CN113631280B - Nozzle for bonding electronic parts - Google Patents
Nozzle for bonding electronic parts Download PDFInfo
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- CN113631280B CN113631280B CN202080024674.9A CN202080024674A CN113631280B CN 113631280 B CN113631280 B CN 113631280B CN 202080024674 A CN202080024674 A CN 202080024674A CN 113631280 B CN113631280 B CN 113631280B
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- Prior art keywords
- discharge
- adhesive
- electronic component
- hole
- diameter
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nozzles (AREA)
- Coating Apparatus (AREA)
Abstract
The invention provides a nozzle for bonding electronic parts, which can spray optimal amount of adhesive to a narrow area with high precision. The electronic component bonding nozzle of the present invention is a nozzle for ejecting an adhesive agent required for mounting an electronic component, the nozzle comprising: a main body portion; an internal space provided inside the main body, the internal space being supplied with the adhesive; and a discharge through hole extending from the internal space toward a tip end of the main body, the discharge through hole having an injection inlet through which the adhesive from the internal space is injected and a discharge outlet through which the adhesive from the internal space is discharged to the outside, the discharge outlet having a diameter of 50 μm or less, the adhesive supplied to the internal space being injected into the injection inlet by a discharge pressure and being discharged from the discharge outlet through the discharge through hole.
Description
Technical Field
The present invention relates to an electronic component bonding nozzle that discharges an adhesive when bonding an electronic component to a mounting board or the like.
Background
A large number of various electronic components are used in apparatuses and devices such as electronic apparatuses, precision apparatuses, conveying apparatuses, and machine tools. Alternatively, not only the assembled components but also various components to be mounted or combined as needed are required. Such electronic components are mounted on a mounting board mounted on an electronic device or a precision device.
Here, the electronic component mounted on the mounting substrate is various components such as a semiconductor device, an LSI, an optical device, a discrete electronic component, and an electronic device. The electronic components are currently extremely miniaturized and high in performance. In particular, many sensor elements are mounted on recent electronic devices. Many sensor elements are similarly mounted not only on electronic devices, but also on transportation devices such as automobiles, machine tools used in factories, and the like. Such many sensor elements are mounted on various machines and devices in recent years. This is because many sensor elements are required at many locations in order to achieve automatic driving, remote operation, and the like.
The machine tool and the device include not only the sensor element but also many electronic components for performing electronic operations. Many of these electronic components are mounted on a mounting board mounted on a device or equipment. The electronic components are mounted on the mounting board by a conductive paste such as solder or various adhesives. At this time, it is necessary to apply a conductive paste or an adhesive (hereinafter, collectively referred to as "adhesive" as needed) for mounting to the mounting substrate.
There are various methods for applying such adhesives. Several techniques have been proposed for applying an adhesive agent necessary for mounting such electronic components (see, for example, patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2018-101815
Disclosure of Invention
Problems to be solved by the invention
In patent document 1, the cleaning member 22 is taken out and held by the mounting head 9 from the cleaning member feeder mounted to the feeder base of the component feeding section together with other accessory feeders, and in this state, the cleaning member is moved to a position where it contacts the discharge nozzle 46 of the dispenser unit 6, and the mounting head 9 performs a cleaning operation of a predetermined pattern for horizontally reciprocating the cleaning member 22, thereby cleaning the discharge nozzle 46. Thus, the electronic component mounting apparatus is disclosed, which can efficiently and appropriately perform the maintenance cleaning work required to stabilize the application of the paste P by the dispenser unit 6.
However, in recent years, many electronic components are mounted in electronic apparatuses and transportation apparatuses. In addition, the size of electronic components is also extremely reduced and miniaturized, and the amount of adhesive to be sprayed to the mounting substrate is also extremely small. In addition, it is necessary to accurately discharge the adhesive to a very precise narrow area. More strict accuracy is required for ensuring the discharge area, the discharge amount, and the interval between adjacent discharge areas.
In response to such a demand, the conventional technology represented by patent document 1 has a problem that it cannot cope with it. In particular, there is a problem that it is difficult to discharge an appropriate amount of adhesive to a precise and narrow area. Because of this problem, it is difficult to perform high-speed mounting by discharging an adhesive for mounting many very small electronic components.
Further, in the conventional technique, there is also a problem that the accuracy of the nozzle portion for ejection is low and the adhesive filled for ejection is clogged. Further, since the through-hole through which the adhesive is discharged cannot be made fine, the amount of the discharged adhesive is too large, and there is a problem that it is not suitable for mounting small electronic components. Alternatively, there is a problem that it is difficult to discharge an optimal amount of adhesive to a range or a place suitable for mounting electronic components. In some cases, there is a problem that the adhesive cannot be discharged to a position to be originally discharged.
Further, there is a problem that the durability of the nozzle itself is also low. Therefore, there is also a problem that the nozzle and the discharge mechanism must be frequently replaced. Due to this problem, there is also caused a problem that the cost of mounting the electronic parts increases.
In view of the above problems, an object of the present invention is to provide a nozzle for bonding electronic components, which can eject an optimal amount of adhesive to a narrow area with high accuracy.
Means for solving the problems
In order to solve the above problems, the nozzle for bonding electronic parts according to the present invention is a nozzle for spraying an adhesive agent required for mounting electronic parts,
the electronic component bonding nozzle includes:
a main body portion;
an internal space provided inside the main body, the internal space being supplied with the adhesive; and
a discharge through hole provided from the internal space toward a tip end of the main body,
the discharge through hole has an injection inlet through which the adhesive from the internal space is injected and a discharge outlet through which the adhesive from the internal space is discharged to the outside,
the diameter of the ejection outlet is 50 μm or less,
the adhesive supplied to the internal space is injected into the injection inlet by receiving a discharge pressure, passes through the discharge through hole, and is discharged from the discharge outlet.
ADVANTAGEOUS EFFECTS OF INVENTION
The invention provides a nozzle for bonding electronic parts, which can spray adhesive to a narrow area corresponding to a very small electronic part with high precision. In this case, the adhesive can be discharged at an optimum level for the position, area, and amount to be discharged.
Further, since it has high durability, it can cope with repeated use. As a result, the cost of electronic component mounting can be reduced.
Drawings
Fig. 1 is a photograph of an electronic component bonding nozzle (hereinafter simply referred to as "nozzle" as needed) according to an embodiment of the present invention.
Fig. 2 is a transverse cross-sectional view of the electronic component bonding nozzle according to the embodiment of the present invention.
Fig. 3 is a side view of an elongated electronic component bonding nozzle according to an embodiment of the present invention.
Fig. 4 is a sectional view of the electronic component bonding nozzle according to the embodiment of the present invention.
Fig. 5 is a sectional view of the electronic component bonding nozzle according to the embodiment of the present invention.
Detailed Description
The electronic component bonding nozzle according to claim 1 of the present invention is a nozzle for ejecting an adhesive agent required for mounting an electronic component, wherein,
the electronic component bonding nozzle includes:
a main body portion;
an internal space provided inside the main body, the internal space being supplied with the adhesive; and
a discharge through hole provided from the internal space toward a tip end of the main body,
the discharge through hole has an injection inlet through which the adhesive from the internal space is injected and a discharge outlet through which the adhesive from the internal space is discharged to the outside,
the diameter of the ejection outlet is 50 μm or less,
the adhesive supplied to the internal space is injected into the injection inlet by receiving a discharge pressure, passes through the discharge through hole, and is discharged from the discharge outlet.
According to this structure, the adhesive can be discharged in a very fine and optimum amount and discharge diameter. By this ejection, small electronic components can be mounted on the electronic substrate at high density.
The electronic component bonding nozzle according to claim 2 of the present invention is the electronic component bonding nozzle according to claim 1, wherein the main body is made of cemented carbide.
With this structure, high durability can be achieved. Further, the accuracy of the ejection axis of the ejection through hole is improved, and the amount of the adhesive to be ejected and the ejection diameter are optimized.
The electronic component bonding nozzle according to claim 3 of the present invention is the electronic component bonding nozzle according to claim 1 or 2, wherein the main body is formed of a sintered body of a metal powder.
With this configuration, the formation of the main body portion is facilitated. In addition, the forming accuracy can be improved.
The electronic component bonding nozzle according to claim 4 of the present invention is the nozzle according to any one of claims 1 to 3, wherein the discharge through hole has a diameter of the discharge outlet smaller than a diameter of the injection inlet.
With this configuration, the discharged adhesive can be discharged to a more precise position in an appropriate amount.
In the electronic component bonding nozzle according to claim 5 of the present invention, the diameter of the injection inlet is larger than the diameter of the discharge outlet by 10% or more.
With this structure, the adhesive can be discharged to a finer portion.
The electronic component bonding nozzle according to claim 6 of the present invention is the electronic component bonding nozzle according to claim 5, wherein the discharge through-hole has an inner diameter that gradually decreases from the injection inlet toward the discharge outlet.
According to this configuration, the adhesive can be reliably discharged to the optimum minute position.
The electronic component bonding nozzle according to claim 7 of the present invention is characterized in that the diameter of the discharge outlet is 40 μm or less in any one of claims 1 to 6.
With this structure, a very fine amount of adhesive can be discharged.
The electronic component bonding nozzle according to claim 8 of the present invention is characterized in that the diameter of the discharge outlet is 30 μm or less in any one of claims 1 to 6.
With this structure, a very fine amount of adhesive can be discharged.
The electronic component bonding nozzle according to claim 9 of the present invention is the nozzle according to any one of claims 1 to 8, wherein the discharge through-hole is formed by machining.
With this configuration, the discharge through hole can be formed with high accuracy.
The electronic component bonding nozzle according to claim 10 of the present invention is the nozzle according to any one of claims 1 to 9, wherein an inner surface of the discharge through hole is subjected to a surface treatment for reducing friction.
With this configuration, the adhesive can be prevented from clogging the discharge through hole.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(embodiment mode)
The embodiments will be explained.
(general overview)
Fig. 1 is a photograph of an electronic component bonding nozzle (hereinafter simply referred to as "nozzle" as needed) according to an embodiment of the present invention. Fig. 1 shows a state of the electronic component bonding nozzle 1 as viewed from obliquely above. That is, the state is shown as seen from the direction of the internal space 3 provided inside the main body 2.
Fig. 2 is a transverse cross-sectional view of the electronic component bonding nozzle according to the embodiment of the present invention. Fig. 2 shows a state in which the electronic component bonding nozzle 1 is cut by the discharge amount through hole 4 described later.
The electronic component bonding nozzle 1 includes a main body 2, an internal space 3, and a discharge through hole 4. The main body 2 forms the outer shape of the electronic component bonding nozzle 1. By adding other elements according to the external shape, the main body 2 can constitute the electronic component bonding nozzle 1.
The internal space 3 is a space provided inside the main body 2. The electronic component bonding nozzle 1 receives and discharges the adhesive, and bonds (mounts) the electronic component to the electronic substrate. The internal space 3 receives supply of the adhesive. That is, the adhesive is supplied (filled) into the internal space 3. The internal space 3 is a space for receiving the adhesive.
The discharge through hole 4 is a through hole extending from the internal space 3 toward the distal end of the main body 2. The discharge through hole 4 discharges the adhesive from the internal space 3. In this case, the discharge through hole 4 has an injection inlet 41 through which the adhesive from the internal space 3 is injected and a discharge outlet 42 through which the adhesive is discharged to the outside.
Here, the diameter of the discharge outlet 42 is 50 μm or less.
The electronic component bonding nozzle 1 is attached to an adhesive supply device. The electronic component is mounted on a mounting device mounted on an electronic substrate. In addition to this structure, the adhesive is supplied to the internal space 3. The supply device applies a discharge pressure for discharging the adhesive in accordance with the supply of the adhesive. The adhesive subjected to the discharge pressure is discharged from the internal space 3 to the outside through the discharge through hole 4. At this time, the adhesive in the internal space 3 is injected into the injection inlet 41 and passes through the discharge through-hole 4. The adhesive having passed through the discharge through hole 4 is discharged to the outside from the discharge outlet 42.
Here, there is a bonding position of the electronic component set on the electronic substrate, and the discharge outlet 42 discharges the adhesive to the bonding position. Thereafter, the electronic component is mounted on the adhesive to complete the mounting of the electronic component. In this case, the adhesive may be a so-called resin or polymer adhesive, or may be a conductive metal paste. These may be determined according to the mounting specification of the electronic component on the electronic substrate.
The adhesive discharged through the discharge through hole 4 is finally discharged from the discharge outlet 42. At this time, as described above, the diameter of the discharge outlet 42 is 50 μm or less. Therefore, the adhesive can be discharged in a very fine amount and discharge diameter. In recent years, electronic parts have been miniaturized. Electronic components such as semiconductor integrated circuits are miniaturized, and sensors having various functions are also used. In particular, automobiles, transportation equipment, and the like tend to be equipped with various and numerous sensors for the purpose of automatic driving and the like.
In such a case, it is desired to discharge an adhesive in a minute amount and a discharge diameter.
The diameter of the discharge outlet 42 is 50 μm or less, so that the adhesive of a desired minute amount and discharge diameter can be discharged. By using the nozzle 1 for bonding electronic components of the present invention, it is possible to realize mounting of electronic components with a fine size.
Next, details and variations of the respective portions will be described.
(Main body part)
Preferably, the main body 2 is formed of cemented carbide. For example, cemented carbide or the like using tungsten as a main raw material is used. Or an alloy in which tungsten carbide is bonded with a binder, or an alloy in which titanium carbide or the like is mixed.
Since the main body 2 is made of cemented carbide, the strength and durability of the electronic component bonding nozzle 1 are improved. In order to bond a large number of electronic components, the electronic component bonding nozzle 1 is repeatedly used a very large number of times. In addition, the operation interval is also very short. Therefore, a very large load is applied. In addition to the supply and ejection of the adhesive, the ejection pressure is constantly applied at short intervals.
Since the main body 2 is made of cemented carbide, it is possible to cope with such a large load. Because of the high durability, the present invention can be used under a heavy load.
Further, as described above, the nozzle 1 for bonding electronic components is required to discharge a fine amount of adhesive and a discharge diameter of the adhesive. Therefore, the inner diameter of the discharge through hole 4 and the discharge shaft are highly accurate. The discharge through-hole 4 is formed by punching a predetermined position of the main body 2, by bonding or the like, or by die processing.
The discharge through-hole 4 thus formed is easily formed with high accuracy because the body 2 is made of cemented carbide. Further, since the hard alloy is used, there is an advantage that the shape and the discharge shaft are not easily deformed even after the formation. In particular, when repeatedly used under a high load, the discharge through-hole 4 may be deformed. Even in such a case, when the main body 2 is formed of cemented carbide, there is an advantage that the risk of such deformation can be greatly reduced.
Further, it is also preferable that the main body 2 is formed of a sintered body of metal powder. In this case, the powder of a hard metal material such as tungsten carbide may be mixed with another powder material and then sintered to form a sintered body. Of course, other metallic materials may be used.
By forming the body 2 from a sintered body of such a metal powder, the body 2 can be manufactured with high accuracy. The discharge through-hole 4 may be provided when the sintered body is formed, or the discharge through-hole 4 may be formed by punching or the like after the sintered body is formed. In either case, the body 2 can be easily formed by forming the sintered body.
Further, since the sintered body is used, the strength and durability of the body 2 are improved, and the durability against repeated use under such a load is improved. Further, since it is a sintered body, the body 2 can be formed into an appropriate shape. For example, as shown in fig. 3, it may be necessary to manufacture an electronic component bonding nozzle 1 having a shape in which a tip portion thereof extends. In this case, since the sintered body is used, the shape can be formed with high accuracy. Of course, the body 2 having such a shape can be formed without using a sintered body.
Fig. 3 is a side view of an elongated electronic component bonding nozzle according to an embodiment of the present invention. Fig. 3 is a left side view showing an outline of a side surface of the long electronic component bonding nozzle 1. A cross-sectional view in which the inside thereof can be seen is shown on the right side of fig. 3. As is apparent from the left and right sides of fig. 3, the long electronic component bonding nozzle 1 also includes an internal space 3 and a discharge through hole 4, and is capable of discharging an adhesive.
Since the long electronic component bonding nozzle 1 is used, the adhesive can be discharged more accurately and with high precision. In addition, when higher density mounting is required, the adhesive can be discharged in accordance with high density mounting by stretching the distal end portion.
(inner space)
The internal space 3 is a space provided inside the main body 2. The internal space 3 may be formed simultaneously with the formation of the main body 2. Alternatively, the internal space 3 may be formed by cutting or the like the inside of the body 2.
The electronic component bonding nozzle 1 is used in combination with a device for supplying an adhesive and applying a discharge pressure. When combined with the apparatus, the adhesive is supplied from the apparatus to the internal space 3. In addition, the device applies a discharge pressure to the internal space 3 in cooperation with this supply. The internal space 3 receives the applied discharge pressure, and the supplied adhesive is discharged through the discharge through-hole 4 communicating with the internal space 3.
At this time, the inner space 3 and the injection inlet 41 are connected to the discharge through hole 4 communicating with the inner space 3. The injection inlet 41 is connected to the discharge outlet 42 via the discharge through hole 4.
The internal space 3 may have a volume corresponding to the size of the main body 2. Further, the volume may be set to the amount of the adhesive to be discharged or the number of the discharged adhesives. Alternatively, the pressure may be determined in relation to a device that applies the ejection pressure.
(through hole for discharge)
The discharge through hole 4 actually discharges the adhesive that enters from the internal space under pressure. The ejection is targeted at a mounting portion of an electronic substrate on which electronic components are mounted. The discharge through hole 4 includes an injection inlet 41 through which the adhesive from the internal space 4 is injected and a discharge outlet 42 through which the adhesive is discharged.
The adhesive supplied to the internal space 3 enters the injection inlet 41 by the ejection pressure. The adhesive is thus subjected to the discharge pressure and discharged from the discharge outlet 42. The adhesive is applied in a mountable state by this ejection.
Here, as shown in fig. 4, it is also preferable that the discharge outlet 42 has a larger diameter than the injection inlet 41 in the discharge through-hole 4. Fig. 4 is a sectional view of the electronic component bonding nozzle according to the embodiment of the present invention. Fig. 4 shows the internal structure of the discharge through hole 4.
At this time, as shown in fig. 5, the discharge through holes may be gradually reduced toward the discharge outlet 42. Fig. 5 is a sectional view of the electronic component bonding nozzle according to the embodiment of the present invention. In fig. 5, the discharge through hole 4 has a two-stage shape, and the discharge outlet 42 has a smaller diameter than the injection inlet 41.
Since the discharge outlet 42 has a smaller diameter than the injection inlet 41, the adhesive discharged through the discharge through hole 4 is easily discharged in a minute amount and a discharge diameter. In particular, when the ink is ejected with a fine ejection diameter, the ink can be ejected with higher accuracy. Further, the ink can be ejected more accurately to a portion to be ejected.
The discharge through-hole 4 has a structure in which the inner diameter gradually decreases from the injection inlet 41 toward the discharge outlet 42. With such a structure, the adhesive is more accurately discharged to the position to be discharged in the process of moving the discharge through hole 4. I.e., to the target position.
Further, the inner diameter gradually decreases toward the distal end, whereby ejection can be performed in a finer amount and ejection diameter.
Here, it is also preferable that the diameter of the injection inlet 41 is larger than the diameter of the discharge outlet 42 by 10% or more. For example, when the diameter of the injection inlet 41 is 50 μm, the diameter of the ejection outlet 42 is 40 μm. Alternatively, when the diameter of the injection inlet 42 is 40 μm, the diameter of the ejection outlet 42 is 30 μm.
Because of such a difference in size, the adhesive that is moved from the injection inlet 41 to the discharge outlet 42 and discharged is reliably discharged with a fine discharge diameter. In particular, the adhesive can be reliably discharged to a fine position. This is because, by making the discharge outlet 42 smaller than the injection inlet 41 into which the adhesive enters, the adhesive is more easily discharged to a target position when moving in the discharge through-hole 4.
Here, it is also preferable that the diameter of the discharge outlet 42 is 40 μm or less. In recent years, the miniaturization of electronic components has been greatly promoted, and when such a small electronic component is mounted on an electronic substrate, it is preferable to discharge the adhesive from the discharge outlet 42 having a diameter of 40 μm or less.
Since the diameter of the discharge outlet 42 is 40 μm or less, the adhesive can be discharged corresponding to a portion having a very small area.
It is also preferable that the diameter of the discharge outlet 42 is 30 μm or less. This is because the amount of the liquid to be ejected to the optimum position required for mounting the electronic component can be optimized when the electronic component is further downsized. Since the diameter of the discharge outlet 42 is 30 μm or less, an adhesive suitable for mounting a smaller electronic component can be discharged. Alternatively, an adhesive suitable for higher density mounting can be discharged.
(variation of discharge through hole)
The discharge through-hole 4 is preferably formed by machining a hole in the main body 2. After the main body 2 is formed, the internal space 3 and the discharge through-hole 4 may be formed by machining. The discharge through-hole 4 is formed by machining a hole, so that the discharge through-hole 4 can be formed with high accuracy.
Further, as described above, it is also preferable that the discharge through hole 4 be tapered toward the discharge outlet 42. Even in the case of such a shape, the discharge through-hole 4 is easily formed by machining. Further, the discharge through-hole 4 having high durability can be realized by forming by machining. Further, the discharge through-hole 4 having a very fine diameter can be realized.
It is also preferable that the inner surface of the ejection through-hole 4 is subjected to a surface treatment for reducing friction. The adhesive is more easily ejected by the surface treatment. The adhesive is less likely to clog inside the discharge through hole 4, and the adhesive can be reliably discharged in an optimum amount and discharge diameter. Further, since clogging or the like is less likely to occur, it is effective for the durability and the life of the electronic component bonding nozzle 1 to be extended.
The surface treatment for reducing friction can be achieved by various means such as coating treatment and polishing treatment.
The electronic component bonding nozzle described in the embodiments above is an example for explaining the gist of the present invention, and modifications and alterations are included without departing from the scope of the gist of the present invention.
Description of the reference numerals
1. A nozzle for bonding electronic parts; 2. a main body portion; 3. an interior space; 4. a through hole for ejection; 41. an injection inlet; 42. and an ejection outlet.
Claims (8)
1. A nozzle for bonding electronic parts, which is used for spraying an adhesive agent required for mounting the electronic parts, wherein,
the electronic component bonding nozzle includes:
a main body portion;
an internal space provided inside the main body, the internal space being supplied with the adhesive; and
a discharge through hole provided from the internal space toward a tip end of the main body,
the discharge through hole has an injection inlet through which the adhesive from the internal space is injected and a discharge outlet through which the adhesive from the internal space is discharged to the outside,
the diameter of the ejection outlet is 50 μm or less,
the adhesive supplied to the internal space is injected into the injection inlet by the injection pressure and is discharged from the discharge outlet through the discharge through hole,
the main body portion is formed of cemented carbide using tungsten as a main raw material,
the inner surface of the ejection through-hole is subjected to a surface treatment for reducing friction by a coating treatment or a polishing treatment,
the electronic component is a small electronic component corresponding to the diameter of the discharge outlet, and the discharge outlet discharges a minute amount of adhesive corresponding to the small electronic component and a discharge diameter.
2. The electronic component bonding nozzle according to claim 1,
the main body is formed of a sintered body of metal powder.
3. The electronic component bonding nozzle according to claim 1 or 2,
in the discharge through hole, a diameter of the discharge outlet is smaller than a diameter of the injection inlet.
4. The electronic component bonding nozzle according to claim 3,
the diameter of the injection inlet is greater than the diameter of the ejection outlet by 10% or more.
5. The electronic component bonding nozzle according to claim 1 or 2,
the discharge through hole has an inner diameter gradually decreasing from the injection inlet toward the discharge outlet.
6. The electronic component bonding nozzle according to claim 1 or 2,
the diameter of the discharge outlet is 40 μm or less.
7. The electronic component bonding nozzle according to claim 1 or 2,
the diameter of the discharge outlet is 30 μm or less.
8. The electronic component bonding nozzle according to claim 1 or 2,
the discharge through hole is formed by machining and punching.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-130053 | 2019-07-12 | ||
| JP2019130053A JP6883876B2 (en) | 2019-07-12 | 2019-07-12 | Nozzle for bonding electronic components |
| PCT/JP2020/023322 WO2021010073A1 (en) | 2019-07-12 | 2020-06-15 | Electronic-component bonding nozzle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113631280A CN113631280A (en) | 2021-11-09 |
| CN113631280B true CN113631280B (en) | 2022-05-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080024674.9A Active CN113631280B (en) | 2019-07-12 | 2020-06-15 | Nozzle for bonding electronic parts |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6883876B2 (en) |
| CN (1) | CN113631280B (en) |
| WO (1) | WO2021010073A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7229558B2 (en) * | 2020-12-04 | 2023-02-28 | 株式会社ワークス | Nozzle for bonding electronic parts |
| JP7327864B1 (en) | 2022-10-24 | 2023-08-16 | 株式会社共立合金製作所 | Precision nozzle and its manufacturing method |
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| JP6127239B1 (en) * | 2016-07-28 | 2017-05-17 | クラスターテクノロジー株式会社 | Dispenser nozzle and fluid dispensing apparatus using the same |
| JP2019058886A (en) * | 2017-09-28 | 2019-04-18 | 日本電波工業株式会社 | Nozzle unit and method for manufacturing the same |
| JP6617298B2 (en) * | 2018-03-28 | 2019-12-11 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting equipment |
| CN109094028A (en) * | 2018-10-13 | 2018-12-28 | 株洲利华硬质合金有限公司 | A kind of high rigidity carboloy nozzle and preparation method thereof for 3D printing |
-
2019
- 2019-07-12 JP JP2019130053A patent/JP6883876B2/en active Active
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2020
- 2020-06-15 WO PCT/JP2020/023322 patent/WO2021010073A1/en active Application Filing
- 2020-06-15 CN CN202080024674.9A patent/CN113631280B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021010073A1 (en) | 2021-01-21 |
| CN113631280A (en) | 2021-11-09 |
| JP6883876B2 (en) | 2021-06-09 |
| JP2021013895A (en) | 2021-02-12 |
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