outlet 42. At this time, as described above, the diameter of the discharge outlet 42 is 50 μm or less. Therefore, the adhesive can be discharged in a very fine amount and discharge diameter. Electronic components in recent years have become extremely small. Not only electronic components such as semiconductor integrated circuits, but also sensors with various functions are becoming smaller. In particular, automobiles and transportation equipment tend to be equipped with various and large numbers of sensors for the purpose of autonomous driving.
　このような状況では、微細な量および吐出直径の接着剤の吐出が求められる。 In such a situation, it is required to discharge an adhesive having a fine amount and a discharge diameter.
　吐出出口４２の直径が、５０μｍ以下であることで、求められる微細な量および吐出直径の接着剤の吐出を行うことができる。本発明の電子部品接着用ノズル１を用いることで、微細化している電子部品の実装を実現することができるようになる。 When the diameter of the discharge outlet 42 is 50 μm or less, it is possible to discharge the adhesive having a required fine amount and discharge diameter. By using the nozzle 1 for adhering electronic components of the present invention, it becomes possible to realize the mounting of miniaturized electronic components.
　次に、各部の詳細やバリエーションについて説明する。 Next, the details and variations of each part will be explained.
　　（本体部）
　本体部２は、超硬合金によって形成されることが好適である。例えば、タングステンを主原料とする超硬合金などが用いられる。タングステンカーバイドがバインダで結合された合金であったり、炭化チタンなどが混合された合金であったりする。 (Main body)
The main body 2 is preferably formed of cemented carbide. For example, a cemented carbide having tungsten as a main raw material is used. It may be an alloy in which tungsten carbide is bonded with a binder, or an alloy in which titanium carbide or the like is mixed.
　本体部２が超硬合金で形成されていることにより、電子部品接着用ノズル１の強度および耐久性が高まる。電子部品接着用ノズル１は、大量の電子部品を接着するために、非常に多くの回数の繰り返し使用を受ける。また、動作間隔も非常に短い。このため、非常な負荷が加わる。接着剤の供給と吐出に加えて、吐出圧力も短間隔で次々と付与される。 Since the main body 2 is made of cemented carbide, the strength and durability of the nozzle 1 for adhering electronic components is increased. The electronic component bonding nozzle 1 is repeatedly used a large number of times in order to bond a large number of electronic components. Also, the operation interval is very short. Therefore, a great load is applied. In addition to the supply and discharge of the adhesive, the discharge pressure is also applied one after another at short intervals.
　本体部２が、超硬合金であることで、このような大きな負荷に対しても対応できるようになる。高い耐久性により、負荷の大きな使用に対応できる。 Since the main body 2 is made of cemented carbide, it can cope with such a large load. Due to its high durability, it can be used under heavy load.
　また、上述したように、電子部品接着用ノズル１は、微細な量と吐出直径の接着剤を吐出することが求められる。このため、吐出用貫通孔４の内径、吐出軸の高い精度が求められる。吐出用貫通孔４は、本体部２の所定位置を穿孔されて形成されるかあるいは、張り合わせなどで形成されるか、型加工で形成されるかする。 Further, as described above, the nozzle 1 for bonding electronic components is required to discharge an adhesive having a fine amount and a discharge diameter. Therefore, high accuracy of the inner diameter of the discharge through hole 4 and the discharge shaft is required. The discharge through hole 4 is formed by drilling a predetermined position of the main body portion 2, is formed by laminating or the like, or is formed by molding.
　このようにして形成される吐出用貫通孔４は、本体部２が超硬合金であることで、高い精度で形成されやすくなる。加えて、超硬合金であることで、形成された後でも、その形状や吐出軸が変形しにくいメリットもある。特に、高い負荷で繰り返し使用される状況では、吐出用貫通孔４の変形などの懸念がある。このような場合でも、本体部２が超硬合金で形成されている場合には、このような変形のリスクを大きく低減できるメリットがある。 The discharge through hole 4 formed in this way can be easily formed with high accuracy because the main body 2 is made of cemented carbide. In addition, since it is a cemented carbide, there is an advantage that its shape and discharge shaft are not easily deformed even after it is formed. In particular, in a situation where it is repeatedly used with a high load, there is a concern that the discharge through hole 4 may be deformed. Even in such a case, if the main body 2 is made of cemented carbide, there is an advantage that the risk of such deformation can be greatly reduced.
　また、本体部２は、金属紛体の焼結体で形成されることも好適である。このとき、タングステンカーバイドなどの超鋼金属素材の粉末が、他の粉末素材と混合された上で、焼結されて焼結体とされればよい。もちろん、他の金属素材が用いられてもよい。 It is also preferable that the main body 2 is formed of a sintered metal powder. At this time, the powder of a super steel metal material such as tungsten carbide may be mixed with another powder material and then sintered to form a sintered body. Of course, other metal materials may be used.
　このような金属紛体の焼結体で本体部２が形成されることで、本体部２を高い精度で製造することができる。また、焼結体とする際に、吐出用貫通孔４を設けてもよいし、焼結体となった後で、穿孔などにより吐出用貫通孔４を形成してもよい。いずれの場合でも、焼結体で本体部２が形成されることで、容易な形成ができるようになる。 By forming the main body 2 with such a sintered metal powder, the main body 2 can be manufactured with high accuracy. Further, when the sintered body is formed, the discharge through hole 4 may be provided, or after the sintered body is formed, the discharge through hole 4 may be formed by drilling or the like. In either case, the main body 2 is formed of the sintered body, so that the main body 2 can be easily formed.
　また、焼結体であることで、本体部２の強度や耐久性が高まり、上述のような負荷の高い繰り返し使用に対する耐久性が高まるようになる。加えて、焼結体であることで、本体部２を適切な形状として形成することができる。例えば、図３のように、先端部が伸びている形状の電子部品接着用ノズル１を製造する必要があることもある。このような場合には、焼結体であることで、形状を高い精度で形成することが可能となる。もちろん、焼結体でなくともこのような形状の本体部２を形成することも可能である。 Further, since it is a sintered body, the strength and durability of the main body 2 are increased, and the durability against repeated use with a high load as described above is increased. In addition, since it is a sintered body, the main body 2 can be formed into an appropriate shape. For example, as shown in FIG. 3, it may be necessary to manufacture the nozzle 1 for adhering electronic components having a shape in which the tip portion is extended. In such a case, the sintered body makes it possible to form the shape with high accuracy. Of course, it is also possible to form the main body 2 having such a shape even if it is not a sintered body.
　図３は、本発明の実施の形態におけるロングタイプの電子部品接着用ノズルの側面図である。図３の左側は、ロングタイプの電子部品接着用ノズル１の側面の外形図を示している。図３の右側は、この内部が分かるような断面図を示している。図３の左右から分かるとおり、ロングタイプの電子部品接着用ノズル１も、
内部空間３と吐出用貫通孔４が備わり、接着剤を吐出することができる。 FIG. 3 is a side view of a long type electronic component bonding nozzle according to the embodiment of the present invention. The left side of FIG. 3 shows an external view of a side surface of a long type electronic component bonding nozzle 1. The right side of FIG. 3 shows a cross-sectional view so that the inside can be seen. As can be seen from the left and right of FIG. 3, the long type electronic component bonding nozzle 1 is also
The internal space 3 and the discharge through hole 4 are provided, and the adhesive can be discharged.
　このようなロングタイプの電子部品接着用ノズル１であることで、より正確かつ高い精度で接着剤を吐出することができる。また、より高密度実装をしなければならない場合に、先端部が伸びていることで、高密度実装に対応して接着剤を吐出することができる。 With such a long type electronic component bonding nozzle 1, the adhesive can be discharged more accurately and with high accuracy. Further, when higher density mounting is required, the elongated tip portion makes it possible to discharge the adhesive corresponding to the high density mounting.
　　（内部空間）
　内部空間３は、本体部２の内部に設けられた空間である。本体部２が形成される際に同時に内部空間３が形成されてもよい。あるいは、本体部２の内部が切削等されることで、内部空間３が形成されてもよい。 (Internal space)
The internal space 3 is a space provided inside the main body 2. The internal space 3 may be formed at the same time when the main body 2 is formed. Alternatively, the internal space 3 may be formed by cutting the inside of the main body 2 or the like.
　電子部品接着用ノズル１は、接着剤を供給して吐出圧力を付与する装置に組み合されて使用される。この装置に組み合されると、装置から接着剤がこの内部空間３に供給される。また、この供給に合わせて、装置が内部空間３に吐出圧力を付与する。この付与を受けて、内部空間３は供給された接着剤を、内部空間３に連通する吐出用貫通孔４を通じて吐出する。 The electronic component bonding nozzle 1 is used in combination with a device that supplies adhesive and applies discharge pressure. When combined with this device, the device supplies the adhesive to the interior space 3. Further, the device applies a discharge pressure to the internal space 3 in accordance with this supply. In response to this application, the internal space 3 discharges the supplied adhesive through the discharge through hole 4 communicating with the internal space 3.
　このとき、内部空間３に連通する吐出用貫通孔４は、内部空間３と注入入口４１がつながっている。この注入入口４１は、吐出用貫通孔４を通じて、吐出出口４２に繋がっている。 At this time, the discharge through hole 4 communicating with the internal space 3 is connected to the internal space 3 and the injection inlet 41. The injection inlet 41 is connected to the discharge outlet 42 through the discharge through hole 4.
　内部空間３は、本体部２の大きさに合わせた容積を有していればよい。また、吐出する接着剤の量や、その回数に合わせた容積を有していればよい。あるいは、吐出圧力を付与する装置との関係で決定されればよい。 The internal space 3 may have a volume that matches the size of the main body 2. Further, it suffices to have a volume corresponding to the amount of the adhesive to be discharged and the number of times thereof. Alternatively, it may be determined in relation to the device that applies the discharge pressure.
　　（吐出用貫通孔）
　吐出用貫通孔４は、内部空間から圧力を受けて入り込む接着剤を、実際に吐出する。吐出する先は、電子部品を実装する電子基板の実装部位である。吐出用貫通孔４は、内部空間４からの接着剤が注入される注入入口４１と接着剤が吐出される吐出出口４２を備える。 (Through hole for discharge)
The discharge through hole 4 actually discharges the adhesive that receives pressure from the internal space and enters. The discharge destination is the mounting portion of the electronic board on which the electronic component is mounted. The discharge through hole 4 includes an injection inlet 41 into which the adhesive is injected from the internal space 4 and a discharge outlet 42 in which the adhesive is discharged.
　内部空間３に供給される接着剤は、吐出圧力を受けて注入入口４１に入る。そのまま吐出圧力を受けて接着剤は、吐出出口４２から吐出される。この吐出によって接着剤が、実装可能な状態として塗布される。 The adhesive supplied to the internal space 3 receives the discharge pressure and enters the injection inlet 41. The adhesive is discharged from the discharge outlet 42 by receiving the discharge pressure as it is. By this discharge, the adhesive is applied in a mountable state.
　ここで、図４のように、吐出用貫通孔４において、吐出出口４２の直径が注入入口４１の直径より大きいことも好適である。図４は、本発明の実施の形態における電子部品接着用ノズルの断面図である。吐出用貫通孔４の内部構造が分かるように示している。 Here, as shown in FIG. 4, it is also preferable that the diameter of the discharge outlet 42 is larger than the diameter of the injection inlet 41 in the discharge through hole 4. FIG. 4 is a cross-sectional view of the nozzle for bonding electronic components according to the embodiment of the present invention. The internal structure of the discharge through hole 4 is shown so as to be understood.
　このとき、図５に示すように、吐出用貫通孔が段階的に吐出出口４２に向かうにつれて小さくなっていくことでもよい。図５は、本発明の実施の形態における電子部品接着用ノズルの断面図である。図５では、吐出用貫通孔４が２段階の形状を有して、吐出出口４２の直径が注入入口４１の直径よりも小さい。 At this time, as shown in FIG. 5, the discharge through hole may gradually become smaller toward the discharge outlet 42. FIG. 5 is a cross-sectional view of the nozzle for bonding electronic components according to the embodiment of the present invention. In FIG. 5, the discharge through hole 4 has a two-stage shape, and the diameter of the discharge outlet 42 is smaller than the diameter of the injection inlet 41.
　吐出出口４２の直径が、注入入口４１の直径より小さいことで、吐出用貫通孔４を通過して吐出される接着剤は、微細な量および吐出直径で吐出されやすくなる。特に、微細な吐出直径で吐出する際に、より高い精度で吐出させることができる。また、吐出する部位へ、より正しく吐出させることができる。 Since the diameter of the discharge outlet 42 is smaller than the diameter of the injection inlet 41, the adhesive discharged through the discharge through hole 4 is likely to be discharged in a fine amount and the discharge diameter. In particular, when discharging with a fine discharge diameter, it is possible to discharge with higher accuracy. In addition, it can be more accurately discharged to the discharge portion.
　また、吐出用貫通孔４は、注入入口４１から吐出出口４２に向けて次第に内径が小さくなっていく構造を有する。このような構造により、吐出用貫通孔４を移動する過程で、接着剤はより吐出すべき位置に正確に吐出されるようになる。すなわち、狙い通りの位置に吐出されるようになる。 Further, the discharge through hole 4 has a structure in which the inner diameter gradually decreases from the injection inlet 41 toward the discharge outlet 42. With such a structure, the adhesive can be more accurately discharged to the position to be discharged in the process of moving through the discharge through hole 4. That is, it will be discharged to the target position.
　加えて、先端にかけて内径が次第に小さくなっていくことで、より微細な量と吐出直径での吐出も可能となる。 In addition, as the inner diameter gradually decreases toward the tip, it is possible to discharge with a finer amount and discharge diameter.
　ここで、注入入口４１の直径は、吐出出口４２の直径よりも１０％以上大きいことも好適である。例えば、注入入口４１の直径が５０μｍであるときに吐出出口４２の直径が４０μｍである。あるいは、注入入口４２の直径が４０μｍであるときに、吐出出口４２の直径が３０μｍである。 Here, it is also preferable that the diameter of the injection inlet 41 is 10% or more larger than the diameter of the discharge outlet 42. For example, when the diameter of the injection inlet 41 is 50 μm, the diameter of the discharge outlet 42 is 40 μm. Alternatively, when the diameter of the injection inlet 42 is 40 μm, the diameter of the discharge outlet 42 is 30 μm.
　このような大きさの差があることで、注入入口４１から吐出出口４２へ移動して吐出される接着剤は、微細な吐出直径で確実に吐出されるようになる。特に、微細な位置に確実に接着剤を吐出することができるようになる。接着剤が入る注入入口４１よりも吐出出口４２が小さいことで、吐出用貫通孔４を移動する際に、接着剤はより目標となる位置に吐出されやすくなるからである。 Due to such a difference in size, the adhesive that moves from the injection inlet 41 to the discharge outlet 42 and is discharged can be reliably discharged with a fine discharge diameter. In particular, the adhesive can be reliably discharged to a fine position. This is because the discharge outlet 42 is smaller than the injection inlet 41 into which the adhesive enters, so that the adhesive is more likely to be discharged to a target position when moving through the discharge through hole 4.
　ここで、吐出出口４２の直径は、４０μｍ以下であることも好適である。近年の電子部品の小型化は非常に進んでおり、このような小型の電子部品を電子基板に実装するには、４０μｍ以下の直径の吐出出口４２から接着剤が吐出されることが好ましい。 Here, it is also preferable that the diameter of the discharge outlet 42 is 40 μm or less. In recent years, the miniaturization of electronic components has been extremely advanced, and in order to mount such a small electronic component on an electronic substrate, it is preferable that the adhesive is discharged from a discharge outlet 42 having a diameter of 40 μm or less.
　吐出出口４２の直径が４０μｍ以下であることで、非常に小さな面積の部位に対応する接着剤を吐出できる。 Since the diameter of the discharge outlet 42 is 40 μm or less, the adhesive corresponding to a portion having a very small area can be discharged.
　さらには、吐出出口４２の直径は、３０μｍ以下であることも好適である。更に小型の電子部品の実装において必要となる最適な量と部位への接着剤の吐出を可能とするからである。吐出出口４２の直径が３０μｍ以下であることで、より小型の電子部品の実装に適した接着剤の吐出を可能とできる。あるいは、より高密度実装に適した接着剤の吐出が可能である。 Furthermore, it is also preferable that the diameter of the discharge outlet 42 is 30 μm or less. Furthermore, it is possible to discharge the adhesive to the optimum amount and site required for mounting small electronic components. When the diameter of the discharge outlet 42 is 30 μm or less, it is possible to discharge an adhesive suitable for mounting smaller electronic components. Alternatively, it is possible to discharge an adhesive suitable for higher density mounting.
　　（吐出用貫通孔のバリエーション）
　吐出用貫通孔４は、本体部２において機械加工で穿孔されて形成されることも好適である。本体部２が形成された後で、内部空間３と吐出用貫通孔４が機械加工で形成されてもよい。機械加工によって穿孔されて吐出用貫通孔４が形成されることで、高い精度で吐出用貫通孔４が形成できる。 (Variation of through hole for discharge)
It is also preferable that the discharge through hole 4 is formed by drilling in the main body 2 by machining. After the main body portion 2 is formed, the internal space 3 and the discharge through hole 4 may be formed by machining. Since the discharge through hole 4 is formed by being drilled by machining, the discharge through hole 4 can be formed with high accuracy.
　また、上述したように、吐出用貫通孔４は、吐出出口４２に向けて次第に細くなっていくことも好適である。このような形状の場合にも、吐出用貫通孔４が機械加工で穿孔されることで実現が容易となる。また、機械加工で形成されることで、耐久性の高い吐出用貫通孔４を実現できる。加えて、非常に微細な直径の吐出用貫通孔４を実現することもできる。 Further, as described above, it is also preferable that the discharge through hole 4 gradually becomes thinner toward the discharge outlet 42. Even in the case of such a shape, it is easy to realize by drilling the discharge through hole 4 by machining. Further, by being formed by machining, a highly durable discharge through hole 4 can be realized. In addition, it is possible to realize a discharge through hole 4 having a very fine diameter.
　吐出用貫通孔４の内部表面は、摩擦低下のための表面処理が施されていることも好適である。この表面処理によって接着剤の吐出がより容易となる。吐出用貫通孔４内部で接着剤が詰まりにくくなり、最適な量と吐出直径での接着剤の吐出が確実に行える。また、目詰まりなどが生じにくいことで、電子部品接着用ノズル１の耐久性や寿命延長に効果的である。 It is also preferable that the inner surface of the discharge through hole 4 is surface-treated to reduce friction. This surface treatment makes it easier to discharge the adhesive. The adhesive is less likely to be clogged inside the discharge through hole 4, and the adhesive can be reliably discharged with the optimum amount and discharge diameter. Further, since clogging is less likely to occur, it is effective in extending the durability and life of the nozzle 1 for adhering electronic components.
　摩擦低下の表面処理は、コーティング処理や磨き処理など様々な手段で実現されればよい。 The surface treatment for reducing friction may be realized by various means such as coating treatment and polishing treatment.
　以上、実施の形態で説明された電子部品接着用ノズルは、本発明の趣旨を説明する一例であり、本発明の趣旨を逸脱しない範囲での変形や改造を含む。 As described above, the nozzle for bonding electronic components described in the embodiment is an example for explaining the gist of the present invention, and includes deformation and modification within a range not deviating from the gist of the present invention.
　１　　電子部品接着用ノズル
　２　　本体部
　３　　内部空間
　４　　吐出用貫通孔
　　４１　　注入入口
　　４２　　吐出出口 1 Nozzle for bonding electronic components 2 Main body 3 Internal space 4 Through hole for discharge 41 Injection inlet 42 Discharge outlet

Claims (10)

  1. 　電子部品の実装に必要となる接着剤を吐出する電子部品接着用ノズルであって、
    　本体部と、
    　前記本体部の内部に設けられて、前記接着剤が供給される内部空間と、
    　前記内部空間から前記本体部の先端に向けて設けられた吐出用貫通孔と、を備え、
    　前記吐出用貫通孔は、前記内部空間からの接着剤が注入される注入入口と、前記内部空間からの接着剤を外部に吐出する吐出出口とを有し、
    　前記吐出出口の直径は、５０μｍ以下であり、
    　前記内部空間に供給される前記接着剤は、吐出圧力を受けて、前記注入入口に注入されて前記吐出用貫通孔を通過し、前記吐出出口から吐出される、電子部品接着用ノズル。     A nozzle for adhering electronic components that ejects the adhesive required for mounting electronic components.
    With the main body
    An internal space provided inside the main body and to which the adhesive is supplied, and
    A discharge through hole provided from the internal space toward the tip of the main body is provided.
    The discharge through hole has an injection inlet into which the adhesive from the internal space is injected and a discharge outlet in which the adhesive from the internal space is discharged to the outside.
    The diameter of the discharge outlet is 50 μm or less.
    The adhesive supplied to the internal space receives a discharge pressure, is injected into the injection inlet, passes through the discharge through hole, and is discharged from the discharge outlet.
  2. 　前記本体部は、超硬合金により形成される、請求の範囲第１記載の電子部品接着用ノズル。 The main body is a nozzle for adhering electronic components according to claim 1, which is formed of cemented carbide.
  3. 　前記本体部は、金属紛体の焼結体で形成される、請求の範囲第１項または第２項記載の電子部品接着用ノズル。 The main body is a nozzle for adhering electronic components according to claim 1 or 2, which is formed of a sintered body of metal powder.
  4. 　前記吐出用貫通孔において、前記吐出出口の直径は、前記注入入口の直径より小さい、請求の範囲第１項から第３項のいずれか記載の電子部品接着用ノズル。 The nozzle for bonding electronic components according to any one of claims 1 to 3, wherein the diameter of the discharge outlet is smaller than the diameter of the injection inlet in the discharge through hole.
  5. 　前記注入入口の直径は、前記吐出出口の直径よりも１０％以上大きい、請求の範囲第４項記載の電子部品接着用ノズル。 The nozzle for bonding electronic components according to claim 4, wherein the diameter of the injection inlet is 10% or more larger than the diameter of the discharge outlet.
  6. 　前記吐出用貫通孔は、前記注入入口から前記吐出出口にかけて次第に内径が小さくなっていく、請求の範囲第１項から第５項のいずれか記載の電子部品接着用ノズル。 The nozzle for bonding electronic components according to any one of claims 1 to 5, wherein the inner diameter of the discharge through hole gradually decreases from the injection inlet to the discharge outlet.
  7. 　前記吐出出口の直径は、４０μｍ以下である、請求の範囲第１項から第６項のいずれか記載の電子部品接着用ノズル。 The nozzle for bonding electronic components according to any one of claims 1 to 6, wherein the discharge outlet has a diameter of 40 μm or less.
  8. 　前記吐出出口の直径は、３０μｍ以下である、請求の範囲第１項から第６項のいずれか記載の電子部品接着用ノズル。 The nozzle for bonding electronic components according to any one of claims 1 to 6, wherein the discharge outlet has a diameter of 30 μm or less.
  9. 　前記吐出用貫通孔は、機械加工で穿孔されて形成される、請求の範囲第１項から第８項のいずれか記載の電子部品接着用ノズル。 The nozzle for bonding electronic components according to any one of claims 1 to 8, wherein the discharge through hole is formed by being drilled by machining.
  10. 　前記吐出用貫通孔の内部表面は、摩擦低下のための表面処理が施されている、請求の範囲第１項から第９項のいずれか記載の電子部品接着用ノズル。 The nozzle for bonding electronic components according to any one of claims 1 to 9, wherein the inner surface of the discharge through hole is surface-treated to reduce friction.
PCT/JP2020/023322 2019-07-12 2020-06-15 Electronic-component bonding nozzle WO2021010073A1 (en)

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JP7327864B1 (en) 2022-10-24 2023-08-16 株式会社共立合金製作所 Precision nozzle and its manufacturing method

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