WO2017110918A1 - 末端変性ポリアミド樹脂およびその製造方法 - Google Patents
末端変性ポリアミド樹脂およびその製造方法 Download PDFInfo
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- WO2017110918A1 WO2017110918A1 PCT/JP2016/088200 JP2016088200W WO2017110918A1 WO 2017110918 A1 WO2017110918 A1 WO 2017110918A1 JP 2016088200 W JP2016088200 W JP 2016088200W WO 2017110918 A1 WO2017110918 A1 WO 2017110918A1
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- polyamide resin
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- 0 CCC(C)(*C(C)(CC)N=I)[N+](C)[O-] Chemical compound CCC(C)(*C(C)(CC)N=I)[N+](C)[O-] 0.000 description 2
- MUOWJIWULURQHT-UHFFFAOYSA-N CCC(C)(C(C)COC(C)(C)C(C)(CCOC(C)C)C=C)NC Chemical compound CCC(C)(C(C)COC(C)(C)C(C)(CCOC(C)C)C=C)NC MUOWJIWULURQHT-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/48—Polymers modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/40—Polyamides containing oxygen in the form of ether groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/08—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids
- C08G69/10—Alpha-amino-carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/08—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids
- C08G69/14—Lactams
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/36—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines and polycarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
Definitions
- the present invention relates to a terminal-modified polyamide resin having a specific terminal structure and excellent in melt fluidity, heat stability during melt residence, molding processability and mechanical properties.
- Polyamide resins are widely used as materials for various molded products such as fibers, various containers, films, electrical / electronic equipment parts, automobile parts and machine parts because they have excellent mechanical and thermal properties.
- Patent Document 1 a polyamide resin having a hydrocarbon group having 6 to 22 carbon atoms and a relative viscosity of 2 or more and less than 2.5 has been proposed (for example, Patent Document 1). reference).
- Patent Document 1 a polyamide resin having a hydrocarbon group having 6 to 22 carbon atoms and a relative viscosity of 2 or more and less than 2.5.
- Patent Document 1 a polyamide resin having a hydrocarbon group having 6 to 22 carbon atoms and a relative viscosity of 2 or more and less than 2.5 has been proposed (for example, Patent Document 1). reference).
- Patent Document 1 a polyamide resin having a hydrocarbon group having 6 to 22 carbon atoms and a relative viscosity of 2 or more and less than 2.5
- such a polyamide resin still has a high melt viscosity, and there has been a problem that molding processability is insufficient in response to the recent demands for downsizing, complication, thinning, and weight reduction of molded products.
- the terminal-modified polyamide resin described in Patent Document 2 is excellent in melt fluidity
- the polyalkylene oxide structure is introduced into the polyamide resin and simultaneously the carboxyl end groups are blocked by the monoamine compound having a polyalkylene oxide structure.
- the amino terminal group is not blocked at all, the thermal decomposition from the amino terminal group and the thermal decomposition of the polyalkylene oxide structure are promoted at the time of melt residence such as during molding. Therefore, there is a problem that the effect of melt fluidity is reduced by introducing a polyalkylene oxide structure at the end of the polyamide resin.
- An object of the present invention is to provide a terminal-modified polyamide resin excellent in melt fluidity, heat stability during melt residence, molding processability and mechanical properties.
- the present inventors have found that the specific end of the polyamide resin has a specific polyalkylene oxide structure (I) and a specific It has been found that the above-mentioned problems can be solved by containing a specific amount of the hydrocarbon group structure (II), and the present invention has been achieved. That is, the present invention has the following configuration. [1] A terminal-modified polyamide resin containing 1 to 20% by mass of a terminal structure represented by the following general formula (I) and 0.1 to 5% by mass of a terminal structure represented by the following general formula (II).
- m represents a range of 2 to 100.
- R 1 represents a divalent hydrocarbon group having 2 to 10 carbon atoms
- R 2 represents a monovalent hydrocarbon group having 1 to 30 carbon atoms.
- —X— represents —NH—, —N (CH 3 ) — or — (C ⁇ O) —.
- the m R 1 contained in the general formula (I) may be the same or different.
- -YR 3 (II) In the above general formula (II), R 3 represents a monovalent hydrocarbon group having 1 to 30 carbon atoms.
- —Y— in the general formula (II) represents — (C ⁇ O) —
- the terminal-modified polyamide resin contains a total of 60 to 250 [mol / t] of the terminal structure represented by the general formula (I) and the terminal structure represented by the general formula (II), and Ratio of content [mol / t] of terminal structure represented by general formula (I) to content [mol / t] of terminal structure represented by general formula (II) ((I) / (II) ) Is 0.3 to 2.5.
- the terminal-modified polyamide resin according to [1].
- the terminal-modified polyamide resin contains a total of 50 to 150 [mol / t] amino terminal groups and carboxyl terminal groups, and the amino terminal group content [mol / t] and the carboxyl terminal group content [
- terminal-modified polyamide resin according to any one of [1] to [9], wherein a mass reduction rate before and after residence for 40 minutes is 4% or less under a nitrogen atmosphere under a melting point + 60 ° C.
- the terminal modification compound represented by the following general formula (III) is converted into a diamine, a dicarboxylic acid, 1 to 20% by mass with respect to the total of amino acids and lactams, and 0.01 to 5 with respect to the total of the diamines, dicarboxylic acids, amino acids and lactams of the terminal modification compounds represented by the following general formula (IV)
- m represents a range of 2 to 100.
- R 1 represents a divalent hydrocarbon group having 2 to 10 carbon atoms
- R 2 represents a monovalent hydrocarbon group having 1 to 30 carbon atoms.
- —X′— represents —NH—, —N (CH 3 ) — or —O (C ⁇ O) —.
- the m R 1 contained in the general formula (III) may be the same or different.
- HY'-R 3 (IV) In the general formula (IV), R 3 represents a monovalent hydrocarbon group having 1 to 30 carbon atoms.
- a terminal-modified polyamide resin having an extremely low melt viscosity and excellent in melt fluidity, heat stability during melt residence, molding processability and mechanical properties.
- the terminal-modified polyamide resin in the present invention is a polyamide resin that can be obtained as a main raw material of at least one selected from amino acids, lactams, and “mixtures of diamines and dicarboxylic acids”, and has the general formula (I) And a terminal structure represented by the general formula (II).
- the terminal-modified polyamide resin in the present invention is polymerized by using at least one selected from the group consisting of a combination consisting of a diamine and a dicarboxylic acid, an amino acid, and a lactam as a main raw material.
- a terminal structure represented by the general formula (II) is a polyamide resin that can be obtained as a main raw material of at least one selected from amino acids, lactams, and “mixtures of diamines and dicarboxylic acids”, and has the general formula (I) And a terminal structure represented by the general formula (II).
- the chemical structure constituting the main structural unit of the polyamide resin preferably has a carbon number in the range of 4 to 20 when amino acid or lactam is used as a raw material.
- the diamine preferably has 2 to 20 carbon atoms
- the dicarboxylic acid preferably has 2 to 20 carbon atoms.
- Typical examples of the raw material include the following.
- amino acids such as 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid and paraaminomethylbenzoic acid.
- Lactams such as ⁇ -caprolactam, ⁇ -undecanactam, ⁇ -laurolactam.
- Aliphatic diamines such as diamine, heptadecanediamine, octadecanediamine, nonadecanediamine, eicosanediamine, 2-methyl-1,5-diaminopentane, 2-methyl-1,8-diaminooctane; cyclohexanediamine, bis- ( Cycloaliphatic diamines such as 4-aminocyclohexyl) methane and bis (3-methyl-4-aminocyclohexyl) methane; Diamine such as family diamine.
- Aliphatic dicarboxylic acids such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid; terephthalic acid, isophthalic acid, 2-chloroterephthalic acid, Aromatic dicarboxylic acids such as 2-methylterephthalic acid, 5-methylisophthalic acid, 5-sodium sulfoisophthalic acid, hexahydroterephthalic acid and hexahydroisophthalic acid; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; Examples thereof include dialkyl esters and dichlorides.
- a polyamide homopolymer or copolymer derived from these raw materials can be used as the polyamide resin into which the terminal structure is introduced. Two or more kinds of such polyamides may be mixed to form a polyamide resin.
- the structural units derived from the raw materials exemplified above are represented by the terminal structure represented by the general formula (I) and the general formula (II). 80 mol% or more, preferably 90 mol% or more, more preferably 100 mol%, in 100 mol% of all structural units constituting the polyamide resin excluding the terminal structure represented by .
- the polymerization structure derived from the raw material illustrated above is linear.
- the terminal-modified polyamide resin of the present invention has a terminal structure represented by the following general formula (I). Since the terminal structure represented by the following general formula (I) has an alkylene oxide structure, the resulting polymer has high molecular mobility and excellent affinity with an amide group.
- the structure represented by the following general formula (I) at the end of the polyamide resin is interposed between the polyamide molecular chains to increase the free volume of the polymer and reduce the entanglement. As a result, the molecular mobility of the polymer can be greatly increased and the melt viscosity can be reduced (that is, the fluidity at the time of melting can be further improved), and as a result, the molding processability is improved.
- m represents a range of 2 to 100 (2 or more and 100 or less). As m is smaller, the effect of reducing the melt viscosity becomes insufficient. m is preferably 5 or more, more preferably 8 or more, and still more preferably 16 or more. On the other hand, if m is too large, the heat resistance will be insufficient. m is preferably 70 or less, and more preferably 50 or less.
- the terminal-modified polyamide resin in the present invention preferably has the structure represented by the above general formula (I) only at the terminal of the polymer.
- R 1 represents a divalent hydrocarbon group having 2 to 10 carbon atoms (2 to 10 carbon atoms). From the viewpoint of affinity with the main structural unit of the polyamide resin, a hydrocarbon group having 2 to 6 carbon atoms is more preferable, and a hydrocarbon group having 2 to 4 carbon atoms is more preferable. From the viewpoint of thermal stability of the terminal-modified polyamide resin and prevention of coloring, a saturated hydrocarbon group is more preferable.
- R 1 include an ethylene group, a 1,3-trimethylene group, an isopropylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, and a 1,6-hexamethylene group.
- the m R 1 may be a combination of hydrocarbon groups having different carbon numbers.
- R 1 is preferably composed of at least a divalent saturated hydrocarbon group having 2 carbon atoms and a divalent saturated hydrocarbon group having 3 carbon atoms.
- the polyamide resin is composed of an ethylene group excellent in affinity with the main structural unit of the polyamide resin and an isopropylene group having a large free volume, and the effect of reducing the melt viscosity can be expressed more effectively.
- the terminal structure represented by the general formula (I) contains 10 or more ethylene groups and 6 or less isopropylene groups, and introduces a terminal structure close to the desired amount into the polyamide resin. It is possible to increase the melt viscosity reduction effect.
- R 2 represents a monovalent hydrocarbon group having 1 to 30 carbon atoms (1 to 30 carbon atoms). Is excellent in affinity with the main structural units of the higher polyamide resin is less number of carbon atoms in R 2, a hydrocarbon group having 1 to 20 carbon atoms is preferable, more preferably used is a hydrocarbon group having 1 to 10 carbon atoms. Further, from the viewpoint of thermal stability of the terminal-modified polyamide resin and prevention of coloring, it is a more preferable embodiment that R 2 is a monovalent saturated hydrocarbon group.
- R 2 examples include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, and a decyl group.
- the main structural unit of a polyamide resin and A methyl group and an ethyl group, which are excellent in affinity, are more preferable.
- —X— represents —NH—, —N (CH 3 ) — or — (C ⁇ O) —.
- —NH— which is excellent in affinity with the main structural unit of the polyamide resin, is more preferable.
- the terminal-modified polyamide resin of the present invention has a terminal structure represented by the general formula (I) at at least one terminal of a polymer constituting the terminal-modified polyamide resin.
- the terminal-modified polyamide resin of the present invention needs to contain 1 to 20% by mass (1 to 20% by mass) of the terminal structure represented by the general formula (I) in 100% by mass of the terminal-modified polyamide resin. is there.
- the content of the terminal structure represented by the general formula (I) is less than 1% by mass, the melt viscosity of the terminal-modified polyamide resin is not sufficiently reduced, and the moldability is deteriorated.
- the content of the terminal structure represented by the general formula (I) is more preferably 3% by mass or more, and further preferably 5% by mass or more.
- the content of the terminal structure represented by the general formula (I) exceeds 20% by mass, the gas component due to the thermal decomposition of the structure represented by the general formula (I) increases during the residence time of the melt. The thermal stability of is reduced. Further, since the molecular weight of the terminal-modified polyamide resin cannot be designed to be high, mechanical properties are deteriorated.
- the content of the terminal structure represented by the general formula (I) is more preferably 15% by mass or less, and further preferably 10% by mass or less.
- the content of the terminal structure represented by the general formula (I) in the terminal-modified polyamide resin is expressed by, for example, the general formula (III) described later used when manufacturing the terminal-modified polyamide resin.
- the terminal-modified polyamide resin of the present invention has a terminal structure represented by the following general formula (II).
- the melt viscosity of the terminal-modified polyamide resin can be reduced and the molding processability can be improved.
- the thermal decomposition of the terminal structure represented by the general formula (I) proceeds, and the melt viscosity reduction effect tends to decrease.
- the amino terminal group and carboxyl terminal group of the polyamide resin act as a thermal decomposition catalyst for the terminal structure represented by the general formula (I)
- the amount of amino terminal group and carboxyl terminal group in the polyamide resin should be reduced.
- the thermal stability during the melt residence is further improved. It was found that it can be improved.
- a polyamide resin having only the terminal structure represented by the general formula (I) is obtained by reacting the carboxyl terminal group of the polyamide resin with a compound for terminal modification represented by the general formula (III) described later. Can do.
- one terminal is modified with the terminal structure represented by the general formula (I), but the other terminal is not modified and remains an amino terminal group or a carboxyl group.
- the amino terminal group or the carboxyl terminal group acts as a thermal decomposition catalyst for the terminal structure represented by the general formula (I), and the thermal decomposition of the structure represented by the general formula (I) easily proceeds. Therefore, for example, the above-mentioned polyamide resin (that is, a polyamide resin in which only one terminal is modified with a structure represented by the general formula (I)), a compound for terminal modification represented by the following general formula (IV) By further reacting, the other terminal can be modified to obtain a polyamide resin further having a terminal structure represented by the following general formula (II).
- R 3 represents a monovalent hydrocarbon group having 1 to 30 carbon atoms. Since the smaller the carbon number of R 3, the better the affinity with the main structural unit of the polyamide resin, it is preferably a hydrocarbon group having 1 to 30 carbon atoms.
- one terminal group is an amino terminal group
- the other terminal group is a carboxyl terminal group.
- the terminal modification compound represented by the general formula (III) when the terminal modification compound represented by the general formula (III) has an amino terminal group, the terminal modification compound reacts with the carboxyl terminal group of the polyamide resin, and X in the general formula (I) is —NH. -Or -N (CH 3 )-.
- the amino terminal group which is the other terminal of the polyamide resin is reacted with the terminal-modifying compound represented by the general formula (IV), so that the other end of the polyamide resin has the general formula (II).
- Terminal structure can be introduced.
- Y in the general formula (II) is — (C ⁇ O) —.
- Y in the general formula (II) is —NH— or —N (CH 3 ) —.
- the terminal-modified polyamide resin of the present invention contains the terminal structure represented by the general formula (II) in an amount of 0.1 to 5% by mass (0.1 to 5% by mass) in 100% by mass of the terminal-modified polyamide resin. It is necessary.
- the content of the terminal structure represented by the general formula (II) is less than 0.1% by mass, the thermal decomposition of the structure represented by the general formula (I) in the terminal-modified polyamide resin during the melt residence proceeds, The thermal stability at the time of melt residence decreases. Inferior in mechanical properties.
- the content of the terminal structure represented by the general formula (II) is more preferably 0.2% by mass or more, and further preferably 0.4% by mass or more.
- the content of the terminal structure represented by the general formula (II) exceeds 5% by mass, mechanical properties and thermal stability are deteriorated.
- the content of the terminal structure represented by the general formula (II) is more preferably 3% by mass or less, and further preferably 1% by mass or less.
- the content of the terminal structure represented by the general formula (II) in the terminal-modified polyamide resin is expressed by, for example, the general formula (IV) described later used when manufacturing the terminal-modified polyamide resin.
- the terminal-modified polyamide resin in the present invention is a polyamide resin having a terminal structure represented by the general formula (I) and a terminal structure represented by the general formula (II) (that is, one terminal is represented by the general formula (I)). It is preferable that the other terminal contains a polyamide resin modified with the terminal structure represented by the general formula (II).
- a polyamide resin having only a terminal structure represented by the general formula (I) for example, a polyamide in which one terminal is modified with a terminal structure represented by the general formula (I) but the other terminal is not modified
- Resin and a polyamide resin having only a terminal structure represented by the general formula (II) (for example, one terminal is modified with a terminal structure represented by the general formula (II), but the other terminal is
- An embodiment containing a non-modified polyamide resin may also be used.
- the terminal-modified polyamide resin of the present invention has a terminal structure content [mol / t] represented by the general formula (I) and a terminal structure content [mol / t] represented by the general formula (II). Is preferably 60 to 250 mol / t (60 mol / t or more and 250 mol / t or less).
- the melt viscosity of the terminal-modified polyamide resin is further reduced.
- the total content of these terminal structures is more preferably 70 mol / t or more, and still more preferably 80 mol / t or more.
- the terminal-modified polyamide resin 1t contains a total of 250 mol or less of the terminal structure represented by the general formula (I) and the terminal structure represented by the general formula (II), so that the mechanical properties and the heat during melt residence Stability can be further improved.
- the total content of these terminal structures is more preferably 225 mol / t, further preferably 200 mol / t or less.
- the total amount of the terminal structure represented by the general formula (I) and the terminal structure represented by the general formula (II) in the terminal-modified polyamide resin is used when, for example, producing the terminal-modified polyamide resin. It can adjust to the desired range by adjusting the compounding quantity of the compound for terminal modification represented by general formula (III) mentioned later and the compound for terminal modification represented by general formula (IV).
- the terminal-modified polyamide resin of the present invention has a terminal structure content [mol / t] represented by the general formula (I) with respect to a content [mol / t] of the terminal structure represented by the general formula (II).
- the ratio ((I) / (II)) is preferably 0.3 to 2.5 (0.3 or more and 2.5 or less).
- the polyamide resin undergoes a molecular weight increase due to a polymerization reaction between an amino terminal group and a carboxyl terminal group simultaneously with a decrease in the molecular weight due to thermal decomposition during melt residence.
- the melt viscosity of the terminal-modified polyamide resin is further reduced to further improve the molding processability, and the terminal-modified polyamide at the time of melt residence
- the thermal decomposition of the structure represented by the general formula (I) in the resin can be further suppressed, and the thermal stability can be further improved.
- the molar ratio ((I) / (II)) is more preferably 0.5 or more, further preferably 0.6 or more, and most preferably 0.8 or more.
- the thermal decomposition of the terminal structure represented by the general formula (I) in the terminal-modified polyamide resin during melt residence is further suppressed.
- the thermal stability can be further improved.
- the molar ratio ((I) / (II)) is more preferably 2.2 or less, and further preferably 2.0 or less.
- the content of the terminal structure represented by the general formula (I) and the terminal structure represented by the general formula (II) in the terminal-modified polyamide resin can be determined by 1 H-NMR measurement, respectively.
- the measurement and calculation methods are as follows.
- a deuterated sulfuric acid solution or deuterated hexafluoroisopropanol solution having a polyamide resin (A) concentration of 50 mg / mL is prepared, and 1 H-NMR measurement is performed with 256 integrations.
- the molar ratio ((I) / (II)) in the terminal-modified polyamide resin is, for example, the terminal modification represented by the general formula (III) described later used when manufacturing the terminal-modified polyamide resin.
- the compounding ratio of the compound for use and the compound for terminal modification represented by the general formula (IV) it can be adjusted to a desired range.
- the terminal-modified polyamide resin of the present invention preferably contains a total of 50 to 150 mol / t (50 mol / t or more and 150 mol / t or less) of amino terminal groups and carboxyl terminal groups.
- a total of 50 mol / t 50 mol / t or more and 150 mol / t or less
- the total content of these end groups is more preferably 60 mol / t or more, and still more preferably 80 mol / t or more.
- the terminal-modified polyamide resin by containing a total of 150 mol / t or less of amino terminal groups and carboxyl terminal groups in the terminal-modified polyamide resin, thermal decomposition of the structure represented by the above general formula (I) in the terminal-modified polyamide resin at the time of melt residence.
- the total content of these end groups is more preferably 135 mol / t or less, and still more preferably 120 mol / t or less.
- the terminal-modified polyamide resin of the present invention has a ratio of amino end group content [mol / t] to carboxyl end group content [mol / t] (amino end group content / carboxyl end group content). ) Is preferably 0.5 to 2.5 (0.5 or more and 2.5 or less). As described above, the greater the difference between the amount of amino end groups and the amount of carboxyl end groups, the more difficult the polymerization during the melt residence, and the lower the molecular weight due to thermal decomposition, the greater the decrease in the melt viscosity and molecular weight during the melt residence. Tend to be.
- thermal decomposition of the structure represented by the general formula (I) in the terminal-modified polyamide resin at the time of melt residence and reduction in molecular weight can be achieved. It can suppress more and can improve thermal stability more.
- the molar ratio (amino end group / carboxyl end group) is more preferably 0.6 or more, and even more preferably 0.8 or more.
- thermal decomposition of the structure represented by the general formula (I) in the terminal-modified polyamide resin at the time of melt residence is further suppressed.
- the molar ratio (content of amino end groups / content of carboxyl end groups) is more preferably 2.4 or less, and even more preferably 2.3 or less.
- the content of amino end groups in the terminal-modified polyamide resin is such that the terminal-modified polyamide resin is dissolved in a phenol / ethanol mixed solution (ratio: 83.5 / 16.5 mass ratio) and thymol blue is used as an indicator. It can be measured by titrating with an aqueous hydrochloric acid solution.
- the content of carboxyl end groups in the terminal-modified polyamide resin is determined by dissolving the terminal-modified polyamide resin in benzyl alcohol at a temperature of 195 ° C., using phenolphthalein as an indicator, and titrating with an ethanol solution of potassium hydroxide. Can be measured.
- the total or ratio of the content of the amino terminal group and the content of the carboxyl terminal group of the terminal-modified polyamide resin is represented by, for example, the general formula (III) described later used when manufacturing the terminal-modified polyamide resin.
- the compounding ratio of the compound for terminal modification and the compound for terminal modification represented by formula (IV) and the reaction time it can be adjusted to a desired range.
- the melting point (Tm) of the terminal-modified polyamide resin of the present invention is preferably 200 ° C. or higher.
- the melting point of the terminal-modified polyamide resin can be determined by differential scanning calorimetry (DSC). The measurement method is as follows. Weigh 5-7 mg of terminal-modified polyamide resin. In a nitrogen atmosphere, the temperature is increased from 20 ° C. to Tm + 30 ° C. at a rate of temperature increase of 20 ° C./min. Subsequently, the temperature is decreased to 20 ° C. at a temperature decrease rate of 20 ° C./min. The temperature at the top of the endothermic peak that appears when the temperature is raised again from 20 ° C. to Tm + 30 ° C. at a rate of temperature increase of 20 ° C./min is defined as the melting point (Tm).
- the terminal-modified polyamide resin having a melting point of 200 ° C. or more has the structure represented by the general formula (I) and the structure represented by the general formula (II) at the ends of the following polyamides and copolymers thereof. Things. Two or more of these may be used depending on the required properties such as heat resistance, toughness, and surface properties.
- Polyamides include polycaproamide (polyamide 6), polyundecanamide (polyamide 11), polydodecanamide (polyamide 12), polyhexamethylene adipamide (polyamide 66), polytetramethylene adipamide (polyamide 46), Polypentamethylene adipamide (polyamide 56), polytetramethylene sebacamide (polyamide 410), polypentamethylene sebacamide (polyamide 510), polyhexamethylene sebacamide (polyamide 610), polyhexamethylene dodecamide ( Polyamide 612), polydecamethylene sebacamide (nylon 1010), polydecamethylene dodecamide (nylon 1012), polymetaxylylene adipamide (MXD6), polymetaxylylene sebacamide (MXD10), polypara Silylene sebacamide (PXD10), polynonamethylene terephthalamide (nylon 9T), polydecamethylene terephthalamide (polyamide 10T), polyundecamethylene
- the terminal-modified polyamide resin of the present invention has a relative viscosity ( ⁇ r) at 25 ° C. of a 98% sulfuric acid solution having a resin concentration of 0.01 g / ml in a range of 1.3 to 3.0 (1.3 to 3.0). It is preferable that By setting ⁇ r to 1.3 or more, toughness can be improved.
- the relative viscosity ( ⁇ r) is preferably 1.4 or more, and more preferably 1.5 or more.
- the moldability can be further improved. 2.5 or less is preferable and 2.1 or less is more preferable. 2.05 or less is more preferable, and 2.0 or less is most preferable.
- the relative viscosity of the terminal-modified polyamide resin is represented by, for example, a compound for terminal modification represented by the general formula (III) described later and the general formula (IV) used when producing the terminal-modified polyamide resin. It can be adjusted to a desired range by adjusting the blending amount of the compound for terminal modification and the reaction time.
- the weight average molecular weight (Mw) measured by gel permeation chromatography (GPC) of the terminal-modified polyamide resin of the present invention is preferably 15,000 or more. By setting Mw to 15,000 or more, the mechanical characteristics can be further improved. Mw is more preferably 18,000 or more, and further preferably 20,000 or more. Further, Mw is preferably 50,000 or less. By setting Mw to 50,000 or less, the melt viscosity can be further reduced and the molding processability can be further improved. Mw is more preferably 45,000 or less, and further preferably 40,000 or less.
- the weight average molecular weight (Mw) in the present invention was determined using hexafluoroisopropanol (added 0.005N-sodium trifluoroacetate) as a solvent, and Shodex HFIP-806M (two) and HFIP-LG as columns. It is obtained by GPC measurement at a temperature of 30 ° C. Polymethyl methacrylate is used as a molecular weight reference material.
- the weight average molecular weight of the terminal-modified polyamide resin is represented by, for example, a compound for terminal modification represented by the general formula (III) described later and the general formula (IV) used when producing the terminal-modified polyamide resin. It can be adjusted to a desired range by adjusting the blending amount of the compound for terminal modification and the reaction time.
- the terminal-modified polyamide resin of the present invention preferably has a melt viscosity of 30 Pa ⁇ s or less under the conditions of a melting point + 60 ° C. and a shear rate of 9728 sec ⁇ 1 .
- the melt viscosity is more preferably 20 Pa ⁇ s or less, further preferably 15 Pa ⁇ s or less, and further preferably 10 Pa ⁇ s or less.
- the melt viscosity is more preferably 0.1 Pa ⁇ s or more, further preferably 0.5 or more, and most preferably 1.0 or more.
- the melt viscosity is measured with a capillary flow meter under the condition of a shear rate of 9728 sec ⁇ 1 after being retained for 5 minutes in order to melt the end-modified polyamide resin at a temperature of the melting point of the end-modified polyamide resin + 60 ° C. be able to.
- the melting point + 60 ° C. is selected as a temperature condition in which the effect of good fluidization of the melt is likely to appear and the thermal decomposition does not proceed easily in a short residence time, complex, thin-walled, was selected 9728Sec -1 as the shear rate is high shear conditions assuming the molded lightweight moldings.
- the melt viscosity of the terminal-modified polyamide resin is represented by, for example, a compound for terminal modification represented by the general formula (III) described later and the general formula (IV) used when producing the terminal-modified polyamide resin. It can be adjusted to a desired range by adjusting the blending amount of the compound for terminal modification and the reaction time.
- the terminal-modified polyamide resin of the present invention has a content retention of the terminal structure represented by the general formula (I) ((content after residence / content before residence)) before and after residence for 60 minutes under the condition of melting point + 60 ° C. 100) is preferably 80% or more.
- the content retention rate of the terminal structure represented by the general formula (I) is more preferably 85% or more, and further preferably 90% or more.
- the content retention of the terminal structure represented by the general formula (I) is preferably 100% or less.
- the content retention rate of the terminal-modified polyamide resin was determined by determining the content of the terminal structure represented by the general formula (I) by the above-mentioned 1 H-NMR measurement, and then in the capillary flow meter, the terminal modification After retaining for 60 minutes at the melting point of the polyamide resin + 60 ° C., the content of the terminal structure represented by the general formula (I) is similarly determined, and the terminal structure represented by the general formula (I) before the melt residence It can be calculated by dividing by the content of and multiplying by 100.
- the melting point + 60 ° C. was selected as a temperature condition in which the effect of good fluidization of the melt is likely to appear and the thermal decomposition does not proceed easily in a short stay.
- the content retention rate of the terminal structure represented by the general formula (I) in the terminal-modified polyamide resin is expressed by, for example, the general formula (III) described later used when manufacturing the terminal-modified polyamide resin.
- the terminal-modified polyamide resin of the present invention has a weight average molecular weight retention ratio ((weight average molecular weight after residence / weight average molecular weight before residence) ⁇ 100) before and after residence for 60 minutes under the condition of melting point + 60 ° C. 80 to 120% (80% It is preferably 120% or less).
- the weight average molecular weight retention is more preferably 85% or more, and still more preferably 90% or more.
- the weight average molecular weight retention is more preferably 115% or less, and even more preferably 110% or less.
- this weight molecular weight retention rate measured the weight average molecular weight about the terminal modified polyamide resin by the above-mentioned gel permeation chromatography (GPC), and then the melting point of the terminal modified polyamide resin in the capillary flow meter + 60 ° C. After the residence at temperature for 60 minutes, the weight average molecular weight is measured in the same manner, and is calculated by dividing by the weight average molecular weight before the melt residence and multiplying by 100.
- the melting point + 60 ° C. was selected as a temperature condition in which the effect of good fluidization of the melt is likely to appear and the thermal decomposition does not proceed easily in a short stay.
- the weight average molecular weight retention of the terminal-modified polyamide resin is, for example, a compound for terminal modification represented by the general formula (III) described later and the general formula (IV) used when producing the terminal-modified polyamide resin. It can adjust to the desired range by adjusting the compounding quantity and reaction time of the compound for terminal modification
- the terminal-modified polyamide resin of the present invention has a melt viscosity retention ratio ((melt viscosity after residence / melt viscosity before residence) ⁇ 100) before and after residence for 60 minutes under the condition of melting point + 60 ° C. (80% to 120%). Or less).
- the melt viscosity retention rate is more preferably 85% or more, more preferably 90% or more, and still more preferably 95% or more.
- the melt viscosity retention rate is 120% or less, molding processability can be further improved.
- the melt viscosity retention is more preferably 115% or less, and even more preferably 110% or less.
- This melt viscosity retention rate was determined by a capillary flow meter at a temperature of the melting point of the terminal-modified polyamide resin + 60 ° C., after being retained for 5 minutes in order to melt the terminal-modified polyamide resin, and under a shear rate of 9728 sec ⁇ 1 . After the terminal-modified polyamide resin was retained for 60 minutes at the measured melt viscosity (melt viscosity before retention) and the melting point of the terminal-modified polyamide resin + 60 ° C., a capillary flow meter was used under the condition of a shear rate of 9728 sec ⁇ 1 .
- melt viscosity after residence From the measured melt viscosity (melt viscosity after residence), it can be calculated by (melt viscosity after residence / melt viscosity before residence) ⁇ 100.
- the melting point + 60 ° C. is selected as a temperature condition where the effect of good fluidization of the melt is likely to appear, and the thermal decomposition is difficult to proceed in a short stay
- 9728 sec ⁇ 1 was selected as the shear rate, which is a high shear condition assuming molding of a compact, complex, thin, and lightweight molded product.
- the melt viscosity retention rate of the terminal-modified polyamide resin is, for example, the compound for terminal modification represented by the general formula (III) described later and the general formula (IV) used when producing the terminal-modified polyamide resin. It can be adjusted to a desired range by adjusting the blending amount of the terminal-modifying compound represented and the reaction time.
- the terminal-modified polyamide resin of the present invention preferably has a mass reduction rate of 4% or less before and after residence for 40 minutes under a melting point + 60 ° C. in a nitrogen atmosphere.
- the mass reduction rate is more preferably 3% or less, and further preferably 2% or less.
- the mass reduction rate can be measured using a thermogravimetric analyzer (TGA).
- TGA thermogravimetric analyzer
- the melting point + 60 ° C. was selected as a temperature condition in which the effect of good fluidization of the melt is likely to appear and the thermal decomposition is difficult to proceed with a short stay.
- the mass reduction rate of the terminal-modified polyamide resin is represented by, for example, a compound for terminal modification represented by the general formula (III) described later and the general formula (IV) used when producing the terminal-modified polyamide resin. It can be adjusted to the desired range depending on the blending amount of the compound for terminal modification and the reaction time.
- the terminal-modified polyamide resin of the present invention for example, (1) A method of melting and kneading a polyamide resin, a compound for terminal modification, and if necessary, other components at a melting point or higher of the polyamide resin and reacting them, or mixing them in a solution and reacting them. And (2) a raw material constituting the main structural unit of the polyamide resin, a compound for terminal modification, and a method of adding and reacting other components as necessary (addition method during reaction).
- Examples of the compound for terminal modification of the present invention include compounds for terminal modification represented by the following general formula (III).
- m represents a range of 2 to 100.
- 5 or more is preferable, 8 or more is more preferable, and 16 or more is more preferable.
- m is preferably 70 or less, and more preferably 50 or less.
- R 1 represents a divalent hydrocarbon group having 2 to 10 carbon atoms
- R 2 represents a monovalent hydrocarbon group having 1 to 30 carbon atoms. Examples thereof include those exemplified as R 1 and R 2 in the general formula (I).
- X′— represents —NH—, —N (CH 3 ) — or —O (C ⁇ O) —.
- -NH- which is excellent in reactivity with the terminal of the polyamide, is more preferable.
- R 3 represents a monovalent hydrocarbon group having 1 to 30 carbon atoms. Similarly to the general formula (II), R 3 is more preferably a monovalent saturated hydrocarbon group from the viewpoint of thermal stability of the terminal-modified polyamide resin and prevention of coloring.
- X ′ in the general formula (III) is —NH— or —N (CH 3 ) —
- —Y′— in the general formula (IV) represents —O (C ⁇ O) —
- Y ′ in the general formula (IV) represents —NH— or —N (CH 3 ) —.
- the number average molecular weight of the compound for terminal modification represented by the general formula (III) is preferably 500 to 10,000.
- the melt viscosity can be further reduced. More preferably, it is 800 or more, More preferably, it is 900 or more.
- the number average molecular weight is 10,000 or less, the affinity with the main structural unit of the polyamide resin can be further improved. More preferably, it is 5000 or less, More preferably, it is 2500 or less, More preferably, it is 1500 or less.
- terminal modification compound represented by the general formula (III) examples include methoxypoly (ethylene glycol) amine, methoxypoly (trimethylene glycol) amine, methoxypoly (propylene glycol) amine, and methoxypoly (tetramethylene glycol) amine. , Methoxy poly (ethylene glycol) poly (propylene glycol) amine, methoxy poly (ethylene glycol) carboxylic acid, methoxy poly (trimethylene glycol) carboxylic acid, methoxy poly (propylene glycol) carboxylic acid, methoxy poly (tetramethylene glycol) carboxylic acid, methoxy poly (ethylene Glycol) poly (propylene glycol) carboxylic acid and the like.
- two types of polyalkylene glycols When two types are included, they may have a block polymerization structure or a random copolymer structure. You may use 2 or more types of above-mentioned terminal modification compounds.
- Examples of the compound for terminal modification of the present invention include a compound for terminal modification represented by the following general formula (IV).
- Specific examples of the terminal modification compound represented by the general formula (IV) include acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, undecanoic acid, lauric acid, tridecane.
- Aliphatic monocarboxylic acids such as acid, myristic acid, myristic acid, palmitic acid, stearic acid, oleic acid, linoleic acid, arachidic acid, and serotic acid, and cycloaliphatic monocarboxylic acids such as cyclohexanecarboxylic acid and methylcyclohexanecarboxylic acid , Aromatic monocarboxylic acids such as benzoic acid, toluic acid, ethylbenzoic acid, phenylacetic acid, methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, heptylamine, octylamine, 2-ethylhexylamine, nonylamine, Decylamine, Undeci Aliphatic monoamines such as amine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine,
- the terminal-modified polyamide resin of the present invention has a terminal structure represented by the general formula (I) and a terminal structure represented by the general formula (II).
- An example of the method will be described. The methods (1) and (2) have been described above, but will be described in more detail below.
- the melt-kneading temperature is 10 ° C. or more and 40 ° C. or less higher than the melting point (Tm) of the polyamide resin. It is preferable to react.
- Tm melting point
- the cylinder temperature of an extruder shall be the said range.
- polyamide resin examples include the polyamide resins described above.
- a melt polymerization method in which the reaction is performed at a temperature higher than the melting point of the polyamide resin; Any solid phase polymerization method may be used.
- the raw material that gives the polyamide resin include the aforementioned amino acids, lactams, and “mixtures of diamine and dicarboxylic acid”.
- the raw material of the terminal-modified polyamide resin is charged into a reaction vessel, purged with nitrogen, and reacted by heating. If the reaction time at this time is too short, not only the molecular weight does not increase, but also the oligomer component increases, so the mechanical properties may decrease. Therefore, it is preferable that the nitrogen flow time in the reaction time is 15 minutes or more. On the other hand, if the reaction time is too long, thermal decomposition proceeds and coloration or the like occurs. Therefore, the nitrogen flow time in the reaction time is preferably 8 hours or less.
- a polymerization accelerator When producing a terminal-modified polyamide resin by a method in which a polyamide resin raw material and a compound for terminal modification are reacted at the time of polymerization, a polymerization accelerator can be added as necessary.
- the polymerization accelerator for example, phosphoric acid, phosphorous acid, hypophosphorous acid, pyrophosphoric acid, polyphosphoric acid and inorganic phosphorus compounds such as alkali metal salts and alkaline earth metal salts thereof are preferable. Sodium acid and sodium hypophosphite are preferably used.
- the polymerization accelerator is preferably used in the range of 0.001 to 1 part by mass with respect to 100 parts by mass of the polyamide resin raw material (excluding the compound for terminal modification). By setting the addition amount of the polymerization accelerator to 0.001 to 1 part by mass, a terminal-modified polyamide resin having an excellent balance between mechanical properties and moldability can be obtained.
- a polyamide resin composition containing a terminal-modified polyamide resin can be obtained by blending the terminal-modified polyamide resin of the present invention with fillers, other types of polymers, various additives, and the like.
- any material generally used as a filler for resin can be used, and the strength, rigidity, heat resistance and dimensional stability of a molded product obtained from the polyamide resin composition can be further improved.
- the filler include glass fiber, carbon fiber, potassium titanate whisker, zinc oxide whisker, aluminum borate whisker, aramid fiber, alumina fiber, silicon carbide fiber, ceramic fiber, asbestos fiber, stone koji fiber, and metal fiber.
- Fibrous inorganic filler wollastonite, zeolite, sericite, kaolin, mica, talc, clay, pyrophyllite, bentonite, montmorillonite, asbestos, aluminosilicate, alumina, silicon oxide, magnesium oxide, zirconium oxide, titanium oxide, oxidation Iron, calcium carbonate, magnesium carbonate, dolomite, calcium sulfate, barium sulfate, magnesium hydroxide, calcium hydroxide, aluminum hydroxide, glass beads, ceramic beads, boron nitride, silicon carbide, silica, etc.
- a coupling agent such as an isocyanate compound, an organic silane compound, an organic titanate compound, an organic borane compound, or an epoxy compound.
- a coupling agent such as an isocyanate compound, an organic silane compound, an organic titanate compound, an organic borane compound, or an epoxy compound.
- montmorillonite an organic montmorillonite obtained by cation exchange of interlayer ions with an organic ammonium salt may be used.
- fibrous inorganic fillers are preferable, and glass fibers and carbon fibers are more preferable.
- polymers include, for example, polyolefins such as polyethylene and polypropylene, elastomers such as polyamide elastomer and polyester elastomer, polyester, polycarbonate, polyphenylene ether, polyphenylene sulfide, liquid crystal polymer, polysulfone, polyethersulfone, ABS resin, SAN Examples thereof include resins and polystyrene. Two or more of these may be contained.
- a modified polyolefin such as a (co) polymer of an olefin compound and / or a conjugated diene compound, a polyamide elastomer, a polyester elastomer, etc.
- An impact resistance improver is preferably used.
- Examples of (co) polymers of olefin compounds and / or conjugated diene compounds include ethylene copolymers, conjugated diene polymers, conjugated diene-aromatic vinyl hydrocarbon copolymers, and the like.
- Examples of the ethylene copolymer include copolymers of ethylene and ⁇ -olefins having 3 or more carbon atoms, non-conjugated dienes, vinyl acetate, vinyl alcohol, ⁇ , ⁇ -unsaturated carboxylic acids and derivatives thereof. Can be mentioned.
- Examples of the ⁇ -olefin having 3 or more carbon atoms include propylene and butene-1.
- Examples of the non-conjugated diene include 5-methylidene-2-norbornene, 5-ethylidene-2-norbornene, dicyclopentadiene, 1,4-hexadiene, and the like.
- Examples of the ⁇ , ⁇ -unsaturated carboxylic acid include acrylic acid, methacrylic acid, ethacrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, and butenedicarboxylic acid.
- Examples of the derivatives of ⁇ , ⁇ -unsaturated carboxylic acids include alkyl esters, aryl esters, glycidyl esters, acid anhydrides, imides and the like of the ⁇ , ⁇ -unsaturated carboxylic acids.
- the conjugated diene polymer refers to at least one conjugated diene polymer.
- the conjugated diene include 1,3-butadiene, isoprene (2-methyl-1,3-butadiene), 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, and the like. Further, some or all of the unsaturated bonds of these polymers may be reduced by hydrogenation.
- the conjugated diene-aromatic vinyl hydrocarbon copolymer refers to a copolymer of conjugated diene and aromatic vinyl hydrocarbon, and may be a block copolymer or a random copolymer.
- Examples of the conjugated diene include 1,3-butadiene and isoprene.
- Examples of the aromatic vinyl hydrocarbon include styrene.
- a part or all of unsaturated bonds other than double bonds other than the aromatic ring of the conjugated diene-aromatic vinyl hydrocarbon copolymer may be reduced by hydrogenation.
- impact modifiers include ethylene / methacrylic acid copolymers and some or all of the carboxylic acid moieties in these copolymers as salts with sodium, lithium, potassium, zinc, calcium, Examples include ethylene / propylene-g-maleic anhydride copolymer, ethylene / butene-1-g-maleic anhydride copolymer, and the like.
- additives include, for example, antioxidants and heat stabilizers (hindered phenols, hydroquinones, phosphites and their substitutes, copper halides, iodine compounds, etc.), weathering agents (resorcinols, salicylates).
- antioxidants and heat stabilizers hindered phenols, hydroquinones, phosphites and their substitutes, copper halides, iodine compounds, etc.
- weathering agents resorcinols, salicylates.
- Benzotriazole series, benzophenone series, hindered amine series, etc.), mold release agents and lubricants aliphatic alcohol, aliphatic amide, aliphatic bisamide, bisurea, polyethylene wax, etc.
- pigments cadmium sulfide, phthalocyanine, carbon black, etc.
- Dye nigrosine, aniline black, etc.
- plasticizer octyl p-oxybenzoate, N-butylbenzenesulfonamide, etc.
- antistatic agent alkyl sulfate type anionic antistatic agent, quaternary ammonium salt type cationic charging
- Inhibitor polyoxyethylene Nonionic antistatic agents such as rubitan monostearate, betaine amphoteric antistatic agents, etc.
- flame retardants hydramines such as melamine cyanurate, magnesium hydroxide, aluminum hydroxide, ammonium polyphosphate, brominated polystyrene
- terminal-modified polyamide resin of the present invention and the polyamide resin composition using the same are molded into a desired shape by any melt molding method such as injection molding, extrusion molding, blow molding, vacuum molding, melt spinning, and film molding. be able to. Molded products obtained by molding terminal-modified polyamide resins and polyamide resin compositions using the same are, for example, resin molded products such as electric / electronic equipment parts, automobile parts, mechanical parts, fibers such as clothing and industrial materials, It can be used as a film for packaging and magnetic recording.
- [Amino terminal group amount [NH 2 ]] 0.5 g of the end-modified polyamide resin or polyamide resin obtained in each example and comparative example was precisely weighed, and 25 ml of a phenol / ethanol mixed solution (ratio: 83.5 / 16.5 mass ratio) was added and dissolved at room temperature. Then, titration with 0.02 N hydrochloric acid was performed using thymol blue as an indicator to determine the amino terminal group amount (mol / t).
- terminal-modified polyamide resin or polyamide resin obtained in Examples and Comparative Examples was subjected to 1 H-NMR measurement using FT-NMR JNM-AL400 manufactured by JEOL Ltd. First, a solution having a sample concentration of 50 mg / mL was prepared using deuterated sulfuric acid as a measurement solvent. The polyamide resin was subjected to 1 H-NMR measurement at a cumulative number of 256 times.
- the integrated intensity of each peak is calculated, and the content [I] of the terminal structure represented by the general formula (I) in the terminal-modified polyamide resin is calculated from the calculated integrated intensity and the number of hydrogen atoms in each structural unit.
- mol / t, mass%) (content before residence) and content [II] (mol / t, mass%) of the terminal structure represented by the general formula (II) were calculated.
- melt viscosity The terminal-modified polyamide resin or polyamide resin obtained in each example and comparative example was dried in an 80 ° C. vacuum dryer for 12 hours or more.
- a capillary flow meter Capillograph 1C type, manufactured by Toyo Seiki Seisakusho Co., Ltd.
- melt viscosity melt viscosity before residence
- the measurement was carried out after being retained for 5 minutes. It shows that it has high fluidity, so that the value of this melt viscosity is small.
- melt viscosity retention [%] was calculated by (melt viscosity after residence / melt viscosity before residence) ⁇ 100.
- the terminal-modified polyamide resin or polyamide resin obtained in each example and comparative example was dried in an 80 ° C. vacuum dryer for 12 hours or more. Using a capillary flow meter (manufactured by 0 Toyo Seiki Seisakusho Co., Ltd., Capillograph Model 1C), melt residence was performed at an melting point of + 60 ° C. for 60 minutes with an orifice having a diameter of 0.5 mm and a length of 5 mm. About the terminal modified polyamide resin or polyamide resin after melt residence, the weight average molecular weight (Mw) (weight average molecular weight after residence) was measured by GPC measurement similar to the molecular weight measurement method described above.
- Mw weight average molecular weight after residence
- the content of the terminal structure represented by the general formula (I) in the terminal-modified polyamide resin by 1 H-NMR measurement similar to the above-described terminal structure content measurement method [ I] (mol / t) (content after residence) was calculated.
- Content of terminal structure represented by general formula (I) [I] (mol / t) (content before residence) and content of terminal structure represented by general formula (I) measured by the above method [ I] The content retention was calculated from (mol / t) (content after residence) (content after residence / content before residence) ⁇ 100.
- the terminal-modified polyamide resin or polyamide resin obtained in each example and comparative example was dried in an 80 ° C. vacuum dryer for 12 hours or more.
- the cylinder temperature is three types of melting point (Tm) of terminal-modified polyamide resin or polyamide resin + 5 ° C, + 10 ° C, + 15 ° C, and the mold temperature is 80 ° C.
- An ASTM No. 4 dumbbell with a test piece thickness of 1/25 inch (about 1.0 mm) was injection molded under the molding cycle conditions of a total injection time and pressure holding time of 10 seconds and a cooling time of 10 seconds. When injection molding was carried out 5 times and all of the molded pieces could be collected 5 times, ⁇ was given when the mold was insufficiently filled or the molded product could not be collected even once in 5 times.
- dumbbell-shaped test piece was subjected to “Tensilon” (registered trademark) UTA-2.5T (manufactured by Orientec Co., Ltd.) and in an atmosphere of 23 ° C. and 50% humidity according to ASTM-D638.
- a tensile test was performed at a strain rate of 10 mm / min to measure the tensile elongation at break.
- ⁇ ⁇ -Caprolactam Wako Special Grade, manufactured by Wako Pure Chemical Industries, Ltd.
- Hexamethylenediamine Wako Pure Chemical Industries, Ltd. Wako first grade.
- Adipic acid Wako Pure Chemical Industries, Ltd. Wako Special Grade.
- ⁇ Sebacic acid Wako first grade manufactured by Wako Pure Chemical Industries, Ltd.
- Methoxypoly (ethylene glycol) poly (propylene glycol) amine represented by the following structural formula (Chemical Formula 2): “JEFFAMINE” (registered trademark) M2070 (number average molecular weight Mn2000) manufactured by HUNTSMAN.
- Methoxyethylene glycol poly (propylene glycol) amine represented by the following structural formula (Chemical Formula 3): “JEFFAMINE” (registered trademark) M600 (number average molecular weight Mn600) manufactured by HUNTSMAN.
- Example 1 A reaction vessel was charged with 20 g of ⁇ -caprolactam, 20 g of ion-exchanged water, 1.6 g of “JEFFAMINE” M1000, and 0.14 g of benzoic acid, and the atmosphere was replaced with nitrogen.
- the set temperature of the heater on the outer periphery of the reaction vessel was set to 290 ° C., and heating was started. After the internal pressure of the can reached 1.0 MPa, the internal pressure of the can was maintained at 1.0 MPa while releasing moisture out of the system, and the temperature was increased until the internal temperature of the can reached 240 ° C.
- the heater set temperature was changed to 270 ° C., and the internal pressure of the can was adjusted to normal pressure over 1 hour (can internal temperature when reaching normal pressure: 243 ° C.) .
- nitrogen was allowed to flow in the can (nitrogen flow) for 240 minutes to obtain a terminal-modified polyamide 6 resin (maximum temperature reached: 253 ° C.).
- the obtained terminal-modified polyamide 6 resin was subjected to Soxhlet extraction with ion-exchanged water to remove the unreacted terminal-modifying compound.
- the terminal-modified polyamide 6 resin thus obtained had a relative viscosity of 1.81, a weight average molecular weight of 30,000, a melting point (Tm) of 220 ° C., and a melt viscosity of 5.5 Pa ⁇ s. Further, the obtained terminal-modified polyamide 6 resin contained a terminal-modified polyamide 6 resin having a structure represented by the following chemical formula 4 and a structure represented by the following chemical formula 5 at its ends. Other physical properties are shown in Table 1-1 and Table 1-2.
- Examples 2 to 26, 32 to 35, Comparative Examples 1 to 6 Example except that the raw material was changed to the composition shown in the table and the internal pressure of the can was changed to normal pressure, and then the time (nitrogen flow time) held while flowing nitrogen into the can was changed to the time shown in the table.
- a polyamide 6 resin was obtained.
- the polyamide resins obtained in Examples 2 to 9, 14 to 26, and Comparative Examples 1 to 4 are terminal-modified having a structure represented by the following chemical formula 4 and a structure represented by the following chemical formula 5. It contained polyamide 6 resin.
- polyamide resins obtained in Examples 10 to 12 contained a structure represented by the following chemical formula 6 and a terminal-modified polyamide 6 resin having a structure represented by the following chemical formula 5 at its terminal.
- the polyamide resin obtained in Example 13 contained a terminal-modified polyamide 6 resin having a structure represented by the following chemical formula 7 and a structure represented by the following chemical formula 5 at its ends.
- the polyamide resin obtained in Comparative Example 6 contained a terminal-modified polyamide 6 resin having a structure represented by the following chemical formula 4 at its terminal.
- the polyamide resin obtained in Comparative Example 5 contained a terminal-modified polyamide 6 resin having a terminal structure having the structure represented by the following chemical formula 5.
- Example 27 Example except that the raw material was changed to the composition shown in the table and the internal pressure of the can was changed to normal pressure, and then the time (nitrogen flow time) held while flowing nitrogen into the can was changed to the time shown in the table.
- a polyamide 6 resin was obtained.
- the terminal-modified polyamide resin obtained in Example 27 contained a terminal-modified polyamide 6 resin having a structure represented by the following chemical formula 4 and a structure represented by the following chemical formula 8 at its ends.
- Example 28 and 29 Example except that the raw material was changed to the composition shown in the table and the internal pressure of the can was changed to normal pressure, and then the time (nitrogen flow time) held while flowing nitrogen into the can was changed to the time shown in the table.
- a polyamide 6 resin was obtained.
- the terminal-modified polyamide resin obtained in Examples 28 and 29 includes a terminal-modified polyamide 6 resin having a structure represented by the following chemical formula 4 and a structure represented by the following chemical formula 9 at the terminal. It was.
- Example 30 Example except that the raw material was changed to the composition shown in the table and the internal pressure of the can was changed to normal pressure, and then the time (nitrogen flow time) held while flowing nitrogen into the can was changed to the time shown in the table.
- a polyamide 6 resin was obtained.
- the obtained terminal-modified polyamide resin contained a terminal-modified polyamide 6 resin having a structure represented by the following chemical formula 4 and a structure represented by the following chemical formula 10 at its ends.
- Example 31 Comparative Examples 8 and 9 Example except that the raw material was changed to the composition shown in the table and the internal pressure of the can was changed to normal pressure, and then the time (nitrogen flow time) held while flowing nitrogen into the can was changed to the time shown in the table.
- a polyamide 6 resin was obtained.
- the obtained terminal-modified polyamide resin contained a terminal-modified polyamide 6 resin having a structure represented by the following chemical formula 6 and a structure represented by the following chemical formula 10 at its ends.
- Example 36 9.46 g of hexamethylenediamine, 11.92 g of adipic acid, 20 g of ion-exchanged water, 1.6 g of “JEFFAMINE” M1000, and 0.14 g of benzoic acid were charged in a reaction vessel and sealed and purged with nitrogen. The set temperature of the heater on the outer periphery of the reaction vessel was set to 290 ° C., and heating was started. After the internal pressure of the can reached 1.75 MPa, the internal pressure of the can was maintained at 1.75 MPa while releasing water out of the system, and the temperature was increased until the internal temperature of the can reached 260 ° C.
- the set temperature of the heater was changed to 290 ° C., and the internal pressure of the can was adjusted to be normal pressure over 1 hour (internal temperature at the time of reaching normal pressure: 270 ° C.). .
- nitrogen was allowed to flow in the can (nitrogen flow) for 240 minutes to obtain a terminal-modified polyamide 66 resin (maximum temperature reached: 275 ° C.).
- the obtained polyamide resin contained a terminal-modified polyamide 66 resin having a structure represented by the following chemical formula 4 and a structure represented by the following chemical formula 5 at its ends.
- Example 37 Hexamethylenediamine 7.74 g, sebacic acid 13.46 g, ion-exchanged water 20 g, “JEFFAMINE” M1000 1.6 g, and benzoic acid 0.14 g were charged in a reaction vessel, sealed, and purged with nitrogen. The set temperature of the heater on the outer periphery of the reaction vessel was set to 290 ° C., and heating was started. After the internal pressure of the can reached 1.0 MPa, the internal pressure of the can was maintained at 1.0 MPa while releasing moisture out of the system, and the temperature was increased until the internal temperature of the can reached 240 ° C.
- the heater set temperature was changed to 290 ° C., and the internal pressure of the can was adjusted to be normal pressure over one hour (can internal temperature when normal pressure reached: 243 ° C.). .
- nitrogen was allowed to flow in the can (nitrogen flow) for 240 minutes to obtain a terminal-modified polyamide 610 resin (maximum temperature reached: 253 ° C.).
- the obtained polyamide resin contained a terminal-modified polyamide 610 resin having a structure represented by the following chemical formula 4 and a structure represented by the following chemical formula 5 at its ends.
- Example 1 and Comparative Examples 2 and 5 it is found that when the content of the terminal structure represented by the general formula (I) is lowered, the melt fluidity is lowered and the molding processability is inferior. From the comparison between Example 1 and Comparative Examples 3 and 6, it can be seen that when the content of the terminal structure represented by the general formula (II) is decreased, the thermal stability and mechanical properties during the melt residence are decreased.
- Example 9 From the comparison between Example 9 and Example 14, Examples 2, 23 and 25 and Example 15, the content [I] of the terminal structure represented by the general formula (I) and the general formula (II) It can be seen that the thermal stability and mechanical characteristics during the melt residence can be further improved by setting the total amount ([I] + [II]) of the content [II] of the terminal structure to 250 mol / t or less. On the other hand, by comparing Examples 1, 3 to 5, 8, 24, 26 and Examples 16, 32, 33, the total amount of terminal structure ([I] + [II]) was set to 60 mol / t or more. It can be seen that the decrease in the molecular weight retention during the melt residence can be further suppressed, and the thermal stability and the moldability during the melt residence can be further improved.
- the total amount of the amino terminal group amount [NH 2 ] and the carboxyl terminal group amount [COOH] is 50 mol / t or more, thereby further improving the thermal stability during melt residence.
- the total amount of amino terminal group amount [NH 2 ] and carboxyl terminal group amount [COOH] was set to 150 mol / t or less, so that heat stability during melt residence was achieved. It can be seen that the properties and mechanical properties can be further improved.
- the thermal stability during the melt residence can be further improved by setting the molar ratio [NH 2 ] / [COOH] to 0.5 or more.
- the thermal stability during melt residence is further improved by setting the molar ratio [NH 2 ] / [COOH] to 2.5 or less. I can see that
- the terminal-modified polyamide resin of the present invention can be molded into a desired shape by any molding method such as injection molding, extrusion molding, blow molding, vacuum molding, melt spinning, and film molding. Molded products obtained by molding terminal-modified polyamide resins are used as resin molded products such as electrical and electronic equipment parts, automobile parts and machine parts, fibers for clothing and industrial materials, and films for packaging and magnetic recording. can do.
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Abstract
Description
[1]下記一般式(I)で表される末端構造を1~20質量%および下記一般式(II)で表される末端構造を0.1~5質量%含有する末端変性ポリアミド樹脂。
-X-(R1-O)m-R2 (I)
上記一般式(I)中、mは2~100の範囲を表す。R1は炭素数2~10の2価の炭化水素基、R2は炭素数1~30の1価の炭化水素基を表す。-X-は-NH-、-N(CH3)-または-(C=O)-を表す。一般式(I)中に含まれるm個のR1は同じでも異なってもよい。
-Y-R3 (II)
上記一般式(II)中、R3は炭素数1~30の1価の炭化水素基を表す。前記一般式(I)におけるXが-NH-または-N(CH3)-の場合、上記一般式(II)における-Y-は-(C=O)-を表し、前記一般式(I)におけるXが-(C=O)-の場合、上記一般式(II)におけるYは-NH-または-N(CH3)-を表す。
[2]前記末端変性ポリアミド樹脂中、前記一般式(I)で表される末端構造と前記一般式(II)で表される末端構造を合計60~250[mol/t]含有し、かつ前記一般式(I)で表される末端構造の含有量[mol/t]と前記一般式(II)で表される末端構造の含有量[mol/t]の比((I)/(II))が0.3~2.5である[1]に記載の末端変性ポリアミド樹脂。
[3]前記末端変性ポリアミド樹脂中、アミノ末端基とカルボキシル末端基を合計50~150[mol/t]含有し、かつアミノ末端基の含有量[mol/t]とカルボキシル末端基の含有量[mol/t]の比(アミノ末端基/カルボキシル末端基)が0.5~2.5である[1]または[2]に記載の末端変性ポリアミド樹脂。
[4]樹脂濃度0.01g/mlの98%硫酸溶液の25℃における相対粘度(ηr)が1.3~3.0である[1]~[3]のいずれかに記載の末端変性ポリアミド樹脂。
[5]ゲルパーミエーションクロマトグラフィーにより測定した重量平均分子量Mwが15,000~50,000である[1]~[4]のいずれかに記載の末端変性ポリアミド樹脂。
[6]融点+60℃、せん断速度9728sec-1の条件における溶融粘度が30Pa・s以下である[1]~[5]のいずれかに記載の末端変性ポリアミド樹脂。
[7]融点+60℃の条件下60分間滞留前後における、前記一般式(I)で表される末端構造の含有量保持率((滞留後含有量/滞留前含有量)×100)が80%以上である[1]~[6]のいずれかに記載の末端変性ポリアミド樹脂。
[8]融点+60℃の条件下60分間滞留前後における重量平均分子量保持率((滞留後重量平均分子量/滞留前重量平均分子量)×100)が80%~120%である[1]~[7]のいずれかに記載の末端変性ポリアミド樹脂。
[9]融点+60℃の条件下60分間滞留前後における溶融粘度保持率((滞留後溶融粘度/滞留前溶融粘度)×100)が80%~120%である[1]~[8]のいずれかに記載の末端変性ポリアミド樹脂。
[10]窒素雰囲気下、融点+60℃の条件下40分間滞留前後の質量減少率が4%以下である[1]~[9]のいずれかに記載の末端変性ポリアミド樹脂。
[11]ジアミンおよびジカルボン酸からなる組み合わせ、アミノ酸、ならびにラクタムからなる群より選ばれる少なくとも1種を重合する際に、下記一般式(III)で表される末端変性用化合物をジアミン、ジカルボン酸、アミノ酸、およびラクタムの合計に対して1~20質量%、および、下記一般式(IV)で表される末端変性用化合物をジアミン、ジカルボン酸、アミノ酸およびラクタムの合計に対して0.01~5質量%含有させて、ポリアミド樹脂の末端に末端変性用化合物を結合させる[1]~[10]のいずれかに記載の末端変性ポリアミド樹脂の製造方法。
H-X’-(R1-O)m-R2 (III)
上記一般式(III)中、mは2~100の範囲を表す。R1は炭素数2~10の2価の炭化水素基、R2は炭素数1~30の1価の炭化水素基を表す。-X’-は-NH-、-N(CH3)-または-O(C=O)-を表す。一般式(III)中に含まれるm個のR1は同じでも異なってもよい。
H-Y’-R3 (IV)
上記一般式(IV)中、R3は炭素数1~30の1価の炭化水素基を表す。
前記一般式(III)におけるX’が-NH-または-N(CH3)-の場合、上記一般式(IV)における-Y’-は-O(C=O)-を表し、前記一般式(III)におけるX’が-O(C=O)-の場合、上記一般式(IV)におけるY’は-NH-または-N(CH3)-を表す。
-X-(R1-O)m-R2 (I)
上記一般式(I)中、mは2~100(2以上100以下)の範囲を表す。mが小さいほど、溶融粘度の低減効果が不十分となる。mは5以上が好ましく、8以上がより好ましく、16以上がさらに好ましい。一方、mが大きすぎると、耐熱性が不十分となる。mは70以下が好ましく、50以下がより好ましい。なお、ポリアミド樹脂の主たる構造単位に由来する特性を維持する観点から、本発明における末端変性ポリアミド樹脂は上記一般式(I)で表される構造をポリマーの末端のみに有することが好ましい。
-Y-R3 (II)
上記一般式(II)中、R3は炭素数1以上30以下の1価の炭化水素基を表す。R3の炭素数が少ないほどポリアミド樹脂の主たる構造単位との親和性に優れるため、炭素数1~30の炭化水素基であることが好ましい。具体的には、具体的には、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、トリデシル基、テトラデシル基、ペンタデシル基、ヘキサデシル基、ヘプタデシル基、オクタデシル基、ノナデシル基、イコシル基、エイコシル基、ヘンイコシル基、ヘネイコシル基、ドコシル基、トリコシル基、テトラコシル基、ペンタコシル基、ヘキサコシル基、ヘプタコシル基、オクタコシル基、ノナコシル基、トリアコンチル等の直鎖アルキル基、イソプロピル基、イソブチル基、tert-ブチル基、イソペンチル基、ネオペンチル基等の分岐鎖アルキル基、シクロペンチル基、シクロヘキシル基、シクロヘプチル基等のシクロアルキル基、フェニル基、トリル基等のアリール基、ベンジル基、2-フェニルエチル基等のアラルキル基などが挙げられる。末端変性ポリアミド樹脂の熱安定性および着色防止の観点から、R3は1価の炭素数1以上20以下の飽和炭化水素基またはアリール基であることがさらに好ましい態様である。
(1)ポリアミド樹脂、末端変性用化合物、および必要に応じてその他の成分を、ポリアミド樹脂の融点以上において溶融混練し、反応せしめる方法や、これらを溶液中において混合し、反応せしめた後に溶媒を除く方法、および
(2)ポリアミド樹脂の主たる構造単位を構成する原料、末端変性用化合物、および必要に応じてその他の成分を添加して反応させる方法(反応時添加方法)などが挙げられる。
H-X’-(R1-O)m-R2 (III)
上記一般式(III)中、mは2~100の範囲を表す。前記一般式(I)におけるmと同様に、5以上が好ましく、8以上がより好ましく、16以上がさらに好ましい。一方、mは70以下が好ましく、50以下がより好ましい。R1は炭素数2~10の2価の炭化水素基、R2は炭素数1~30の1価の炭化水素基を表す。それぞれ、一般式(I)におけるR1およびR2として例示したものが挙げられる。X’-は-NH-、-N(CH3)-または-O(C=O)-を示す。ポリアミドの末端との反応性に優れる-NH-がより好ましい。
上記一般式(IV)中、R3は炭素数1~30の1価の炭化水素基を表す。前記一般式(II)と同様に、末端変性ポリアミド樹脂の熱安定性および着色防止の観点から、R3は1価の飽和炭化水素基がさらに好ましい。前記一般式(III)におけるX’が-NH-または-N(CH3)-の場合、上記一般式(IV)における-Y’-は-O(C=O)-を表し、前記一般式(III)におけるX’が-O(C=O)-の場合、上記一般式(IV)におけるY’は-NH-または-N(CH3)-を表す。
(2)ポリアミド樹脂の原料と末端変性用化合物とを重合時に反応させる方法により末端変性ポリアミド樹脂を製造する場合には、ポリアミド樹脂の融点以上で反応させる溶融重合法、ポリアミド樹脂の融点未満で反応させる固相重合法のいずれを用いてもよい。ポリアミド樹脂を与える原料としては、前述のアミノ酸、ラクタムおよび「ジアミンとジカルボン酸との混合物」が例示される。
各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂の、樹脂濃度0.01g/mlの98%硫酸溶液について、25℃でオストワルド式粘度計を用いて相対粘度を測定した。
各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂2.5mgを、ヘキサフルオロイソプロパノール(0.005N-トリフルオロ酢酸ナトリウム添加)4mlに溶解し、得られた溶液を0.45μmのフィルターでろ過した。得られた溶液を用いて、GPC測定により数平均分子量(Mn)および重量平均分子量(Mw)(溶融滞留前重量平均分子量)を測定した。測定条件を以下に示す。
ポンプ:e-Alliance GPC system(Waters製)
検出器:示差屈折率計 Waters 2414(Waters製)
カラム:Shodex HFIP-806M(2本)+HFIP-LG
溶媒:ヘキサフルオロイソプロパノール(0.005N-トリフルオロ酢酸ナトリウム添加)
流速:1ml/min
試料注入量:0.1ml
温度:30℃
分子量基準物質:ポリメチルメタクリレート。
各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂0.5gを精秤し、フェノール/エタノール混合溶液(比率:83.5/16.5質量比)25mlを加えて室温で溶解した後、チモールブルーを指示薬として、0.02規定の塩酸で滴定してアミノ末端基量(mol/t)を求めた。
各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂0.5gを精秤し、ベンジルアルコール20mlを加えて195℃の温度で溶解した後、フェノールフタレインを指示薬として、0.02規定の水酸化カリウムのエタノール溶液を用いて、195℃の状態で滴定してカルボキシル末端基量(mol/t)を求めた。
実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂について、日本電子(株)製FT-NMR JNM-AL400を用いて1H-NMR測定を実施した。まず、測定溶媒として重水素化硫酸を用いて、試料濃度50mg/mLの溶液を調製した。積算回数256回にて、ポリアミド樹脂の1H-NMR測定を実施した。一般式(I)で表される末端構造におけるR1およびR2由来部分のピーク、一般式(II)で表される末端構造におけるR3部分由来のピークおよびポリアミド樹脂骨格の繰り返し構造単位由来のピークを同定した。各ピークの積分強度を算出し、算出した積分強度と、それぞれの構造単位中の水素原子数とから、末端変性ポリアミド樹脂における一般式(I)で表される末端構造の含有量[I](mol/t、質量%)(滞留前含有量)および一般式(II)で表される末端構造の含有量[II](mol/t、質量%)をそれぞれ算出した。
TAインスツルメント社製示差走査熱量計(DSC Q20)を用いて、各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂5~7mgを秤量し、窒素雰囲気下、20℃から昇温速度20℃/minで250℃まで昇温した。昇温したときに現れる吸熱ピークの頂点をTm(融点)とした。
各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂を、80℃真空乾燥器中で12時間以上乾燥した。溶融粘度の測定装置として、キャピラリーフローメーター((株)東洋精機製作所製、キャピログラフ1C型)を用いて、径0.5mm、長さ5mmのオリフィスにて、融点+60℃、せん断速度9728sec-1の条件で溶融粘度(滞留前溶融粘度)を測定した。ただし、末端変性ポリアミド樹脂またはポリアミド樹脂を溶融させるため、5分間滞留させた後に測定を行った。この溶融粘度の値が小さいほど、高い流動性を有することを示す。
各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂を、80℃真空乾燥器中で12時間以上乾燥した。キャピラリーフローメーター((株)東洋精機製作所製、キャピログラフ1C型)を用いて、径0.5mm、長さ5mmのオリフィスにて、融点+60℃で60分間溶融滞留後、せん断速度9728sec-1の条件で溶融粘度(滞留後溶融粘度)を測定した。前述の方法により測定した溶融粘度(滞留前溶融粘度)と溶融粘度(滞留後溶融粘度)から、(滞留後溶融粘度/滞留前溶融粘度)×100により溶融粘度保持率[%]を算出した。
各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂を、80℃真空乾燥器中で12時間以上乾燥した。キャピラリーフローメーター((株)0東洋精機製作所製、キャピログラフ1C型)を用いて、径0.5mm、長さ5mmのオリフィスにて、融点+60℃で60分間溶融滞留を行った。溶融滞留後の末端変性ポリアミド樹脂またはポリアミド樹脂について、前述の分子量測定方法と同様のGPC測定により重量平均分子量(Mw)(滞留後重量平均分子量)を測定した。前述の方法により測定した重量平均分子量(溶融滞留前重量平均分子量)と重量平均分子量(滞留後重量平均分子量)から、(滞留後重量平均分子量/滞留前重量平均分子量)×100により重量平均分子量保持率[%]を算出した。
各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂を、80℃真空乾燥器中で12時間以上乾燥した。キャピラリーフローメーター((株)東洋精機製作所製、キャピログラフ1C型)を用いて、径0.5mm、長さ5mmのオリフィスにて、融点+60℃で60分間溶融滞留を行った。溶融滞留後の末端変性ポリアミド樹脂またはポリアミド樹脂について、前述の末端構造含有量測定方法と同様の1H-NMR測定により末端変性ポリアミド樹脂における一般式(I)で表される末端構造の含有量[I](mol/t)(滞留後含有量)を算出した。前述の方法により測定した一般式(I)で表される末端構造の含有量[I](mol/t)(滞留前含有量)と一般式(I)で表される末端構造の含有量[I](mol/t)(滞留後含有量)から、(滞留後含有量/滞留前含有量)×100により含有量保持率を算出した。
各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂を、80℃真空乾燥器中で12時間以上乾燥した。任意部分を20mg切り出し、熱重量分析装置(パーキンエルマー社製、TGA7)を用い、窒素ガス雰囲気下、末端変性ポリアミド樹脂またはポリアミド樹脂の融点+60℃の温度で40分間保持し、熱処理前後の質量減少率[%]を測定した。
各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂を、80℃真空乾燥器中で12時間以上乾燥した。東芝機械(株)製IS55EPN射出成形機を用いて、シリンダー温度は、末端変性ポリアミド樹脂またはポリアミド樹脂の融点(Tm)+5℃、+10℃、+15℃の3種類とし、金型温度は80℃とし、射出時間と保圧時間は合わせて10秒、冷却時間は10秒の成形サイクル条件で、試験片厚み1/25インチ(約1.0mm)のASTM4号ダンベルを射出成形した。射出成形を5回実施し、成形片を5回全て採取できた場合は○、5回中1回でも金型への充填不十分または成形品を採取できなかった場合を×とした。
各実施例および比較例により得られた末端変性ポリアミド樹脂またはポリアミド樹脂を、80℃真空乾燥器中で12時間以上乾燥した。東芝機械(株)製IS55EPN射出成形機を用いて、シリンダー温度は、末端変性ポリアミド樹脂またはポリアミド樹脂の融点(Tm)+60℃とし、金型温度は80℃とし、射出時間と保圧時間は合わせて10秒、冷却時間は10秒の成形サイクル条件で、試験片厚み1/25インチ(約1.0mm)のASTM4号ダンベルの評価用試験片を射出成形した。得られたASTM4号ダンベル型試験片を、“テンシロン”(登録商標)UTA-2.5T(オリエンテック社製)に供し、ASTM-D638に準じて、23℃、湿度50%の雰囲気下で、歪み速度10mm/minで引張試験を行い、引張破断伸度を測定した。
実施例および比較例において、原料は以下に示すものを用いた。
・下記の構造式(化学式1)で表されるメトキシポリ(エチレングリコール)ポリ(プロピレングリコール)アミン:HUNTSMAN製“JEFFAMINE”(登録商標) M1000 (数平均分子量Mn1000)。
・安息香酸:和光純薬工業(株)製 試薬特級
・酢酸:和光純薬工業(株)製 試薬特級
・ステアリン酸:和光純薬工業(株)製 試薬特級
・セロチン酸:東京化成工業(株)製 。
ε-カプロラクタム20g、イオン交換水20g、“JEFFAMINE”M1000 1.6g、安息香酸0.14gを反応容器に仕込み密閉し、窒素置換した。反応容器外周にあるヒーターの設定温度を290℃とし、加熱を開始した。缶内圧力が1.0MPaに到達した後、水分を系外へ放出させながら缶内圧力1.0MPaに保持し、缶内温度が240℃になるまで昇温した。缶内温度が240℃に到達した後、ヒーターの設定温度を270℃に変更し、1時間かけて常圧となるよう缶内圧力を調節した(常圧到達時の缶内温度:243℃)。続けて、缶内に窒素を流しながら(窒素フロー)240分間保持して末端変性ポリアミド6樹脂を得た(最高到達温度:253℃)。続いて得られた末端変性ポリアミド6樹脂を、イオン交換水でソックスレー抽出を行い、未反応の末端変性用化合物を除去した。このようにして得られた末端変性ポリアミド6樹脂の相対粘度は1.81、重量平均分子量は3.0万、融点(Tm)は220℃、溶融粘度は5.5Pa・sであった。また、得られた末端変性ポリアミド6樹脂は以下の化学式4にて示される構造と以下の化学式5で示される構造を末端に有する末端変性ポリアミド6樹脂を含むものであった。その他の物性を表1-1および表1-2に示す。
原料を表に示す組成に変更し、かつ缶内圧力を常圧とした後、缶内に窒素を流しながら保持する時間(窒素フロー時間)を表に示す時間に変更したこと以外は、実施例1と同様にしてポリアミド6樹脂を得た。ここで、実施例2~9、14~26、比較例1~4にて得られたポリアミド樹脂は以下の化学式4にて示される構造と以下の化学式5で示される構造を末端に有する末端変性ポリアミド6樹脂を含むものであった。
原料を表に示す組成に変更し、かつ缶内圧力を常圧とした後、缶内に窒素を流しながら保持する時間(窒素フロー時間)を表に示す時間に変更したこと以外は、実施例1と同様にしてポリアミド6樹脂を得た。ここで、実施例27にて得られた末端変性ポリアミド樹脂は以下の化学式4にて示される構造と以下の化学式8で示される構造を末端に有する末端変性ポリアミド6樹脂を含むものであった。
原料を表に示す組成に変更し、かつ缶内圧力を常圧とした後、缶内に窒素を流しながら保持する時間(窒素フロー時間)を表に示す時間に変更したこと以外は、実施例1と同様にしてポリアミド6樹脂を得た。ここで、実施例28および29にて得られた末端変性ポリアミド樹脂は以下の化学式4にて示される構造と以下の化学式9で示される構造を末端に有する末端変性ポリアミド6樹脂を含むものであった。
原料を表に示す組成に変更し、かつ缶内圧力を常圧とした後、缶内に窒素を流しながら保持する時間(窒素フロー時間)を表に示す時間に変更したこと以外は、実施例1と同様にしてポリアミド6樹脂を得た。ここで、得られた末端変性ポリアミド樹脂は以下の化学式4にて示される構造と以下の化学式10で示される構造を末端に有する末端変性ポリアミド6樹脂を含むものであった。
原料を表に示す組成に変更し、かつ缶内圧力を常圧とした後、缶内に窒素を流しながら保持する時間(窒素フロー時間)を表に示す時間に変更したこと以外は、実施例1と同様にしてポリアミド6樹脂を得た。ここで、得られた末端変性ポリアミド樹脂は以下の化学式6にて示される構造と以下の化学式10で示される構造を末端に有する末端変性ポリアミド6樹脂を含むものであった。
ヘキサメチレンジアミン9.46g、アジピン酸11.92g、イオン交換水20g、“JEFFAMINE”M1000 1.6g、安息香酸0.14gを反応容器に仕込み密閉し、窒素置換した。反応容器外周にあるヒーターの設定温度を290℃とし、加熱を開始した。缶内圧力が1.75MPaに到達した後、水分を系外へ放出させながら缶内圧力1.75MPaに保持し、缶内温度が260℃になるまで昇温した。缶内温度が260℃に到達した後、ヒーターの設定温度を290℃に変更し、1時間かけて常圧となるよう缶内圧力を調節した(常圧到達時の缶内温度:270℃)。続けて、缶内に窒素を流しながら(窒素フロー)240分間保持して末端変性ポリアミド66樹脂を得た(最高到達温度:275℃)。ここで、得られたポリアミド樹脂は以下の化学式4にて示される構造と以下の化学式5で示される構造を末端に有する末端変性ポリアミド66樹脂を含むものであった。
ヘキサメチレンジアミン7.74g、セバシン酸13.46g、イオン交換水20g、“JEFFAMINE”M1000 1.6g、安息香酸0.14gを反応容器に仕込み密閉し、窒素置換した。反応容器外周にあるヒーターの設定温度を290℃とし、加熱を開始した。缶内圧力が1.0MPaに到達した後、水分を系外へ放出させながら缶内圧力1.0MPaに保持し、缶内温度が240℃になるまで昇温した。缶内温度が240℃に到達した後、ヒーターの設定温度を290℃に変更し、1時間かけて常圧となるよう缶内圧力を調節した(常圧到達時の缶内温度:243℃)。続けて、缶内に窒素を流しながら(窒素フロー)240分間保持して末端変性ポリアミド610樹脂を得た(最高到達温度:253℃)。ここで、得られたポリアミド樹脂は以下の化学式4にて示される構造と以下の化学式5で示される構造を末端に有する末端変性ポリアミド610樹脂を含むものであった。
Claims (11)
- 下記一般式(I)で表される末端構造を1~20質量%および下記一般式(II)で表される末端構造を0.1~5質量%含有する末端変性ポリアミド樹脂。
-X-(R1-O)m-R2 (I)
上記一般式(I)中、mは2~100の範囲を表す。R1は炭素数2~10の2価の炭化水素基、R2は炭素数1~30の1価の炭化水素基を表す。-X-は-NH-、-N(CH3)-または-(C=O)-を表す。一般式(I)中に含まれるm個のR1は同じでも異なってもよい。
-Y-R3 (II)
上記一般式(II)中、R3は炭素数1~30の1価の炭化水素基を表す。前記一般式(I)におけるXが-NH-または-N(CH3)-の場合、上記一般式(II)における-Y-は-(C=O)-を表し、前記一般式(I)におけるXが-(C=O)-の場合、上記一般式(II)におけるYは-NH-または-N(CH3)-を表す。 - 前記末端変性ポリアミド樹脂中、前記一般式(I)で表される末端構造と前記一般式(II)で表される末端構造を合計60~250[mol/t]含有し、かつ前記一般式(I)で表される末端構造の含有量[mol/t]と前記一般式(II)で表される末端構造の含有量[mol/t]の比((I)/(II))が0.3~2.5である請求項1に記載の末端変性ポリアミド樹脂。
- 前記末端変性ポリアミド樹脂中、アミノ末端基とカルボキシル末端基を合計50~150[mol/t]含有し、かつアミノ末端基の含有量[mol/t]とカルボキシル末端基の含有量[mol/t]の比(アミノ末端基/カルボキシル末端基)が0.5~2.5である請求項1または2に記載の末端変性ポリアミド樹脂。
- 樹脂濃度0.01g/mlの98%硫酸溶液の25℃における相対粘度(ηr)が1.3~3.0である請求項1~3のいずれかに記載の末端変性ポリアミド樹脂。
- ゲルパーミエーションクロマトグラフィーにより測定した重量平均分子量Mwが15,000~50,000である請求項1~4のいずれかに記載の末端変性ポリアミド樹脂。
- 融点+60℃、せん断速度9728sec-1の条件における溶融粘度が30Pa・s以下である請求項1~5のいずれかに記載の末端変性ポリアミド樹脂。
- 融点+60℃の条件下60分間滞留前後における、前記一般式(I)で表される構造の含有量保持率((滞留後含有量/滞留前含有量)×100)が80%以上である請求項1~6のいずれかに記載の末端変性ポリアミド樹脂。
- 融点+60℃の条件下60分間滞留前後における重量平均分子量保持率((滞留後重量平均分子量/滞留前重量平均分子量)×100)が80%~120%である請求項1~7のいずれかに記載の末端変性ポリアミド樹脂。
- 融点+60℃の条件下60分間滞留前後における溶融粘度保持率((滞留後溶融粘度/滞留前溶融粘度)×100)が80%~120%である請求項1~8のいずれかに記載の末端変性ポリアミド樹脂。
- 窒素雰囲気下、融点+60℃の条件下40分間滞留前後の質量減少率が4%以下である請求項1~9のいずれかに記載の末端変性ポリアミド樹脂。
- ジアミンおよびジカルボン酸からなる組み合わせ、アミノ酸、ならびにラクタムからなる群より選ばれる少なくとも1種を重合する際に、下記一般式(III)で表される末端変性用化合物をジアミン、ジカルボン酸、アミノ酸、およびラクタムの合計に対して1~20質量%、および、下記一般式(IV)で表される末端変性用化合物をジアミン、ジカルボン酸、アミノ酸およびラクタムの合計に対して0.01~5質量%含有させて、ポリアミド樹脂の末端に末端変性用化合物を結合させる請求項1~10のいずれかに記載の末端変性ポリアミド樹脂の製造方法。
H-X’-(R1-O)m-R2 (III)
上記一般式(III)中、mは2~100の範囲を表す。R1は炭素数2~10の2価の炭化水素基、R2は炭素数1~30の1価の炭化水素基を表す。-X’-は-NH-、-N(CH3)-または-O(C=O)-を表す。一般式(III)中に含まれるm個のR1は同じでも異なってもよい。
H-Y’-R3 (IV)
上記一般式(IV)中、R3は炭素数1~30の1価の炭化水素基を表す。
前記一般式(III)におけるX’が-NH-または-N(CH3)-の場合、上記一般式(IV)における-Y’-は-O(C=O)-を表し、前記一般式(III)におけるXが-O(C=O)-の場合、上記一般式(IV)におけるY’は-NH-または-N(CH3)-を表す。
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CN108137799A (zh) | 2018-06-08 |
US20180371166A1 (en) | 2018-12-27 |
US10556989B2 (en) | 2020-02-11 |
JPWO2017110918A1 (ja) | 2017-12-28 |
EP3395856A4 (en) | 2019-08-07 |
CN108137799B (zh) | 2020-01-07 |
EP3395856B1 (en) | 2021-02-17 |
EP3395856A1 (en) | 2018-10-31 |
JP6172409B1 (ja) | 2017-08-02 |
KR102000896B1 (ko) | 2019-07-16 |
KR20180098223A (ko) | 2018-09-03 |
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