WO2018030261A1 - Module de communication optique - Google Patents

Module de communication optique Download PDF

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Publication number
WO2018030261A1
WO2018030261A1 PCT/JP2017/028202 JP2017028202W WO2018030261A1 WO 2018030261 A1 WO2018030261 A1 WO 2018030261A1 JP 2017028202 W JP2017028202 W JP 2017028202W WO 2018030261 A1 WO2018030261 A1 WO 2018030261A1
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WO
WIPO (PCT)
Prior art keywords
communication module
optical communication
substrate
resin block
optical
Prior art date
Application number
PCT/JP2017/028202
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English (en)
Japanese (ja)
Inventor
大輔 土井
Original Assignee
株式会社村田製作所
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Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2018030261A1 publication Critical patent/WO2018030261A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements

Definitions

  • This disclosure relates to an optical communication module including at least one of a light emitting element and a light receiving element.
  • An optical communication module (such as an infrared communication module) is mounted on a mobile device such as a smartphone and used as a data communication module at a short distance.
  • Patent Document 1 discloses an example of the configuration of an optical communication module.
  • the optical communication module of this document includes a substrate and a block-shaped resin package provided on one surface of the substrate.
  • a photodiode is further provided as a light receiving element on one surface of the substrate, and the photodiode is sealed with a resin package.
  • a condensing lens is disposed on the light incident surface opposite to the substrate of the resin package. The condenser lens is integrally formed with the resin package by resin molding using a mold.
  • the condensing lens is formed in an exposed state on the outer surface (light incident surface) of the resin package. For this reason, when the optical communication module is mounted on a mobile device or the like, or during the handling of the optical communication module, there is a risk that the surface of the condensing lens may be scratched or dust or foreign matter may adhere.
  • the present invention has been made in consideration of the above-described problems, and an object of the present invention is to provide an optical communication module having a lens integrally formed with a sealing resin of an optical element (light emitting element or light receiving element). An object of the present invention is to provide an optical communication module having a configuration capable of preventing scratches and dirt on the surface.
  • the present invention is an optical communication module, and includes a substrate, a first optical element, a resin block, a lid, and a first hollow path.
  • the substrate has a main surface and a back surface facing each other.
  • the first optical element is provided on the main surface and functions as a light emitting element or a light receiving element.
  • the resin block is provided on the main surface, seals the first optical element, and is transparent to light emitted or received by the first optical element.
  • the resin block includes an upper surface opposite to the substrate and a first hole. The first hole is at a position that covers the first optical element when viewed from the direction perpendicular to the substrate, and is recessed in the direction from the upper surface toward the substrate.
  • At least a part of the bottom surface of the first hole portion constitutes a first lens surface protruding in the direction opposite to the substrate.
  • the lid is connected to the upper surface of the resin block, covers the first hole, and is transparent to light emitted or received by the first optical element.
  • the first hollow path is provided in the resin block or the lid part, and communicates between the first internal space and the external space surrounded by the first hole part and the lid part.
  • the optical communication module is mounted on the printed circuit board of the electronic device by using soldering (for example, reflow method).
  • the first hollow path is used as a vent for releasing air in the first space that has been thermally expanded. Thereby, peeling with a cover part and a resin block can be prevented.
  • a glass plate is used as the lid.
  • the apparatus further includes a plurality of electrodes provided on the back surface of the substrate.
  • the plurality of electrodes are used as lands for solder connection when the optical communication module is mounted on a printed circuit board of an electronic device.
  • the first hollow path is constituted by a groove provided on the upper surface side of the resin block and a portion of the lid that covers the groove.
  • the first hollow path is a through hole provided in the resin block.
  • the lid (glass plate) and the upper surface of the resin block are connected as compared to the case where the first hollow path is configured by the groove. Therefore, it is not necessary to strictly manage the coating amount of the adhesive. Furthermore, since the contact area between the lid (glass plate) and the upper surface of the resin block can be further expanded compared to the case where the first hollow path is constituted by the groove, the joint strength between the two is increased. Can do.
  • the through hole extends from the first opening provided on the side surface of the first hole portion to the second opening provided on the outer surface of the resin block.
  • the second opening is preferably located closer to the substrate than the first opening.
  • the optical communication module when the optical communication module is disposed so that the substrate is positioned downward as in the case where the optical communication module is soldered onto the printed circuit board of the electronic device, the first communication is performed via the first hollow path. It is possible to suppress dust and foreign matter from entering the internal space.
  • the first hollow path includes a bent portion.
  • the first hollow path is not a simple straight line shape but a complicated shape including a bent portion, thereby reducing the risk of dust and foreign matter entering from the external space into the first internal space. can do.
  • the number of openings on the outer surface side of the resin block of the first hollow path is preferably limited to one.
  • the resin block further includes a second hole
  • the optical communication module further includes a second optical element and a second hollow path.
  • the second optical element is provided on the main surface of the substrate and sealed with a resin block.
  • One of the first and second optical elements functions as a light emitting element, and the other functions as a light receiving element.
  • the second hole provided in the functional block is at a position covering the second optical element when viewed from the direction perpendicular to the substrate, and is recessed in the direction from the upper surface toward the substrate. At least a part of the bottom surface of the second hole portion constitutes a second lens surface protruding in the direction opposite to the substrate.
  • the lid covers both the first and second holes.
  • the second hollow path is provided in the resin block or the lid part, and communicates between the second internal space and the external space surrounded by the second hole part and the lid part.
  • the second hollow path is branched from the middle of the first hollow path to the second hole. It may be configured to communicate between the second internal space and the external space surrounded by the second hole portion and the lid portion by reaching the side surface of the portion. As another modification, the second hollow path may be configured to communicate between the second internal space surrounded by the second hole portion and the lid portion and the first internal space. Good.
  • the number of openings on the outer surface side by the first and second hollow paths in the entire optical communication module is limited to one. Therefore, it is possible to reduce the risk of dust and foreign matter entering from the external space into the first and second internal spaces.
  • water through the first hollow path is used. Intrusion can be suppressed.
  • the optical communication module further includes a second optical element provided on the main surface and sealed with a resin block.
  • One of the first and second optical elements functions as a light emitting element, and the other functions as a light receiving element.
  • the bottom surface of the first hole is at a position that covers the first optical element when viewed from the direction perpendicular to the substrate, and the portion constituting the first lens surface by projecting in the direction opposite to the substrate, A portion that covers the second optical element when viewed from the vertical direction and projects in the direction opposite to the substrate to form the second lens surface.
  • the first and second lens surfaces respectively used for the first and second optical elements are provided on the bottom surface of the common first hole.
  • the 1st hollow path for connecting the internal space and external space which were comprised by this common 1st hole part is provided.
  • the optical communication module having a lens integrally formed with the sealing resin of the optical element (light emitting element or light receiving element), scratches and dirt on the lens surface can be prevented.
  • FIG. 1 is an exploded perspective view showing a configuration of an optical communication module according to Embodiment 1.
  • FIG. 3 is a perspective view illustrating a configuration of a portion obtained by removing a glass plate from the optical communication module according to Embodiment 1.
  • 3 is a plan view of the optical communication module according to Embodiment 1.
  • FIG. 2 is a side view of the optical communication module according to Embodiment 1.
  • FIG. 5 is a diagram for explaining a usage example of the optical communication module having the configuration of FIGS. 1 to 4; 5 is a flowchart showing an example of a method for manufacturing the optical communication module of FIGS. 1 to 4; 6 is a plan view of an optical communication module according to Embodiment 2.
  • FIG. FIG. 1 is an exploded perspective view showing a configuration of an optical communication module according to Embodiment 1.
  • FIG. FIG. 3 is a perspective view illustrating a configuration of a portion obtained by removing a glass plate from the optical communication module according to Embodiment 1.
  • FIG. 6 is a side view of the optical communication module according to the second embodiment. 6 is a plan view of an optical communication module according to Embodiment 3.
  • FIG. FIG. 10 is a side view of the optical communication module according to the third embodiment.
  • FIG. 10 is a cross-sectional view taken along a cutting line XI-XI in FIG. 9.
  • FIG. 6 is a perspective view illustrating a configuration of an optical communication module according to a fourth embodiment.
  • FIG. 10 is a perspective view illustrating a configuration of an optical communication module according to a fifth embodiment.
  • FIG. 10 is a perspective view illustrating a configuration of an optical communication module according to a sixth embodiment.
  • FIG. 10 is a plan view of an optical communication module according to a sixth embodiment.
  • FIG. 1 is an exploded perspective view showing the configuration of the optical communication module according to the first embodiment.
  • FIG. 2 is a perspective view illustrating a configuration of a portion obtained by removing the glass plate 5 from the optical communication module according to the first embodiment.
  • FIG. 3 is a plan view of the optical communication module according to the first embodiment.
  • FIG. 4 is a side view of the optical communication module according to the first embodiment.
  • the attachment position of the glass plate 5 is shown with a dashed-two dotted line, and the glass plate 5 is not illustrated.
  • an optical communication module 1 includes a substrate 30, a photodetector 20 (PD: Photo Detector) as a light receiving element, and a vertical cavity surface emitting laser (VCSEL: Vertical) as a light emitting element.
  • PD Photodetector
  • VCSEL Vertical cavity surface emitting laser
  • a Cavity Surface Emitting Laser (IC) element 21, an integrated circuit (IC: Integrated Circuit) chip 22, a resin block 10, and a glass plate 5 as a lid portion are included.
  • the light receiving element and the light emitting element may be collectively referred to as an optical element in some cases.
  • the board 30 is, for example, a printed board, and a printed wiring 31 is provided on the main surface 30A of the board 30.
  • a plurality of electrodes 32 are provided on the back surface 30B of the substrate 30 facing the main surface 30A.
  • the electrode 32 is electrically connected to the printed wiring 31 through a through hole that penetrates the substrate 30.
  • the electrode 32 is used as a land for solder connection when the optical communication module 1 is mounted on a printed circuit board of an electronic device.
  • the photodetector 20, the VCSEL element 21, and the integrated circuit chip 22 are fixed on the main surface 30A of the substrate 30 with solder or the like.
  • the integrated circuit chip 22 includes a driver circuit that drives the photodetector 20 and the VCSEL element 21, a trans-impedance amplifier (TIA) that converts a current signal output from the photodetector 20 into a voltage signal, and the like. .
  • the integrated circuit chip 22 is connected to the printed wiring 31 by a bonding wire 25 or the like.
  • the photodetector 20 is connected to the integrated circuit chip 22 by a bonding wire 23 or the like, and the VCSEL element 21 is connected to the integrated circuit chip 22 by a bonding wire 24 or the like.
  • the resin block 10 is formed of a resin material that transmits light (for example, infrared rays) received and emitted by the photodetector 20 and the VCSEL element 21 (that is, the resin block 10 is transparent to this light). .
  • the resin block 10 is formed on the main surface 30A of the substrate 30 and seals the photodetector 20, the VCSEL element 21, and the integrated circuit chip 22.
  • the resin block 10 is manufactured by transfer molding using a mold. 1 to 4, the resin block 10 having a rectangular parallelepiped shape is used, but the shape is not limited to this.
  • the resin block 10 includes an upper surface 10A opposite to the substrate 30 and holes 11 and 12 that are recessed in the direction from the upper surface 10A toward the substrate 30.
  • the hole 11 is in a position covering the photodetector 20, and the hole 12 is in a position covering the VCSEL element 21.
  • the photodetector 20 is positioned at the center of a lens surface 13 described later, and the VCSEL element 21 is positioned at the center of a lens surface 14 described later.
  • At least a part of the bottom surface 11B of the hole 11 protrudes in a hemispherical shape in a direction away from the substrate to constitute a lens surface 13 (light receiving lens).
  • a lens surface 13 light receiving lens
  • at least a part of the bottom surface 12B in the hole portion 12 protrudes in a hemispherical shape in a direction away from the substrate, thereby forming a lens surface 14 (light emitting lens).
  • the light receiving lens constituted by the lens surface 13 condenses the incoming light on the light receiving surface of the photodetector 20.
  • the light-emitting lens constituted by the lens surface 14 collimates the light emitted from the VCSEL element 21 so as to become parallel rays.
  • the glass plate 5 is connected to the upper surface 10A of the resin block 10 by, for example, an adhesive so as to cover the holes 11 and 12 of the resin block 10.
  • the adhesive is preferably a thermosetting type.
  • the glass plate 5 is formed of a resin material that transmits light (for example, infrared rays) received and emitted by the photodetector 20 and the VCSEL element 21 (that is, the glass plate 5 is transparent to this light).
  • the glass plate 5 is formed of a material having a hardness higher than that of the resin block 10 so that the surface is not easily damaged.
  • the lens surface 13 faces the internal space 17 surrounded by the glass plate 5 and the holes 11.
  • the lens surface 14 comes to face an internal space 18 surrounded by the glass plate 5 and the hole 12.
  • grooves 15 and 16 are formed on the upper surface 10A side of the resin block 10.
  • the groove portion 15 extends from the side surface 11A of the hole portion 11 to the outer side surface 10B of the resin block 10 and is formed in a linear shape.
  • a portion of the glass plate 5 that covers the groove portion 15 and the groove portion 15 form a hollow passage 44 that communicates the internal space 17 and the external space (the openings 41 and 40 of the hollow passage 44 are formed on the side surface 11A of the hole portion 11 and Formed on the outer surface 10B of the resin block 10).
  • the groove portion 16 extends from the side surface 12A of the hole portion 12 to the outer side surface 10B of the resin block 10 and is formed in a straight line shape.
  • a portion of the glass plate 5 that covers the groove portion 16 and the groove portion 16 constitutes a hollow path 45 that communicates the internal space 18 and the external space (the openings 43 and 42 of the hollow path 45 are the side surfaces 12A and 12A of the hole portion 12). Formed on the outer surface 10B of the resin block 10).
  • Sectional size of the grooves 15 and 16 (hollow paths 44 and 45) (cut perpendicular to the path of the hollow paths 44 and 45 extending from the side surfaces 11A and 12A of the holes 11 and 12 to the outer surface 10B of the resin block 10)
  • the cross-sectional area of the hollow portion in this case is less than a size that does not cause a problem even if foreign matter passes through the hollow paths 44 and 45 and adheres to the lens surfaces 13 and 14 (for example, the lens surfaces 13 and 14). It is desirable to be 5% or less of the area).
  • the lens surface 13 faces an internal space 17 surrounded by the glass plate 5 and the hole 11, and the lens surface 14 faces an internal space 18 surrounded by the glass plate 5 and the hole 11. ing. Accordingly, it is possible to suppress the lens surfaces 13 and 14 from being scratched and the lens surfaces 13 and 14 from being attached with dust and foreign matter.
  • the optical communication module 1 is mounted on the printed circuit board of the electronic device by using soldering (for example, reflow method).
  • soldering for example, reflow method
  • the hollow passages 44 and 45 are used as vents for releasing the thermally expanded air.
  • the hollow paths 44 and 45 with a relatively simple configuration using the grooves 15 and 16 formed on the upper surface 10A side of the resin block 10, the shape of the mold used for resin formation is simplified. There are advantages.
  • FIG. 5 is a diagram for explaining a usage example of the optical communication module configured as shown in FIGS.
  • the two optical communication modules 1 ⁇ / b> A and 1 ⁇ / b> B are arranged so that the glass plate 5 sides face each other.
  • the VCSEL element 21 of the first optical communication module 1A and the photodetector 20 of the second optical communication module 1B face each other, and the photodetector 20 of the first optical communication module 1A and the second light
  • the VCSEL elements 21 of the communication module 1B face each other.
  • Full-duplex communication can be realized using the first channel CH1 and the second channel CH2.
  • the two optical communication modules 1A and 1B having the configuration shown in FIG. 5 can be suitably used for high-speed and large-capacity infrared communication at a short distance.
  • the optical communication modules 1A and 1B can be used for communication between a function expansion unit called a docking station and a notebook computer.
  • a function expansion unit called a docking station a notebook computer.
  • the configuration shown in FIG. 5 is used for communication between the keyboard unit and the display unit.
  • the optical communication modules 1A and 1B can be used.
  • FIG. 6 is a flowchart showing an example of a manufacturing method of the optical communication module shown in FIGS.
  • a printed circuit board an assembly of substrates 30
  • a plurality of printed wirings 31 for the plurality of optical communication modules 1 are arranged on the main surface of the printed circuit board, and electrodes 32 for the plurality of optical communication modules 1 are arranged on the back surface of the printed circuit board.
  • step S20 various semiconductor devices such as the photodetector 20, the VCSEL element 21, and the integrated circuit chip 22 corresponding to each optical communication module 1 are attached to the printed circuit board by solder or the like.
  • step S30 various semiconductor devices such as the photodetector 20, the VCSEL element 21, and the integrated circuit chip 22 corresponding to each optical communication module 1 are attached to the printed circuit board by solder or the like.
  • step S30 various semiconductor devices and the various semiconductor devices and the printed wiring 31 are connected by bonding wires or the like.
  • the resin block 10 is produced on the main surface 30A of each substrate 30 by transfer molding using a mold (step S40).
  • the holes 11 and 12, the lens surfaces 13 and 14 and the grooves 15 and 16 provided in each resin block 10 are integrally molded.
  • the printed circuit board (the assembly of the substrates 30) is cut into individual substrates by dicing (step S50).
  • step S60 the glass plate 5 is attached to the upper surface 10A of each resin block 10 with an adhesive (step S60).
  • the optical communication module shown in FIGS. 1 to 4 is completed.
  • a printed board size glass plate (an assembly of glass plates 5) is attached to the upper surface 10A of each resin block 10 with an adhesive, and then the dicing process is performed, whereby a printed board is obtained.
  • the glass plate may be cut.
  • one hollow path 44, 45 is provided for each hole 11, 12, but two or more hollow paths 44, 45 may be provided for each hole 11, 12.
  • Increasing the number of hollow passages 44 and 45 increases the risk of dust and foreign matter entering the internal spaces 17 and 18 of the resin block 10, but conversely facilitates removal of dust and foreign matter by washing with water.
  • water enters from one hollow passage and air in the internal spaces 17 and 18 can easily escape from the other hollow passage.
  • even if water enters the internal spaces 17 and 18 in the cleaning process after the optical communication module is soldered to the printed circuit board of the electronic device there is an advantage that the subsequent drying becomes easy.
  • the grooves 15 and 16 may be formed so as to reach from the upper surface 10A of the resin block 10 to the bottom surfaces 11B and 12B of the holes 11 and 12 (that is, to have a slit shape).
  • FIG. 7 is a plan view of the optical communication module according to the second embodiment.
  • FIG. 8 is a side view of the optical communication module according to the second embodiment.
  • the attachment position of the glass plate 5 is shown with a dashed-two dotted line, and the glass plate 5 is not illustrated.
  • the optical communication module of the second embodiment is different from that of the first embodiment in the shape of the groove portions 15A and 16A.
  • the groove portions 15 and 16 are formed in a straight line, whereas the groove portions 15A and 16A in FIGS. 7 and 8 include bent portions.
  • the groove portions 15A and 16A are bent in an S shape when the substrate 30 is viewed in plan.
  • the hollow paths 44 and 45 comprised by the part which covers groove part 15A, 16A among the glass plates 5, and groove part 15A, 16A also have a curved part. That is, the path of the hollow path 44 from the opening 41 on the side surface 11A of the hole 11 to the opening 40 on the outer side surface 10B of the resin block 10 is not linear. Similarly, the path of the hollow path 45 from the opening 43 on the side surface 12A of the hole 12 to the opening 42 on the outer side surface 10B of the resin block 10 is not linear.
  • the size of the cross section of the grooves 15A, 16A (hollow paths 44, 45) (cut perpendicular to the path of the hollow paths 44, 45 extending from the side surfaces 11A, 12A of the holes 11, 12 to the outer side surface 10B of the resin block 10)
  • the cross-sectional area of the hollow portion in this case is less than a size that does not cause a problem even if foreign matter passes through the hollow paths 44 and 45 and adheres to the lens surfaces 13 and 14 (for example, the lens surfaces 13 and 14). It is desirable to be 5% or less of the area).
  • FIG. 9 is a plan view of the optical communication module according to the third embodiment.
  • FIG. 10 is a side view of the optical communication module according to the third embodiment.
  • FIG. 11 is a cross-sectional view taken along the cutting line XI-XI in FIG.
  • the attachment position of the glass plate 5 is indicated by a two-dot chain line, and the glass plate 5 is not illustrated.
  • the optical communication module of the third embodiment is different from the first and second embodiments in that the hollow paths 44 and 45 are through holes 15B and 16B provided in the resin block 10. Different from optical communication module. Specifically, the through hole 15 ⁇ / b> B (hollow path 44) extends from the opening 41 provided on the side surface 11 ⁇ / b> A of the hole 11 of the resin block 10 to the opening 40 provided on the outer side surface 10 ⁇ / b> B of the resin block 10.
  • the through hole 16 ⁇ / b> B extends from the opening 43 provided on the side surface 12 ⁇ / b> A of the hole 12 of the resin block 10 to the opening 42 provided on the outer side surface 10 ⁇ / b> B of the resin block 10.
  • the size of the cross-section of the through holes 15B, 16B (the hollow portion when cut perpendicular to the path of the through holes 15B, 16B from the side surfaces 11A, 12A of the hole portions 11, 12 to the outer surface 10B of the resin block 10)
  • the cross-sectional area is less than a size that does not cause a problem even if foreign matter passes through the through holes 15B and 16B and adheres to the lens surfaces 13 and 14 (for example, 5% or less of the area of the lens surfaces 13 and 14). It is desirable to make it.
  • the hollow paths 44 and 45 are configured by the through holes 15B and 16B, strict management of the amount of adhesive applied to connect the glass plate 5 and the upper surface 10A of the resin block 10 is unnecessary. There is an advantage of becoming. Specifically, when the hollow passages 44 and 45 are configured using the groove portions 15 and 16 (15A and 16A) as in the first and second embodiments, the adhesive is provided in the groove portions 15 and 16 (15A and 16A). It is necessary to strictly control the amount of adhesive applied so that it does not flow into the adhesive. If the application amount of the adhesive is reduced too much, there will be a problem in terms of the adhesive strength between the glass plate 5 and the upper surface 10A of the resin block 10.
  • the openings 40 and 42 on the outer space side of the through holes 15B and 16B are closer to the substrate 30 than the openings 41 and 43 on the inner spaces 17 and 18 side. In position.
  • the internal spaces 17 and 18 are provided via the hollow path. It is possible to prevent dust and foreign matter from entering the surface (because the intrusion direction of the foreign matter is against the gravity).
  • the bent portions may be provided in the through holes 15B and 16B as in the second embodiment. Further, it is possible to provide two or more through holes for each of the holes 11 and 12.
  • the optical communication module according to the fourth embodiment is different from the first to third embodiments in the shape of the hollow path.
  • the opening on the outer surface 10B side of the resin block 10 is formed in the entire optical communication module with respect to the hollow path for communicating the internal space constituted by the holes 11 and 12 and the external space.
  • the number is limited to one.
  • FIG. 12 is a perspective view showing the configuration of the optical communication module of the fourth embodiment.
  • the attachment position of the glass plate 5 is indicated by a two-dot chain line, and the glass plate 5 is not shown.
  • grooves 51, 52, and 53 having a Y-shape are provided on the upper surface 10A side of the resin block 10 by being connected to each other.
  • the end of the groove 51 opposite to the connecting portion reaches the outer surface 10 ⁇ / b> B of the resin block 10.
  • the end of the groove 52 opposite to the connecting portion reaches the side surface of the hole 11.
  • the end of the groove 53 opposite to the connecting portion reaches the side surface of the hole 12.
  • a hollow path 50 that connects the external space and the internal space formed by the hole 11 is formed by the groove portions 52 and 52 and the portion of the glass plate 5 that covers the groove portions 51 and 52.
  • the hollow path 50 extends from the opening 54 on the outer side surface 10 ⁇ / b> B of the resin block 10 to the opening 55 on the side surface of the hole 11.
  • a hollow path 57 that branches from the middle of the hollow path 50 and reaches the opening 56 on the side surface of the hole 12 is formed by the groove 53 and the portion of the glass plate 5 that covers the groove 53.
  • the external space communicates with the internal space formed by the hole 12 through the hollow path 57.
  • the number of openings on the outer surface by the hollow paths 50 and 57 in the entire optical communication module is limited to one.
  • the internal space is passed through the hollow paths 50 and 57. Invasion of water can be suppressed.
  • the shape of the hollow passages 50 and 57 may be a shape including a bent portion as shown in FIGS. Furthermore, the hollow paths 50 and 57 may be configured by through holes provided in the resin block 10 instead of the grooves 50, 51 and 52.
  • the hollow path for communicating the internal space constituted by the holes 11 and 12 and the external space is outside the resin block 10.
  • the number of openings on the side surface 10B side is limited to one for the entire optical communication module.
  • FIG. 13 is a perspective view showing the configuration of the optical communication module of the fifth embodiment.
  • the attachment position of the glass plate 5 is shown with a dashed-two dotted line, and the glass plate 5 is not illustrated.
  • the optical communication module of FIG. 13 is configured by the internal space and the hole portion 11 constituted by the hole portion 12 instead of the hollow path 45 for communicating the internal space constituted by the hole portion 12 and the external space. It differs from the optical communication module of Embodiment 1 shown in FIGS. 2 to 4 in that a hollow path 60 for communicating with the internal space is provided in the resin block 10.
  • the hollow path 60 is configured using a groove portion 61 provided on the upper surface 10 ⁇ / b> A side of the resin block 10, and the groove portion 61 reaches the side surface of the hole portion 12 from the side surface of the hole portion 11.
  • a through hole penetrating the portion of the resin block 10 between the hole portions 11 and 12 may be provided.
  • the internal space configured by the hole portion 12 becomes an external space through the hollow path 60, the internal space configured by the hole section 11, and the hollow path 44 in order. Communicate with. Therefore, as in the case of the first embodiment, when the optical communication module is mounted on the printed circuit board of the electronic device by using soldering (for example, reflow method), the air in which the hollow paths 44 and 60 are thermally expanded is used. Used as a vent for escape. As a result, it is possible to prevent the pressure in the internal space formed by the holes 11 and 12 from being increased, and therefore, peeling between the glass plate 5 connected by the adhesive and the upper surface 10A of the resin block 10 is prevented. be able to.
  • soldering for example, reflow method
  • the optical communication module according to the sixth embodiment is characterized in that a common hole 70 is provided in the resin block 10 by integrating the holes 11 and 12 described in the first to fifth embodiments. .
  • a common hole 70 is provided in the resin block 10 by integrating the holes 11 and 12 described in the first to fifth embodiments.
  • FIG. 14 is a perspective view showing a configuration of an optical communication module according to the sixth embodiment.
  • FIG. 15 is a plan view of the optical communication module according to the sixth embodiment.
  • the attachment position of the glass plate 5 is shown with a dashed-two dotted line, and the glass plate 5 is not illustrated.
  • the resin block 10 is provided with a hole 70 that is recessed in the direction from the upper surface 10 ⁇ / b> A toward the substrate 30.
  • the hole 70 is provided at a position covering the photodetector 20 and the VCSEL element 21.
  • the bottom surface 70 ⁇ / b> B of the hole 70 includes a portion constituting the lens surface 13 and a portion constituting the lens surface 14.
  • the portion constituting the lens surface 13 is at a position covering the photodetector 20 when viewed from the direction perpendicular to the substrate 30, and protrudes in the opposite direction to the substrate 30.
  • the portion constituting the lens surface 14 is at a position covering the VCSEL element 21 when viewed from the direction perpendicular to the substrate 30, and protrudes in the opposite direction to the substrate 30.
  • the resin block 10 is further provided with a groove 15 on the upper surface 10A side.
  • One end of the groove 15 reaches the outer surface 10B of the resin block 10, and the other end of the groove 15 reaches the side surface 70A of the hole 70.
  • a hollow path 44 is constituted by the groove 15 and a portion covering the groove 15 of the glass plate 5. The hollow path 44 extends from the opening 40 on the outer side surface 10B of the resin block 10 to the opening 41 on the side surface 70A of the hole 70, whereby the internal space 71 and the external space surrounded by the hole 70 and the glass plate 5 are separated. Communicate.
  • the number of openings on the outer surface side by the hollow path 44 in the entire optical communication module is limited to one.
  • Intrusion can be suppressed.
  • the shape of the hollow path 44 may be a shape including a bent portion as shown in FIGS. Further, the hollow path 44 may be constituted by a through hole provided in the resin block 10 instead of the groove portion 15.
  • a transparent resin can be used instead of the glass plate 5 as a lid for covering the holes 11 and 12.
  • the resin material used as the lid has a higher hardness than the material of the resin block 10.
  • the lid portion is made of transparent resin, it is possible to provide a hollow path in the lid portion.
  • either one or both of the hollow paths 44 and 45 can be constituted by a through hole provided in the lid.
  • the hollow path 44 can be constituted by a through hole provided in the lid portion.
  • the optical communication module includes both the photodetector 20 as a light receiving element and the VCSEL element 21 as a light emitting element.
  • the optical communication module may be configured to include only one of them. . In this case, only one corresponding holes 11 and 12 and hollow paths 44 and 45 are provided.
  • the optical communication module may include three or more optical elements.
  • 1, 1A, 1B optical communication module 5 glass plate (lid), 10 resin block, 11, 12, 70 hole, 13, 14 lens surface, 15, 15A, 16, 16A, 51-53, 61 groove, 15B, 16B through hole, 17, 18, 71 internal space, 20 photodetector, 21 vertical cavity surface emitting laser element (VCSEL element), 22 integrated circuit chip, 30 substrate, 30A main surface, 30B back surface, 31 printed wiring , 32 electrodes, 40-43, 54-56 openings, 44, 45, 50, 57, 60 hollow paths.
  • VCSEL element vertical cavity surface emitting laser element

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Semiconductor Lasers (AREA)

Abstract

L'invention concerne un module de communication optique (1), des éléments optiques (20, 21) étant disposés sur une surface principale (30A) d'un substrat (30). Un bloc de résine (10) transparent est disposé sur la surface principale (30A) du substrat (30), et scelle les éléments optiques (20, 21). Le bloc de résine (10) comprend des sections de trou (11, 12) qui sont en retrait vers le substrat (30) à partir de la surface supérieure (10A) du bloc. Au moins une partie des surfaces inférieures des sections de trou (11, 12) forme des surfaces de lentille (13, 14) qui font saillie dans une direction opposée au substrat (30). Une section de couvercle (5) transparent est reliée à la surface supérieure (10A) du bloc de résine (10) et recouvre les sections de trou (11, 12). Des passages creux (44, 45) sont ménagés dans le bloc de résine (10), et assurent une communication entre un espace interne et un espace externe, l'espace interne étant entouré par les sections de trou (11, 12) et la section de couvercle (5).
PCT/JP2017/028202 2016-08-10 2017-08-03 Module de communication optique WO2018030261A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-157377 2016-08-10
JP2016157377 2016-08-10

Publications (1)

Publication Number Publication Date
WO2018030261A1 true WO2018030261A1 (fr) 2018-02-15

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PCT/JP2017/028202 WO2018030261A1 (fr) 2016-08-10 2017-08-03 Module de communication optique

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WO (1) WO2018030261A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7493419B2 (ja) 2020-09-09 2024-05-31 株式会社村田製作所 光通信モジュール及び積層型コイル部品

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006202998A (ja) * 2005-01-20 2006-08-03 Ricoh Co Ltd 光電変換モジュール、およびそれに用いる複合成形体の作製方法
JP2007049017A (ja) * 2005-08-11 2007-02-22 Ricoh Co Ltd 光電気変換モジュール
JP2008294339A (ja) * 2007-05-28 2008-12-04 Rohm Co Ltd 光通信モジュール
US20090226139A1 (en) * 2008-01-31 2009-09-10 Coretek Opto Corp. Optoelectronic component and optical subassembly for optical communication
JP2009229613A (ja) * 2008-03-20 2009-10-08 Murata Mfg Co Ltd 光モジュール
JP2010238751A (ja) * 2009-03-30 2010-10-21 Autonetworks Technologies Ltd 光通信モジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006202998A (ja) * 2005-01-20 2006-08-03 Ricoh Co Ltd 光電変換モジュール、およびそれに用いる複合成形体の作製方法
JP2007049017A (ja) * 2005-08-11 2007-02-22 Ricoh Co Ltd 光電気変換モジュール
JP2008294339A (ja) * 2007-05-28 2008-12-04 Rohm Co Ltd 光通信モジュール
US20090226139A1 (en) * 2008-01-31 2009-09-10 Coretek Opto Corp. Optoelectronic component and optical subassembly for optical communication
JP2009229613A (ja) * 2008-03-20 2009-10-08 Murata Mfg Co Ltd 光モジュール
JP2010238751A (ja) * 2009-03-30 2010-10-21 Autonetworks Technologies Ltd 光通信モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7493419B2 (ja) 2020-09-09 2024-05-31 株式会社村田製作所 光通信モジュール及び積層型コイル部品

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