JP2022089371A5 - - Google Patents
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- Publication number
- JP2022089371A5 JP2022089371A5 JP2020201715A JP2020201715A JP2022089371A5 JP 2022089371 A5 JP2022089371 A5 JP 2022089371A5 JP 2020201715 A JP2020201715 A JP 2020201715A JP 2020201715 A JP2020201715 A JP 2020201715A JP 2022089371 A5 JP2022089371 A5 JP 2022089371A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- electronic component
- discharge
- hole
- component bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 230000003746 surface roughness Effects 0.000 claims 2
- 230000007423 decrease Effects 0.000 claims 1
- 238000009760 electrical discharge machining Methods 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 238000007517 polishing process Methods 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
Description
上記課題を解決するために、本発明の電子部品接着用ノズルは、電子部品の実装に必要となる接着剤を吐出する電子部品接着用ノズルであって、
本体部と、
前記本体部の内部に設けられて、前記接着剤が供給される内部空間と、
前記内部空間から前記本体部の先端に向けて設けられた吐出用貫通孔と、を備え、
前記本体部は、タングステンを主原料とする超硬合金により形成され、
前記吐出用貫通孔は、前記内部空間からの接着剤が注入される注入入口と、前記内部空間からの接着剤を外部に吐出する吐出出口とを有し、
前記吐出出口の直径は、５０μｍ以下であり、
前記内部空間に供給される前記接着剤は、吐出圧力を受けて、前記注入入口に注入されて前記吐出用貫通孔を通過し、前記吐出出口から吐出され、
前記吐出用貫通孔の内部表面は、摩擦低下のための表面処理が施されており、
前記電子部品は、前記吐出出口の直径に対応する小型であり、前記吐出出口は、当該小型の電子部品に対応する微細な量および吐出直径の接着剤を吐出する。
In order to solve the above problems, the electronic component bonding nozzle of the present invention is an electronic component bonding nozzle that discharges an adhesive necessary for mounting an electronic component,
a main body;
an internal space provided inside the main body and supplied with the adhesive;
a discharge through hole provided from the internal space toward the tip of the main body,
The main body is formed of a cemented carbide containing tungsten as a main raw material,
The discharge through-hole has an injection inlet into which the adhesive from the internal space is injected and a discharge outlet from which the adhesive from the internal space is discharged to the outside,
The diameter of the ejection outlet is 50 μm or less,
The adhesive supplied to the internal space receives a discharge pressure, is injected into the injection inlet, passes through the discharge through hole, and is discharged from the discharge outlet,
The inner surface of the discharge through-hole is subjected to a surface treatment to reduce friction,
The electronic component is of a small size corresponding to the diameter of the dispensing outlet, and the dispensing outlet dispenses a fine volume and dispensing diameter of adhesive corresponding to the small electronic component .
Claims (14)
本体部と、
前記本体部の内部に設けられて、前記接着剤が供給される内部空間と、
前記内部空間から前記本体部の先端に向けて設けられた吐出用貫通孔と、を備え、
前記本体部は、タングステンを主原料とする超硬合金により形成され、
前記吐出用貫通孔は、前記内部空間からの接着剤が注入される注入入口と、前記内部空間からの接着剤を外部に吐出する吐出出口とを有し、
前記吐出出口の直径は、５０μｍ以下であり、
前記内部空間に供給される前記接着剤は、吐出圧力を受けて、前記注入入口に注入されて前記吐出用貫通孔を通過し、前記吐出出口から吐出され、
前記吐出用貫通孔の内部表面は、摩擦低下のための表面処理が施されており、
前記電子部品は、前記吐出出口の直径に対応する小型であり、前記吐出出口は、当該小型の電子部品に対応する微細な量および吐出直径の接着剤を吐出する、電子部品接着用ノズル。 An electronic component bonding nozzle that ejects an adhesive required for mounting electronic components,
a main body;
an internal space provided inside the main body and supplied with the adhesive;
a discharge through hole provided from the internal space toward the tip of the main body,
The main body is formed of a cemented carbide containing tungsten as a main raw material,
The discharge through-hole has an injection inlet into which the adhesive from the internal space is injected and a discharge outlet from which the adhesive from the internal space is discharged to the outside,
The diameter of the ejection outlet is 50 μm or less,
The adhesive supplied to the internal space receives a discharge pressure, is injected into the injection inlet, passes through the discharge through hole, and is discharged from the discharge outlet,
The inner surface of the discharge through-hole is subjected to a surface treatment to reduce friction ,
A nozzle for bonding electronic components, wherein the electronic components are small in size corresponding to the diameter of the ejection outlet, and the ejection outlet ejects adhesive in a minute amount and in a diameter corresponding to the small electronic components .
接着剤を収容する接着剤収容容器と、
前記接着剤収容容器の先端に備わり、請求項１から１３のいずれかの電子部品接着用ノズルと、
前記接着剤収容容器内部において上下移動可能な押出しピンと、
前記押出しピンに押出し圧力を加える圧力部材と、を備え、 前記内部空間と
前記接着剤収容容器の内部空間とは連通しており、前記接着剤収容容器に収容されている前記接着剤が、前記内部空間に供給され、
前記押出しピンの押し出しが、前記吐出圧力を生じさせる、電子部品接着用ディスペンサー。 An electronic component bonding dispenser that discharges an adhesive required for mounting electronic components,
an adhesive containing container containing an adhesive;
The electronic component bonding nozzle according to any one of claims 1 to 13, which is provided at the tip of the adhesive container,
an ejector pin that can move up and down inside the adhesive container;
a pressure member that applies a pushing pressure to the push pin, wherein the internal space and the internal space of the adhesive container communicate with each other, and the adhesive contained in the adhesive container presses against the supplied to the inner space,
A dispenser for bonding electronic components, wherein extrusion of the ejector pin produces the discharge pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020201715A JP7229558B2 (en) | 2020-12-04 | 2020-12-04 | Nozzle for bonding electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020201715A JP7229558B2 (en) | 2020-12-04 | 2020-12-04 | Nozzle for bonding electronic parts |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022089371A JP2022089371A (en) | 2022-06-16 |
| JP2022089371A5 true JP2022089371A5 (en) | 2022-07-28 |
| JP7229558B2 JP7229558B2 (en) | 2023-02-28 |
Family
ID=81989088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020201715A Active JP7229558B2 (en) | 2020-12-04 | 2020-12-04 | Nozzle for bonding electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7229558B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7327864B1 (en) | 2022-10-24 | 2023-08-16 | 株式会社共立合金製作所 | Precision nozzle and its manufacturing method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69611692T2 (en) * | 1995-11-16 | 2001-09-06 | Nordson Corp | METHOD AND DEVICE FOR APPLYING SMALL LIQUID QUANTITIES OF MATERIAL |
| JP2001232801A (en) * | 2000-02-23 | 2001-08-28 | Matsushita Electric Ind Co Ltd | Phosphor ink nozzle and phosphor ink coater comprising it, and method for manufacturing gas discharge panel |
| JP2006312146A (en) * | 2005-05-09 | 2006-11-16 | Matsushita Electric Ind Co Ltd | Liquid discharging head and liquid discharging method |
| KR101369364B1 (en) * | 2012-01-09 | 2014-03-06 | 삼성전자주식회사 | Phosphor dispenser |
| JP5802347B1 (en) * | 2014-05-20 | 2015-10-28 | エンジニアリングシステム株式会社 | Trace liquid dropping method and trace liquid dispenser |
| JP6883876B2 (en) * | 2019-07-12 | 2021-06-09 | 株式会社ワークス | Nozzle for bonding electronic components |
-
2020
- 2020-12-04 JP JP2020201715A patent/JP7229558B2/en active Active
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