WO2019179239A1 - 掩膜装置及其制作方法、蒸镀*** - Google Patents

掩膜装置及其制作方法、蒸镀*** Download PDF

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Publication number
WO2019179239A1
WO2019179239A1 PCT/CN2019/073152 CN2019073152W WO2019179239A1 WO 2019179239 A1 WO2019179239 A1 WO 2019179239A1 CN 2019073152 W CN2019073152 W CN 2019073152W WO 2019179239 A1 WO2019179239 A1 WO 2019179239A1
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WO
WIPO (PCT)
Prior art keywords
alignment
strip
plate
frame
support plate
Prior art date
Application number
PCT/CN2019/073152
Other languages
English (en)
French (fr)
Inventor
吕守华
黄俊杰
张德
赵蓉
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/768,485 priority Critical patent/US11542588B2/en
Publication of WO2019179239A1 publication Critical patent/WO2019179239A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • B05C21/005—Masking devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/10—Deposition methods
    • C03C2218/15—Deposition methods from the vapour phase
    • C03C2218/151—Deposition methods from the vapour phase by vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/34—Masking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present application relates to the field of mask manufacturing, and in particular to a mask device, a method for fabricating the same, and an evaporation system.
  • a core technology for preparing a high-quality OLED panel is to deposit an organic material of three primary colors of R, G, and B on a glass substrate by using a high-precision OLED mask.
  • the quality of the mask used in the evaporation process directly affects the quality of the OLED panel. Therefore, the structure and fabrication method of the mask are important.
  • a masking device for the purpose of the present application, comprising a frame, at least two alignment plates and at least one support plate, wherein each of the at least two alignment plates is provided with a hollow portion And each of the at least two alignment plates is fixed on the frame;
  • Each of the at least one support plate intersects with the corresponding alignment plate, and an area corresponding to the hollow portion is disposed on a surface of the at least one support plate opposite to the frame At least one solder joint is disposed to be soldered to the frame.
  • the at least two alignment plates and the at least one support plate are strip-shaped, and the at least two alignment plates are located on both sides of the frame.
  • each of the at least one support plate includes opposite ends, and at least one of the two ends of each of the support plates is from the corresponding one A side of the strip-shaped alignment plate facing away from the frame extends via the hollow portion to a side of the frame of the alignment plate; the at least one solder joint is disposed at the at least one end portion.
  • each of the at least one support plate includes opposite ends, and at least one of the two ends of each of the support plates is from the corresponding one
  • the side of the frame of the alignment plate extends via the hollow to a side of the alignment plate facing away from the frame; the at least one solder joint is disposed at the at least one end.
  • each of the support plates is stacked on a side of the corresponding strip-shaped alignment plate that faces away from the frame.
  • each of the support plates is stacked on a side of the corresponding alignment plate that faces the frame.
  • each of the alignment plates is disposed as a through hole disposed along a thickness direction of the alignment plate.
  • each of the alignment plates includes a groove disposed on the alignment plate, the opening of the groove facing an extending direction perpendicular to the alignment plate, and facing the phase Corresponding to the end of the support plate.
  • the at least one at least one support plate is parallel to each other and spaced apart.
  • a plurality of the solder joints are arranged in at least one row in a length direction perpendicular to the support plate, and a plurality of the solder joints in the same row are spaced apart along a length direction parallel to the support plate. Arrange.
  • a positioning hole is provided in the alignment plate.
  • the alignment plate includes parallel plates; the mask device further includes at least one strip shielding plate, each of the at least one strip shielding plate being located between the two alignment plates, and The alignment plates are parallel to each other, and at least one of the strip-shaped shielding plates is spaced apart.
  • the method further includes at least one strip mask and at least two strip masks, and one strip mask is disposed between each adjacent two strip masks; and An opening is provided in each of the strip masks.
  • the present application further provides an evaporation system for vapor deposition of a film, including the above-mentioned mask device provided by the present application.
  • the present application further provides a method for fabricating a mask device, including:
  • Providing at least one support plate corresponding to the at least two alignment plates, and intersecting each of the at least one support plate with a corresponding alignment plate, and at the At least one solder joint is formed in a region of the opposite surface of the frame corresponding to the hollow portion to be welded and fixed to the frame.
  • the step of providing at least one support plate corresponding to the at least two alignment plates includes moving an end of each of the at least one support plate away from a corresponding alignment plate
  • One side of the frame extends to the side of the frame of the alignment plate via the hollow portion of the alignment plate, and the at least one solder joint is disposed at the end portion.
  • the step of providing at least one support plate corresponding to the at least two alignment plate plates comprises: aplying an end of each of the at least one support plate from a corresponding alignment plate
  • the side of the frame extends via the hollow of the alignment plate to the side of the alignment plate facing away from the frame, and the at least one solder joint is disposed at the end.
  • the step of providing at least one support plate corresponding to the at least two alignment plates comprises stacking each of the at least one support plate on a corresponding one of the alignment plates Deviate from the side of the frame.
  • the step of providing at least one support plate corresponding to the at least two alignment plates comprises stacking each of the at least one support plate on a corresponding one of the alignment plates Towards one side of the frame.
  • providing at least two alignment plates to form a hollow in the at least two alignment plates includes providing a groove on the at least two alignment plates such that the opening of the groove faces It is perpendicular to the direction in which the alignment plate extends and faces the end of the support plate.
  • Figure 1 is a schematic view showing the structure of a known mask device
  • FIG. 2 is a schematic structural view of a mask device according to a first embodiment of the present application.
  • 3A is a schematic structural view of a mask device according to a second embodiment of the present application.
  • FIG. 3B is another schematic structural diagram of a mask device according to a second embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a mask device according to a third embodiment of the present application.
  • FIG. 5A is a schematic structural diagram of a mask device according to a fourth embodiment of the present application.
  • FIG. 5B is another structural diagram of a mask device according to a fourth embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a mask device according to a fifth embodiment of the present application.
  • a related art mask includes a frame, a strip alignment plate, and a strip support plate, wherein the strip support plate is welded to the frame for supporting the strip mask; the strip alignment plate is welded to the frame, And intersecting the strip-shaped support plates for alignment with the glass substrate.
  • the mask of the related art inevitably has the following problems in practical applications, that is, at the intersection of the strip-shaped alignment plate and the strip-shaped support plate, the strip-shaped alignment plate blocks a part of the solder joints of the strip-shaped support plate, When it is necessary to repair the solder joint, the strip alignment plate needs to be removed first, resulting in waste of the strip alignment material. In addition, re-welding the strip alignment plate can result in a change in the alignment of the strip alignment plate, which makes subsequent alignment work difficult.
  • the mask device of the related art includes a frame 11, a strip alignment plate 13, and a strip-shaped support plate 12, wherein the strip-shaped support plate 12 is first welded to the frame 11.
  • the strip alignment plate 13 is then welded to the frame 11.
  • the strip-shaped alignment plate 13 and the strip-shaped support plate 12 cross each other and are welded to the frame 11 by a plurality of solder joints 121.
  • the strip support plate 12 is used to support a strip mask (not shown) containing an effective vapor deposition opening.
  • positioning holes 131 are provided on the strip alignment plate 13 for alignment with the positioning marks on the glass substrate (not shown). It should be noted that the solder joints 132 on the strip alignment plate 13 and the solder joints 121 on the strip-shaped support plate 12 shown in FIG. 1 are all in contact with the frame 11.
  • the strip-shaped alignment plate 13 blocks a portion of the solder joints 121 of the strip-shaped support plate 12. After a period of time, the solder joints 121 may be damaged, and the solder joints 121 need to be repaired. When the solder joint 121 is repaired, the strip alignment plate 13 needs to be removed first, resulting in waste of the strip-shaped alignment plate material. In addition, re-welding the strip alignment plate 13 causes the alignment reference of the strip alignment plate 13 to change, thereby causing difficulty in subsequent alignment work.
  • the embodiment of the present application provides a mask device including a frame 21, a strip alignment plate 23, and a strip-shaped support plate 22, wherein the strip-shaped alignment plate 23 is A hollow portion 232 is provided, and the strip-shaped alignment plate 23 is fixed to the frame 21.
  • the strip-shaped support plate 22 and the strip-shaped alignment plate 23 cross each other, and a plurality of solder joints 221 are provided on a surface of the strip-shaped support plate 22 opposite to the frame 21.
  • the solder joints 221 of the strip-shaped support plate 22 can be exposed without being blocked by the strip-shaped alignment plate 23.
  • the bit plate 23 can avoid the waste of the strip-shaped alignment plate material, and can avoid the change of the alignment reference of the strip-shaped alignment plate 23, thereby avoiding the difficulty of the subsequent alignment work.
  • solder joint 221 is soldered to the frame 21 by the hollow portion 232.
  • the end portion 22a of the strip-shaped support plate 22 extends from the side of the strip-shaped alignment plate 23 away from the frame 21 via the hollow portion 232 to the side of the frame 21 of the strip-shaped alignment plate 23, All solder joints 221 are disposed at the end portion 22a.
  • the end portion 22a of the strip-shaped support plate 22 is a portion extending from the intermediate portion of the strip-shaped support plate 22 to both ends, in other words, the strip-shaped support plate 22 includes an intermediate portion and two edge regions on both sides of the intermediate portion Wherein the intermediate portion is located on a side of the strip-shaped alignment plate 23 facing away from the frame 21; and the two edge regions are located on a side of the frame of the strip-shaped alignment plate 23. Also, all of the pads 221 are disposed in the edge region.
  • the strip-shaped alignment plates 23 are two, and the two strip-shaped alignment plates 23 are parallel to each other.
  • the two end portions 22a of the strip-shaped support plate 22 extend from the side of the two strip-shaped alignment plates 23 away from the frame 21 via the hollow portion 232 to the frame 21 of the two strip-shaped alignment plates 23, respectively.
  • the two end portions 22a of the strip-shaped support plate 22 are portions extending from the intermediate portion of the strip-shaped support plate 22 to both ends, in other words, the strip-shaped support plate 22 includes an intermediate portion and two sides on both sides of the intermediate portion.
  • the strip-shaped support plate 22 By extending the end portion 22a of the strip-shaped support plate 22 from the side of the strip-shaped alignment plate 23 away from the frame 21 via the hollow portion 232 to the side of the frame 21 of the strip-shaped alignment plate 23, the strip-shaped support plate 22 can
  • the strip-shaped alignment plate 23 is press-fitted to the surface of the frame 21, and when the masking device is used, the stability of the strip-shaped alignment plate 23 can be enhanced, so that the alignment reference can be made more stable, and the vapor deposition stability can be improved.
  • the hollow portion 232 includes through holes provided in the thickness direction of the strip alignment plate 23.
  • the plurality of solder joints 221 are arranged in at least one row in a direction perpendicular to the extending direction of the strip-shaped support plate 22, and the plurality of solder joints 221 in the same row are spaced apart from each other in parallel with the extending direction of the strip-shaped support plate 22. Arrange. Of course, in practical applications, the plurality of solder joints 221 may also be arranged in any manner.
  • the strip-shaped alignment plate 23 is fixed to the frame by welding.
  • a positioning hole 231 is provided in the strip alignment plate 23.
  • the alignment holes 231 are aligned with the alignment marks on the glass substrate, thereby completing the alignment of the mask device with the glass substrate.
  • the mask device provided by the embodiment of the present application is substantially the same as the mask device provided by the embodiment shown in FIG. 2 except that the structure of the hollow portion is different.
  • the hollow portion 232' includes a groove disposed on the strip-shaped alignment plate 23, the opening of the groove is oriented perpendicular to the extending direction of the strip-shaped alignment plate 23, and faces the strip-shaped support End 22a of plate 22.
  • the groove structure also exposes all of the pads 221.
  • the strip-shaped alignment plate 23 is first welded to the frame 21; the strip-shaped support plate 22 is then welded to the frame 21. That is, the strip-shaped support plate 22 is located above the strip-shaped alignment plate 23.
  • the present application is not limited thereto. In practical applications, as shown in FIG. 3B, the strip-shaped support plate 22 may be first welded to the frame 21; the strip-shaped alignment plate 23 is then welded to the frame 21. . That is, the strip alignment plate 23 is located above the strip support plate 22.
  • the above groove structure can also expose all the solder joints 221.
  • the mask device provided by the embodiment of the present application is substantially the same as the mask device provided by the embodiment shown in FIG. 2 except that the strip supporting plates 22 are arranged differently.
  • the end portion 22a of the strip-shaped support plate 22 extends from the side where the frame 21 of the strip-shaped alignment plate 23 is located via the hollow portion 232 to the side of the strip-shaped alignment plate 23 facing away from the frame 21. All of the solder joints 221 are disposed at the end portion 22a.
  • the direction in which the end portion 22a of the strip-shaped support plate 22 in the present embodiment passes through the hollow portion 232 and the end portion 22a of the strip-shaped support plate 22 in the first embodiment shown in Fig. 2 are hollowed out.
  • the direction of the portion 232 is reversed, that is, the intermediate portion of the strip-shaped support plate 22 is located on the side of the frame 21 of the strip-shaped alignment plate 23, and the edge region of the strip-shaped support plate 22 is located away from the frame 21 of the strip-shaped alignment plate 23.
  • One side. At least a portion of the solder joint 221 can pass through the hollow portion 232 and ensure that all of the solder joints 221 are exposed.
  • the strip-shaped support plate 22 By extending the end portion 22a of the strip-shaped support plate 22 from the side where the frame 21 of the strip-shaped alignment plate 23 is located via the hollow portion 232 to the side of the strip-shaped alignment plate 23 facing away from the frame 21, the strip-shaped support plate 22 can
  • the strip-shaped alignment plate 23 is press-fitted to the surface of the frame 21, and when the masking device is used, the stability of the strip-shaped alignment plate 23 can be enhanced, so that the alignment reference can be made more stable, and the vapor deposition stability can be improved.
  • the mask device provided by the embodiment of the present application is substantially the same as the mask device provided by the embodiment shown in FIG. 2 except that the strip support plates 22 are arranged differently.
  • the strip-shaped support plates 22 are stacked on the strip-shaped alignment plate 23, and a plurality of solder joints 221 are welded and fixed to the frame 21 by the hollow portions 232. That is to say, the intermediate portion and the edge region of the strip-shaped support plate 22 are both located on the side of the strip-shaped alignment plate 23 facing away from the frame 21. A portion of the solder joint 221 may be in contact with the frame 21 through the hollow portion 232.
  • the strip-shaped support plate 22 is stacked on the strip-shaped alignment plate 23.
  • the present application is not limited thereto, and in practical use, as shown in FIG. 5B, the strip-shaped alignment plates 23 are stacked on the strip-shaped support plate 22. This also exposes all solder joints 221.
  • the structure of the mask device provided by the embodiment of the present application is improved on the basis of the above various embodiments.
  • the masking device includes a frame 31, a strip-shaped alignment plate 33, and a strip-shaped support plate 32, wherein the frame 31 is a rectangular body.
  • a hollow portion 332 is provided in the strip alignment plate 33, and the strip alignment plate 33 is fixed to the frame 31.
  • the strip alignment plate 33 may be fixed to the frame 31 by welding.
  • the strip-shaped support plate 32 and the strip-shaped alignment plate 33 cross each other, and a plurality of solder joints 321 are provided on a surface of the strip-shaped support plate 32 opposite to the frame 31, and the plurality of solder joints 321 pass through the hollow portion 332 and the frame 31. Solder fixed.
  • the end portion 32a of the strip-shaped support plate 32 extends from the side of the frame 31 of the strip-shaped alignment plate 33 via the hollow portion 332 to the side of the strip-shaped alignment plate 33 facing away from the frame 31, so that A plurality of solder joints 321 are in contact with the frame 31, that is, the strip-shaped support plates 32 are disposed in the manner of the embodiment shown in FIG. 4 described above.
  • the strip-shaped support plate 32 can also be arranged in the manner of the other embodiments described above.
  • the masking device includes a plurality of strip-shaped support plates 32, and the plurality of strip-shaped support plates 32 are parallel to each other and arranged at intervals, thereby enabling a more stable supporting action.
  • the mask device further includes a plurality of strip masks 34, and each strip mask 34 is provided with an opening 341.
  • the deposition material is deposited on the glass substrate through the opening 341, and finally a pattern is formed on the glass substrate.
  • the mask device includes two strip-shaped alignment plates 33, and the two strip-shaped alignment plates 33 are parallel to each other; and the mask device further includes a plurality of strip-shaped shielding plates 35, a plurality of strips Each of the shielding plates 35 is located between two adjacent strip-shaped alignment plates 34, and is parallel to the strip-shaped alignment plates 34, and a plurality of strip-shaped shielding plates 35 are spaced apart.
  • a strip mask 34 is disposed between each two adjacent strip masks 35 such that the openings 341 of the plurality of strip masks 34 are arranged in a matrix.
  • the mask device provided in each of the above embodiments of the present application is provided with a hollow portion in the strip alignment plate.
  • the hollow portion By means of the hollow portion, all the solder joints on the strip-shaped support plate can be exposed without being blocked by the strip-shaped alignment plate.
  • the embodiment of the present application further provides an evaporation system for vapor deposition of a film, such as evaporation of an organic film.
  • the evaporation system includes the masking device provided by the various embodiments described above.
  • the present application further provides a method for fabricating a mask device, including:
  • the strip-shaped support plate Providing a strip-shaped support plate, and intersecting the strip-shaped support plate and the strip-shaped alignment plate, and forming a plurality of solder joints on a surface of the strip-shaped support plate opposite to the frame, the strip-shaped support plate corresponding to the hollow portion A plurality of solder joints are formed in the area.
  • the masking device is fabricated by first welding a strip-shaped support plate to the frame, and then welding the strip-shaped alignment plate to the frame.
  • this has a problem in practical applications: as shown in FIG. 1, at the intersection of the strip-shaped alignment plate 13 and the strip-shaped support plate 12, the strip-shaped alignment plate 13 blocks the strip-shaped support plate 12. Part of the solder joints 121, which reduces the soldering robustness of the strip-shaped support plate 12.
  • the strip alignment plate 13 needs to be torn off first, resulting in waste of the strip-shaped alignment plate material.
  • re-welding the strip alignment plate 13 causes the alignment reference of the strip alignment plate 13 to change, thereby causing difficulty in subsequent alignment work.
  • the mask device provided by the present application is formed by forming a hollow portion 232 in the strip alignment plate 23 in advance, and first welding the strip alignment plate 23 to the frame 21. .
  • the strip-shaped support plate 22 is then welded to the frame 21.
  • the bit plate 23 can avoid the waste of the strip-shaped alignment plate material, and can avoid the change of the alignment reference of the strip-shaped alignment plate 23, thereby avoiding the difficulty of the subsequent alignment work.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
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  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

一种掩膜装置，包括框架（11）、条状对位板（13）和条状支撑板（12），在条状对位板（13）中设置有镂空部（232），且条状对位板（13）固定在框架（11）上；条状支撑板（12）与条状对位板（13）相互交叉，并且在条状支撑板（12）与框架（11）相对的表面上对应镂空部（232）的区域内设置有多个焊点（221）以与框架（11）焊接固定。还包括一种蒸镀***和掩膜装置制作方法。

Description

掩膜装置及其制作方法、蒸镀***
相关申请的交叉引用
本申请要求于2018年3月22日提交的申请号为201810240561.7，发明名称为“掩膜装置及其制作方法、蒸镀***”的中国专利的优先权，该申请在此以引文方式整体并入本文。
技术领域
本申请涉及掩膜板制造领域，具体地，涉及一种掩膜装置及其制作方法、蒸镀***。
背景技术
目前，制备高质量OLED屏的一种核心技术是采用高精密OLED掩膜板在玻璃基板上蒸镀R、G、B三原色的有机材料。蒸镀工艺使用的掩膜板的质量直接影响到OLED屏的质量，因此，掩膜板的结构和制作方法都很重要。
发明内容
为实现本申请的目的而提供一种掩膜装置，包括框架、至少两个对位板和至少一个支撑板，在所述至少两个对位板中的每个对位板中设置有镂空部，且所述至少两个对位板中的每个对位板固定在所述框架上；
所述至少一个支撑板中的每个支撑板与相对应的所述对位板相互交叉，并且在所述至少一个支撑板的与所述框架相对的表面上设置有对应所述镂空部的区域内设置至少一个焊点以与所述框架焊接固定。
在一个实施例中，所述至少两个对位板和所述至少一个支撑板为条状，所述至少两个对位板位于所述框架的两侧。
在一个实施例中，所述至少一个支撑板中的每个支撑板包括相 对的两个端部，以及所述每个支撑板的两个端部中的至少一个端部自相对应的所述条状对位板背离所述框架的一侧经由所述镂空部延伸至所述对位板的所述框架所在一侧；所述至少一个焊点均设置在所述至少一个端部。
在一个实施例中，所述至少一个支撑板中的每个支撑板包括相对的两个端部，以及所述每个支撑板的两个端部中的至少一个端部自相对应的所述对位板的所述框架所在一侧经由所述镂空部延伸至所述对位板的背离所述框架的一侧；所述至少一个焊点均设置在所述至少一个端部。
在一个实施例中，所述每个支撑板叠置在相对应的所述条状对位板背离所述框架的一侧。
在一个实施例中，所述每个支撑板叠置在相对应的所述对位板朝向所述框架的一侧。
在一个实施例中，所述每个对位板的镂空部设置为沿所述对位板的厚度方向设置的通孔。
在一个实施例中，所述每个对位板的镂空部包括设置于所述对位板上的凹槽，所述凹槽的开口朝向垂直于所述对位板的延伸方向，且朝向相对应的所述支撑板的所述端部。
在一个实施例中，所述至少一个至少一个支撑板相互平行，并间隔排布。
在一个实施例中，多个所述焊点在垂直于所述支撑板的长度方向上排成至少一排，同一排中的多个所述焊点沿平行于所述支撑板的长度方向间隔排布。
在一个实施例中，在所述对位板中设置有定位孔。
在一个实施例中，包括相互平行的对位板；所述掩膜装置还包括至少一个条状遮挡板，至少一个条状遮挡板中的每一个均位于两个对位板之间，且与所述对位板相互平行，并且至少一个所述条状遮挡板间隔排布。
在一个实施例中，还包括至少一个条状掩膜板和至少两个条状遮挡板，且在每相邻的两个条状遮挡板之间设置一个所述条状掩膜板； 并且，在每个所述条状掩膜板上设置有开口。
作为另一个技术方案，本申请还提供一种蒸镀***，用于薄膜的蒸镀，包括本申请提供的上述掩膜装置。
作为另一个技术方案，本申请还提供一种掩膜装置的制作方法，包括：
提供框架；
提供至少两个对位板，以在所述至少两个对位板中形成镂空部，所述至少两个对位板固定在所述框架上；
提供与所述至少两个对位板相对应的至少一个支撑板，且使所述至少一个支撑板中的每个支撑板与相对应的对位板相互交叉，并且在所述支撑板的与所述框架相对的表面上对应所述镂空部的区域内形成有至少一个焊点以与所述框架焊接固定。
在一个实施例中，提供与所述至少两个对位板相对应的至少一个支撑板的步骤包括将所述至少一个支撑板中的每个支撑板的端部自相对应的对位板背离所述框架的一侧经由该对位板的镂空部延伸至所述对位板的所述框架所在一侧，并且将所述至少一个焊点均设置在所述端部。
在一个实施例中，提供与所述至少两个对位板板相对应的至少一个支撑板的步骤包括将所述至少一个支撑板中的每个支撑板的端部自相对应的对位板的所述框架所在一侧经由该对位板的镂空部延伸至该对位板的背离所述框架的一侧，并且将所述至少一个焊点均设置在所述端部。
在一个实施例中，提供与所述至少两个对位板相对应的至少一个支撑板的步骤包括将所述至少一个支撑板中的每个支撑板叠置在相对应的所述对位板背离所述框架的一侧。
在一个实施例中，提供与所述至少两个对位板相对应的至少一个支撑板的步骤包括将所述至少一个支撑板中的每个支撑板叠置在相对应的所述对位板朝向所述框架的一侧。
在一个实施例中，提供至少两个对位板以在所述至少两个对位板中形成镂空部包括在所述至少两个对位板上设置凹槽以使得所述 凹槽的开口朝向垂直于所述对位板的延伸方向，且朝向支撑板的端部。
附图说明
图1为已知的掩膜装置的结构示意图；
图2为本申请第一实施例提供的掩膜装置的结构示意图；
图3A为本申请第二实施例提供的掩膜装置的一种结构示意图；
图3B为本申请第二实施例提供的掩膜装置的另一种结构示意图；
图4为本申请第三实施例提供的掩膜装置的结构示意图；
图5A为本申请第四实施例提供的掩膜装置的一种结构示意图；
图5B为本发明第四实施例提供的掩膜装置的另一种结构图；
图6为本申请第五实施例提供的掩膜装置的结构示意图。
具体实施方式
为使本领域的技术人员更好地理解本申请的技术方案，下面结合附图来对本申请提供的掩膜装置及其制作方法进行详细描述。
相关技术的掩膜板包括框架、条状对位板和条状支撑板，其中，条状支撑板焊接在框架上，用于支撑条状掩膜板；条状对位板焊接在框架上，且与条状支撑板相互交叉，用于与玻璃基板进行对位。相关技术的掩膜板在实际应用中不可避免地存在以下问题，即：在条状对位板与条状支撑板的交叉处，条状对位板会遮挡条状支撑板的部分焊点，当需要对焊点进行修复时，需要先撕除条状对位板，导致条状对位板材料的浪费。另外，重新焊接条状对位板会导致条状对位板的对位基准改变，从而给后续的对位工作带来困难。
请参阅图1，相关技术的掩膜装置包括框架11、条状对位板13和条状支撑板12，其中，条状支撑板12先被焊接在框架11上。条状对位板13后被焊接在框架11上。并且，条状对位板13与条状支撑板12相互交叉，并通过多个焊点121焊接在框架11上。条状支撑板12用于支撑含有有效蒸镀开口的条状掩膜板(图中未示出)。并且，在条状对位板13上设置有定位孔131，用于与玻璃基板(图中 未示出)上的定位标记进行对位。需要说明的是，图1中示出的条状对位板13上的焊点132以及条状支撑板12上的焊点121均与框架11相接触。
但是，在条状对位板13与条状支撑板12的交叉处，条状对位板13会遮挡条状支撑板12的部分焊点121。在经过一段时间之后，焊点121可能会损坏，此时需要对焊点121进行修复。在修复焊点121时，需要先撕除条状对位板13，导致条状对位板材料的浪费。另外，重新焊接条状对位板13会导致条状对位板13的对位基准改变，从而给后续的对位工作带来困难。
为了解决上述问题，如图2所示，本申请实施例提供了一种掩膜装置，其包括框架21、条状对位板23和条状支撑板22，其中，条状对位板23中设置有镂空部232，且该条状对位板23固定在框架21上。条状支撑板22与条状对位板23相互交叉，并且在条状支撑板22的与框架21相对的表面上设置有多个焊点221。
借助上述镂空部232，可以使条状支撑板22的所有焊点221均暴露出来，而不会被条状对位板23遮挡，当需要对焊点221进行修复时，无需撕除条状对位板23，从而可以避免条状对位板材料的浪费，同时可以避免条状对位板23的对位基准发生改变，从而避免给后续的对位工作带来困难。
可选的，至少部分焊点221通过镂空部232与框架21焊接固定。
具体地，在本实施例中，条状支撑板22的端部22a自条状对位板23背离框架21的一侧经由镂空部232延伸至条状对位板23的框架21所在一侧，所有焊点221均设置在该端部22a。该条状支撑板22的端部22a为自条状支撑板22的中间区域延伸至两端的部分，换句话说，条状支撑板22包括中间区域和位于该中间区域两侧的两个边缘区域，其中，中间区域位于条状对位板23背离框架21的一侧；而两个边缘区域位于条状对位板23的框架所在一侧。并且，所有焊点221均设置在边缘区域中。
在本实施例中，条状对位板23为两个，两个条状对位板23相互平行。在这种情况下，条状支撑板22的两个端部22a分别自两个 条状对位板23背离框架21的一侧经由镂空部232延伸至两个条状对位板23的框架21所在一侧。该条状支撑板22的两个端部22a为自条状支撑板22的中间区域延伸至两端的部分，换句话说，条状支撑板22包括中间区域和位于该中间区域两侧的两个边缘区域，其中，中间区域位于条状对位板23背离框架21的一侧；而两个边缘区域分别位于两个条状对位板23的框架所在一侧。
通过使条状支撑板22的端部22a自条状对位板23背离框架21的一侧经由镂空部232延伸至条状对位板23的框架21所在一侧，条状支撑板22能够将条状对位板23压合到框架21表面，在使用掩膜装置时，可以增强条状对位板23的稳定性，从而可以使对位基准更稳定，进而可以提高蒸镀稳定性。
在本实施例中，镂空部232包括沿条状对位板23的厚度方向设置的通孔。
在本实施例中，多个焊点221在垂直于条状支撑板22的延伸方向上排成至少一排，同一排中的多个焊点221沿平行于条状支撑板22的延伸方向间隔排布。当然，在实际应用中，多个焊点221也可以采用任意方式排列。
在本实施例中，条状对位板23采用焊接的方式固定在框架上。
在本实施例中，在条状对位板23中设置有定位孔231。当将玻璃基板置于掩膜装置上时，将定位孔231与玻璃基板上的对位标识进行对中，从而完成掩膜装置与玻璃基板的对位。
请参阅图3A，本申请实施例提供的掩膜装置，其与上述图2所示的实施例提供的掩膜装置基本相同，除了镂空部的结构不同。
具体地，在本实施例中，镂空部232’包括设置于条状对位板23上的凹槽，该凹槽的开口朝向垂直于条状对位板23的延伸方向，且朝向条状支撑板22的端部22a。凹槽结构同样可以将所有焊点221均暴露出来。
需要说明的是，在本实施例中，条状对位板23先被焊接在框架21上；条状支撑板22后被焊接在框架21上。即，条状支撑板22位于条状对位板23之上。但是，本申请并不局限于此，在实际应用中， 如图3B所示，也可以使得条状支撑板22先被焊接在框架21上；条状对位板23后被焊接在框架21上。即，条状对位板23位于条状支撑板22之上。上述凹槽结构同样可以将所有焊点221均暴露出来。
请参阅图4，本申请实施例提供的掩膜装置，其与上述图2所示的实施例提供的掩膜装置基本相同，除了条状支撑板22的设置方式不同。
具体地，在本实施例中，条状支撑板22的端部22a自条状对位板23的框架21所在一侧经由镂空部232延伸至条状对位板23的背离框架21的一侧，所有焊点221均设置在该端部22a。换句话说，本实施例中的条状支撑板22的端部22a穿过镂空部232的方向与上述图2所示的第一实施例中的条状支撑板22的端部22a穿过镂空部232的方向相反，即，条状支撑板22的中间区域位于条状对位板23的框架21所在一侧，而条状支撑板22的边缘区域位于条状对位板23的背离框架21的一侧。至少部分焊点221可以贯通镂空部232，并保证所有焊点221均暴露出来。
通过使条状支撑板22的端部22a自条状对位板23的框架21所在一侧经由镂空部232延伸至条状对位板23的背离框架21的一侧，条状支撑板22能够将条状对位板23压合到框架21表面，在使用掩膜装置时，可以增强条状对位板23的稳定性，从而可以使对位基准更稳定，进而可以提高蒸镀稳定性。
请参阅图5A，本申请实施例提供的掩膜装置与上述图2所示的实施例提供的掩膜装置基本相同，除了条状支撑板22的设置方式不同。
具体地，在本实施例中，条状支撑板22叠置在条状对位板23上，且多个焊点221通过镂空部232与框架21焊接固定。也就是说，条状支撑板22的中间区域和边缘区域均位于条状对位板23的背离框架21的一侧。部分焊点221可以贯通镂空部232与框架21相接触。
需要说明的是，在本实施例中，条状支撑板22叠置在条状对位板23上。但是，本申请并不局限于此，在实际应用中，如图5B所示，条状对位板23叠置在条状支撑板22上。这同样可以将所有焊点 221均暴露出来。
请参阅图6，本申请的实施例提供的掩膜装置结构在上述各个实施例的基础上有所改进。具体地，掩膜装置包括框架31、条状对位板33和条状支撑板32，其中，框架31为矩形体。条状对位板33中设置有镂空部332，且该条状对位板33固定在框架31上。在实际应用中，条状对位板33可以采用焊接的方式固定在框架31上。
条状支撑板32与条状对位板33相互交叉，并且在条状支撑板32的与框架31相对的表面上设置有多个焊点321，多个焊点321通过镂空部332与框架31焊接固定。在本实施例中，条状支撑板32的端部32a自条状对位板33的框架31所在一侧经由镂空部332延伸至条状对位板33的背离框架31的一侧，以使多个焊点321均与框架31相接触，即，条状支撑板32采用上述图4所示的实施例的方式进行设置。当然，条状支撑板32还可以采用上述其他实施例的方式进行设置。
在本实施例中，掩膜装置包括多个条状支撑板32，且多个条状支撑板32相互平行，并间隔排布，从而能够起到更稳固地支撑作用。
在本实施例中，掩膜装置还包括多个条状掩膜板34，每个条状掩膜板34上设有开口341。在进行沉积工艺时，沉积材料通过开口341沉积在玻璃基板上，最终在玻璃基板上形成图形。
在本实施例中，掩膜装置包括两个条状对位板33，这两个条状对位板33相互平行；并且，掩膜装置还包括多个条状遮挡板35，多个条状遮挡板35的每个均位于两个相邻的条状对位板34之间，且与条状对位板34相互平行，并且多个条状遮挡板35间隔排布。在每两个相邻的条状遮挡板35之间设置一个条状掩膜板34，从而使多个条状掩膜板34上的开口341呈矩阵排布。
综上所述，本申请上述各个实施例提供的掩膜装置，其在条状对位板中设置有镂空部。借助该镂空部，可以使条状支撑板上的所有焊点均暴露出来，而不会被条状对位板遮挡。当需要对焊点进行修复时，无需撕除条状对位板，从而可以避免条状对位板材料的浪费，同时可以避免条状对位板的对位基准发生改变，从而避免给后续的对位 工作带来困难。
作为另一个技术方案，本申请实施例还提供一种蒸镀***，用于薄膜的蒸镀，例如有机薄膜的蒸镀。该蒸镀***包括本申请上述各个实施例提供的掩膜装置。
作为另一个技术方案，本申请还提供一种掩膜装置的制作方法，其包括：
提供框架；
提供条状对位板，且在该条状对位板中形成镂空部；
提供条状支撑板，且使该条状支撑板与条状对位板相互交叉，并且在条状支撑板的与框架相对的表面上形成有多个焊点，条状支撑板对应镂空部的区域内形成有多个焊点。
在相关技术中，掩膜装置的制作方法是先将条状支撑板焊接在框架上，后将条状对位板焊接在框架上。但是，这在实际应用中会存在这样的问题：如图1所示，在条状对位板13与条状支撑板12的交叉处，条状对位板13会遮挡条状支撑板12的部分焊点121，这使得条状支撑板12的焊接牢固性降低。而且，当需要对焊点121进行修复时，需要先撕除条状对位板13，导致条状对位板材料的浪费。另外，重新焊接条状对位板13会导致条状对位板13的对位基准改变，从而给后续的对位工作带来困难。
为了解决上述问题，如图2所示，本申请提供的掩膜装置的制作方法是预先在条状对位板23中形成镂空部232，并首先将条状对位板23焊接在框架21上。然后再将条状支撑板22焊接在框架21上。
借助该镂空部232，可以使条状支撑板22上的所有焊点221均暴露出来，而不会被条状对位板23遮挡，当需要对焊点进行修复时，无需撕除条状对位板23，从而可以避免条状对位板材料的浪费，同时可以避免条状对位板23的对位基准发生改变，从而避免给后续的对位工作带来困难。
可以理解的是，以上实施方式仅仅是为了说明本申请的原理而采用的示例性实施方式，然而本申请并不局限于此。对于本领域内的 普通技术人员而言，在不脱离本申请的实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本申请的保护范围。

Claims (20)

  1. 一种掩膜装置，包括框架、至少两个对位板和至少一个支撑板，其中，
    在所述至少两个对位板中的每个对位板中设置有镂空部，且所述至少两个对位板固定在所述框架上；以及
    所述至少一个支撑板与相对应的对位板相互交叉，并且在所述至少一个支撑板与所述框架相对的表面上对应所述镂空部的区域内设置至少一个焊点以与所述框架焊接固定。
  2. 根据权利要求1所述的掩膜装置，其中，所述至少两个对位板和所述至少一个支撑板为条状，所述至少两个对位板位于所述框架的两侧。
  3. 根据权利要求2所述的掩膜装置，其中，所述至少一个支撑板中的每个支撑板包括相对的两个端部，以及
    所述每个支撑板的两个端部中的至少一个端部自相对应的所述对位板背离所述框架的一侧经由所述镂空部延伸至所述对位板的所述框架所在一侧；所述至少一个焊点均设置在所述至少一个端部。
  4. 根据权利要求2所述的掩膜装置，其中，所述至少一个支撑板中的每个支撑板包括相对的两个端部，以及
    所述每个支撑板的两个端部中的至少一个端部自相对应的所述对位板的所述框架所在一侧经由所述镂空部延伸至所述对位板的背离所述框架的一侧；所述至少一个焊点均设置在所述至少一个端部。
  5. 根据权利要求2所述的掩膜装置，其中，所述每个支撑板叠置在相对应的所述对位板背离所述框架的一侧。
  6. 根据权利要求2所述的掩膜装置，其中，所述每个支撑板叠 置在相对应的所述对位板朝向所述框架的一侧。
  7. 根据权利要求1-6任意一项所述的掩膜装置，其中，所述每个对位板的镂空部设置为沿所述对位板的厚度方向设置的通孔。
  8. 根据权利要求5或6所述的掩膜装置，其中，所述每个对位板的镂空部包括设置于所述对位板上的凹槽，所述凹槽的开口朝向垂直于所述对位板的延伸方向，且朝向相对应的所述支撑板的端部。
  9. 根据权利要求1-6任意一项所述的掩膜装置，其中，至少一个支撑板相互平行，并间隔排布。
  10. 根据权利要求1-6任意一项所述的掩膜装置，其中，多个所述焊点在垂直于所述支撑板的长度方向上排成至少一排，同一排中的多个所述焊点沿平行于所述支撑板的长度方向间隔排布。
  11. 根据权利要求1-8任意一项所述的掩膜装置，其中，在所述对位板中设置有定位孔。
  12. 根据权利要求1-8任意一项所述的掩膜装置，包括两个相互平行的对位板；所述掩膜装置还包括至少一个条状遮挡板，至少一个条状遮挡板中的每一个均位于两个对位板之间，且与所述对位板相互平行，并且至少一个所述条状遮挡板间隔排布。
  13. 根据权利要求12所述的掩膜装置，还包括至少一个条状掩膜板和至少两个条状遮挡板，且在每相邻的两个条状遮挡板之间设置一个所述条状掩膜板；并且，在每个所述条状掩膜板上设置有开口。
  14. 一种蒸镀***，用于薄膜的蒸镀，包括权利要求1-13任意一项所述的掩膜装置。
  15. 一种掩膜装置的制作方法，包括：
    提供框架；
    提供至少两个对位板以在所述至少两个对位板中形成镂空部，所述至少两个对位板固定在所述框架上；
    提供与所述至少两个对位板相对应的至少一个支撑板，且使所述至少一个支撑板中的每个支撑板与相对应的对位板相互交叉，并且在所述支撑板的与所述框架相对的表面上对应所述镂空部的区域内形成有至少一个焊点以与所述框架焊接固定。
  16. 根据权利要求15所述的掩膜装置的制作方法，其中，提供与所述至少两个对位板相对应的至少一个支撑板的步骤包括将所述至少一个支撑板中的每个支撑板的端部自相对应的对位板背离所述框架的一侧经由该对位板的镂空部延伸至该对位板的所述框架所在一侧，并且将所述至少一个焊点均设置在所述端部。
  17. 根据权利要求15所述的掩膜装置的制作方法，其中，提供与所述至少两个对位板相对应的至少一个支撑板的步骤包括将所述至少一个支撑板中的每个支撑板的端部自相对应的对位板的所述框架所在一侧经由该对位板的镂空部延伸至该对位板的背离所述框架的一侧，并且将所述至少一个焊点均设置在所述端部。
  18. 根据权利要求15所述的掩膜装置的制作方法，其中，提供与所述至少两个对位板相对应的至少一个支撑板的步骤包括将所述至少一个支撑板中的每个支撑板叠置在相对应的对位板背离所述框架的一侧。
  19. 根据权利要求15所述的掩膜装置的制作方法，其中，提供与所述至少两个对位板相对应的至少一个支撑板的步骤包括将所述至少一个支撑板中的每个支撑板叠置在相对应的对位板朝向所述框 架的一侧。
  20. 根据权利要求18或19所述的掩膜装置的制作方法，其中，提供至少两个对位板以在所述至少两个对位板中形成镂空部包括在所述至少两个对位板上设置凹槽以使得所述凹槽的开口朝向垂直于所述对位板的延伸方向，且朝向支撑板的端部。
PCT/CN2019/073152 2018-03-22 2019-01-25 掩膜装置及其制作方法、蒸镀*** WO2019179239A1 (zh)

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