WO2017091997A1 - Système de dissipation thermique et aéronef le comprenant - Google Patents

Système de dissipation thermique et aéronef le comprenant Download PDF

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Publication number
WO2017091997A1
WO2017091997A1 PCT/CN2015/096253 CN2015096253W WO2017091997A1 WO 2017091997 A1 WO2017091997 A1 WO 2017091997A1 CN 2015096253 W CN2015096253 W CN 2015096253W WO 2017091997 A1 WO2017091997 A1 WO 2017091997A1
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WO
WIPO (PCT)
Prior art keywords
heat
fan
fins
dissipation system
heat dissipation
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Application number
PCT/CN2015/096253
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English (en)
Chinese (zh)
Inventor
张磊
冯建刚
唐尹
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2015/096253 priority Critical patent/WO2017091997A1/fr
Priority to CN201580069093.6A priority patent/CN107211556B/zh
Priority to CN201910098293.4A priority patent/CN109673139B/zh
Publication of WO2017091997A1 publication Critical patent/WO2017091997A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat dissipation technology, and more particularly to a heat dissipation system and an aircraft having the same.
  • the integration degree of chips is getting higher and higher, the chip size is getting smaller and smaller, and the heat flux density of the chip is also getting higher and higher.
  • the narrow space structure inside the product is not conducive to the heat dissipation of the chip.
  • Temperature is a key factor affecting the reliability of the chip. As the temperature increases, the failure rate of the chip increases as a geometric multiple. Therefore, how to quickly and efficiently dissipate heat from the chip is an important factor in determining the reliability of the product.
  • This solution uses a fan and a heat sink to reduce the heat flux density of the chip by using a heat sink, and then uses a fan to blow the heat sink of the heat sink.
  • the forced convection heat transfer dissipates the heat from the heat sink to reduce the temperature of the chip.
  • Aircraft especially unmanned aerial vehicles, have some chips inside the fuselage, and the design of these chip cooling solutions is also affected by the narrow space inside the fuselage.
  • the invention relates to a heat dissipation system comprising: a substrate, a plurality of heat sinks and a fan.
  • the substrate has a first surface and a second surface opposite the first surface.
  • the plurality of fins are disposed on the first surface of the substrate.
  • the fan has a tuyere disposed on one side of the first surface of the substrate. The tuyere of the fan is inclined with respect to the first surface of the substrate, and the tuyere of the fan faces the plurality of fins and is inclined toward the extending direction of the plurality of fins.
  • the invention also relates to a heat dissipation system comprising: a heat sink and a fan.
  • the heat sink includes a plurality of airflow channels, each airflow channel having an airflow inlet.
  • the fan has a tuyere disposed on one side of the heat sink. The tuyere of the fan is disposed obliquely with respect to the heat dissipating device, and the tuyere of the fan faces the airflow inlet of the plurality of airflow passages and is inclined toward the extending direction of the airflow passage.
  • the invention also relates to an aircraft comprising: a fuselage and a heat dissipation system.
  • the body includes: a housing, an accommodating space, and a heat generating component.
  • the accommodating space is surrounded by the housing.
  • the heat generating component is housed in the accommodating space.
  • the heat dissipation system is for dissipating heat generated by the heat generating component.
  • the heat dissipation system is disposed in the accommodating space, and the heat dissipation system includes: a heat conducting plate, a plurality of heat sinks, and a fan.
  • the heat conducting plate is attached to the heat generating component.
  • the plurality of fins are located on one side of the heat conducting plate for dissipating heat absorbed by the heat conducting plate from the heat generating component.
  • the fan has a tuyere disposed at one end of the plurality of fins. The tuyere of the fan faces the plurality of fins and is inclined toward the extending direction of
  • the invention also relates to an aircraft comprising: a fuselage and a heat dissipation system.
  • the body includes: a housing, an accommodating space, and a heat generating component.
  • the accommodating space is surrounded by the housing.
  • the heat generating component is housed in the accommodating space.
  • the heat dissipation system is configured to dissipate heat generated by the heat generating component.
  • the heat dissipation system is disposed in the accommodating space, and the heat dissipation system includes: a heat dissipation device and a fan.
  • the heat sink includes a plurality of airflow passages, each of the airflow passages having an airflow inlet.
  • the fan has a tuyere disposed on one side of the heat sink.
  • the tuyere of the fan is disposed obliquely with respect to the heat dissipating device, and the tuyere of the fan faces the airflow inlet of the plurality of airflow passages and is inclined toward the extending direction of the airflow passage.
  • the present invention adopts a wind tilt setting, which reduces the occupation size of the heat dissipation system in height.
  • the tuyere of the fan faces the fin/airflow passage and is inclined toward the extending direction of the fin/airflow passage, so that the forced airflow provided by the fan is blown toward the fin/airflow passage, and the forced airflow direction is
  • the fins/airflow channels extend in the same direction, so that the forced airflow provided by the fan passes through the fin/airflow channel, and the wind resistance is small, forming an effective heat dissipation channel.
  • each of the fins is curved along its extending direction.
  • the plurality of fins are located at a middle position of the first surface of the substrate.
  • each of the heat dissipating fins includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion in a row along the extending direction thereof, and the second heat dissipating portion and the third heat dissipating portion extend in a different direction from the The direction in which the first heat radiating portion extends.
  • the tuyere of the fan is close to the first heat dissipating portion and away from the third heat dissipating portion.
  • the second heat dissipating portion has a curved shape and connects the first heat dissipating portion and the third heat dissipating portion.
  • the height of the second heat dissipating portion is greater than the height of the first heat dissipating portion and greater than the height of the third heat dissipating portion.
  • first heat dissipation portions of the plurality of heat sinks are parallel to each other.
  • the third heat dissipating portion of the plurality of fins is radially along the extending direction thereof.
  • the heat dissipation system further includes a plurality of other heat sinks on both sides of the plurality of heat sinks, and the other heat sinks extend in a different direction from the extending direction of the heat sink.
  • the heat dissipation system further includes:
  • a heat conducting plate for absorbing heat generated by the heat generating component, comprising a contact surface for bonding with the heat generating component and a bonding surface for bonding with the second surface of the substrate;
  • the heat conducting plate is provided with a plurality of receiving grooves for accommodating the heat generating component on one side of the contact surface thereof.
  • a plurality of notches are disposed on a periphery of the heat conducting plate.
  • each of the air flow passages has a curved shape.
  • the plurality of air flow passages are radially away from one end of the fan.
  • the airflow inlets of the plurality of airflow channels are parallel to each other.
  • the plurality of air flow channels are located between the plurality of heat sinks.
  • the plurality of fins further have other airflow passages, and the airflow passages extend in a direction different from the extending direction of the other airflow passages.
  • the fan is an axial fan.
  • the housing has an air inlet and an air outlet, the air outlet is an air outlet of the fan, the fan further has an air inlet, and the air inlet corresponds to the air inlet, the exhaust The port corresponds to the end of the heat sink away from the fan.
  • the aircraft further includes: another heating element and another heat sink.
  • the other heat sink includes a base that is attached to the other heat generating component and a plurality of heat sink fins extending from the base.
  • the material of the housing is a heat conductive material, and the heat dissipation fin contacts the housing.
  • the housing is provided with a plurality of perforations.
  • FIG. 1 is a schematic plan view of a heat dissipation system according to an embodiment of the present invention.
  • FIG. 2 is a perspective exploded view of the heat sink of the heat dissipation system shown in FIG. 1.
  • Figure 3 is a combined plan view of the heat sink shown in Figure 2.
  • FIG. 4 is a cross-sectional view of the heat sink shown in FIG. 3 taken along line IV-IV.
  • FIG. 5 is another schematic plan view of the heat dissipation system shown in FIG. 1.
  • FIG. 6 is another schematic plan view of the heat dissipation system shown in FIG. 1.
  • FIG. 7 is a partial cross-sectional view of an aircraft having a heat dissipation system according to an embodiment of the present invention.
  • Figure 8 is an enlarged schematic view of a portion VIII of Figure 7.
  • Figure 9 is an enlarged schematic view of a portion IX of Figure 7.
  • cooling system 1 fan 10 shell 11 Air duct 111 Inlet 113 Air outlet 115 Mount 13 rib 131 Heat sink 20 Thermal plate twenty one Contact surfaces 211 Joint surface 213 Trench 215 Notch 217 Locating slot 219 Heat pipe twenty three First heat transfer section 231 Second heat transfer section 233 Third heat transfer section 235 heat sink 25 Substrate 251 First surface 2511 Second surface 2512 Fitting groove 2513 First side 2514 Second side 2515 Third side 2516 Fourth side 2517 Notch 2518 heat sink 253 First heat sink 2531 Second heat sink 2532 Third heat sink 2533 First heat sink 25331 Second heat sink 25332 Third heat sink 25333 Fourth heat sink 2534 First air channel 2535 Second air channel 2536 Third air channel 2537 Air inlet 25371 Air outlet 25372 Fourth air passage 2538 Fixed part 255 Fixed hole 2551 Aircraft 4 body 41 case 411 Air inlet 4111 exhaust vent 4113 perforation 4115 Housing space 413 Arm 42 Rotor 43 Heating element 44 Fixtures 45 Heating element 46 Heat sink 47 Pedestal 471 Heat sink fin 473
  • a component when referred to as being “fixed” to another component, it can be directly on the other component or the component can be present.
  • a component When a component is considered to "connect” another component, it can be directly connected to another component or possibly a central component.
  • a component When a component is considered to be “set to” another component, it can be placed directly on another component or possibly with a centered component.
  • the terms “vertical,” “horizontal,” “left,” “right,” and the like, as used herein, are for illustrative purposes only.
  • an embodiment of the present invention provides a heat dissipation system 1 for dissipating heat from an electronic component.
  • the heat dissipation system 1 includes a fan 10 and a heat sink 20 that cooperates with the fan 10.
  • the fan 10 is disposed obliquely with respect to the heat sink 20.
  • the fan 10 can be an axial fan or a radial fan.
  • the fan 10 is an axial flow fan.
  • the fan 10 includes a housing 11, a mounting bracket 13, and an impeller (not shown).
  • the outer casing 11 hollowly forms a wind cylinder 111, and opposite ends of the air cylinder 111 open to form an air inlet 113 and an air outlet 115.
  • the mounting bracket 13 is disposed in the air cylinder 111 and fixed to the outer casing 11 by a plurality of ribs 131.
  • the impeller is housed in the air cylinder 111 and rotatably mounted to the mounting bracket 13.
  • the heat sink 20 includes a heat conducting plate 21 , a heat pipe 23 coupled to the heat conducting plate 21 , and a heat sink 25 thermally coupled to the heat conducting plate 21 and the heat pipe 23 .
  • the heat conducting plate 21 includes a contact surface 211 and a bonding surface 213.
  • the contact surface 211 is for contacting a heat generating component.
  • the bonding surface 213 is for bonding the heat sink 25.
  • a groove 215 for accommodating the heat pipe 23 is disposed on a side of the joint surface 213 of the heat transfer plate 21 .
  • the groove 215 extends from the joint surface 213 toward the contact surface 211 to have a certain depth.
  • the shape of the groove 215 may be correspondingly set according to the shape of the heat pipe 23, and may be a linear type or a curved type. When it is a curved type, it may be an S shape, a C shape, a U shape, an M shape, an N shape, or the like. In this embodiment, the trench 215 has a U shape.
  • the shape of the heat conducting plate 21 can be set according to actual needs.
  • the heat conducting plate 21 is polygonal.
  • the periphery of the heat conducting plate 21 is provided with a plurality of notches 217 to avoid interference of the mounting position of the peripheral elements to the heat conducting plate 21 when mounted on the heat generating component.
  • the receiving surface 211 of the heat conducting plate 21 is further provided with a plurality of receiving grooves 219 for accommodating the heat generating elements.
  • the plurality of receiving grooves 219 extend from the contact surface 211 toward the joining surface 213 to have a certain depth.
  • the depths of the plurality of accommodating grooves 219 may be set to be the same or different depending on the height of the heat generating elements.
  • the material of the heat conducting plate 21 is a metal with good thermal conductivity, such as copper, aluminum, etc., and may also be a heat conductive graphite material or a heat conductive carbon nano material.
  • the heat conducting plate 21 may also be filled with a phase change medium such as water, ethanol, diethyl ether or the like.
  • the heat pipe 23 is a metal pipe body filled with a phase change medium, and the phase change medium may be water, ethanol, diethyl ether or the like.
  • the heat pipe 23 may be a circular tube shape, a semicircular tube shape, a flat shape or the like. In the present embodiment, the heat pipe 23 is flat and has opposite two parallel flat surfaces for bonding with the heat conducting plate 21 and the heat sink 25.
  • the heat pipe 23 includes a first heat transfer section 231, a second heat transfer section 233, and a third heat transfer section 235.
  • the second heat transfer section 233 extends outward from one end of the first heat transfer section 231.
  • the third heat transfer section 235 extends outward from the other end of the first heat transfer section 231. In other words, the second heat transfer section 233 and the third heat transfer section 235 extend in a different direction from the end of the first heat transfer section 231.
  • the heat pipe 23 has a U shape corresponding to the shape of the groove 215.
  • the first heat transfer section 231, the second heat transfer section 233, and the third heat transfer section collectively constitute a U-shaped structure of the heat pipe 23.
  • the first heat transfer section 231 is linear.
  • the second heat transfer section 233 is linear.
  • the junction of the first heat transfer section 231 and the second heat transfer section 233 is curved in a curved shape.
  • the third heat transfer section 235 is linear.
  • the junction of the first heat transfer section 231 and the third heat transfer section 235 is curved in a curved shape.
  • the second heat transfer section 233 is parallel to the third heat transfer section 235.
  • the second heat transfer section 233 and the third heat transfer section 235 are substantially perpendicular to the first heat transfer section 231.
  • the length of the third heat transfer section 235 is less than the length of the second heat transfer section 233.
  • the thickness of the heat pipe 23 is greater than, equal to, or less than the depth of the trench 215. In this embodiment, the thickness of the heat pipe 23 is greater than or equal to the depth of the trench 215.
  • the heat sink 25 includes a substrate 251 and a plurality of fins 253 disposed on the substrate 251. A plurality of air flow channels are formed between the plurality of fins 253.
  • the substrate 251 is a metal plate body having good thermal conductivity, and may also be a thermally conductive graphite plate body or a thermally conductive carbon nanoplate body.
  • the substrate 251 further extends outwardly from the plurality of fixing portions 255.
  • the substrate 251 includes a first surface 2511 and a second surface 2512 opposite the first surface 2511.
  • the substrate 251 may be provided with a fitting groove 2513 (refer to FIG. 4 ) corresponding to the groove 215 of the heat conducting plate 21 on one side of the second surface 2512 thereof for accommodating the heat pipe 23 .
  • the shape of the substrate 251 may be square, trapezoidal, circular or other polygonal shape.
  • the substrate 251 is substantially square, and includes a first side 2514, a second side 2515, a third side 2516 opposite to the first side, and a second side opposite to the second side.
  • the second side 2515 is substantially parallel to the fourth side 2517.
  • a plurality of notches 2518 are disposed at the third side 2516 to prevent the peripheral component from interfering with the mounting position of the substrate 251 when the heat sink 20 is mounted on the heat generating component.
  • the first side 2514, the second side 2515, the third side 2516, and the fourth side 2517 are connected to the first surface 2511 and the second surface 2512.
  • each of the fixing portions 255 is provided with a fixing hole 2551.
  • the plurality of fins 253 are disposed on the first surface 2511 of the substrate 251.
  • the plurality of fins 253 include heat sinks of different shapes or orientations.
  • the plurality of heat sinks 253 include a plurality of first heat sinks 2531 , a plurality of second heat sinks 2532 , a plurality of third heat sinks 2533 , and a plurality of fourth heat sinks 2534 .
  • the plurality of first fins 2531 are disposed at one end of the substrate 251 adjacent to the second side 2515.
  • the plurality of first fins 2531 are disposed in parallel with each other.
  • a first air flow passage 2535 is formed between adjacent first fins 2531.
  • Each of the first fins 2531 is substantially parallel to the second side 2515.
  • Each of the first fins 2531 extends from near the first side 2514 toward the third side 2516.
  • Each of the first fins 2531 is linear along its extending direction.
  • the first heat sink 2531 is defined to extend in a first direction from the first side edge 2514.
  • the first air flow channel 2535 has a linear shape extending from the first side edge 2514 in the direction of the second side edge 2515 to near the third side edge 2516 and substantially parallel to the first side Two sides 2515. In this embodiment, the first air flow channel 2535 extends in a first direction from near the first side edge 2514.
  • the plurality of second fins 2532 are disposed on a side of the substrate 251 adjacent to the third side 2516.
  • the plurality of second heat sinks 2532 are located between the first heat sink 2531 and the third heat sink 2533.
  • the plurality of second fins 2532 are spaced apart from each other.
  • a second air flow passage 2536 is formed between the adjacent second fins 2532.
  • Each of the second fins 2532 extends at an oblique angle from the second side 2515 toward the third side 2516 and opposite to the second side 2515 and the third side 2516.
  • Each of the second fins 2532 is disposed obliquely with respect to the first fins 2531.
  • the second heat sink 2532 forms an angle with the first heat sink 2531.
  • the second heat sink 2532 is defined to extend in a second direction from the second side 2515.
  • the plurality of second fins 2532 are slightly radial in a direction away from the first fins 2531.
  • the lengths of the plurality of second fins 2532 may be different.
  • the length of the plurality of second fins 2532 gradually increases along the direction of the third side 2516 toward the first side 2514, that is, the length of the plurality of second fins 2532
  • the edge of the substrate 251 gradually increases toward the center.
  • the second air flow channel 2536 has a linear shape from the second side 2515 toward the third side 2516 and opposite to the second side 2515 and the third side 2516. Extends at an oblique angle. That is, the second air flow passage 2536 extends substantially in a diagonal direction of the substrate 251 from near the second side edge 2515. In this embodiment, the second air flow passage 2536 extends in a second direction from the second side edge 2515. The second direction is different from the first direction. The second direction has an angle with the first direction.
  • the plurality of third heat sinks 2533 are disposed at a central position of the substrate 251.
  • the plurality of third fins 2533 are located between the second fins 2532 and the fourth fins 2534.
  • Each of the third fins 2533 extends from one end of the first side 2514 adjacent to the second side 2515 to the fourth side 2517. That is, the third fin 2533 extends from the first side 2514 toward the end of the second side 2515 substantially in the diagonal direction of the substrate 251.
  • the plurality of third fins 2533 are spaced apart from each other, and a third airflow passage 2537 is formed between the adjacent third fins 2533, and the third airflow passage 2537 is adjacent to the second side from the first side 2514.
  • One end of 2515 extends to the fourth side 2517.
  • Each of the third fins 2533 has a curved shape along its extending direction.
  • Each of the third heat sinks 2533 includes a first heat dissipation portion 25331 along the extending direction thereof, a second heat dissipation portion 25332 extending outward from one end of the first heat dissipation portion 25331, and a second heat dissipation portion 25332 outward.
  • the extended third heat dissipation portion 25333 is a first heat dissipation portion 25331 along the extending direction thereof, a second heat dissipation portion 25332 extending outward from one end of the first heat dissipation portion 25331, and a second heat dissipation portion 25332 outward.
  • the first heat dissipation portion 25331 is linear along its extending direction.
  • the first heat dissipation portion 25331 of the plurality of third heat dissipation fins 2533 is adjacent to the first side edge 2514.
  • the first heat dissipation portions 25331 of the plurality of third heat dissipation fins 2533 are parallel to each other.
  • the first heat dissipation portion 25331 of the plurality of third heat dissipation fins 2533 is parallel to the first heat dissipation fins 2531 and the second side edges 2515.
  • the first heat dissipation portion 25331 extends from the first side edge 2514 in a first direction.
  • the first heat dissipation portion 25331 of the plurality of third heat dissipation fins 2533 is perpendicular to the first side edge 2514.
  • the height of each of the third fins 2533 gradually increases in the extending direction thereof.
  • the third air flow passage 2537 forms an air flow inlet 25371 at the first heat dissipation portion 25331.
  • the second heat radiating portion 25332 is curved in a direction in which the second heat radiating portion 25332 extends.
  • the second heat dissipation portion 25332 connects the first heat dissipation portion 25331 and the third heat dissipation portion 25333.
  • the second heat dissipation portion 25332 of the plurality of third heat dissipation fins 2533 is located substantially in the middle of the substrate 251.
  • the second heat dissipating portions 25332 of the plurality of third fins 2533 are parallel to each other or slightly radial along the extending direction thereof.
  • the extending direction of the second heat dissipating portion 25332 is different from the first direction, that is, different from the extending direction of the first heat dissipating portion 25331.
  • the height of each of the second heat dissipation portions 25332 is greater than the height of the first heat dissipation portion 25331 and the third heat dissipation portion 25333.
  • the third heat dissipation portion 25333 is linear along its extending direction.
  • the third heat dissipation portion 25333 of the plurality of third heat dissipation fins 2533 extends toward the fourth side edge 2517.
  • the extending direction of the third heat radiating portion 25333 is substantially the diagonal direction of the substrate 251.
  • the extending direction of the third heat radiating portion 25333 is different from the first direction, that is, different from the extending direction of the first heat radiating portion 25331.
  • the third heat dissipation portion 25333 of the plurality of third heat dissipation fins 2533 is radially along the extending direction thereof.
  • the angle between the third heat dissipation portion 25333 of the plurality of third heat dissipation fins 2533 and the first heat dissipation fin 2531 or the second side edge 2515 is 50-70 degrees.
  • the third air flow passage 2537 forms an air flow outlet 25372 at the third heat dissipation portion 25333.
  • the third air flow passage 2537 has a curved shape and extends from one end of the first side edge 2514 adjacent to the second side edge 2515 to the fourth side edge 2517. That is, the third air flow passage 2537 has a curved shape, and an end from the first side edge 2514 near the second side edge 2515 extends substantially in a diagonal direction of the substrate 251.
  • the third airflow channel 2537 is defined to extend from the first side edge 2514 adjacent to the second side edge 2515 in a third direction.
  • the third direction is curved, which is different from the first direction and the second direction.
  • the plurality of fourth fins 2534 are located at a corner of the substrate 251 near the first side 2514 and the fourth side 2517.
  • the plurality of fourth fins 2534 are located on one side of the third fins 2533.
  • the plurality of fourth fins 2534 are spaced apart from each other, and a fourth airflow channel 2538 is formed between the adjacent fourth fins 2534.
  • the plurality of fourth fins 2534 are parallel to each other.
  • the plurality of fourth fins 2534 are parallel to the first side 2514.
  • the lengths of the plurality of fourth fins 2534 are different.
  • the fourth air flow passage 2538 has a linear shape that extends in a direction parallel to the first side edge 2514.
  • the fourth air flow channel 2538 is defined to extend in the fourth direction.
  • the fourth direction is different from the first direction, the second direction, and the third direction.
  • the fourth direction is substantially perpendicular to the first direction.
  • the heat pipe 23 is received in the groove 215 of the heat conducting plate 21 , and the second surface 2512 of the substrate 251 of the heat sink 25 is attached to the heat conducting plate.
  • the heat pipe 23 is further received in the bonding groove 2513 of the substrate 251 and sandwiched between the heat conducting plate 21 and the substrate 251.
  • a solder paste is applied between the trench 215, the bonding groove 2513, and between the heat conducting plate 21 and the substrate 251 for reducing the heat conducting plate 21 and the heat pipe 23 And the thermal resistance between the substrates 251.
  • the fan 10 when the fan 10 and the heat sink 20 are assembled, the fan 10 is obliquely placed on one side of the heat sink 20 .
  • the air outlet 115 of the fan 10 is disposed obliquely with respect to the first surface 2511 of the substrate 251.
  • the air outlet 115 of the fan 10 faces the heat sink 253 and has a certain distance from the heat sink 253.
  • the air inlet 113 of the fan 10 faces away from the heat sink 253.
  • the fan 10 corresponds to the first side 2514 of the substrate 251 of the heat sink 25 near the second side 2515, and the air outlet 115 faces the first of the third heat sink 2533.
  • the heat radiating portion 25331 is an airflow inlet 25371 that faces the third airflow passage 2537 and is inclined toward the extending direction of the third heat sink 2533 and the third air flow passage 2537.
  • the air outlet 115 of the fan 10 forms an angle of 12 degrees with the second side 2515 and the fourth side 2517 of the substrate 251 of the heat sink 25 , that is, the air outlet of the fan 10 .
  • 115 faces the substrate 251 and is inclined toward the extending direction of the first heat radiating portion 25331 of the third heat sink 2533.
  • the air outlet 115 of the fan 10 is at an angle of 3 degrees with the first side 2514 of the substrate 251 of the heat sink 25 , that is, the air outlet 115 of the fan 10 faces the substrate 251 . And inclined to the extending direction of the second heat radiating portion 25332 and the third heat radiating portion 25333 of the third heat sink 2533.
  • the air outlet 115 of the fan 10 is inclined toward the third heat sink 2533 and toward the extending direction of the third heat sink 2533, that is, the air outlet 115 of the fan 10 is directed toward the air flow of the third air flow passage 2537.
  • the inlet 25371 is inclined toward the extending direction of the third air flow passage 2537.
  • the heat conducting plate 21 of the heat sink 20 of the heat dissipation system 1 absorbs heat from the heat generating component.
  • the heat pipe 23 of the heat sink 20 absorbs heat from the heat conducting plate 21 to further distribute heat evenly to the heat conducting plate 21.
  • the heat conducting plate 21 and the heat pipe 23 transfer heat to the substrate 251 of the heat sink 25 of the heat sink 20 and the heat sink 253.
  • the fan 10 of the heat dissipation system 1 blows a forced airflow to the heat sink 253 via its air outlet 115.
  • the third air flow channel 2537 between the heat sinks 2533 has a small portion of the first air flow channel 2535 between the first heat sink 2531, the second air channel 2536 and the fourth heat sink 2534 between the second heat sinks 2532.
  • a fourth air flow passage 2538 is in between.
  • the forced airflow entering the third air flow passage 2537 flows in the extending direction of the third heat sink 2533 and carries away the heat on the third heat sink 2533.
  • the airflow entering the first airflow channel 2535, the second airflow channel 2536, and the fourth airflow channel 2538 carries heat away from the first heat sink 2531, the second heat sink 2532, and the fourth heat sink 2534.
  • the fan 10 is disposed obliquely with respect to the substrate 251 such that the fan 10 and the heat sink 20 occupy a small space.
  • the air outlet 115 of the fan 10 is inclined toward the airflow inlet 25371 of the third airflow passage 2537 and toward the extending direction of the third heat sink 2533 and the third airflow passage 2537 therebetween, so that the forced airflow provided by the fan 10 is blown.
  • the forced airflow direction is consistent with the extending direction of the third heat sink 2533 and the third air flow passage 2537, so that the forced airflow provided by the fan 10 passes through the third heat sink 2533. It can take away most of the heat generated by the heating element, and the wind resistance is reduced to form an effective heat dissipation channel.
  • the second heat dissipation portion 25332 of the third heat sink 2533 is curved along the extending direction thereof, so that the heat exchange between the forced airflow provided by the fan 10 and the third heat sink 2533 is more sufficient.
  • the height of the second heat dissipation portion 25332 is greater than the heights of the first heat dissipation portion 25331 and the third heat dissipation portion 25333, so that the heat exchange between the forced airflow provided by the fan 10 and the third heat sink 2533 is further sufficient. .
  • the first heat sink 2531 is located at one side of the third heat sink 2533 to prevent the forced airflow provided by the fan 10 from being blown outside the heat sink 25, so that the utilization rate of the forced airflow provided by the fan 10 is utilized. Can be improved.
  • the second heat sink 2532 and the fourth heat sink 2534 extend in different directions, so that a portion of the forced airflow provided by the fan 10 is directed to different places of the heat sink 25, so that heat dissipation is more effective.
  • the heat dissipating device 20 adopts a heat pipe 23, so that the heat absorbed by the heat conducting plate 21 is more evenly distributed to avoid local overheating.
  • the air inlet 113 of the fan 10 can face the heat sink 20 such that heat absorbed by the heat sink 20 from the heat generating component is sucked by the fan 10 through the air inlet 113.
  • the air outlet 115 of the fan 10 faces away from the heat sink 20.
  • an embodiment of the present invention provides an aircraft 4.
  • the aircraft 4 includes the heat dissipation system 1.
  • the aircraft 4 includes a body 41, a plurality of arms 42 extending outward from the body 41, a plurality of rotors 43 mounted to the plurality of arms 42 and heating elements located in the body 41 44 (see Figure 8).
  • the heat generating component 44 can include one or more heat generating electronic components.
  • the body 41 includes a housing 411 and an accommodation space 413 surrounded by the housing 411.
  • the heating element 44 is placed in the accommodating space 413.
  • the heating element 44 is mounted to a mounting plate.
  • the accommodating space 413 is located between the mounting plate and the housing 411. In this embodiment, the accommodating space 413 is located at the bottom of the body 41.
  • An air inlet 4111 and an exhaust port 4113 are provided on opposite sides of the housing 411. An angle is formed between the air inlet 4111 and the exhaust port 4113 so as not to cause a circulation of heat flow.
  • the heating element 44 is concentratedly distributed between the intake port 4111 and the exhaust port 4113.
  • a plurality of through holes 4115 may be further disposed in the housing 411 corresponding to the position of the accommodating space 413.
  • the heat conducting plate 21 of the heat sink 20 of the heat dissipation system 1 is attached to the heat generating component 44.
  • the heat conducting plate 21 and the heat generating component 44 may be further bonded together by a heat conductive medium.
  • the air inlet 113 of the fan 10 of the heat dissipation system 1 corresponds to the air inlet 4111 of the casing 411.
  • An end of the heat sink 20 away from the fan 10 is adjacent to an exhaust port 4113 of the housing 411.
  • the fan 10 can be fixed to the housing 411 by a fixing device 45.
  • the aircraft 4 may further include another heating element 46 placed in the accommodating space 413.
  • the heat generating component 46 can include one or more heat generating electronic components.
  • the aircraft 4 includes another heat sink 47 coupled to the heat generating component 46.
  • the heat generating component 46 is located on one side of the heat generating component 44 and the heat dissipation system 1.
  • the heat generating component 46 is adjacent to the exhaust port 4113 of the housing 411.
  • the heat sink 47 includes a base 471 and a plurality of heat dissipation fins 473 extending from the base 471.
  • the base 471 is attached to the heat generating component 46.
  • the base 471 and the heat generating component 44 may be further bonded together by a heat conductive medium.
  • the susceptor 471 may also be provided with a plurality of receiving slots for accommodating a plurality of electronic components of the heating element 46.
  • the heat dissipation fins 473 face the housing 411 of the body 41. In this embodiment, the heat dissipation fins 473 are in contact with the housing 411, and the housing 411 is made of a metal material or other heat conductive material, such as a thermally conductive carbon nano material.
  • the heating element 44 operates to generate heat.
  • the heat conducting plate 21 of the heat sink 20 of the heat dissipation system 1 absorbs heat generated by the heat generating component.
  • the heat pipe 23 of the heat sink 20 absorbs heat from the heat conducting plate 21 to further distribute heat evenly to the heat conducting plate 21.
  • the heat conducting plate 21 and the heat pipe 23 transfer heat to the substrate 251 of the heat sink 25 of the heat sink 20 and the heat sink 253.
  • the fan 10 of the heat dissipation system 1 inhales through the air inlet 4111 of the casing 411 of the body 41 and its air inlet 113, and blows a forced airflow to the heat sink 253 via the air outlet 115 thereof.
  • the third air flow channel 2537 between the heat sinks 2533 has a small portion of the first air flow channel 2535 between the first heat sink 2531, the second air channel 2536 and the fourth heat sink 2534 between the second heat sinks 2532.
  • a fourth air flow passage 2538 is in between. The forced airflow entering the third air flow passage 2537 flows in the extending direction of the third heat sink 2533 and carries away the heat on the third heat sink 2533.
  • the airflow entering the first airflow channel 2535, the second airflow channel 2536, and the fourth airflow channel 2538 carries heat away from the first heat sink 2531, the second heat sink 2532, and the fourth heat sink 2534.
  • the hot air passing through the fins 253 is discharged outside the body 41 through the exhaust port 4113 of the casing 411.
  • the heat generating component 46 operates to generate heat
  • the susceptor 471 of the heat sink 47 absorbs heat from the heat generating component 46 and transfers heat to the heat sink fin 473.
  • the heat dissipation fins 473 radiate heat outward and transmit a part of the heat to the casing 411 to be emitted from the casing 411 to the outside of the fuselage 41.
  • the fan 10 is disposed obliquely with respect to the substrate 251 such that the fan 10 and the heat sink 20 are reduced in size in height, and the space inside the body 41 is accommodated or saved.
  • the air outlet 115 of the fan 10 is inclined toward the airflow inlet 25371 of the third airflow passage 2537 and toward the extending direction of the third heat sink 2533 and the third airflow passage 2537 therebetween, so that the forced airflow provided by the fan 10 is blown.
  • the forced airflow direction is consistent with the extending direction of the third heat sink 2533 and the third air flow passage 2537, so that the forced airflow provided by the fan 10 passes through the third heat sink 2533. It can take away most of the heat generated by the heating elements, and the wind resistance is small, forming an effective heat dissipation channel.
  • the air inlet 4111 of the casing 41 of the fuselage 41 corresponds to the air inlet 113 of the fan 10
  • the exhaust port 4113 corresponds to the end of the heat sink 25 away from the fan 10, so that the heat dissipation system 1
  • the formed heat dissipation channel is smoother and more efficient.
  • the heat generating component 46 of the aircraft 4 contacts the casing 411 of the fuselage 41 by the heat dissipating device 47 to perform natural heat dissipation, and on the other hand, the heat dissipating area of the heat dissipating device 47 is enlarged, so that the heat dissipating device 47 can be small. Size, on the other hand, saves energy.
  • the air inlet 113 of the fan 10 can face the heat sink 20 such that heat absorbed by the heat sink 20 from the heat generating component 44 is sucked by the fan 10 via the air inlet 113.
  • the air outlet 115 of the fan 10 faces away from the heat sink 20, and the air inlet 4111 of the housing 411 corresponds to the air outlet 115, and the hot air sucked by the fan 10 is exhausted from the airframe. Outside of 41, the exhaust port 4113 is a cold air intake.

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un système de dissipation thermique et un aéronef le comprenant. Le système de dissipation thermique (1) comprend un substrat (251), une pluralité de dissipateurs de chaleur (253) et un ventilateur (10). Le substrat (251) présente une première surface (2511) et une seconde surface (2512) opposée à la première surface (2511), et la pluralité de dissipateurs de chaleur (253) est disposée sur la première surface (2511) du substrat. Le ventilateur (10) présente un orifice d'écoulement d'air (10), le ventilateur (10) est disposé sur la première surface (2511) du substrat (251) sur un côté, l'orifice d'écoulement d'air du ventilateur (10) est incliné par rapport à la première surface (2511) du substrat (251), et l'orifice d'écoulement d'air du ventilateur (10) est incliné vers la pluralité de dissipateurs de chaleur (253) et dans un sens d'extension de la pluralité de dissipateurs de chaleur (253). La hauteur occupée par le système de dissipation thermique est réduite, et une direction d'écoulement d'un flux d'air forcé fourni par le ventilateur correspond à la direction d'extension des dissipateurs de chaleur/passages d'écoulement d'air, de sorte que le flux d'air forcé fourni par le ventilateur subisse peu de résistance au vent lors de son passage à travers les dissipateurs de chaleur/passages de circulation d'air, formant ainsi des passages de dissipation thermique efficaces.
PCT/CN2015/096253 2015-12-03 2015-12-03 Système de dissipation thermique et aéronef le comprenant WO2017091997A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/CN2015/096253 WO2017091997A1 (fr) 2015-12-03 2015-12-03 Système de dissipation thermique et aéronef le comprenant
CN201580069093.6A CN107211556B (zh) 2015-12-03 2015-12-03 散热***及具有散热***的飞行器
CN201910098293.4A CN109673139B (zh) 2015-12-03 2015-12-03 散热***及具有散热***的飞行器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/096253 WO2017091997A1 (fr) 2015-12-03 2015-12-03 Système de dissipation thermique et aéronef le comprenant

Publications (1)

Publication Number Publication Date
WO2017091997A1 true WO2017091997A1 (fr) 2017-06-08

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CN (2) CN109673139B (fr)
WO (1) WO2017091997A1 (fr)

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CN108811475A (zh) * 2018-09-07 2018-11-13 埃视森智能科技(上海)有限公司 光栅式3d视觉定位***的散热导风装置
CN109219328A (zh) * 2018-11-22 2019-01-15 斯贝克电子（嘉善）有限公司 一种音箱的散热***
CN112533428A (zh) * 2020-12-24 2021-03-19 张雪 一种智能型网络通讯设备
CN113031273A (zh) * 2021-03-16 2021-06-25 歌尔股份有限公司 一种头戴显示设备及其散热机构
CN115268603A (zh) * 2022-07-22 2022-11-01 深圳市安卓微科技有限公司 一种迷你电脑主机
CN117320422A (zh) * 2023-11-28 2023-12-29 合众新能源汽车股份有限公司 一种智能座舱域控制器及车辆

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KR20200116815A (ko) * 2019-04-02 2020-10-13 엘지이노텍 주식회사 컨버터
CN110107822B (zh) * 2019-05-20 2021-01-05 东莞市闻誉实业有限公司 散热器件及照明设备
CN113382608B (zh) * 2021-06-09 2022-11-08 北京机电工程研究所 一种飞行器设备舱散热***及其散热方法
CN115840312A (zh) * 2022-12-26 2023-03-24 合肥鑫晟光电科技有限公司 背板、背光模组和显示装置

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CN108811475A (zh) * 2018-09-07 2018-11-13 埃视森智能科技(上海)有限公司 光栅式3d视觉定位***的散热导风装置
CN108811475B (zh) * 2018-09-07 2024-04-16 埃视森智能科技(上海)有限公司 光栅式3d视觉定位***的散热导风装置
CN109219328A (zh) * 2018-11-22 2019-01-15 斯贝克电子（嘉善）有限公司 一种音箱的散热***
CN109219328B (zh) * 2018-11-22 2023-12-08 斯贝克电子（嘉善）有限公司 一种音箱的散热***
CN112533428A (zh) * 2020-12-24 2021-03-19 张雪 一种智能型网络通讯设备
CN112533428B (zh) * 2020-12-24 2022-01-18 广州信溢创科技股份有限公司 一种智能型网络通讯设备
CN113031273A (zh) * 2021-03-16 2021-06-25 歌尔股份有限公司 一种头戴显示设备及其散热机构
CN113031273B (zh) * 2021-03-16 2023-01-20 歌尔股份有限公司 一种头戴显示设备及其散热机构
CN115268603A (zh) * 2022-07-22 2022-11-01 深圳市安卓微科技有限公司 一种迷你电脑主机
CN117320422A (zh) * 2023-11-28 2023-12-29 合众新能源汽车股份有限公司 一种智能座舱域控制器及车辆

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CN107211556B (zh) 2019-03-12
CN109673139A (zh) 2019-04-23
CN109673139B (zh) 2020-05-29

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