WO2018198457A1 - 生体センサ用積層体および生体センサ - Google Patents

生体センサ用積層体および生体センサ Download PDF

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Publication number
WO2018198457A1
WO2018198457A1 PCT/JP2018/002670 JP2018002670W WO2018198457A1 WO 2018198457 A1 WO2018198457 A1 WO 2018198457A1 JP 2018002670 W JP2018002670 W JP 2018002670W WO 2018198457 A1 WO2018198457 A1 WO 2018198457A1
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WO
WIPO (PCT)
Prior art keywords
pressure
layer
base material
probe
sensitive adhesive
Prior art date
Application number
PCT/JP2018/002670
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English (en)
French (fr)
Japanese (ja)
Inventor
良真 吉岡
豊田　英志
敬史 竹村
森　重恭
Original Assignee
日東電工株式会社
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Publication of WO2018198457A1 publication Critical patent/WO2018198457A1/ja

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/05—Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fields; Measuring using microwaves or radio waves 
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
    • A61B5/291—Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/316—Modalities, i.e. specific diagnostic methods
    • A61B5/318—Heart-related electrical modalities, e.g. electrocardiography [ECG]
    • A61B5/332—Portable devices specially adapted therefor

Definitions

  • the present invention relates to a biosensor laminate and a biosensor.
  • a wearable device As a biosensor, a wearable device has been proposed in which a printed circuit board including a flexible insulating layer and a conductive pattern embedded in an upper portion of the insulating layer is attached to a user's skin. (For example, refer to Patent Document 1).
  • the conductor pattern includes a wiring and two terminals continuous at both ends thereof, and a memory and a sensor are mounted on each of the two terminals.
  • the present invention provides a biosensor laminate and a biosensor capable of preventing a short circuit through a living body surface.
  • the present invention (1) includes a pressure-sensitive adhesive layer for application to the surface of a living body, a base layer having elasticity that is disposed on the top surface of the pressure-sensitive adhesive layer, and a wiring layer disposed on the base layer.
  • the probe embedded in the pressure-sensitive adhesive layer so as to be exposed from the lower surface of the pressure-sensitive adhesive layer, and electrically connecting the wiring layer and the probe so as to pass through the pressure-sensitive adhesive layer.
  • a biosensor laminate comprising a connection portion for connection.
  • the probe since the probe is exposed from the lower surface of the pressure-sensitive adhesive layer, if the lower surface of the pressure-sensitive adhesive layer is attached to the living body surface, the probe can contact the living body surface and sense the living body. can do.
  • the wiring layer is disposed on the base material layer disposed on the upper surface of the pressure-sensitive adhesive layer, that is, disposed on the base material layer disposed on the opposite side of the pressure-sensitive adhesive layer from the side where the probe is embedded. Yes. Therefore, the wiring layer can prevent contact with the surface of the living body. As a result, the wiring layer can prevent a short circuit through the living body surface.
  • the present invention (2) includes the biosensor laminate according to (1), wherein at least a part of the wiring layer is embedded in the base material layer.
  • the wiring layer is embedded in the base material layer, so that the thickness can be reduced.
  • the present invention (3) includes the biosensor laminate according to (1) or (2), wherein the material of the pressure-sensitive adhesive layer has biocompatibility.
  • the material of the pressure-sensitive adhesive layer has biocompatibility, the load on the living body can be suppressed.
  • the present invention (4) includes the biosensor laminate according to any one of (1) to (3), wherein the material of the base material layer is a polyurethane resin.
  • the material of the base material layer is a polyurethane resin
  • the base material layer has excellent stretchability. Therefore, the sticking feeling of the living body (feeling that the living body is sticking. Wearing feeling) can be reduced.
  • the present invention (5) is mounted on the base material layer so as to be electrically connected to the biosensor laminate according to any one of (1) to (4) and the wiring layer.
  • a biosensor including an electronic component.
  • this biosensor includes the above-described laminated body for biosensors, reliable sensing can be performed.
  • the laminate for a biosensor and the biosensor of the present invention can reliably sense a living body.
  • FIG. 1 shows the top view of one Embodiment of the laminated body for biosensors of this invention.
  • 2A and 2B are cross-sectional views of the biosensor laminate shown in FIG. 1.
  • FIG. 2A is a cross-sectional view taken along the line AA
  • FIG. 2B is a cross-sectional view taken along the line BB.
  • 3A to 3D are manufacturing process diagrams of the biosensor laminate shown in FIG. 2A.
  • FIG. 3A is a process for preparing a base material layer and a wiring layer
  • FIG. 3B is a pressure-sensitive adhesive layer and a base material layer.
  • 3C shows a step of forming an opening and preparing a probe member
  • FIG. 3D shows a step of fitting the probe member into the opening, and a step of forming a connection portion.
  • FIG. 4 is a perspective view of the probe-containing sheet as viewed from below, and shows a perspective view in which a part of the second release sheet is cut out.
  • FIG. 5 is a perspective view for explaining a manufacturing process of the probe member.
  • An upper side view is a perspective view seen from the lower side.
  • a lower side view shows a perspective view seen from the upper side.
  • 6A to 6C are exploded perspective views of the probe member.
  • FIG. 6A shows the probe member
  • FIG. 6B shows the connection portion
  • FIG. 6C shows the opening at one end portion in the longitudinal direction of the biosensor laminate.
  • FIG. 7A to 7D are cross-sectional views of a biosensor laminate according to a modification of one embodiment.
  • FIG. 7A shows an embodiment in which the lower part of the wiring layer is embedded in the base material layer, and FIG. A mode in which the wiring layer is not exposed from the base material layer without being embedded in the material layer,
  • FIG. 7C is a mode in which the wiring layer is embedded in the base material layer, FIG. The aspect embedded in a base material layer so that it may be exposed from the base material lower surface is shown.
  • FIG. 8 shows a cross-sectional view of a biosensor laminate (an embodiment in which an upper portion of a probe is embedded in a pressure-sensitive adhesive layer) according to a modification of one embodiment.
  • FIG. 8 shows a cross-sectional view of a biosensor laminate (an embodiment in which an upper portion of a probe is embedded in a pressure-sensitive adhesive layer) according to a modification of one embodiment.
  • FIG. 9 is a cross-sectional view of a biosensor laminate (probe is substantially plate-shaped) according to a modification of the embodiment.
  • FIG. 10 is a cross-sectional view of a biosensor laminate (probe having a solid columnar shape) according to a modification of the embodiment.
  • FIG. 11 is a plan view of a biosensor laminate (a connection portion is substantially a rod (needle) column shape) according to a modified example of the embodiment.
  • FIG. 12 is a cross-sectional view taken along line AA of the biosensor laminate shown in FIG.
  • FIG. 13 is a cross-sectional view of a biosensor laminate (a connection portion is a substantially rod (needle) shape and a probe is a substantially plate shape) according to a modification of one embodiment.
  • FIG. 14A and 14B are further modifications of the biosensor laminate shown in FIG. 12, in which FIG. 14A is an embodiment in which a conductive pressure-sensitive adhesive layer is provided on the lower surface of the probe, and FIG. 14B is a pressure-sensitive strong adhesive layer as a probe. The aspect provided in this hole is shown.
  • FIG. 15 shows the top view of the laminated body for biosensors (mode which a probe and a connection part are integrated) of the modification of one Embodiment.
  • FIG. 16 is a cross-sectional view taken along line AA of the biosensor laminate shown in FIG. 17A and 17B show a modification in which the probe is larger than the connection portion, FIG. 17A is a sectional view, and FIG. 17B is an enlarged perspective view of the probe and the connection portion shown in FIG. 17A.
  • a biosensor laminate 1 as an embodiment of the biosensor laminate of the present invention will be described with reference to FIGS. 1 to 6C.
  • the horizontal direction on the paper surface is the longitudinal direction (first direction) of the biosensor laminate 1.
  • the right side of the drawing is one side in the longitudinal direction (one side in the first direction), and the left side of the drawing is the other side in the longitudinal direction (the other side in the first direction).
  • the up and down direction on the paper surface is the short direction (the direction perpendicular to the longitudinal direction, the width direction, and the second direction perpendicular to the first direction) of the biosensor laminate 1.
  • the upper side of the drawing is one side in the short direction (one side in the width direction, one side in the second direction), and the lower side of the drawing is the other side in the short direction (the other side in the width direction, the other side in the second direction).
  • the paper thickness direction is the vertical direction of the biosensor laminate 1 (thickness direction, third direction orthogonal to the first direction and the second direction).
  • the front side of the paper is the upper side (one side in the thickness direction, the one side in the third direction), and the back side of the paper is the lower side (the other side in the thickness direction, the other side in the third direction).
  • the direction conforms to the direction arrow described in each drawing.
  • the biosensor laminate 1 has a substantially flat plate shape extending in the longitudinal direction.
  • the biosensor laminate 1 includes a pressure-sensitive adhesive layer 2, a base material layer 3 disposed on the top surface of the pressure-sensitive adhesive layer 2, a wiring layer 4 disposed on the base material layer 3, and a pressure-sensitive adhesive layer 2.
  • the probe 5 embedded in the pressure-sensitive adhesive layer 2 and the connection part 6 that electrically connects the wiring layer 4 and the probe 5 are provided so as to be exposed from the adhesive lower surface 9 as an example of the lower surface of the electrode.
  • the pressure-sensitive adhesive layer 2 forms the lower surface of the biosensor laminate 1.
  • the pressure-sensitive adhesive layer 2 is a layer that imparts pressure-sensitive adhesiveness to the lower surface of the biosensor laminate 1 in order to attach the lower surface of the biosensor laminate 1 to the living body surface (skin 33 or the like). .
  • the pressure-sensitive adhesive layer 2 forms the outer shape of the biosensor laminate 1.
  • the pressure sensitive adhesive layer 2 has a flat plate shape extending in the longitudinal direction. Specifically, for example, the pressure-sensitive adhesive layer 2 has a strip shape extending in the longitudinal direction, and has a shape in which the center portion in the longitudinal direction swells toward both outer sides in the lateral direction. Further, in the pressure-sensitive adhesive layer 2, both ends in the short direction of the central portion in the longitudinal direction are located on both outer sides in the short direction with respect to both ends in the short direction other than the central portion in the longitudinal direction.
  • the pressure-sensitive adhesive layer 2 has an adhesive upper surface 8 as an example of an upper surface and an adhesive lower surface 9.
  • the adhesive upper surface 8 is a flat surface.
  • the adhesive lower surface 9 is disposed to face the lower side of the adhesive upper surface 8 with a gap.
  • the pressure-sensitive adhesive layer 2 has two adhesive openings 11 at both ends in the longitudinal direction.
  • Each of the two bonding openings 11 has a substantially ring shape in plan view.
  • the adhesive opening 11 penetrates the thickness direction of the pressure-sensitive adhesive layer 2.
  • the bonding opening 11 is filled with the connecting portion 6.
  • the adhesive lower surface 9 inside the adhesive opening 11 has an adhesive groove 10 corresponding to the probe 5 (described later).
  • the adhesive groove 10 is opened downward.
  • the material of the pressure-sensitive adhesive layer 2 is not particularly limited as long as it is a material having pressure-sensitive adhesiveness, and preferably includes a material having biocompatibility.
  • examples of such materials include acrylic pressure sensitive adhesives and silicone pressure sensitive adhesives.
  • an acrylic pressure sensitive adhesive is used.
  • the acrylic pressure-sensitive adhesive include acrylic polymers described in JP-A-2003-325441.
  • the keratin peeling area ratio is, for example, 50% or less, preferably 30% or less, more preferably 15% or less, and for example, 0% or more. is there. If the stratum corneum peeling area ratio is equal to or less than the above upper limit, even if the pressure-sensitive adhesive layer 2 is adhered to a living body, the load on the living body can be suppressed. That is, the material of the pressure-sensitive adhesive layer 2 can have excellent biocompatibility.
  • the stratum corneum peeling test is measured by the method described in JP-A-2004-83425.
  • the moisture permeability of the pressure-sensitive adhesive layer 2 is, for example, 300 (g / m 2 / day) or more, preferably 600 (g / m 2 / day) or more, and more preferably 1000 (g / m 2 / day). That's it.
  • the moisture permeability of the pressure-sensitive adhesive layer 2 is equal to or higher than the lower limit described above, even if the pressure-sensitive adhesive layer 2 is attached to a living body, the load on the living body can be suppressed. That is, the material of the pressure-sensitive adhesive layer 2 can have excellent biocompatibility.
  • the material of the pressure-sensitive adhesive layer 2 is biocompatible.
  • the thickness of the pressure-sensitive adhesive layer 2 is, for example, 10 ⁇ m or more, preferably 20 ⁇ m or more, and, for example, less than 100 ⁇ m, preferably as the distance between the adhesive upper surface 8 and the adhesive lower surface 9 in the region other than the adhesive groove 10. 50 ⁇ m or less.
  • the base material layer 3 forms the upper surface of the biosensor laminate 1.
  • the base material layer 3 forms the outer shape of the biosensor laminate 1 together with the pressure-sensitive adhesive layer 2.
  • the planar view shape of the base material layer 3 is the same as the planar view shape of the pressure-sensitive adhesive layer 2.
  • the base material layer 3 is disposed on the entire upper surface of the pressure-sensitive adhesive layer 2 (however, excluding the region where the connection portion 6 is provided).
  • the base material layer 3 is a support layer that supports the pressure-sensitive adhesive layer 2.
  • the base material layer 3 has a flat plate shape extending in the longitudinal direction.
  • the substrate layer 3 has a substrate lower surface 12 and a substrate upper surface 13 as an example of the upper surface.
  • the base material lower surface 12 is a flat surface.
  • the base material lower surface 12 is in contact (pressure-sensitive adhesion) with the adhesive upper surface 8 of the pressure-sensitive adhesive layer 2.
  • the base material upper surface 13 is disposed to face the upper surface of the base material lower surface 12 with a gap.
  • the base material upper surface 13 has a base material groove 14 corresponding to the wiring layer 4.
  • the substrate groove 14 has the same pattern shape as the wiring layer 4 in plan view.
  • the base material groove 14 is opened upward.
  • the base material layer 3 has a base material opening 15 corresponding to the adhesive opening 11.
  • the base material opening 15 communicates with the bonding opening 11 in the thickness direction.
  • the base material opening 15 has a substantially ring shape in plan view having the same shape and the same dimensions as the bonding opening 11.
  • the material of the base material layer 3 has stretchability. Moreover, the material of the base material layer 3 has an insulating layer, for example.
  • An example of such a material is a resin.
  • the resin include thermoplastic resins such as polyurethane resins, silicone resins, acrylic resins, polystyrene resins, vinyl chloride resins, and polyester resins.
  • the material of the base material layer 3 is preferably a polyurethane resin.
  • the breaking elongation of the base material layer 3 is, for example, 100% or more, preferably 200% or more, more preferably 300% or more, and for example, 2000% or less. If the breaking elongation is not less than the above lower limit, the material of the base material layer 3 can have excellent stretchability.
  • the elongation at break is measured according to JIS K 7127 (1999) with a tensile rate of 5 mm / min and a test piece type 2.
  • the tensile strength at 20 ° C. of the base material layer 3 (100 mm between chucks, tensile speed 300 mm / min, strength at break) is, for example, 0.1 N / 20 mm or more, preferably 1 N / 20 mm or more. For example, it is 20 N / 20 mm or less.
  • the tensile strength is JIS Measured based on K 7127 (1999).
  • the tensile storage elastic modulus E ′ at 20 ° C. of the base material layer 3 is, for example, 2,000 MPa or less, preferably 1,000 MPa or less, more preferably 100 MPa or less, still more preferably 50 MPa or less, particularly preferably. , 20 MPa or less, and for example, 0.1 MPa or more. If the tensile storage elastic modulus E ′ of the base material layer 3 is not more than the above upper limit, the material of the base material layer 3 can have excellent stretchability.
  • the tensile storage elastic modulus E ′ at 20 ° C. of the base material layer 3 is obtained by measuring the dynamic viscoelasticity of the base material layer 3 under the conditions of a frequency of 1 Hz and a temperature increase rate of 10 ° C./min.
  • the elongation at break is 100% or more
  • the tensile strength is 20 N / 20 mm or less
  • the tensile storage elastic modulus E ′ is at least one requirement of 2,000 MPa or less, preferably 2 If one or more requirements, more preferably all three requirements are satisfied, the material of the base material layer 3 has elasticity.
  • the thickness of the base material layer 3 is, for example, 1 ⁇ m or more, preferably 5 ⁇ m or more, for example, 300 ⁇ m or less, as the distance between the base material lower surface 12 and the base material upper surface 13 in the region other than the base material groove 14. Preferably, it is 10 ⁇ m or less.
  • the wiring layer 4 is embedded in the base material groove 14. Specifically, the wiring layer 4 is embedded in the upper part of the base material layer 3 so as to be exposed from the base material upper surface 13 of the base material layer 3.
  • the wiring layer 4 has an upper surface and a lower surface that are spaced apart from each other, and a side surface that connects their peripheral edges. All of the lower surface and all of the side surfaces are in contact with the base material layer 3.
  • the upper surface is exposed from the substrate upper surface 13 (excluding the substrate groove 14).
  • the upper surface of the wiring layer 4 forms the upper surface of the biosensor laminate 1 together with the substrate upper surface 13.
  • the wiring layer 4 has a wiring pattern for connecting the connecting portion 6 to an electronic component 31 (described later) and a battery 32 (described later). Specifically, the wiring layer 4 includes a first wiring pattern 41 and a second wiring pattern 42 independently.
  • the first wiring pattern 41 is arranged on one side in the longitudinal direction of the base material layer 3.
  • the first wiring pattern 41 includes a first wiring 16A, and a first terminal 17A and a second terminal 17B continuous thereto.
  • the first wiring pattern 41 has a substantially T shape in plan view. Specifically, the first wiring pattern 41 extends from one end of the base material layer 3 in the longitudinal direction (the connecting portion 6) to the other side in the longitudinal direction, and branches at the center in the longitudinal direction of the base material layer 3. , Extending toward both outer sides in the short direction.
  • Each of the first terminal 17A and the second terminal 17B is disposed at each of both ends of the base layer 3 in the longitudinal direction center.
  • Each of the first terminal 17A and the second terminal 17B has a substantially rectangular shape (land shape) in plan view.
  • Each of the first terminal 17A and the second terminal 17B is continuous with both end portions of the first wiring 16A extending outward in the lateral direction at the center portion in the longitudinal direction of the base material layer 3.
  • the second wiring pattern 42 is provided on the other side in the longitudinal direction of the first wiring pattern 41 with an interval.
  • the second wiring pattern 42 includes a second wiring 16B, and a third terminal 17C and a fourth terminal 17D continuous thereto.
  • the second wiring pattern 42 has a substantially T shape in plan view. Specifically, the second wiring pattern 42 extends from the other end portion in the longitudinal direction of the base material layer 3 (the connection portion 6 located in the longitudinal direction) to one side in the longitudinal direction, and branches at the central portion in the longitudinal direction of the base material layer 3. Extending toward the outside in the lateral direction.
  • Each of the 3rd terminal 17C and the 4th terminal 17D is arranged in each of both ends of the transversal direction in the longitudinal direction central part of base material layer 3.
  • Each of the third terminal 17C and the fourth terminal 17D has a substantially rectangular shape (land shape) in plan view.
  • Each of the third terminal 17C and the fourth terminal 17D is continuous with each of both end portions of the second wiring 16B extending outward in the lateral direction at the center portion in the longitudinal direction of the base material layer 3.
  • Examples of the material of the wiring layer 4 include conductors such as copper, nickel, gold, and alloys thereof.
  • the material of the wiring layer 4 is preferably copper.
  • the thickness of the wiring layer 4 is, for example, 0.1 ⁇ m or more, preferably 1 ⁇ m or more, and for example, 100 ⁇ m or less, preferably 5 ⁇ m or less.
  • the probe 5 is an electrode that, when the pressure-sensitive adhesive layer 2 is attached to the surface of a living body, comes into contact with the surface of the living body and senses an electrical signal, temperature, vibration, sweat, metabolites, and the like from the living body.
  • the probe 5 is embedded in the adhesive groove 10 in the pressure-sensitive adhesive layer 2 inside the adhesive opening 11. That is, the probe 5 is embedded in the lower end portion of the pressure-sensitive adhesive layer 2 inside the adhesive opening 11.
  • the probe 5 has a substantially grid shape (or substantially mesh shape) in plan view. In other words, the probe 5 has holes that are spaced from each other in the surface direction (longitudinal direction and short direction). The hole is filled with the pressure-sensitive adhesive layer 2.
  • the probe 5 has a substantially rectangular shape in a cross-sectional view orthogonal to the direction in which the probe 5 extends.
  • the probe 5 includes a probe lower surface 20, a probe upper surface 21 that is disposed opposite to the probe lower surface 20 with a space therebetween, and a side surface that connects the probe lower surface 20 and the peripheral edge of the probe upper surface 21.
  • the probe lower surface 20 is exposed from the adhesive lower surface 9 (excluding the adhesive groove 10) of the pressure-sensitive adhesive layer 2.
  • the probe lower surface 20 is flush with the adhesive lower surface 9.
  • the probe lower surface 20 forms the lower surface of the biosensor laminate 1 together with the adhesive lower surface 9.
  • the probe upper surface 21 is covered with the pressure-sensitive adhesive layer 2.
  • the outermost surface of the side surfaces of the probe 5 is the outer surface 22.
  • the outer side surface 22 forms a virtual circle that passes through the outer side surface 22 in plan view.
  • Examples of the material of the probe 5 include the materials exemplified in the wiring layer 4 (specifically, conductors).
  • the external dimensions of the probe 5 are set so that the virtual circle passing through the outer surface 22 overlaps the inner peripheral surface defining the bonding opening 11 in plan view.
  • the thickness of the probe 5 is, for example, 0.1 ⁇ m or more, preferably 1 ⁇ m or more, and for example, less than 100 ⁇ m, preferably 75 ⁇ m or less.
  • connection part 6 is provided corresponding to the base material opening part 15 and the adhesion
  • the connection part 6 penetrates (passes) the base material layer 3 and the pressure-sensitive adhesive layer 2 in the thickness direction (vertical direction), and is filled in the base material opening 15 and the adhesive opening 11.
  • the connecting portion 6 has an endless shape in plan view along the outer surface 22 of the probe 5. Specifically, the connecting portion 6 has a substantially cylindrical shape whose axis extends in the thickness direction (along a virtual circle passing through the outer surface 22).
  • the inner surface of the connecting portion 6 is in contact with the outer surface 22 of the probe 5.
  • the connecting portion 6 is pressure-sensitively bonded to the pressure-sensitive adhesive layer 2 outside the adhesive opening 11 and the pressure-sensitive adhesive layer 2 inside the adhesive opening 11.
  • the upper surface of the connecting portion 6 is flush with the upper surface 13 of the base material.
  • the lower surface of the connecting portion 6 is flush with the adhesive lower surface 9.
  • connection portion 6 located on one side in the longitudinal direction is continuous with one end edge in the longitudinal direction of the first wiring 16 ⁇ / b> A located on one side in the longitudinal direction at the upper end portion.
  • connection portion 6 located on the other side in the longitudinal direction is continuous with the other end in the longitudinal direction of the wiring 16B located on the other side in the longitudinal direction at the upper end thereof.
  • connection part 6 electrically connects the wiring layer 4 and the probe 5.
  • Examples of the material of the connecting portion 6 include metals, conductive resins (including conductive polymers), and preferably include conductive resins.
  • the thickness (vertical length) of the connecting portion 6 is the same as the total thickness of the base material layer 3 and the pressure-sensitive adhesive layer 2.
  • the length in the radial direction of the connecting portion 6 (half value of the value obtained by subtracting the inner diameter from the outer diameter) is, for example, 1 ⁇ m or more, preferably 100 ⁇ m or more, and for example, 1000 ⁇ m or less, preferably 500 ⁇ m or less.
  • a base material layer 3 and a wiring layer 4 are prepared.
  • the base material layer 3 and the wiring layer 4 are prepared so that the wiring layer 4 is embedded in the base material groove 14 by a method described in Japanese Patent Application Laid-Open Nos. 2017-2222236 and 2017-22237.
  • the pressure-sensitive adhesive layer 2 is arranged on the lower surface 12 of the base material.
  • the pressure-sensitive adhesive layer 2 In order to arrange the pressure-sensitive adhesive layer 2 on the lower surface 12 of the substrate, for example, first, a coating liquid containing the material of the pressure-sensitive adhesive layer 2 is prepared, and then the coating liquid is applied to the upper surface of the first release sheet 19. It is applied and then dried by heating. Thereby, the pressure-sensitive adhesive layer 2 is disposed on the upper surface of the first release sheet 19.
  • the first release sheet 19 has, for example, a substantially flat plate shape that extends in the longitudinal direction. Examples of the material of the first release sheet 19 include resins such as polyethylene terephthalate.
  • the pressure-sensitive adhesive layer 2 and the base material layer 3 are bonded together by, for example, a laminator. Specifically, the adhesion upper surface 8 of the pressure-sensitive adhesive layer 2 and the substrate lower surface 12 of the substrate layer 3 are brought into contact with each other.
  • the base material layer 3 and the pressure-sensitive adhesive layer 2 do not have the base material opening 15 and the adhesive opening 11, respectively.
  • the opening 23 is formed in the base material layer 3 and the pressure-sensitive adhesive layer 2.
  • the opening 23 penetrates the base material layer 3 and the pressure-sensitive adhesive layer 2.
  • the opening 23 is a substantially circular hole (through hole) in plan view defined by an outer peripheral surface that defines the base material opening 15 and an outer peripheral surface that defines the bonding opening 11.
  • the opening 23 is opened upward.
  • the lower end of the opening 23 is closed by the first release sheet 19.
  • the pressure-sensitive adhesive layer 2 and the base material layer 3 are punched and half-etched, for example.
  • the probe member 18 is prepared and fitted into the opening 23.
  • a probe-containing sheet 26 is prepared as shown in FIG.
  • the probe-containing sheet 26 includes a second release sheet 29, a probe pattern 25 formed on the second release sheet 29, and a pressure-sensitive adhesive layer 2 formed on the second release sheet 29 to embed the probe pattern 25. And a base material layer 3 disposed on the adhesive upper surface 8 of the pressure-sensitive adhesive layer 2.
  • the second release sheet 29 has the same configuration as the first release sheet 19 described above.
  • the probe pattern 25 has the same pattern shape as the probe 5, and the material of the probe pattern 25 is the same as the material of the probe 5.
  • the probe pattern 25 has a larger plane area than the virtual circle that passes through the outer surface 22 of the probe 5.
  • Each of the pressure-sensitive adhesive layer 2 and the base material layer 3 in the probe-containing sheet 26 has the same configuration as each of the pressure-sensitive adhesive layer 2 and the base material layer 3 described above.
  • the probe-containing sheet 26 is prepared by a method described in, for example, Japanese Patent Application Laid-Open No. 2017-22236 and Japanese Patent Application Laid-Open No. 2017-22237.
  • a photoresist is laminated on the entire upper surface of the seed layer.
  • the photoresist is exposed and developed to form a photoresist in the reverse pattern of the probe pattern 25.
  • the photoresist is removed.
  • a coating solution containing the material for the pressure-sensitive adhesive layer 2 is applied so as to cover the probe pattern 25 and cured to form the pressure-sensitive adhesive layer 2.
  • the base material layer 3 is bonded to the upper surface of the pressure-sensitive adhesive layer 2 using, for example, a laminator.
  • the second release sheet 29 has the same configuration as the first release sheet 19 described above.
  • the cutting line 27 is formed in the probe pattern 25, the pressure-sensitive adhesive layer 2, and the base material layer 3 in a substantially circular shape in plan view.
  • the cutting line 27 is formed by, for example, punching.
  • the cutting line 27 divides the probe pattern 25, the pressure-sensitive adhesive layer 2 and the base material layer 3 into and out of the probe pattern 25, but is not formed on the second release sheet 29.
  • the dimension of the cutting line 27 is the same as the inner diameter of the bonding opening 11 and the base material opening 15. That is, the cutting line 27 coincides with a virtual circle that passes through the outer surface 22.
  • the probe member 18 is formed by forming the cutting line 27.
  • the outer surface 22 of the probe 5 is flush with the outer surface of the pressure-sensitive adhesive layer 2. In the probe member 18, the outer surface 22 is exposed radially outward from the outer surface of the pressure-sensitive adhesive layer 2.
  • the probe member 18 is pulled up from the second release sheet 29. Specifically, the adhesive lower surface 9 and the probe lower surface 20 in the probe member 18 are peeled from the second release sheet 29.
  • the probe member 18 is fitted into the opening 23 as shown by the arrow in FIG. 3C.
  • a space is provided between the pressure-sensitive adhesive layer 2, the base material layer 3 and the probe 5 of the probe member 18 and the pressure-sensitive adhesive layer 2 and the base material layer 3 around the opening 23. That is, the probe member 18 is fitted into the opening 23 so that the base material opening 15 and the bonding opening 11 are formed.
  • the connecting portion 6 is provided in the base material opening 15 and the bonding opening 11.
  • the conductive resin composition is injected (or applied) into the base material opening 15 and the adhesive opening 11. Thereafter, the conductive resin composition is heated as necessary.
  • the biosensor laminate 1 is manufactured.
  • the biosensor laminate 1 includes a pressure-sensitive adhesive layer 2, a base material layer 3, a wiring layer 4, a probe 5, a connection portion 6, and a first release sheet 19, preferably only these Consists of. As shown in FIG. 2A, the biosensor laminate 1 does not include the first release sheet 19, and includes the pressure-sensitive adhesive layer 2, the base material layer 3, the wiring layer 4, the probe 5, and the connection portion. It may consist only of 6.
  • the laminated body 1 for biosensors is a device that can be distributed and used industrially. Specifically, the biosensor laminate 1 can be distributed separately from the electronic component 31 and the battery 32 (see the phantom line in FIG. 1) described below. That is, the biosensor laminate 1 is a component for manufacturing the pasted electrocardiograph 30 without mounting the electronic component 31 and the battery 32.
  • the adhesive electrocardiograph 30 for example, first, the biosensor laminate 1, the electronic component 31, and the battery 32 are prepared.
  • an analog front end for processing and storing an electric signal from a living body acquired by the probe 5, a microcomputer, a memory, and further converting the electric signal into a radio wave, and receiving this externally Examples include a communication IC for wireless transmission to a machine, a transmitter, and the like.
  • the electronic component 31 may have some or all of them.
  • the electronic component 31 has two or three or more terminals (not shown) provided on the lower surface thereof.
  • the battery 32 has two terminals (not shown) provided on the lower surface thereof.
  • the two terminals of the electronic component 31 are electrically connected to the first terminal 17A and the third terminal 17C. Further, the two terminals of the battery 32 are electrically connected to the second terminal 17B and the fourth terminal 17D.
  • the pasted electrocardiograph 30 including the biosensor laminate 1, the electronic component 31 and the battery 32 mounted thereon is manufactured.
  • the first release sheet 19 (see the arrow and the phantom line in FIG. 3D) is peeled from the pressure-sensitive adhesive layer 2 and the probe 5.
  • the adhesive lower surface 9 of the pressure-sensitive adhesive layer 2 is then brought into contact with the human skin 33, for example. Specifically, the pressure-sensitive adhesive layer 2 is pressure-bonded to the surface of the skin 33.
  • the probe lower surface 20 of the probe 5 comes into contact with the surface of the skin 33 by the pressure-sensitive adhesion (sticking) of the adhesion lower surface 9 to the skin 33.
  • the probe 5 senses the cardiac action potential as an electrical signal, and the electrical signal sensed by the probe 5 is input to the electronic component 31 via the connection portion 6 and the wiring layer 4.
  • the electronic component 31 processes an electrical signal based on the power supplied from the battery 32 and stores it as information. Furthermore, if necessary, the electric signal is converted into a radio wave and wirelessly transmitted to an external receiver.
  • the probe 5 is exposed from the adhesive lower surface 9 of the pressure-sensitive adhesive layer 2, and therefore, if the adhesive lower surface 9 of the pressure-sensitive adhesive layer 2 is attached to the skin 33, the probe 5. Can touch the skin 33 and sense the action potential of the heart.
  • the wiring layer 4 is disposed on the base material layer 3 disposed on the adhesion upper surface 8 of the pressure-sensitive adhesive layer 2, that is, disposed on the opposite side (upper side) of the wiring layer 4 to the side where the probe 5 is embedded.
  • the base material layer 3 is disposed. Therefore, the wiring layer 4 can prevent contact with the skin 33. As a result, the wiring layer 4 can prevent a short circuit through the skin 33.
  • biosensor laminate 1 it is possible to reliably sense the action potential of the heart.
  • the wiring layer 4 is embedded in the base material layer 3, so that the thickness can be reduced.
  • the material of the base material layer 3 has biocompatibility, safety to the living body can be improved.
  • the base material layer 3 is excellent in stretchability.
  • this biosensor 30 includes the above-described laminate 1 for biosensors, reliable sensing can be performed.
  • the line passing through the outer surface 22 is circular, but the shape is not particularly limited.
  • the line may be rectangular. Good.
  • the entire side surface of the wiring layer 4 is in contact with the base material layer 3.
  • the lower part of the side surface of the wiring layer 4 is in contact with the base material layer 3, and the upper part of the side surface of the wiring layer 4 is from the base material upper surface 13 of the base material layer 3. Can be exposed. That is, the upper part of the wiring layer 4 protrudes from the upper surface 13 of the base material layer 3 and the lower part of the wiring layer 4 is embedded in the base material layer 3.
  • the entire side surface of the wiring layer 4 can be exposed.
  • the substrate upper surface 13 does not have the substrate groove 14 and is a flat surface.
  • the lower surface of the wiring layer 4 is placed in contact with the substrate upper surface 13. That is, the wiring layer 4 shown in FIG. 7B is not embedded in the base material layer 3 and is disposed on the base material upper surface 13.
  • the wiring layer 4 may be completely embedded in the base material layer 3. That is, the wiring layer 4 is embedded in the base material layer 3. The upper surface, the lower surface, and the side surfaces of the wiring layer 4 are all covered with the base material layer 3. The wiring layer 4 is located between the substrate upper surface 13 and the substrate lower surface 12 in the substrate layer 3.
  • the wiring layer 4 is embedded in the base material layer 3 so as to be exposed from the base material lower surface 12.
  • the lower surface of the wiring layer 4 is flush with the lower surface 12 of the base material and contacts the bonding upper surface 8.
  • the connection portion 6 does not pass through the base material layer 3 but passes only through the pressure-sensitive adhesive layer 2. That is, the connection portion 6 is filled only in the bonding opening 11.
  • first wiring 16A and / or the second wiring 16B may have a planar wave shape.
  • the entire side surface (except the outer surface 22) of the probe 5 is in contact with the pressure-sensitive adhesive layer 2, and the probe lower surface 20 of the probe 5 is connected to the pressure-sensitive adhesive layer 2. It is flush with the adhesive lower surface 9.
  • the upper portion of the side surface (excluding the outer surface 22) of the probe 5 can be in contact with the pressure-sensitive adhesive layer 2 and the lower portion can be exposed from the adhesive lower surface 9.
  • the probe lower surface 20 is positioned below the bonding lower surface 9. That is, only the upper part of the probe 5 is embedded in the pressure-sensitive adhesive layer 2, and the lower part of the probe 5 protrudes downward from the adhesive lower surface 9.
  • the probe 5 does not have a hole and can have a substantially plate shape (specifically, a substantially disk shape) extending in the surface direction.
  • the outer peripheral surface of the probe 5 is in contact with the inner peripheral surface of the lower end portion of the connection portion 6.
  • the probe 5 may have a substantially columnar shape (specifically, a substantially cylindrical shape) that passes through the pressure-sensitive adhesive layer 2 and the base material layer 3.
  • the probe upper surface 21 is exposed from the substrate upper surface 13 of the substrate layer 3 and the upper surface of the connection portion 6.
  • the entire outer peripheral surface of the probe 5 is in contact with the entire inner peripheral surface of the connection portion 6.
  • the connecting portion 6 can also have a substantially bar (round bar) (needle) shape whose axis extends along the thickness direction.
  • the connecting part 6 and the probe 5 are in a point-like contact.
  • the connecting portion 6 has a substantially columnar shape
  • the probe 5 has a substantially plate shape (specifically, a substantially disc shape) that does not have a hole and extends in the surface direction. be able to.
  • a conductive pressure-sensitive adhesive layer 28 can be provided on the lower surface of the probe 5.
  • the conductive pressure-sensitive adhesive layer 28 has a substantially disk shape having the same dimensions as a virtual circle passing through the outer surface 22.
  • the upper surface of the conductive pressure-sensitive adhesive layer 28 is in contact with the probe lower surface 20 and the adhesive lower surface 9 in the virtual circle described above.
  • the conductive pressure-sensitive adhesive layer 28 is provided in order to suppress a decrease in sensing accuracy and noise caused by a difference in moisture content and surface unevenness in the skin 33 depending on a living body (individual), and moisture for adjusting the moisture content in the skin 33. It may have a function of adjusting the amount (or stabilizing the amount of water).
  • the material of the conductive pressure-sensitive adhesive layer 28 may include a conductive material (for example, a hydrophilic compound) having a moisture content adjusting function (or moisture content stabilizing function).
  • the materials include pressure sensitive adhesives such as silicone, acrylic and urethane, and hydrophilic polymers such as polyethylene oxide (PEO), polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP) and polyethylene glycol (PEG).
  • PEO polyethylene oxide
  • PVA polyvinyl alcohol
  • PVP polyvinyl pyrrolidone
  • PEG polyethylene glycol
  • a pressure-sensitive strong adhesive layer 45 may be filled in the hole of the probe 5.
  • the lower surface of the pressure-sensitive strong adhesive layer 45 is flush with the probe lower surface 20 and the adhesive lower surface 9.
  • Examples of the material of the pressure-sensitive strong adhesive layer 45 include pressure-sensitive strong adhesives such as silicone, acrylic, and urethane.
  • the peel peel strength of the pressure sensitive adhesive layer 45 is, for example, 1.5 times or more that of the pressure sensitive adhesive layer 2. Since the probe 5 is firmly fixed to the skin 33 by the pressure-sensitive strong adhesive layer 45, the signal processing accuracy is further improved.
  • the probe 5 and the connecting portion 6 may be integrated.
  • the probe 5 also serves as the connection portion 6.
  • the probe 5 has a solid substantially cylindrical shape.
  • the probe lower surface 20 is exposed from the adhesive lower surface 9.
  • the probe upper surface 21 is exposed from the substrate upper surface 13.
  • One end edge in the longitudinal direction of the first wiring 16A and the other edge in the longitudinal direction of the second wiring 16B are in contact with the upper ends of the two probes 5, respectively.
  • Examples of the material of the probe 5 include the same material as that of the connection portion 6.
  • the connecting portion 6 may be smaller than the probe 5 in plan view.
  • the virtual circle 34 that passes through the outer surface 22 of the probe 5 includes the connection portion 6 and is larger than the connection portion 6 in plan view.
  • the lower end edge of the connecting portion 6 is in contact with a portion in the surface direction of the probe 5 (a portion on the inner side of the outer surface 22).
  • the longitudinal center portion of the biosensor laminate 1 is swollen, but the present invention is not limited to this.
  • the biosensor laminate 1 is long.
  • the central portion in the direction does not swell and may have a substantially rectangular shape in plan view.
  • the patch type electrocardiograph 30 is given as an example of the biosensor of the present invention.
  • the biosensor include a device that can sense a biological signal and monitor the health state of the living body. Examples thereof include an adhesive electroencephalograph, an adhesive blood pressure monitor, an adhesive pulse meter, an adhesive electromyograph, and an adhesive thermometer.
  • the living body includes a human body and animals other than the human body, and is preferably a human body.
  • the said invention was provided as exemplary embodiment of this invention, this is only a mere illustration and should not be interpreted limitedly. Variations of the present invention that are apparent to one of ordinary skill in the art are within the scope of the following claims.
  • the biosensor laminate is provided in a biosensor.

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  • Veterinary Medicine (AREA)
  • Biophysics (AREA)
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  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Public Health (AREA)
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  • Surgery (AREA)
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  • General Health & Medical Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Cardiology (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2018/002670 2017-04-28 2018-01-29 生体センサ用積層体および生体センサ WO2018198457A1 (ja)

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WO2020090634A1 (ja) * 2018-10-31 2020-05-07 三井化学株式会社 ベンダブル配線基板、伸縮できる配線基板およびそれらによる電子デバイス
JP2020156692A (ja) * 2019-03-26 2020-10-01 日東電工株式会社 電極接合構造及び生体センサ

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JPH09108195A (ja) * 1995-10-20 1997-04-28 Nec Corp 電気回路内蔵型生体用表面電極
JP2002325740A (ja) * 2001-04-13 2002-11-12 Ge Medical Systems Information Technologies Inc 心電図電極パッチ

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US4848353A (en) * 1986-09-05 1989-07-18 Minnesota Mining And Manufacturing Company Electrically-conductive, pressure-sensitive adhesive and biomedical electrodes
US20040122500A1 (en) * 2002-12-19 2004-06-24 Kimberly-Clark Worldwide, Inc. Electrode for utilizing edge effect to create uniform current density
KR20140090135A (ko) * 2011-07-14 2014-07-16 엠씨10, 인크 발 또는 신발류 위의 힘의 검출
WO2015119208A1 (ja) * 2014-02-06 2015-08-13 独立行政法人科学技術振興機構 電極アレイおよび生体センサー
WO2016187536A1 (en) * 2015-05-20 2016-11-24 Mc10 Inc. Ultra-thin wearable sensing device

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Publication number Priority date Publication date Assignee Title
JPH09108195A (ja) * 1995-10-20 1997-04-28 Nec Corp 電気回路内蔵型生体用表面電極
JP2002325740A (ja) * 2001-04-13 2002-11-12 Ge Medical Systems Information Technologies Inc 心電図電極パッチ

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