WO2020170762A1 - Masque pour dépôt en phase vapeur - Google Patents

Masque pour dépôt en phase vapeur Download PDF

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Publication number
WO2020170762A1
WO2020170762A1 PCT/JP2020/003651 JP2020003651W WO2020170762A1 WO 2020170762 A1 WO2020170762 A1 WO 2020170762A1 JP 2020003651 W JP2020003651 W JP 2020003651W WO 2020170762 A1 WO2020170762 A1 WO 2020170762A1
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WIPO (PCT)
Prior art keywords
vapor deposition
upper plate
lower plate
deposition mask
support frame
Prior art date
Application number
PCT/JP2020/003651
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English (en)
Japanese (ja)
Inventor
洋平 岩井
淳 高城
Original Assignee
株式会社ジャパンディスプレイ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社ジャパンディスプレイ filed Critical 株式会社ジャパンディスプレイ
Priority to CN202080014896.2A priority Critical patent/CN113490761B/zh
Priority to KR1020217025912A priority patent/KR102641271B1/ko
Publication of WO2020170762A1 publication Critical patent/WO2020170762A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present invention relates to a vapor deposition mask when a pixel of an organic EL display device or the like is formed by vapor deposition.
  • the organic EL display device has an organic layer, which is a light emitting material, formed by vapor deposition for each pixel.
  • the pixel pitch is small, and therefore the size of the light-emitting body formed of the organic EL layer in each pixel formed by vapor deposition is also small.
  • the pitch of the holes and the size of the holes in the vapor deposition mask are very small. Therefore, the accuracy of the vapor deposition mask is important.
  • the vapor deposition mask is composed of a portion of the mask foil in which a large number of holes for vapor deposition on the pixels are formed, and a support frame for indicating the mask foil.
  • the support frame is composed of two pieces, an upper frame and a lower frame, and the upper frame and the lower frame are bonded by an adhesive material. The configuration is described.
  • the vapor deposition mask in the present invention is composed of a foil-shaped mask corresponding to the pixels of the display area of the organic EL display device and having a large number of holes, a support frame for supporting the foil-shaped mask, and a foil-shaped mask.
  • a foil-shaped mask in which a large number of holes are formed is simply referred to as a mask, and an assembly of the mask and the supporting frame is referred to as a vapor deposition mask.
  • the pixel pitch of the organic EL display device is very small, and the diameter of the mask hole corresponding to each pixel is also very small. Therefore, the thickness of the mask in which the holes are formed needs to be very small. Further, the mask needs to be flattened along the substrate to be deposited. In order to maintain the flatness of the mask, it is necessary to apply tension to the outside of the mask by the support frame. At this time, inward tension is applied to the support frame as a reaction.
  • the support frame has a two-layer structure consisting of an upper frame and a lower frame in order to improve dimensional accuracy and prevent distortion of the frame itself, and a configuration in which the upper frame and the lower frame are bonded with an adhesive is used. At this time, the tension on the support frame as a reaction from the mask is mainly applied to the upper frame.
  • the present invention is to prevent displacement of the upper frame and the lower frame due to shearing force, maintain the dimensional accuracy of the vapor deposition mask, and thereby enable manufacturing of an organic EL display device of excellent quality.
  • the present invention overcomes the above problems, and the main concrete means are as follows.
  • a vapor deposition mask used for manufacturing a display device wherein the vapor deposition mask includes a mask for forming a vapor deposition material on a pixel and a support frame that supports the mask, and the support frame includes: An upper plate and a lower plate, and an adhesive material for bonding the upper plate and the lower plate, and when a shearing force is applied between the upper plate and the lower plate, in the main surface direction of the support frame, A vapor deposition mask having a stopper for preventing the plate and the lower plate from being displaced from each other.
  • a vapor deposition mask used for manufacturing a display device wherein the vapor deposition mask includes a mask for forming a vapor deposition material on a pixel and a support frame that supports the mask, and the support frame includes: It is composed of an upper plate and a lower plate, and an adhesive material that adheres the upper plate and the lower plate, and one surface of the upper plate is formed with projections at a predetermined pitch, and one surface of the lower plate.
  • the concave portions are formed at the predetermined pitch, and the convex portions and the concave portions are fitted together.
  • FIG. 9 is a sectional view taken along line AA of FIG. 8. It is sectional drawing of a support frame in the state where tension was added to the upper plate of a support frame. It is sectional drawing which shows the outline of this invention. It is a top view which shows the outline of this invention. 6A and 6B are cross-sectional views illustrating the manufacturing process of the first embodiment of the first example. It is sectional drawing which shows the process of following FIG. 13A. 3 is a sectional view showing Embodiment 1 of Example 1.
  • FIG. 9 is a sectional view showing Embodiment 1 of Example 1.
  • FIG. 7A and 7B are cross-sectional views showing the manufacturing process of the second exemplary embodiment. It is sectional drawing which shows the process of following FIG. 14A. It is sectional drawing which shows the process of following FIG. 14B. 6 is a cross-sectional view showing the configuration of Embodiment 1 of Example 2.
  • FIG. FIG. 9 is a cross-sectional view showing a manufacturing process of the first embodiment of Example 2; It is sectional drawing which shows the process of following FIG. 15A. It is sectional drawing which shows the process of following FIG. 15B. It is sectional drawing which shows the process of following FIG. 15C. 7 is a cross-sectional view showing the configuration of Embodiment 1 of Example 2.
  • FIG. FIG. 9 is a cross-sectional view showing a manufacturing process of the first embodiment of Example 2; It is sectional drawing which shows the process of following FIG. 15A. It is sectional drawing which shows the process of following FIG. 15B. It is sectional drawing which shows the process of following FIG. 15C. 7 is a
  • FIG. 8 is a cross-sectional view showing the manufacturing process of the second embodiment of Example 2; It is sectional drawing which shows the process of following FIG. 16A.
  • FIG. 17C is a cross-sectional view showing a step that follows FIG. 16B.
  • 7 is a cross-sectional view showing the configuration of Embodiment 2 of Example 2.
  • FIG. 8 is a cross-sectional view showing the manufacturing process of the third embodiment of Example 2; It is sectional drawing which shows the process of following FIG. 17A. It is sectional drawing which shows the process of following FIG. 17B. It is sectional drawing which shows the process of following FIG. 17C. It is sectional drawing which shows the process of following FIG. 17D.
  • 11 is a cross-sectional view showing the configuration of Embodiment 3 of Example 2.
  • FIG. FIG. 8 is a cross-sectional view showing the manufacturing process of the first embodiment of Example 3; It is sectional drawing which shows the process of following FIG. 18A. It is sectional drawing which shows the process of following FIG. 18B. It is sectional drawing which shows the process of following FIG. 18C.
  • 7 is a cross-sectional view showing the configuration of Embodiment 1 of Example 3.
  • FIG. 7 is a plan view showing the configuration of Embodiment 1 of Example 3.
  • FIG. 11 is a plan view showing the configuration of another example of Embodiment 1 of Example 3.
  • FIG. FIG. 8 is a cross-sectional view showing the manufacturing process of the second embodiment of Example 3; It is sectional drawing which shows the process of following FIG. 19A. It is sectional drawing which shows the process of following FIG.
  • FIG. 11 is a cross-sectional view showing the configuration of Embodiment 2 of Example 3.
  • FIG. 11 is a plan view showing the configuration of Embodiment 2 of Example 3.
  • FIG. 11 is a plan view showing the configuration of another example of Embodiment 2 of Example 3.
  • FIG. 9 is a cross-sectional view showing a manufacturing process of the first embodiment of Example 4; It is sectional drawing which shows the process of following FIG. 20A. It is sectional drawing which shows the process of following FIG. 20B. It is sectional drawing which shows the process of following FIG. 20C. It is sectional drawing which shows the process of following FIG. 20D.
  • FIG. 13 is a cross-sectional view showing the final step of the first embodiment of Example 4;
  • FIG. 7 is a plan view showing the configuration of the first exemplary embodiment of the fourth embodiment.
  • FIG. 11 is a cross-sectional view showing the manufacturing process of the second embodiment of Example 4; It is sectional drawing which shows the process of following FIG. 21A.
  • FIG. 22C is a cross-sectional view showing a step that follows FIG. 21B. It is sectional drawing which shows the process of following FIG. 21C. It is sectional drawing which shows the process of following FIG. 21D.
  • FIG. 9 is a cross-sectional view showing the configuration of the second embodiment of Example 4; FIG.
  • FIG. 11 is a cross-sectional view showing a manufacturing process of the first embodiment of Example 5; 13 is a cross-sectional view showing the configuration of Embodiment 1 of Example 5.
  • FIG. FIG. 13 is a diagram showing an example of a convex portion and a concave portion in the fifth embodiment.
  • FIG. 16 is a diagram showing another example of the convex portion and the concave portion in the fifth embodiment.
  • FIG. 13 is a plan view showing still another example of the convex portion and the concave portion in the fifth embodiment.
  • FIG. 13 is a plan view showing still another example of the convex portion and the concave portion in the fifth embodiment.
  • FIG. 13 is a plan view showing still another example of the convex portion and the concave portion in the fifth embodiment.
  • FIG. 13 is a plan view showing still another example of the convex portion and the concave portion in the fifth embodiment.
  • FIG. 13 is a plan view showing still another example of the convex portion and the con
  • FIG. 11 is a cross-sectional view showing the manufacturing process of the second embodiment of Example 5; 13 is a cross-sectional view showing the configuration of Embodiment 2 of Example 5.
  • FIG. 11 is a cross-sectional view showing a manufacturing process of the third embodiment of Example 5; 13 is a cross-sectional view showing the configuration of Embodiment 3 of Example 5.
  • FIG. 11 is a cross-sectional view showing a manufacturing process of the third embodiment of Example 5; 13 is a cross-sectional view showing the configuration of Embodiment 3 of Example 5.
  • FIG. 1 is a plan view of the organic EL display device.
  • a display area 10 for displaying an image is formed on a TFT substrate 40 formed of glass or polyimide resin.
  • a frame region 21 is arranged around the display region 10.
  • a current supply line that supplies a current to the pixel 14, the scanning line drive circuit 20, and the like are arranged.
  • the scanning lines 11 extend in the horizontal direction (x direction) and are arranged in the vertical direction (y direction).
  • the video signal lines 12 and the power supply lines 13 extend in the vertical direction and are arranged in the horizontal direction.
  • a region surrounded by the scanning line 11, the video signal line 12, and the power supply line 13 is a pixel 14, and in the pixel 14, an organic EL layer that emits light, a driving transistor formed by a TFT, and a switching transistor are formed. , Etc. are formed.
  • the terminal area 30 is formed on one side of the substrate 40.
  • a driver IC 31 is mounted on the terminal area 30 to drive the video signal line 12, and a flexible wiring board 32 is connected to supply power and signals to the organic EL display device.
  • FIG. 2 is a plan view of the display area of the organic EL display device.
  • a red pixel having a red light emitter R, a green pixel having a green light emitter G, or a blue pixel having a blue light emitter B is formed in a portion corresponding to the pixel 14 in FIG.
  • the light emitters are in a delta configuration.
  • the red light emitter R, the green light emitter G, and the blue light emitter B are made of different organic EL materials, and thus are separately deposited. Therefore, three vapor deposition masks are required to obtain the pixel configuration as shown in FIG.
  • each light-emitting body is a circle, and each light-emitting body is arranged in a delta, but this is an example, and the planar shape of the light-emitting body may be a square, a rectangle, a stripe, or the like. It is possible.
  • the arrangement of the light emitters is not limited to the delta, but may be a rhombus, a parallelogram, a stripe arrangement, or the like.
  • the diameter d1 of the light emitter is, for example, 15 ⁇ m to 20 ⁇ m.
  • the pixel pitch pp is, for example, 30 ⁇ m to 40 ⁇ m. In this case, the diameter of the mask is the same as the diameter of the light emitter.
  • the pitch pm of the holes of the mask is 50 ⁇ m to 67 ⁇ m.
  • the distance between the different colors arranged adjacent to each other, that is, the alignment margin of the vapor deposition mask is required to be about 10 ⁇ m to 30 ⁇ m, but in consideration of the enlargement of the light emitting region of each pixel and the high definition of the display region. Then, it is preferable to reduce this distance.
  • FIG. 3 is a cross-sectional view showing a state of a mask 50 and a substrate 40 for depositing an organic EL material which is one of three color issuers.
  • the thickness ts of the vapor deposition substrate 40 that is, the TFT substrate 40 is, for example, 0.5 mm.
  • the mask 50 is similarly formed with holes having the hole diameter d1.
  • the organic EL material is deposited on the surface of the substrate 40 exposed through the holes provided in the mask 50.
  • the plate thickness tm of the mask 50 needs to be thin, about 5 ⁇ m to 10 ⁇ m. If the mask 50 has a large plate thickness, it serves as a shield against the organic EL material to be obliquely deposited, so-called "vignetting" occurs, and vapor deposition becomes defective.
  • the mask 50 and the vapor deposition substrate 40 be in a substantially contact state as shown in FIG.
  • the arrow 80 in FIG. 3 is an evaporated material of the organic EL material.
  • a magnet may be arranged so as to face the opposite side of the substrate 40 with respect to the mask 50, and the mask 50 may be brought into close contact with the substrate 40 by magnetic force.
  • FIG. 4 is a schematic sectional view showing the state of vacuum vapor deposition.
  • the vapor deposition material 80 evaporates from the vapor deposition source 900 toward the substrate 40.
  • the light emitting material is vapor-deposited on the substrate 40 through the mask 50 of the vapor deposition mask.
  • two vapor deposition sources 90 are used in FIG. The number of the vapor deposition sources 90 is increased or decreased as necessary to make the vapor deposition film uniform.
  • the vapor deposition mask is a foil-shaped mask 50 and a support frame 60 joined by a joining member 70.
  • the support frame 60 has a configuration in which an upper plate 61 and a lower plate 62 are bonded by an adhesive material 63.
  • the support frame 60 and the mask 50 are joined by a joining member 70 formed by plating.
  • the mask 50 is tensioned by a support frame 60 so that the thin mask 50 does not bend. As a reaction thereof, an inward tension is generated in the support frame 60, and a shear stress is generated in the adhesive 63 that bonds the upper plate 61 and the lower plate 62.
  • FIG. 5 is a detailed view of the vapor deposition mask 5.
  • the upper side is a plan view and the lower side is a cross-sectional view. Since the organic EL display device is not efficient if manufactured individually, a large number of organic EL display panels are formed on a large substrate. Therefore, the vapor deposition mask 5 also corresponds to this large substrate.
  • the vapor deposition mask 5 is divided into four parts by the support frame 60, and the mask 50 is present in each part. 16 organic EL display devices correspond to each mask 50. Therefore, 64 organic EL display devices are formed by the vapor deposition mask 50 of FIG. Although the vapor deposition mask 5 is divided into four in FIG. 5, this is an example, and the number of the divisions is not limited to four.
  • Each mask 50 includes an opening area 51 in which a large number of holes are formed corresponding to each pixel in the display area of the organic EL display device, and a peripheral area 52 in which no holes are present.
  • the mask 50 is, for example, Ni or Ni alloy having a thickness of several ⁇ m to several tens of ⁇ m, and is formed by plating.
  • the support frame 60 has an upper plate 61 and a lower plate 62 bonded by an adhesive 63.
  • the support frame 60 has a two-layered structure for one reason that when the plate material is formed by the rollers, the thinner the number of rollers, the more the number of rollers increases. Another reason is to prevent distortion of the laminated support frames by offsetting the strain inherent in the plate materials by the two plate materials.
  • the upper plate 61 and the lower plate 62 are formed of, for example, an Invar material having a thickness of about 0.5 mm.
  • the Invar material is an alloy of iron and nickel and has a very small coefficient of thermal expansion.
  • the upper plate 61, the lower plate 62, and the support frame 60 formed of the adhesive 63 and the mask 50 are joined by a joining member 70 by plating. Tension is applied to the completed mask 50 by the support frame 60 to prevent the mask 50 from bending.
  • FIG. 6A to 6E are sectional views showing a process for forming the vapor deposition mask shown in FIG.
  • FIG. 6A is a sectional view showing a state in which the mask 50 is formed by plating.
  • a metal plate having a flat surface is prepared, this is used as a base material 90, and the mask 50 is formed on the base material 90. That is, a foil 91 is formed by forming a photoresist 91 for patterning on the base material 90 and growing plating at a predetermined position.
  • the photoresist 91 is formed only on the outer shape of the mask 50. However, the photoresist is formed to form a hole in the opening region, and a hole for vapor deposition of the pixel portion is formed in the opening of the mask 50. Can be formed at the same time.
  • FIG. 6B is a cross-sectional view of the support frame 60 formed separately from the mask 50.
  • the support frame 60 is, for example, an upper plate 61 and a lower plate 62 made of an Invar material having a thickness of 0.5 mm, which are bonded together by an adhesive 63.
  • the thickness of the adhesive material 63 is, for example, 15 ⁇ m. Since the plate material is provided in the form of a roll as a stretched material, warpage in the arc direction may remain. In such a case, it is possible to secure the flatness by attaching the two plates to each other with the front and back reversed and canceling the warpage.
  • the supporting frame 50 may be processed by cutting or etching.
  • FIG. 6C is a sectional view showing a state in which the support frame 60 is temporarily bonded to the base material 90 on which the mask 50 is formed.
  • the temporary adhesive 92 used for the temporary adhesion it is preferable to use a material that facilitates the peeling of the base material 90 in a later step.
  • FIG. 6D shows that a photoresist 91 is formed on the structure of FIG. 6C to bond the mask 50 and the support frame 60, and then plating is grown to form a connection member 70 between the mask 50 and the support frame 60. It is sectional drawing which shows the state. In FIG. 6D, a portion of the joining member 70 other than the portion where plating is to be formed is covered with a photoresist 91, and the joining member 70 is formed by plating.
  • the resist 91 is formed on the support frame 60 except for the portion where the joining member 70 is formed by plating. Not limited to this, the entire surface of the support frame 60 may be plated. However, in this case, since the support frame 60 may be deformed due to the stress of the plating film by plating the entire surface of the support frame 60, caution is required.
  • FIG. 6E is a cross-sectional view showing a state where the base material 90 made of metal is removed from the vapor deposition mask 5 after the photoresist 91 is removed. Thereby, the vapor deposition mask 5 is completed.
  • the mask 50 is formed on the base material 90 by plating, stress is generated in the mask 50.
  • the base material 90 is separated from the vapor deposition mask 5, the stress acts in a direction in which the mask 50 contracts and supports it.
  • the frame 60 supports the mask 50 against contraction. In other words, the support frame 60 causes the mask 50 to be tensioned outward. The flatness of the mask 50 is maintained by this tension.
  • FIG. 7 is a cross-sectional view showing the method of manufacturing the support frame 60.
  • the support frame 60 is formed by bonding an upper plate 61 and a lower plate 62 with an adhesive 63. Since the plate materials for the upper plate 61 and the lower plate 62 are provided in a roll shape as a stretched material, the warp in the arc direction remains. Therefore, as shown in FIG. 7, two plates are attached to each other with the front and back reversed to ensure flatness.
  • FIG. 8 is a plan view of the vapor deposition mask 5 in the following description. In FIG. 8, only one section in FIG. 5 is shown. That is, one mask 50 is formed in the support frame 60.
  • FIG. 9 is a sectional view taken along line AA of FIG.
  • the mask 50 and the support frame 60 are joined by a joining member 70 formed by plating, but in FIG. 9, the joining member 70 is omitted, and the mask 50 includes the supporting frame 70. It is joined to the upper plate 61.
  • FIG. 10 is a sectional view showing a problem solved by the present invention.
  • Tension is applied to the mask 50 to maintain the flatness.
  • a tension is applied to the inside of the support frame 60, which causes shear stress in the adhesive 63 that bonds the upper plate 61 and the lower plate 62, and the upper plate 61 and the lower plate 62 are separated from each other. It shifts in the plane direction. Then, as a result, the positions of the holes in the mask 50 move.
  • both the substrate 40 and the lower plate 62 of the vapor deposition mask 5 are fixed to the vapor deposition apparatus, and as a result, the opening in the mask 50 joined to the upper plate 61 of the support frame 60 deviates from the substrate 40.
  • the pixel pitch is very small. Therefore, when the displacement as shown in FIG. 10 occurs, the position of the light emitting body in the pixel, that is, the organic EL layer is displaced, Significantly affects display quality.
  • the support frame 60 is provided with the stopper 100 that prevents the upper plate 61 and the lower plate 62 from being displaced, and thus, even if the stopper 100 is provided between the upper plate 61 and the lower plate 62. Even when shear stress due to tension is applied, the upper plate 61 and the lower plate 62 are prevented from being displaced from each other, and the position of the organic EL layer as a light emitting body is not displaced.
  • FIG. 12 is a plan view of the vapor deposition mask 5 showing the structure for this purpose.
  • stoppers 100 for fixing the upper plate 61 and the lower plate 62 of the support frame 60 are formed on the long sides, the short sides, and the corners outside the mask 50.
  • the planar position of the stopper 100 is not limited to that shown in FIG. 12, and the position may be selected according to the property of the stopper 100.
  • the embodiments described below show various stopper 100 configurations.
  • FIG. 13A to 13C are views showing the first embodiment in the first embodiment.
  • the support frame 60 is sandwiched between a lower rigid body (mounting table) 115 having holes and an upper rigid body (holding table) 114, and the punching tool 110 is applied to the supporting frame 60.
  • FIG. The drawing on the lower side of 13A is a plan view showing the hitting points 111 of the punching tool 110 arranged on the support frame 60.
  • FIG. 13B shows a state in which the upper plate 61 and the lower plate 62 of the support frame 60 are penetrated by the punching tool 110.
  • the upper diagram is a cross-sectional view and the lower diagram is a plan view.
  • the burrs 113 are generated on the upper plate 61 and the lower plate 62, and the burrs 113 prevent the upper plate 61 and the lower plate 62 from being displaced from each other.
  • 112 is a through hole
  • 1121 is a portion in which the support frame 60 is deformed so as to generate burrs.
  • FIG. 13C is a sectional view showing a state of the burr 113 formed in the through hole 112.
  • the hole 112 formed is, for example, circular. Therefore, the upper plate 61 and the lower plate 62 of the support frame 60 are restrained from moving relative to each other in any of the planar directions.
  • (Embodiment 2) 14A to 14D are cross-sectional views showing Embodiment 2 of Example 1.
  • a burr 113 is formed as a protrusion on the back side of the support frame 60 punched by the punching tool 110. In a vapor deposition device or the like, such a protruding burr 113 may be an obstacle.
  • the second embodiment deals with this problem.
  • FIG. 14A In the upper sectional view of FIG. 14A, the support frame 60 is sandwiched between a lower rigid body 115 having holes and an upper rigid body 114, and an end mill 116 for end milling the lower plate 62 is applied.
  • FIG. A hole is formed only in the lower plate 62 by the end mill 116.
  • FIG. 14B is a cross-sectional view showing a state in which after forming a hole in the lower plate 62, the support frame 60 is arranged in a portion where the diameter of the lower rigid body 115 is small, and the punching tool 110 is applied to the upper plate 61 side.
  • FIG. 14C is a cross-sectional view showing a state where the upper plate 61 is punched by the punching tool 110.
  • the burr 113 of the upper plate 61 does not protrude below the lower plate 62, It comes into contact with the end portion of the lower plate 62.
  • FIG. 14D is a sectional view of the support frame 60 after processing.
  • the burr 113 of the punched upper plate 61 does not project from the lower surface of the lower plate 62, but contacts the end surface of the lower plate 62.
  • the burr 113 of the upper plate 61 prevents the lower plate 62 and the upper plate 61 from shifting in the plane direction. Moreover, the burr 113 does not project below the lower surface of the lower plate 62.
  • FIG. 15A shows a state in which the reamer 117 is applied to the upper plate 61 to form through holes in the upper plate 61 and the lower plate 62.
  • the lower rigid body 115 on which the support frame 60 is placed has an opening formed in a portion corresponding to the reamer 117.
  • FIG. 15B shows that the support plate 60 having the through holes is placed on the lower rigid body 115 having no opening, and the upper plate is formed to form the holes for accommodating the heads of the driven pins. It is sectional drawing which shows the state which the end mill 116 is contacting at 61.
  • FIG. 15C is a cross-sectional view showing a state in which a hole corresponding to the head of the pin is drilled by the end mill 116.
  • FIG. 15D is a cross-sectional view showing a state in which the pin 120 is inserted into the holes of the upper plate 61 and the lower plate 62 thus formed.
  • the relationship between the main body of the pin 120 and the through holes of the upper plate 61 and the lower plate 62 is "tight fit” rather than "space fit”. Better.
  • FIG. 15E is a sectional view showing a state in which the pin 120 is inserted into the holes formed in the upper plate 61 and the lower plate 62.
  • the pin 120 is completely accommodated in the upper plate 61 and the lower plate 62 by reamer processing and end mill processing.
  • the pin 120 can prevent the upper plate 61 and the lower plate 62 from being displaced from each other in the support frame 60. Further, the reproducibility is excellent as compared with the case where the burr 113 prevents the upper plate 61 and the lower plate 62 from being displaced as in the first embodiment.
  • 16A to 16D are cross-sectional views illustrating Embodiment 2 of Example 2. The difference between the second embodiment and the first embodiment is that the pins used are parallel pins 121 as shown in FIG. 16C. In the case of the parallel pin 121, since the pin has no head, the end milling used in the first embodiment is unnecessary.
  • FIG. 16A is a cross-sectional view showing a state in which the reamer 117 is applied onto the lower rigid body 115 having holes.
  • FIG. 16B is a cross-sectional view showing a state in which the support frame 60 having a through hole formed by the reamer 117 is placed on the lower rigid body 115 having no hole.
  • FIG. 16C is a cross-sectional view showing a state in which the parallel pin 121 is inserted into the through hole of the support frame 60. Also in this case, in order to eliminate the deviation of the upper plate 61 and the lower plate 62 in the plane direction, the relationship between the parallel pin 121 and the through hole of the upper plate 61 and the lower plate 62 is not “tight fit” but “tightening”. "Fit" is better.
  • FIG. 16D is a cross-sectional view showing a state in which the parallel pin 121 is inserted into the through hole of the support frame 60 by hitting.
  • the second embodiment does not require the end mill processing, and thus the process can be simplified.
  • (Embodiment 3) 17A to 17D are sectional views showing Embodiment 3 of Example 2.
  • the pins used are hollow pins 122 as shown in FIG. 17D.
  • the outer shape of the pin 122 is similar to that of the pin 120 of the first embodiment. Therefore, the through holes formed in the support frame 115 and the holes formed by the end mill 116 in the upper plate 61 are the same as those in the first embodiment, and the machining process shown in FIGS. 15A, 15B, and 15C in FIG.
  • FIG. 17D The difference between FIG. 17D and FIG. 15D is that the length of the pin 122 used in FIG. 17D is longer than the length of the pin 120 used in FIG. 15D.
  • a hole is formed in the lower rigid body 115 on which the support frame 60 is placed, and at this portion, the tip of the pin 122 projects below the lower surface of the lower plate 62.
  • FIG. 17E is a cross-sectional view showing a state in which the support frame 60 is turned over and the hollow portion of the pin 122 is tapped by the tool (strike rod) 123 on the lower rigid body 115 having no hole. This crushes the tip of the hollow pin 122 and fixes the hollow pin 122.
  • FIG. 17F is a cross-sectional view showing a state where the hollow pin 122 is fixed by crushing the tip of the hollow pin 122. As shown in FIG. 17F, the crushed portion of the tip of the hollow pin 122 projects below the lower surface of the lower plate 62. In the vapor deposition apparatus, the configuration as shown in FIG. 17F can be used as long as the vapor deposition mask 5 may have protrusions on any surface thereof.
  • the lower plate 62 is made smaller than the upper plate 61 in a plan view, and a material capable of strongly adhering to the lower plate 62 and the upper plate 61 is used for the end lower surface of the upper plate 61.
  • a material capable of strongly adhering to the lower plate 62 and the upper plate 61 is used for the end lower surface of the upper plate 61.
  • the upper plate 61 and the lower plate 62 are prevented from shifting in the plane direction.
  • FIG. 18A is a cross-sectional view showing a state in which the upper plate 61 and the lower plate 62 are placed upside down on the lower rigid body 115.
  • the size of the lower plate 62 is smaller than the size of the upper plate 61, and the upper plate 61 projects outward from the lower plate 62 at the end portion.
  • FIG. 18B shows a state in which the modeled object 133 is stacked on the end portion of the upper plate 61 using a three-dimensional printer.
  • Reference numeral 130 denotes a nozzle of the three-dimensional printer.
  • the modeled object 133 formed in this manner is a material having a property of strongly adhering to the upper plate 61 and the lower plate 62 and the adhesive 63 or more after being subjected to heat treatment or ultraviolet irradiation. ..
  • FIG. 18C is a cross-sectional view showing a state in which the three-dimensional printer 133 has finished stacking the shaped objects 133.
  • a barbell mark 135 in FIG. 18C and the like indicates that the layered product 133 is strongly bonded to the upper plate 61 and the lower plate 62.
  • FIG. 18D is a cross-sectional view showing a state in which the modeling tool 133 is polished using the polishing tool 132 to flatten the plane and side surfaces of the support frame 60.
  • FIG. 18E is a cross-sectional view of the support frame 60 after processing. 18A to 18D, the upper plate 61 and the lower plate 62 are processed upside down, but in FIG. 18E, the vertical relationship between the upper plate 61 and the lower plate 62 is returned to the original state. ..
  • FIG. 18F is a rear surface plan view of the support frame 60 as viewed from the rear surface.
  • the outer shape of the lower plate 62 is smaller than that of the upper plate 61 over the entire circumference.
  • the layered product 131 is discretely formed outside the lower plate 62 as shown in FIG. 18F. You can do it.
  • the layered product 131 may be formed on the entire outer periphery of the lower plate 62.
  • FIG. 18G is an example in which the layered product 131 is formed on the inner peripheral side of the support frame 60. Since FIG. 18G is a back plan view, only the lower plate 62 is visible. When the width of the lower plate 62 is smaller than that of the upper plate 61 on the entire inner circumference, the layered product 113 is formed on the entire inner circumference of the lower plate 62.
  • (Embodiment 2) 19A to 19E are sectional views showing Embodiment 2 of Example 3. The difference between the second embodiment and the first embodiment is that in the support frame 60, the lower plate 62 and the upper plate 61 are initially set to have the same size, and the end portion of the lower plate 62 is removed by an end mill. A space for forming the modeled article 131 by the three-dimensional printer is secured.
  • FIG. 19A shows a state in which the support frame 60 having the same size as the upper plate 61 and the lower plate 62 is placed upside down on the lower rigid body 115, and a part of the end portion of the lower plate 62 is removed.
  • FIG. 6 is a cross-sectional view showing a state in which the end mill 116 is applied in order to do so.
  • the support frame 60 in FIGS. 19A to 19E is placed upside down and placed on the lower rigid body 115.
  • FIG. 19B is a cross-sectional view showing a state where the end portion of the lower plate 62 is cut and removed by the end mill 116.
  • FIG. 19C is a cross-sectional view showing a state in which the layered product 133 is formed on the end portion of the upper plate 61 by the three-dimensional printer.
  • Reference numeral 130 denotes a nozzle of the three-dimensional printer.
  • FIG. 19C is similar to the configuration described in FIG. 18B.
  • FIG. 19D corresponds to FIG. 18C of the first embodiment
  • FIG. 19E corresponds to FIG. 18D of the first embodiment.
  • 19F is a cross-sectional view showing the support frame 60 after processing, and corresponds to FIG. 18E of the first embodiment.
  • FIG. 19G is a backside plan view of the support frame 60 according to the second embodiment.
  • the layered product 133 formed by a three-dimensional printer is filled in the hole formed by the end mill 116 formed at the end of the lower plate 62. Since the holes are formed by the end mill, the holes and the laminate-molded product 133 are discretely formed on the outer circumference.
  • FIG. 19H is a back plan view of another example of the support frame 60 according to the second embodiment.
  • a hole is formed by the end mill 116 at the end portion on the inner peripheral side of the lower plate 62, and the layered product 133 formed by a three-dimensional printer is filled in this hole.
  • the holes are formed by the end mill 116, the holes and the layered molded article 133 are discretely formed on the inner circumference.
  • the removed portion formed on the lower plate 62 is formed by the end mill 116, it has a circular hole.
  • the planar shape of the removed portion at the end of the lower plate 62 can be made a shape other than a circle.
  • the fourth embodiment is an example in which the upper plate 61 and the lower plate 62 are fixed by plating at the ends of the support frame 60 in order to eliminate the displacement between the upper plate 61 and the lower plate 62.
  • 20A to 20F are cross-sectional views showing Embodiment 1 of Example 4, and FIG. 20G is a plan view of a support frame 60 according to Example 4.
  • 20A is a cross-sectional view of the support frame 60 before performing the process of the present embodiment
  • the lower diagram is an adhesive material that bonds the upper plate 61 and the lower plate 62 of the support frame 60.
  • It is sectional drawing of the solvent tank 141 which contains the solvent 140 which melt
  • FIG. 20B is a cross-sectional view showing a state where one end of the support frame 60 is immersed in the solvent 140.
  • a circle in the portion where the support frame 60 is immersed in the solvent 140 indicates a process in which the adhesive 63 is being dissolved in the solvent 140.
  • FIG. 20C is a cross-sectional view showing a state in which the adhesive material 63 in the range immersed in the solvent 140 is removed.
  • the plating is configured to form plating between the end faces of the upper plate 61 and the lower plate 62 and between the upper plate 61 and the lower plate 62 at the ends.
  • the upper drawing of FIG. 20D is a cross-sectional view showing a state in which the masking tape 142 is attached so that plating is not formed on the main surfaces of the upper plate 61 and the lower plate 62 before plating.
  • the drawing on the lower side of FIG. 20 is a cross-sectional view showing a state in which the plating solution 143 is contained in the plating tank 145.
  • FIG. 20E is a sectional view showing a state where the end portion of the support frame 60 is immersed in the plating liquid 143.
  • the upper plate 61 and the lower plate 62 which are in contact with the plating solution 143, are plated.
  • FIG. 20F is a cross-sectional view showing a state in which the support frame 60 with the plating 144 applied to the end plate between the upper plate 61 and the lower plate 62 and the end side surface is taken out from the plating tank 145 at the end. As shown on the upper side of FIG.
  • the plating 144 fills the space between the lower plate 62 and the upper plate 61 to firmly bond the upper plate 61 and the lower plate 62 together, and the shearing force is applied to the upper plate 61 and the lower plate 62. Misalignment can be prevented.
  • the plating thickness between the upper plate 61 and the lower plate 62 is the same as that of the adhesive material 63, and is 15 ⁇ m to 20 ⁇ m.
  • FIG. 20G is a plan view showing a state where the support frame 60 is plated 144 according to the present embodiment. As shown in FIG. 20G, the plating 144 is applied to the entire outer edges of the four sides of the support frame 60 and can cope with shearing force in any direction. The dotted line in FIG. 20G indicates that the plating is formed between the upper plate 61 and the lower plate 62 at the end of the support frame 60.
  • (Embodiment 2) 21A to 21E are cross-sectional views illustrating Embodiment 2 of Example 4.
  • FIG. 21A is a cross-sectional view showing a state where the end of the support frame 60 is immersed in the solvent 140 to melt the adhesive 63, and corresponds to FIG. 20B in the first embodiment.
  • the distance between the upper plate 61 and the lower plate 62 is likely to be large in the range where the adhesive 63 is removed.
  • FIG. 21B is a cross-sectional view showing a state where the distance between the upper plate 61 and the lower plate 62 is large at the end of the support frame 60. Then, even if the upper plate 61 and the lower plate 62 are plated 144, the upper plate 61 and the lower plate 62 are not joined by the plating 144.
  • FIG. 21C is a cross-sectional view showing a state in which the clamp 146 prevents expansion of the distance between the upper plate 61 and the lower plate 62 before plating in order to prevent this.
  • the masking tape 142 is attached to the support frame 60 from which the adhesive material 63 has been removed at the end, and then the clamp 146 suppresses the expansion of the distance between the upper plate 61 and the lower plate 62.
  • the upper plate 61 and the lower plate 62 are plated with a uniform thickness.
  • the clamps 146 may be formed on one entire side of the support frame 60 or may be formed discretely. In this state, it is immersed in the plating solution 143 shown in FIG. 21C.
  • FIG. 21D is a cross-sectional view showing a state in which the clamped support frame 60 is immersed in the plating solution 143 to perform plating 144.
  • FIG. 21D is a cross-sectional view showing a state in which the support frame 60 having the ends plated in this manner is taken out from the plating solution 143.
  • 21E is a sectional view of the support frame 60 showing a state in which the clamp 146 and the masking tape 142 are removed.
  • a plan view of the support frame 60 in the second embodiment thus formed is the same as FIG. 20G in the first embodiment.
  • the upper plate 61 and the lower plate 62 can be reliably adhered to each other by the plating 144 at the end portion, so that the displacement due to the shearing force can be reliably prevented. I can.
  • the cross-sectional structure of the support frame 60 of the fifth embodiment is different from that of the first to fourth embodiments.
  • an upper plate 61 having a convex portion 611 and a concave portion 612 on one surface and a lower plate 62 having a convex portion 621 and a concave portion 622 on one surface are prepared.
  • the upper plate 61 and the lower plate 62 are attached to each other by fitting the convex part of the above and the other concave part of the upper plate 61 or the lower plate 62.
  • FIG. 22 is a cross-sectional view showing the method of manufacturing the support frame 60 according to the first embodiment of the fifth example.
  • an upper plate 61 having a convex portion 611 and a concave portion 612 formed on one surface, and a lower plate 62 having a convex portion 621 and a concave portion 622 formed on one surface are prepared.
  • Such a plate material can be manufactured by pressing or machining.
  • the upper plate 61 and the lower plate 62 are bonded to each other by a roller with the uneven surfaces facing each other.
  • the bonding is performed while applying the adhesive liquid 152 from the nozzle 153 to the bonding surface so that the upper plate 61 and the lower plate 62 are not separated by the force in the direction perpendicular to the main surface of the support frame 60.
  • the roller 150 allows the protrusions of one of the upper plate 61 or the lower plate 62 and the recesses of the other of the upper plate 61 or the lower plate 62 to be attached to each other. Even if a shearing force is applied between the upper plate 61 and the lower plate 62, the displacement of the upper plate 61 and the lower plate 62 in the main surface direction does not occur. Further, since the convex portion and the concave portion are fitted while being crushed by the roller 150, it is possible to prevent the deviation of the convex portion and the concave portion due to the manufacturing tolerance.
  • FIG. 23 is a cross-sectional view of the support frame manufactured in this way.
  • the upper plate 61 and the concave portion of the lower plate are fitted and combined with each other, the upper plate 61 and the lower plate 62 do not shift even if a shearing force is applied. Further, since the adhesive is present between the upper plate 61 and the lower plate 62, the upper plate 61 and the lower plate 62 do not separate even if a force is applied in the direction perpendicular to the main surface.
  • FIG. 24 is a diagram showing a state of a surface on which convex portions and concave portions are formed on the upper plate 61 and the lower plate 62.
  • the left side of FIG. 24 is the upper plate 61, and the right side is the lower plate 62.
  • the convex portions 611 are formed on the upper plate 61 at a predetermined pitch.
  • the upper side is a plan view and the lower side is a BB sectional view thereof.
  • the convex portions 611 are formed in an island shape and arranged in a matrix.
  • the planar shape of each convex portion 611 is circular in FIG. 24, but may be square or rectangular.
  • a recess 622 is formed in the lower plate 62 at a portion corresponding to the protrusion 611 of the upper plate 61.
  • the upper side of the drawing on the right side of FIG. 24 is a plan view, and the lower side is its CC cross-sectional view.
  • the concave portions 622 of the lower plate 62 are formed at the same pitch as the convex portions 611 of the upper plate 61, and the planar shape of each concave portion 622 is the same as the convex portion 611 of the upper plate 61.
  • the convex portion 611 of the upper plate 61 and the concave portion 622 of the lower plate 62 are fitted and bonded to each other, whereby the support frame 60 in which the upper 61 plate and the lower plate 62 are not displaced even if shearing force is applied Can be manufactured.
  • FIG. 25 is a diagram showing another example of the state of the surfaces of the upper plate 61 and the lower plate 62 on which the concave portions and the convex portions are formed.
  • the left side of FIG. 24 is the upper plate 61, and the right side is the lower plate 62.
  • the convex portions 611 are formed on the upper plate 61 at a predetermined pitch.
  • the upper side is a plan view and the lower side is a DD cross-sectional view thereof.
  • the lower plate 62 is formed with the convex portions 621 at a predetermined pitch, like the upper plate 61.
  • the upper side is a plan view
  • the lower side is its EE cross-sectional view. That is, the lower plate 62 and the upper plate 61 are the same.
  • the convex portion 611 of the upper plate 61 is fitted to the concave portion of the lower plate 62 indicated by a dotted circle.
  • the space between the four convex portions 621 forms the concave portion 622.
  • the effect is the same as that in FIG. 24.
  • the upper plate 61 and the lower plate 62 need to be formed in separate steps, but in the configuration of FIG. 25, the upper plate 61 and the lower plate 62 can be simultaneously formed. Therefore, the manufacturing cost can be reduced.
  • FIG. 26 is a plan view showing another example of the convex portion and the concave portion formed on the upper plate 61 and the lower plate 62 of the support frame 60.
  • the convex portions 611 are formed in a stripe shape in the vertical direction (y direction) and are formed at a predetermined pitch in the horizontal direction (x direction).
  • a concave portion 612 is formed between the convex portions 611. 26 to 28, since the upper plate 61 and the lower plate 62 have the same shape, only the upper plate 61 is shown.
  • the convex portions 611 and the concave portions 612 having the same width are formed at the same pitch.
  • the upper plate 61 and the lower plate 62 can be simultaneously formed.
  • the support frame 60 can be formed by fitting the convex portions and the concave portions of the upper plate 61 and the lower plate 62 thus formed. Note that spraying the adhesive liquid 152 when the upper plate 61 and the lower plate 62 are fitted together is the same as described with reference to FIG.
  • the upper plate 61 and the lower plate 62 do not shift with respect to the shearing force applied in the lateral direction (the x direction in FIG. 26).
  • the bonding area increases due to the unevenness formed on the upper plate 61 and the lower plate 62, so that there is some effect.
  • FIG. 27 is a plan view showing another example of the convex portion 611 and the concave portion 612 formed on the upper plate 61 and the lower plate 62 of the support frame 60.
  • the convex portions 611 extend obliquely in the form of stripes and are formed at a predetermined pitch in the direction orthogonal thereto.
  • a concave portion 612 is formed between the convex portions 611.
  • the configuration of FIG. 27 is the same as that of FIG. 26 except that the convex portions 611 are formed in a stripe shape in an oblique direction.
  • the support frame 60 formed by fitting the upper plate 61 and the lower plate 62 according to the configuration of FIG. 27 disperses the shearing force in the horizontal direction (x direction in FIG. 27) and the vertical direction (y direction in FIG. 27). Therefore, the displacement between the upper plate 61 and the lower plate 62 is unlikely to occur in both the x direction and the y direction. However, when the shearing force in the x direction or the y direction is very large, the upper plate 61 and the lower plate 62 may be slightly displaced.
  • FIG. 28 is a plan view showing another example of the convex portion and the concave portion formed on the upper plate and the lower plate of the support frame 60.
  • the convex portions 611 are formed in a zigzag shape in the vertical direction on one surface of the upper plate 61, and are arranged at a predetermined pitch in the direction perpendicular to the zigzag shape.
  • a concave portion 612 is formed between the convex portions 611.
  • the configuration of FIG. 28 is the same as that of FIG. 26 except that the convex portion 61 is formed in a zigzag shape.
  • the support frame 60 formed by fitting the upper plate 61 and the lower plate 62 with the configuration of FIG. 28 disperses the shearing force in the horizontal direction (x direction in FIG. 28) and the vertical direction (y direction in FIG. 28). Therefore, the displacement between the upper plate and the lower plate is unlikely to occur in both the x direction and the y direction.
  • the shearing force applied in the x direction or the y direction is canceled by the vertical and horizontal directions and becomes zero. Therefore, even if a large shearing force is generated, the upper plate 61 and the lower plate 62 do not shift.
  • FIG. 29 is a cross-sectional view showing the manufacturing process of the configuration of the second exemplary embodiment. 29 is the same as FIG. 22 of the first embodiment except that the cross section of the convex portion 611 of the upper plate 61 and the cross section of the convex portion 621 of the lower plate 62 are triangular.
  • the convex portions 611 and 621 as shown in FIG. 29 can also be formed by pressing or machining.
  • the planar shape of the upper plate 61 or the lower plate 62 in the second embodiment is the same as that described with reference to FIGS. 24 to 28.
  • FIG. 30 is a cross-sectional view of the support frame 60 according to the second embodiment.
  • the second embodiment shows the case where the cross section is a triangle, this cross section is not limited to the triangle, and the same applies to a case where the curvature R is formed at the apex of the triangle or a trapezoid.
  • FIG. 31 is a cross-sectional view showing the manufacturing process of the configuration of the third embodiment of Example 5.
  • the third embodiment is different from the first embodiment in that a convex portion 65 is formed on the upper plate 61 and a convex portion 66 is formed on the lower plate 62 by a three-dimensional printer.
  • 22 is the same as that described in FIG. 22 in the first embodiment except that the convex portions 65 and 66 are formed by the three-dimensional printer.
  • FIG. 32 is a sectional view of the support frame in the third embodiment.
  • 23 is the same as that described in Embodiment 1 with reference to FIG. 23, except that the convex portions 65 and 66 are formed by a three-dimensional pre-printer.
  • the planar shape of the upper plate 61 or the lower plate 62 in the third embodiment is the same as that described with reference to FIGS. 24 to 28.
  • the present invention is not limited to this, and can be used as a vapor deposition mask in a display device other than an organic EL display device when vapor deposition with a fine pitch is required.
  • Vapor deposition mask 10... Display area, 11... Scan line, 12... Video signal line, 13... Power line, 14... Pixel, 14... Pixel, 14... Pixel, 20... Scan line driving circuit, 21 ...Frame area, 30...terminal area, 31...driver IC, 32...flexible wiring board, 40...board, 50...mask, 51...opening area, 52...peripheral area, 60...support frame, 61...upper plate, 62... Lower plate, 63... Adhesive material, 65... Convex part by 3D printer, 66... Convex part by 3D printer, 70... Joining member, 80... Evaporated material, 90... Base material, 91... Resist, 92...
  • Temporary bonding Material 100...Stopper, 110...Punching tool, 111...Doting point, 112...Hole, 113...Burr, 114...Upper rigid body (mounting stand), 115...Lower rigid body (holding stand), 116...End mill, 117...Reamer, 120... pin, 121... parallel pin, 122... hollow pin, 123... striking rod, 130... 3D printer nozzle, 131... 3D model, 132... polishing tool, 133... ejected product, 135... show strong adhesion Mark, 140... Solvent, 141... Solvent tank, 142... Masking tape, 143... Plating liquid, 144... Plating, 145... Plating tank, 150... Roller, 152...
  • Adhesive liquid 153... Nozzle, 150... Common electrode, 151... Capacitance insulating film, 152... Pixel electrode, 153... Alignment film, 611... Convex part, 612... Recessed part, 621... Convex part, 622... Recessed part, 900... Deposition source, 1000... Vacuum deposition chamber, 1121... Deformed part of support frame , B... blue light emitter, G... green light emitter, R... red light emitter

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Afin de réaliser un masque de dépôt en phase vapeur, un élément électroluminescent pouvant être déposé en phase vapeur avec une bonne précision dans un pixel lors de la fabrication d'un dispositif d'affichage, la présente invention présente la configuration suivante : un masque de dépôt en phase vapeur utilisé pour fabriquer un dispositif d'affichage, le masque de dépôt en phase vapeur étant caractérisé en ce qu'il est constitué d'un masque 50 pour former un dépôt dans un pixel, et d'un cadre support 60 pour supporter le masque 50, le cadre support 60 étant constitué d'une plaque supérieure 61 et d'une plaque inférieure 62 et d'un matériau adhésif 63 pour assembler la plaque supérieure 61 et la plaque inférieure 62, et le masque de dépôt en phase vapeur présentant un bouchon 100 pour empêcher un désalignement de la plaque supérieure 61 et de la plaque inférieure 62 l'une par rapport à l'autre dans la direction du plan principal du cadre support 60 lorsqu'une force de cisaillement est appliquée entre la plaque supérieure 61 et la plaque inférieure 62.
PCT/JP2020/003651 2019-02-19 2020-01-31 Masque pour dépôt en phase vapeur WO2020170762A1 (fr)

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WO2011132325A1 (fr) * 2010-04-21 2011-10-27 株式会社アルバック Masque
JP2017210633A (ja) * 2016-05-23 2017-11-30 マクセルホールディングス株式会社 蒸着マスクおよびその製造方法
WO2018110253A1 (fr) * 2016-12-14 2018-06-21 大日本印刷株式会社 Dispositif de masque de dépôt en phase vapeur et procédé de fabrication de dispositif de masque de dépôt en phase vapeur

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CN113490761A (zh) 2021-10-08
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KR102641271B1 (ko) 2024-02-27
KR20210114040A (ko) 2021-09-17

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