CN116060723A - Solder paste anti-blocking device and tin-plating equipment - Google Patents
Solder paste anti-blocking device and tin-plating equipment Download PDFInfo
- Publication number
- CN116060723A CN116060723A CN202211477414.4A CN202211477414A CN116060723A CN 116060723 A CN116060723 A CN 116060723A CN 202211477414 A CN202211477414 A CN 202211477414A CN 116060723 A CN116060723 A CN 116060723A
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- China
- Prior art keywords
- solder paste
- nozzle
- hole section
- vibration
- runner
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of welding machinery, in particular to a solder paste anti-blocking device and solder pointing equipment. The solder paste anti-blocking device comprises a mounting plate, a runner plate, a solder paste joint, a nozzle and a vibration mechanism. The runner plate is installed on the mounting panel, and first hole section, runner and second hole section top-down communicate in proper order and run through the upper and lower face of runner plate, and the solder paste connects and first hole section switch-on, nozzle and second hole Duan Jietong, and vibrating mechanism sets up in the side of runner plate. The vibration mechanism is connected to the outer side of the flow channel plate, so that the nozzle is given certain vibration in the working process, tin powder particles at the nozzle are in a uniform state, the aggregation phenomenon is reduced, the condition that the nozzle is blocked in the process of tin paste dropping is avoided, and the process yield of tin dropping is ensured. By providing the vibration mechanism, the clogging of the tin powder example at the nozzle can be reduced, and the solder paste clogging can be prevented when the high-precision solder element is encountered, so that the development of the high-precision spot solder paste and the miniaturization of electronic components can be promoted.
Description
Technical Field
The invention relates to the technical field of welding machinery, in particular to a solder paste anti-blocking device and solder pointing equipment.
Background
Solder paste is a common welding material in the SMT (Surface Mounted Technology, surface mount technology) industry, and is a paste formed by mixing soldering powder, soldering flux and other additives. Tin powder particles in the tin paste are distributed in a granular form, and are finely divided into a plurality of tin paste types such as No. 3 powder, no. 4 powder, no. 5-8 powder and the like according to tin powder. In the SMT chip mounting process of a general large component, powder solder paste III is adopted; when the IC is met, adopting No. 4 powder solder paste; in the case of high precision welded components, no. 5-8 powders are used. In the process of dispensing solder paste, a nozzle with a proper size should be selected according to solder pastes with different numbers of powder. The tin powder particles in the tin paste can generate an aggregation phenomenon at the nozzle, and when the tin powder particles are aggregated to a certain degree, the nozzle can generate a blocking phenomenon, so that the yield of the spot tin paste process is affected. The solder paste dispensing equipment in the prior art prevents solder paste from being blocked by replacing nozzles with different specifications, so that the nozzle has poor compatibility, the replacement is troublesome, and the processing efficiency is low.
Therefore, there is a need for a solder paste anti-clogging device and a solder dispensing apparatus to solve the above problems.
Disclosure of Invention
The invention aims to provide a solder paste anti-blocking device, which can avoid the condition of nozzle blocking in the process of solder paste dispensing and ensure the process yield of solder paste dispensing.
To achieve the purpose, the invention adopts the following scheme:
the utility model provides a solder paste anti-blocking device, including the mounting panel, the runner board, the solder paste connects, nozzle and vibration mechanism, this runner board is installed on this mounting panel, first hole section has been seted up to this runner board, runner and second hole section, this first hole section, this runner and this second hole section top-down communicate in proper order and run through the upper and lower face of this runner board, this solder paste connects and this first hole section switch-on, this nozzle and this second hole Duan Jietong, this vibration mechanism sets up in the side of this runner board, this vibration mechanism can vibrate this runner board.
Illustratively, two vibration mechanisms are provided, and the two vibration mechanisms are respectively arranged at the left side and the right side of the flow channel plate.
The vibration mechanism illustratively includes a fixed plate coupled to the flow field plate and a vibration driver mounted to the fixed plate.
Illustratively, the vibration driver is a miniature vibration motor.
The vibration driving member is exemplarily provided with four, four of which are mounted on the fixing plate.
Illustratively, the securing plate is threadably coupled to the flow field plate.
Illustratively, the first bore section is provided with internal threads, and the solder paste joint is threadably coupled to the first bore section.
Illustratively, the second bore section is provided with internal threads and the nozzle is coupled to the second bore Duan Luowen.
The invention aims to provide a tin-plating device, which can avoid the condition of nozzle blockage in the tin-plating process and ensure the process yield of tin plating.
To achieve the purpose, the invention adopts the following scheme:
tin equipment includes foretell solder paste anti-clogging device.
Illustratively, the spot tin apparatus further comprises a solder paste barrel in communication with the solder paste joint, the solder paste barrel configured to store and supply solder paste.
The beneficial effects of the invention are as follows:
according to the solder paste anti-blocking device and the solder paste dispensing equipment, the vibration mechanism is connected to the outer side of the flow channel plate, so that the nozzle is given certain vibration in the working process, the tin powder particles at the nozzle are in a uniform state, the aggregation phenomenon is reduced, the situation that the nozzle is blocked in the solder paste dispensing process is avoided, and the process yield of solder paste dispensing is ensured. By providing the vibration mechanism, the clogging of the tin powder example at the nozzle can be reduced, and the solder paste clogging can be prevented when the high-precision solder element is encountered, so that the development of the high-precision spot solder paste and the miniaturization of electronic components can be promoted.
Drawings
FIG. 1 is a schematic diagram of a tin plating apparatus according to the present invention;
fig. 2 is a schematic structural diagram of a solder paste anti-blocking device provided by the invention;
fig. 3 is a cross-sectional view of the solder paste anti-clogging device provided by the invention.
In the figure:
100. a tin paste barrel; 200. a mounting plate; 300. a flow channel plate; 310. a first bore section; 320. a flow passage; 330. a second bore section; 400. a solder paste joint; 500. a nozzle; 600. a vibration mechanism; 610. a fixing plate; 620. and vibrating the driving member.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the drawings related to the present invention are shown.
In the present invention, directional terms, such as "upper", "lower", "left", "right", "inner" and "outer", are used for convenience of understanding and are not to be construed as limiting the scope of the present invention unless otherwise specified.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-3, the present embodiment provides a solder paste dispensing apparatus including a solder paste anti-clogging device and a solder paste barrel 100. The solder paste anti-clogging device includes a mounting plate 200, a flow channel plate 300, a solder paste joint 400, a nozzle 500, and a vibration mechanism 600. The flow channel plate 300 is installed on the installation plate 200, the flow channel plate 300 is provided with a first hole section 310, a flow channel 320 and a second hole section 330, the first hole section 310, the flow channel 320 and the second hole section 330 are sequentially communicated from top to bottom and penetrate through the upper surface and the lower surface of the flow channel plate 300, the solder paste joint 400 is communicated with the first hole section 310, the nozzle 500 is communicated with the second hole section 330, the vibration mechanism 600 is arranged on the side surface of the flow channel plate 300, and the vibration mechanism 600 can vibrate the flow channel plate 300. The solder paste barrel 100 communicates with the solder paste joint 400, and the solder paste barrel 100 is used for storing and supplying solder paste. Since the tin powder particles in the solder paste can generate an aggregation phenomenon at the nozzle 500, when the tin powder particles are aggregated to a certain degree, the nozzle 500 can be blocked, and the yield of the spot solder paste process is affected. By connecting the vibration mechanism 600 to the outer side of the flow channel plate 300, the nozzle 500 is given a certain vibration in the working process, so that tin powder particles at the nozzle 500 are in a uniform state, the aggregation phenomenon is reduced, the condition that the nozzle 500 is blocked in the process of tin paste dropping is avoided, and the process yield of tin dropping is ensured. By providing the vibration mechanism 600, clogging of the nozzle 500 with the tin powder example can be reduced, and it can be ensured that clogging of solder paste does not occur when a high-precision solder element is encountered, and thus development of high-precision spot solder paste and miniaturization of electronic components can be promoted.
Preferably, two vibration mechanisms 600 are provided in the present embodiment, and the two vibration mechanisms 600 are provided at both left and right sides of the flow field plate 300, respectively. Through setting up two vibration mechanism 600 to set up two vibration mechanism 600 respectively in the left and right sides of runner board 300, can vibrate the left and right sides of runner board 300 simultaneously, the vibration effect is more even, thereby can further avoid tin powder gathering.
Specifically, the vibration mechanism 600 in the present embodiment includes a fixing plate 610 and a vibration driving member 620, the fixing plate 610 is connected to the flow path plate 300, and the vibration driving member 620 is mounted on the fixing plate 610.
Further, the vibration driving member 620 in the present embodiment is a micro vibration motor, which has the advantages of no noise, obvious vibration effect, small size, portability and easy installation. The micro vibration motor is a common control structure in the mechanical field, is a conventional arrangement in the field, and the connection relationship, the specific structure and the specific control mode between the micro vibration motor and other parts are all conventional in the field.
Further, the vibration driving part 620 in the present embodiment is provided with four, and the four vibration driving parts 620 are mounted on the fixing plate 610. The area of the vibration effect can be ensured to be larger by providing four vibration driving members 620, so that the tin powder particles at the positions of the flow channel 320 can be vibrated to reduce the aggregation phenomenon.
The fixing plate 610 in this embodiment is screw-coupled to the flow field plate 300. Specifically, the fixing plate 610 and the flow field plate 300 may be screw-coupled by a screw so as to be stably maintained, and may not be detached due to vibration during vibration.
Further, the first hole section 310 in this embodiment is provided with an internal thread, and the solder paste joint 400 is screwed with the first hole section 310. The second bore section 330 is provided with an internal thread and the nozzle 500 is threadedly connected to the second bore section 330. Through such arrangement, the connection between the first hole section 310 and the solder paste joint 400, and the connection between the second hole section 330 and the nozzle 500 can be effectively ensured to be stable, and the solder paste joint is not easy to fall off due to vibration in the working process.
It is to be understood that the above-described embodiments of the present invention are provided by way of illustration only and not limitation of the embodiments thereof. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (10)
1. The utility model provides a device is prevented blockking up by solder paste, its characterized in that includes mounting panel (200), runner board (300), solder paste connects (400), nozzle (500) and vibration mechanism (600), runner board (300) install in on mounting panel (200), first hole section (310), runner (320) and second hole section (330) have been seted up to runner board (300), first hole section (310), runner (320) with second hole section (330) top-down communicate in proper order and run through the upper and lower face of runner board (300), solder paste connect (400) with first hole section (310) switch-on, nozzle (500) with second hole section (330) switch-on, vibration mechanism (600) set up in the side of runner board (300), vibration mechanism (600) can be right runner board (300) vibrate.
2. The solder paste anti-clogging device according to claim 1, wherein two vibration mechanisms (600) are provided, and the two vibration mechanisms (600) are respectively provided at the left and right sides of the flow channel plate (300).
3. The solder paste anti-clogging device as recited in claim 1, wherein the vibration mechanism (600) includes a fixing plate (610) and a vibration driving member (620), the fixing plate (610) is connected to the flow path plate (300), and the vibration driving member (620) is mounted on the fixing plate (610).
4. A solder paste anti-clogging device according to claim 3, characterized in that the vibration drive (620) is a miniature vibration motor.
5. A solder paste anti-clogging device according to claim 3, characterized in that the vibration driving members (620) are provided with four, four vibration driving members (620) being mounted on the fixing plate (610).
6. A solder paste anti-clogging device according to claim 3, characterized in that the fixing plate (610) is screwed with the flow channel plate (300).
7. The solder paste anti-clogging device according to claim 1, wherein the first hole section (310) is provided with an internal thread, and the solder paste joint (400) is screwed with the first hole section (310).
8. A solder paste anti-clogging device according to claim 1, characterized in that the second hole section (330) is provided with an internal thread, the nozzle (500) being in threaded connection with the second hole section (330).
9. Tin spot-soldering apparatus, characterized in that it comprises a solder paste anti-clogging device according to any one of claims 1-8.
10. The soldering apparatus according to claim 9, further comprising a solder paste barrel (100), the solder paste barrel (100) being in communication with the solder paste joint (400), the solder paste barrel (100) being configured to store and supply solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211477414.4A CN116060723A (en) | 2022-11-23 | 2022-11-23 | Solder paste anti-blocking device and tin-plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211477414.4A CN116060723A (en) | 2022-11-23 | 2022-11-23 | Solder paste anti-blocking device and tin-plating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116060723A true CN116060723A (en) | 2023-05-05 |
Family
ID=86172377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211477414.4A Pending CN116060723A (en) | 2022-11-23 | 2022-11-23 | Solder paste anti-blocking device and tin-plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116060723A (en) |
-
2022
- 2022-11-23 CN CN202211477414.4A patent/CN116060723A/en active Pending
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