WO2017031950A1 - 玻璃熔料、光电封装器件及其封装方法、和显示装置 - Google Patents

玻璃熔料、光电封装器件及其封装方法、和显示装置 Download PDF

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Publication number
WO2017031950A1
WO2017031950A1 PCT/CN2016/072758 CN2016072758W WO2017031950A1 WO 2017031950 A1 WO2017031950 A1 WO 2017031950A1 CN 2016072758 W CN2016072758 W CN 2016072758W WO 2017031950 A1 WO2017031950 A1 WO 2017031950A1
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Prior art keywords
glass frit
substrate
thickener
frit
organic
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PCT/CN2016/072758
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English (en)
French (fr)
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洪瑞
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京东方科技集团股份有限公司
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Priority to US15/322,755 priority Critical patent/US10196300B2/en
Publication of WO2017031950A1 publication Critical patent/WO2017031950A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a glass frit, an optoelectronic package device and a package method thereof, and a display device.
  • Frit material glass frit
  • OLED Organic Light-Emitting Display
  • the organic material in the Frit material is mainly an organic thickener, and its function is to disperse an inorganic material such as a powdery glass frit powder. If the composition of the organic thickener is too small, it is difficult to form a Frit material having a certain viscosity. A creamy mixture that is difficult to coat to form a pattern.
  • Embodiments of the present invention provide a glass frit, an optoelectronic package device, a package method thereof, and a display device It can reduce the bubbles generated during high-temperature sintering of the glass frit, improve the flatness of the glass frit surface, and improve the ratio of the package area after the glass frit and the device substrate are bonded, without increasing the viscosity of the glass frit.
  • the embodiment of the present invention provides a glass frit, the frit includes: a frit powder, an organic material: the organic material includes: an organic thickener; the glass frit further includes: An inorganic thickener composed of a clay mineral material.
  • the glass frit has a viscosity in the range of 0.3 x 10 5 to 1.3 x 10 5 cps.
  • the inorganic thickener has a mass of 30 to 70% of the total mass of the inorganic thickener and the organic thickener.
  • the inorganic thickener has a mass of from 3 to 15% by weight based on the total mass of the glass frit.
  • the clay mineral material comprises at least one of attapulgite, bentonite, and kaolin.
  • the inorganic thickener has a particle size ranging from 0.1 to 2.0 ⁇ m.
  • an embodiment of the present invention further provides an optoelectronic package device, including: a first substrate disposed opposite to the second substrate, disposed between the first substrate and the second substrate a photovoltaic element, an encapsulating material surrounding the photovoltaic element; the encapsulating material forms a sealed space with the first substrate and the second substrate; and the encapsulating material is cured by the glass frit according to any one of the above to make.
  • an embodiment of the present invention further provides a display device, where the display device includes the optoelectronic package device described above.
  • the embodiment of the present invention further provides a method for packaging the optoelectronic package device, wherein the package method includes: providing a first substrate and a second substrate; wherein the second substrate is formed to be packaged a photovoltaic element; the first substrate corresponding to a region of the second substrate surrounding the photovoltaic element being a package region; forming a glass frit of any of the above in the package region of the first substrate; or Forming a glass frit according to any one of the above-mentioned materials on a region of the second substrate surrounding the photovoltaic element; heat treating the glass frit; and introducing both the first substrate and the second substrate One of the glass frits formed therein is bonded to the other; the glass frit is subjected to laser irradiation.
  • the temperature of the heat treatment ranges from 400 to 450 ° C; the time range of the heat treatment is 10 to 60 minutes.
  • the heat treatment uses a stepwise temperature rise.
  • the inorganic thickener is added to the glass frit system, the thickening effect can be kept unchanged compared with the prior art glass frit.
  • the proportion of organic thickener in the glass frit is reduced by replacing the organic thickener of the prior art with an inorganic thickener. Since the proportion of the organic thickener is reduced, the number of bubbles generated by the organic material during the high-temperature sintering process is reduced, the flatness of the glass frit surface is improved, and the residual bubbles inside the glass frit are reduced, and the glass frit and the device are improved.
  • the ratio of the package area after the substrate is bonded, thereby improving the mechanical strength of the display device (such as an OLED panel) after packaging.
  • 1 is a temperature curve of a glass frit provided by the prior art and a high temperature sintering of a glass frit according to an embodiment of the present invention
  • 2A is a topographical test result obtained by a step test after a glass frit is sintered by the prior art
  • 2B is a topographical test result obtained by a step test after a glass frit is sintered according to an embodiment of the present invention
  • 3A is a surface topography image obtained by SEM scanning of a glass frit after sintering according to the prior art (magnification: 2000 times);
  • 3B is a topographical view (magnification of 2000 times) obtained by SEM scanning of a glass frit after sintering according to an embodiment of the present invention
  • 4A is a cross-sectional top view of a glass frit obtained by SEM scanning after the sintering of the prior art (magnification: 1500 times);
  • 4B is a cross-sectional view of a glass frit obtained by SEM scanning after being sintered according to an embodiment of the present invention (magnification: 1500 times);
  • FIG. 5 is a schematic cross-sectional view showing a structure of an optoelectronic package device according to an embodiment of the invention.
  • 01-optical package device 10-first substrate; 20-second substrate; 30-photoelectric element; 40-encapsulation material.
  • Embodiments of the present invention provide a glass frit including: frit powder, organic material: the organic material includes: an organic thickener; the glass frit further includes: an inorganic increase composed of a clay mineral material Thickener.
  • the first and the above glass frit powders may also be referred to as ceramic powders, and for example, powdered SiO 2 (silica), Bi 2 O 3 (antimony trioxide), CaO (oxidation) may be used.
  • Calcium ZnO (zinc oxide), V 2 O 5 (vanadium pentoxide), B 2 O 3 (boron trioxide), Al 2 O 3 (aluminum trioxide), Na 2 O (sodium oxide), At least one oxide such as K 2 O (potassium oxide), MgO (magnesium oxide), Sb 2 O 3 (antimony trioxide), Li 2 O (lithium oxide), BaO (cerium oxide), and SnO (tin oxide) Material powder composition.
  • the specific types and components of the glass frit powder in the above glass frit can be used in the prior art.
  • the U.S. Patent No. 7,923,393 B2 the Chinese patent CN 1616366 A, etc., is not limited herein.
  • the organic thickener may be, for example, EC (Ethyl cellulose ethoce, Chinese name is ethyl cellulose) and/or BCA (2-(2-Butoxyethoxy)ethyl acetate, Chinese name is butyl carbitol acetate) .
  • the above organic material may also include an organic solvent that dissolves EC.
  • it may be a mixed solvent in which an organic solvent such as acetic acid or alcohol is mixed in a certain ratio; and BCA is liquid at room temperature, without additional Solvent to dissolve BCA.
  • the specific type of the organic thickener can be used in the prior art.
  • the Chinese patent CN 102709050A and the like can be referred to, and the embodiment of the present invention is not limited herein.
  • the organic thickener and the inorganic thickener together provide the glass frit having a predetermined range of viscosities, and the value of this preset range can be, for example, the prior art requirements for the viscosity of the glass frit. That is to say, in the above glass frit system, an inorganic thickener composed of a clay mineral material is substituted for a part of the liquid organic thickener, so that the glass frit system acts on the above two thickeners. The viscosity is met to meet the process design requirements such as coating.
  • the viscosity range of the glass frit provided by the embodiment of the present invention may specifically be 0.3 ⁇ 10 5 to 1.3 ⁇ 10 5 cps, so that the viscosity of the glass frit better satisfies the design requirements of the patterning process.
  • centipoise is the Brooklyn viscosity unit "centipoise", which is used to indicate the self-flow resistance of the liquid.
  • the ratio of the inorganic thickener can be designed with reference to the following components:
  • the inorganic thickener may be present in an amount of from 30 to 70% by weight of the total thickener (i.e., the sum of the mass of the inorganic thickener and the organic thickener).
  • the quality of the inorganic thickener is from 40 to 60% by mass of the total thickener.
  • the inorganic thickener may be present in an amount of from 3 to 15% by weight based on the total mass of the glass frit.
  • the mass of the inorganic thickener accounts for 5 to 10% of the total mass of the glass frit.
  • the inorganic thickener composed of the clay mineral material includes at least one of attapulgite, bentonite, and kaolin.
  • the clay mineral material has stability characteristics other than that of the glass frit powder and the organic matter. Stronger, it can be stably dispersed in the glass frit system.
  • the clay mineral materials are usually in the form of a powder, and the particle diameter thereof is preferably in the range of 0.1 to 2.0 ⁇ m so that the inorganic thickener can be more uniformly dispersed in the glass frit system.
  • the specific kind of the inorganic thickener is preferably attapulgite.
  • the attapulgite is also known as palygorskite, and its chemical formula is Mg 5 Si 8 O 20 (OH) 2 (OH 2 ) 4 ⁇ 4H 2 O, which is an aqueous magnesium-rich silicate viscosity mineral having a chain structure. Compared with other clay mineral materials, the viscosity of the dispersion in the liquid is higher, and a small amount can achieve a good thickening effect, thereby further reducing the amount of the organic thickener.
  • the particle size range of the inorganic thickener is further preferably 0.5 ⁇ m, and this particle size allows the inorganic thickener powder to be sufficiently dispersed without causing powder agglomeration due to an excessively small particle diameter.
  • the inorganic thickener is added to the glass frit system, the thickening effect can be kept unchanged compared with the prior art glass frit.
  • the proportion of organic thickener in the glass frit is reduced by replacing the organic thickener of the prior art with an inorganic thickener. Since the proportion of the inorganic thickener is reduced, the number of bubbles generated by the organic material during the high-temperature sintering process is reduced, the flatness of the glass frit surface is improved, and the residual bubbles inside the glass frit are reduced, and the glass frit and the device are improved.
  • the ratio of the package area after the substrate is bonded, thereby improving the mechanical strength of the display device (such as an OLED panel) after packaging.
  • a glass frit provided by the prior art wherein the glass frit powder is a commercially available Corning HCP-20 product, and the main component thereof is a mixed powder of V 2 O 5 , BaO and ZnO (glass frit powder), and contains An organic material comprising an organic thickener and an organic solvent.
  • the organic thickener is EC
  • the solvent is a mixture of diethylene glycol butyl ether acetate and ⁇ -terpineol.
  • the resulting glass frit has an overall viscosity of 0.5 x 10 5 cps, a density of 4.1 to 4.3 g/cc (g/ml), and a dark brown color.
  • the same frit powder component and organic solvent as in sample 1 were used, except that attapulgite was used as an inorganic thickener to replace 40% of the mass of EC in sample 1, and the inorganic thickener accounted for the total mass of the glass frit. 8%.
  • the attapulgite has an average particle diameter of 0.2 ⁇ m, and is sufficiently stirred to obtain a glass frit according to an embodiment of the present invention, that is, sample 2.
  • the specific parameters are as follows: viscosity is 0.55 ⁇ 10 5 cps, density is 4.1 to 4.3 g / cc, and the color is dark brown.
  • Patterned Sample 1 and Sample 2 were obtained by a screen printing process.
  • the printing of sample 1 and sample 2 is the same, the process parameters are: printing speed is 80 mm / s (mm / sec), the amount of dispensing is 400 ⁇ m, the angle of the printed blade is 75 °, the printing width of the pattern For example, it can be 0.6 mm, 0.7 mm or 0.8 mm.
  • the patterned sample 1 and sample 2 were subjected to high-temperature sintering treatment, and the temperature rising curve is as shown in FIG. 1: the sample 1 and the sample 2 were heated at a rate of 5 to 8 ° C per minute to 150 to 180 ° C and kept for 10 minutes, and then The temperature is raised to 400-420 ° C per minute at a rate of 5-8 ° C and held for 30 minutes, then allowed to cool, that is, naturally cooled to room temperature.
  • the stepwise heating mode is used to sufficiently volatilize the organic materials in Samples 1 and 2, and to bond the glass frit to the substrate for subsequent bonding and laser irradiation processes.
  • sample 2 was 10.6507 ⁇ m, the surface morphology was significantly improved compared with sample 1, the surface was smoother, and the unevenness was rare; and the thickness of sample 2 did not change significantly compared with sample 1, indicating that the glass frit system was entirely Under the premise that the viscosity meets the preset range, after replacing the organic thickener with the powdery inorganic thickener, the overall thickness of the glass frit is not significantly increased, and the subsequent bonding and laser irradiation processes are not affected, and normal operation can be achieved. Sealed.
  • the parameter 9.982 ⁇ m in FIG. 4A indicates the section thickness of the test portion of the sample 1; the parameters indicated by the arrows in FIG. 4B indicate the section thicknesses of different regions of the sample portion of the sample 2, and the glass frit powder after the sample 2 is subjected to high-temperature sintering treatment; The diameter of the particles.
  • the embodiment of the present invention further provides an optoelectronic package device 01.
  • the optoelectronic package device 01 includes: a first substrate 10 and a second substrate 20 disposed opposite to each other, and is disposed on the first substrate.
  • the photovoltaic element 30 may be, for example, an OLED device or an element such as a solar thin film battery, which is not limited herein.
  • the embodiment of the present invention further provides a method for packaging the above-mentioned optoelectronic package device, and the package method includes:
  • the glass frit may be formed on the package region of the first substrate by a process such as a screen or a dispensing, or may be formed on the second substrate on a region surrounding the photovoltaic element. Glass frit.
  • the first substrate is preferably used as the package substrate, so that the second substrate on which the photovoltaic element to be packaged is formed is used as the device substrate.
  • a patterned glass frit is formed on the package substrate.
  • one of the first glass substrate and the second substrate is formed to be bonded to the other of the glass frit, and when the glass frit is formed on the first substrate, The side on which the first substrate is formed with the glass frit is bonded to the side on which the second substrate is formed with the photovoltaic element.
  • the temperature range of the heat treatment in the above step S03 is 400 to 450 ° C; heat treatment The time range is from 10 to 60 minutes, so that the organic material in the glass frit is sufficiently volatilized, and the glass frit is sufficiently bonded to the substrate for subsequent bonding and laser irradiation processes.
  • an embodiment of the present invention further provides a display device including the above-described optoelectronic package device.
  • the display device described above may be, for example, a product or a component having any display function such as an OLED panel, an OLED display, an OLED television, a tablet computer, a mobile phone, an electronic paper, or a digital photo frame.

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Abstract

本发明实施例提供了玻璃熔料、光电封装器件及其封装方法、和显示装置，涉及显示技术领域，可在不影响玻璃熔料粘性的前提下，减少玻璃熔料高温烧结时产生的气泡，改善玻璃熔料表面平整度，提高玻璃熔料与器件基板贴合后的封装面积比例，从而提高封装后OLED面板的机械强度。该玻璃熔料包括：玻璃料粉体、有机材料；所述有机材料包括：有机增稠剂；所述玻璃熔料还包括：由粘土矿物材料构成的无机增稠剂。本发明实施例用于玻璃熔料及包括该玻璃熔料的光电封装器件、显示装置的制备。

Description

玻璃熔料、光电封装器件及其封装方法、和显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种玻璃熔料、一种光电封装器件及其封装方法、和一种显示装置。
背景技术
Frit材料(玻璃熔料)是由无机材料和有机材料构成的具有一定粘度的膏状混合物，其具有成本低、工艺简单的优势，且Frit材料经激光(Laser)熔化后为无机物，具有非常好的水氧阻隔特性。因此，采用Frit封装技术是目前OLED(Organic Light-Emitting Display，有机电致发光显示装置)量产封装的主流技术，可使得封装的OLED器件具有高寿命。
由于Frit材料是涂覆在封装基板的封装区域，需要经过丝网、点胶等构图工艺形成相应的图案。因此，Frit材料中的有机材料主要为有机增稠剂，其作用是分散粉末状的玻璃料粉体等无机材料，若有机增稠剂的组分过少，则难以使得Frit材料形成具有一定粘度的膏状混合物，难以涂覆形成图案。
而有机物在激光照射时会发生闪爆并产生影响OLED器件的有害气体，因此在对Frit材料进行激光熔融之前需经过高温烧结的预处理过程，以使得有机材料挥发去除，之后再与形成有OLED器件的器件基板相贴合以进行激光封装工艺。
然而，由于有机材料在高温烧结过程中会产生气泡，而涂覆在封装基板上的Frit材料厚度较小(通常不到10μm)，气泡对Frit材料表面及内部的形貌影响较大，气泡受高温影响移动到Frit材料表面后会导致表面凹凸不平，使得器件基板与Frit材料贴合后一些区域实际上就没有与Frit材料相接触，导致激光照射后产生封装不良，降低了封装后的OLED面板的机械强度；并且，在Frit材料内部，有机材料挥发后留下的气泡还会加大熔融固化后的Frit材料内部应力，进一步降低封装后的OLED面板的机械强度。
发明内容
本发明的实施例提供一种玻璃熔料、光电封装器件及其封装方法、显示装 置，可在不影响玻璃熔料粘性的前提下，减少玻璃熔料高温烧结时产生的气泡，改善玻璃熔料表面平整度，提高玻璃熔料与器件基板贴合后的封装面积比例，从而提高封装后OLED面板的机械强度。
为达到上述目的，本发明的实施例采用如下技术方案：
一方面、本发明实施例提供了一种玻璃熔料，所述玻璃熔料包括：玻璃料粉体、有机材料：所述有机材料包括：有机增稠剂；所述玻璃熔料还包括：由粘土矿物材料构成的无机增稠剂。
优选的，所述玻璃熔料的粘度范围为0.3×105～1.3×105cps。
作为一种可选的方式，所述无机增稠剂的质量占所述无机增稠剂与所述有机增稠剂总质量的30～70％。
作为另一种可选的方式，所述无机增稠剂的质量占所述玻璃熔料总质量的3～15％。
优选的，所述粘土矿物材料包括：凹凸棒土、膨润土、高岭土中的至少一种。
优选的，所述无机增稠剂的粒径范围为0.1～2.0μm。
另一方面、本发明实施例还提供了一种光电封装器件，所述光电封装器件包括：相对设置的第一基板、第二基板、设置在所述第一基板与所述第二基板之间的光电元件、环绕所述光电元件的封装材料；所述封装材料与所述第一基板、所述第二基板形成密封空间；所述封装材料由上述任一项所述的玻璃熔料固化而成。
再一方面、本发明实施例还提供了一种显示装置，所述显示装置包括上述所述的光电封装器件。
又一方面、本发明实施例还提供了一种上述所述的光电封装器件的封装方法，所述封装方法包括：提供第一基板与第二基板；其中，所述第二基板上形成有待封装的光电元件；所述第一基板对应于所述第二基板中环绕所述光电元件的区域为封装区域；在所述第一基板的所述封装区域形成上述任一项的玻璃熔料；或者，在所述第二基板上环绕所述光电元件的区域形成上述任一项所述的玻璃熔料；对所述玻璃熔料进行热处理；将所述第一基板与所述第二基板二者中形成有所述玻璃熔料的一者与另一者相贴合；对所述玻璃熔料进行激光照射。
优选的，所述热处理的温度范围为400～450℃；所述热处理的时间范围为 10～60min。
优选的，所述热处理采用阶梯式升温。
基于此，采用本发明实施例提供的上述玻璃熔料，由于在玻璃熔料体系中添加了无机增稠剂，可在与现有技术的玻璃熔料相比增稠效果不变的情况下，降低了有机增稠剂在玻璃熔料中的比例，即以无机增稠剂替换了现有技术中部分的有机增稠剂。由于有机增稠剂的比例减少，从而减少了有机材料在高温烧结过程中产生的气泡数量，改善了玻璃熔料表面平整度以及降低了玻璃熔料内部残留的气泡，提高了玻璃熔料与器件基板贴合后的封装面积比例，从而提高封装后显示装置(如OLED面板)的机械强度。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为对现有技术提供的一种玻璃熔料、本发明实施例提供的一种玻璃熔料高温烧结的温度曲线；
图2A为现有技术提供的一种玻璃熔料经烧结后由台阶仪测试得出的形貌试验结果；
图2B为本发明实施例提供的一种玻璃熔料经烧结后由台阶仪测试得出的形貌试验结果；
图3A为现有技术提供的一种玻璃熔料经烧结后由SEM扫描获得的表面形貌图(放大倍数为2000倍)；
图3B为本发明实施例提供的一种玻璃熔料经烧结后由SEM扫描获得的表面形貌图(放大倍数为2000倍)；
图4A为现有技术提供的一种玻璃熔料经烧结后由SEM扫描获得的截面形貌图(放大倍数为1500倍)；
图4B为本发明实施例提供的一种玻璃熔料经烧结后由SEM扫描获得的截面形貌图(放大倍数为1500倍)；
图5为本发明实施例提供一种光电封装器件的结构截面示意图。
附图说明：
01-光电封装器件；10-第一基板；20-第二基板；30-光电元件；40-封装材料。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要指出的是，除非另有定义，本发明实施例中所使用的所有术语(包括技术和科学术语)具有与本发明所属领域的普通技术人员共同理解的相同含义。还应当理解，诸如在通常字典里定义的那些术语应当被解释为具有与它们在相关技术的上下文中的含义相一致的含义，而不应用理想化或极度形式化的意义来解释，除非这里明确地这样定义。
本发明实施例提供了一种玻璃熔料，该玻璃熔料包括：玻璃料粉体、有机材料：有机材料包括：有机增稠剂；该玻璃熔料还包括：由粘土矿物材料构成的无机增稠剂。
需要说明的是，第一、上述的玻璃料粉体也可称之为陶瓷粉，例如可以采用粉末状的SiO2(二氧化硅)、Bi2O3(三氧化二铋)、CaO(氧化钙)、ZnO(氧化锌)、V2O5(五氧化二钒)、B2O3(三氧化二硼)、Al2O3(三氧化二铝)、Na2O(氧化钠)、K2O(氧化钾)、MgO(氧化镁)、Sb2O3(三氧化二锑)、Li2O(氧化锂)、BaO(氧化钡)、SnO(氧化锡)等至少一种氧化物材料粉末构成。
这里，上述玻璃熔料中玻璃料粉体的具体种类和组分可沿用现有技术，例如，可参见美国专利US 7923393B2、中国专利CN 1616366A等，本发明实施例在此不作限定。
第二、有机增稠剂例如可以为EC(Ethyl cellulose ethoce，中文名称为乙基纤维素)和/或BCA(2-(2-Butoxyethoxy)ethyl acetate，中文名称为乙酸丁基卡必醇酯)。
其中，由于EC室温状态(也称为常温或者一般温度，通常来说，室温有3种范围的定义，即：(1)、23℃±2℃；(2)、25℃±5℃；(3)、20℃±5℃)下为粉末状，上述的有机材料还可包括溶解EC的有机溶剂。例如可以是醋酸、醇等有机溶剂按一定比例混合的混合溶剂；而BCA室温状态下为液体，无需额外 溶剂来溶解BCA。
这里，有机增稠剂的具体种类可沿用现有技术，例如，可参见中国专利CN 102709050A等，本发明实施例在此不作限定。
第三、有机增稠剂以及无机增稠剂共同使得上述的玻璃熔料具有预设范围的粘度，这一预设范围的数值例如可以是现有技术对玻璃熔料粘度的要求。也即是说，在上述玻璃熔料体系中，是将由粘土矿物材料构成的无机增稠剂替代部分组分的液态有机增稠剂，使得由玻璃熔料体系在上述两种增稠剂的作用下达到符合涂覆等工艺设计要求的粘度。
当玻璃熔料粘度过小时(例如小于0.3×105cps)会导致玻璃熔料在图案化的时产生表面形貌差、图案印刷不均匀的问题；当玻璃熔料粘度过大时(例如大于1.3×105cps)容易造成网版孔的堵塞，影响丝网图案化的精细程度。因此，本发明实施例提供的玻璃熔料的粘度范围的数值具体可以为0.3×105～1.3×105cps，以使玻璃熔料的粘度更好地满足图案化工艺的设计要求。其中，cps(全称为centipoise)为布氏粘度单位“厘泊”，用于表示液体的自身流动阻力。
这里，为了获得满足上述粘度预设范围要求的玻璃熔料，无机增稠剂的比例可参考以下组分设计：
作为一种可选的方式，可以使得无机增稠剂的质量占总增稠剂质量(即无机增稠剂与有机增稠剂质量之和)的30～70％。
当玻璃熔料的粘度范围进一步优选为0.5×105～1.0×105cps时，无机增稠剂的质量占总增稠剂质量的40～60％。
作为另一种可选的方式，可以使得无机增稠剂的质量占玻璃熔料总质量的3～15％。
当玻璃熔料的粘度范围进一步优选为0.5×105～1.0×105cps时，无机增稠剂的质量占玻璃熔料总质量的5～10％。
第四、由粘土矿物材料构成的无机增稠剂包括：凹凸棒土、膨润土、高岭土中的至少一种，这些粘土矿物材料除了具有不与玻璃料粉体、有机物发生反应的特性外，稳定性较强，可在玻璃熔料体系中稳定分散。
其中，这些粘土矿物材料的形貌通常均为粉末状，其粒径范围优选为0.1～2.0μm，以使得无机增稠剂可更为均匀地分散在玻璃熔料体系中。
这里，无机增稠剂的具体种类优选为凹凸棒土。凹凸棒土又名坡缕石，化 学式为Mg5Si8O20(OH)2(OH2)4·4H2O，是一种具有链状结构的含水富镁硅酸盐粘度矿物。相比于其他几种粘土矿物材料，其分散于液体中的粘度更高，少量即能达到很好的增稠效果，从而可进一步降低有机增稠剂的用量。
无机增稠剂粒径范围进一步优选为0.5μm，这一粒径尺寸可使无机增稠剂粉末充分分散，并且不会由于粒径过小而产生粉末团聚现象。
基于此，采用本发明实施例提供的上述玻璃熔料，由于在玻璃熔料体系中添加了无机增稠剂，可在与现有技术的玻璃熔料相比增稠效果不变的情况下，降低了有机增稠剂在玻璃熔料中的比例，即以无机增稠剂替换了现有技术中部分的有机增稠剂。由于无机增稠剂的比例减少，从而减少了有机材料在高温烧结过程中产生的气泡数量，改善了玻璃熔料表面平整度以及降低了玻璃熔料内部残留的气泡，提高了玻璃熔料与器件基板贴合后的封装面积比例，从而提高封装后显示装置(如OLED面板)的机械强度。
下面给出一组对照试验，以详细地描述本发明提供的玻璃熔料与现有技术的玻璃熔料之间的形貌差异。
样品1：
现有技术提供的一种玻璃熔料，其中玻璃料粉体为市售的康宁HCP-20产品，其主要成分为V2O5、BaO以及ZnO的混合粉末(玻璃料粉体)，并含有有机材料，所述有机材料包含有机增稠剂和有机溶剂。其中，有机增稠剂为EC，溶剂为二甘醇丁醚醋酸与α-松油醇的混合物。形成的玻璃熔料整体粘度为0.5×105cps、密度为4.1～4.3g/cc(克/毫升)、颜色为深棕色。
样品2：
采用与样品1相同的玻璃料粉体组分和有机溶剂，不同之处在于以凹凸棒土为无机增稠剂替代样品1中40％质量的EC，并且无机增稠剂占玻璃熔料总质量的8％。其中凹凸棒土的平均粒径为0.2μm，经充分搅拌得到本发明实施例提供的一种玻璃熔料，即样品2。其具体参数如下：粘度为0.55×105cps、密度为4.1～4.3g/cc、颜色为深棕色。
通过丝网印刷工艺，得到图案化的样品1和样品2。其中，对样品1和样品2的印刷相同，工艺参数为：印刷速度为80mm/s(毫米/每秒)、点胶的压入量为400μm、印刷的刮刀角度为75°、图案的印刷宽度例如可为0.6mm、0.7mm或0.8mm。
对图案化的样品1和样品2进行高温烧结处理，升温曲线如图1所示：对样品1和样品2以每分钟5～8℃的速度升温至150～180℃并保温10分钟，再以每分钟5～8℃的速度升温至400～420℃并保温30分钟，之后放冷，即自然冷却至室温。采用阶梯式升温模式是为了使样品1和样品2中的有机材料充分挥发，并使玻璃熔料与基板相粘结，以便进行后续的贴合、激光照射工艺。
通过台阶仪对样品1和样品2烧结后的表面形貌做定量的测试，测试结果如图2A和图2B所示，可以看出样品1的厚度为9.3078μm，表面存在大量的凹凸不平，表面规则度较差。样品2的厚度为10.6507μm，表面形貌较样品1明显有所改善，表面更为平滑，少见凹凸不平；并且，样品2的厚度较样品1没有发生明显变化，说明在使玻璃熔料体系整体粘度满足预设范围的前提下，将粉末状的无机增稠剂替代部分有机增稠剂后，对玻璃熔料整体厚度没有明显增加，不会影响后续的贴合以及激光照射工艺，能够实现正常封接。
通过扫描电子显微镜(Scanning Electron Microscope，简称为SEM)对样品1和样品2烧结后的表面及截面形貌做扫描测试，如图3A和图3B所示，可以看出，样品1表面存在大量的凹凸不平，而样品2的表面较为平滑，凹凸不平的区域较少。这一扫描测试结果与台阶仪的测试结果相一致，进一步验证了本发明实施例提供的上述玻璃熔料在使玻璃熔料体系整体粘度满足预设范围的前提下，将粉末状的无机增稠剂替代部分有机增稠剂后，明显改善了玻璃熔料高温烧结处理后的表面形貌，提高了封接面积比例。
进一步如图4A和图4B所示，可以看出，在样品1的截面中存在大量气泡，且气泡的直径与玻璃熔料高温烧结后的厚度数量级相差不大，这些气泡会存在大量的集中应力，影响玻璃熔料的机械强度；而样品2的截面中未见明显的气泡，说明样品2的玻璃熔料烧结后内部没有或只存在极少量的气泡，不会产生集中应力，进一步提高了玻璃熔料的机械强度。
其中，图4A中的参数9.982μm表示样品1测试部分的截面厚度；图4B中各箭头所指参数表示样品2测试部分不同区域的截面厚度，以及样品2经过高温烧结处理后，玻璃料粉体颗粒的直径。
在上述基础上，如图5所示，本发明实施例还提供了一种光电封装器件01，该光电封装器件01包括：相对设置的第一基板10、第二基板20、设置在第一基板10与第二基板20之间的光电元件30、环绕光电元件的封装材料40；封装材料40与第一基板10、第二基板20形成密封空间；其中，封装材料40是 由上述的玻璃熔料固化而成。
这里，光电元件30例如可以是OLED器件，也可以为太阳能薄膜电池等元件，在此不作限定。
进一步的，本发明实施例还提供了一种上述光电封装器件的封装方法，该封装方法包括：
S01、提供第一基板与第二基板；其中，第二基板上形成有待封装的光电元件；第一基板对应于第二基板中环绕光电元件的区域为封装区域。
S02、在第一基板的封装区域形成玻璃熔料；或者，在第二基板上环绕光电元件的区域形成上述的玻璃熔料。
S03、对玻璃熔料进行热处理，以去除玻璃熔料中的有机材料，并使玻璃熔料与第一基板相粘结。
S04、将第一基板与第二基板二者中形成有上述玻璃熔料的一者与另一者相贴合。
S05、对封装区域内的玻璃熔料进行激光照射，以使玻璃熔料与第二基板相粘结。
需要说明的是，第一、在上述步骤S02中，可以将玻璃熔料通过丝网、点胶等工艺形成在第一基板的封装区域，也可以在第二基板上环绕光电元件的区域形成上述的玻璃熔料。
这样一来，由于在之后的步骤S03中需要通过高温烧结对玻璃熔料进行预处理，而待封装的光电元件，如OLED器件、太阳能薄膜电池等元件对高温非常敏感，温度过高会导致如OLED器件中的电子传输层、空穴传输层等功能层失效。因此，在上述步骤S01中，优选地以第一基板作为封装基板，以形成有待封装的光电元件的第二基板作为器件基板。并在之后的步骤S02中，在封装基板上形成图案化的玻璃熔料。
第二、在上述步骤S04中，将第一基板与第二基板二者中形成有上述玻璃熔料的一者与另一者相贴合，当在第一基板上形成玻璃熔料时，即将第一基板形成有玻璃熔料的一侧与第二基板形成有光电元件的一侧相贴合。
第三、上述步骤S02～S05的具体工艺过程，例如形成玻璃熔料图案的过程、热处理的温度及时间、第一基板与第二基板贴合工艺以及激光照射的光强、时间等具体可沿用现有技术，在此不作赘述。
其中，示例的，上述步骤S03中热处理的温度范围为400～450℃；热处理 的时间范围为10～60min，以使玻璃熔料中的有机材料充分挥发，并使玻璃熔料与基板充分相粘结，以便进行后续的贴合、激光照射工艺。
进一步的，本发明实施例还提供了一种显示装置，该显示装置包括上述的光电封装器件。
这里，上述的显示装置例如可以为OLED面板、OLED显示器、OLED电视、平板电脑、手机、电子纸或数码相框等具有任何显示功能的产品或者部件。
需要说明的是，本发明所有附图是上述的玻璃熔料、光电封装器件及其封装方法简略的示意图，只为清楚描述本方案体现了与发明点相关的结构，对于其他的与发明点无关的结构是现有结构，在附图中并未体现或只体现部分。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (11)

  1. 一种玻璃熔料，所述玻璃熔料包括：玻璃料粉体、有机材料；所述有机材料包括：有机增稠剂；其特征在于，所述玻璃熔料还包括：由粘土矿物材料构成的无机增稠剂。
  2. 根据权利要求1所述的玻璃熔料，其特征在于，所述玻璃熔料的粘度范围为0.3×105～1.3×105cps。
  3. 根据权利要求2所述的玻璃熔料，其特征在于，所述无机增稠剂的质量占所述无机增稠剂与所述有机增稠剂总质量的30～70％。
  4. 根据权利要求2所述的玻璃熔料，其特征在于，所述无机增稠剂的质量占所述玻璃熔料总质量的3～15％。
  5. 根据权利要求1所述的玻璃熔料，其特征在于，所述粘土矿物材料包括：凹凸棒土、膨润土、高岭土中的至少一种。
  6. 根据权利要求1所述的玻璃熔料，其特征在于，所述无机增稠剂的粒径范围为0.1～2.0μm。
  7. 一种光电封装器件，所述光电封装器件包括：相对设置的第一基板、第二基板、设置在所述第一基板与所述第二基板之间的光电元件、环绕所述光电元件的封装材料；所述封装材料与所述第一基板、所述第二基板形成密封空间；其特征在于，所述封装材料由权利要求1至6任一项所述的玻璃熔料固化而成。
  8. 一种显示装置，其特征在于，所述显示装置包括如权利要求7所述的光电封装器件。
  9. 一种光电封装器件的封装方法，其特征在于，所述封装方法包括：
    提供第一基板与第二基板；其中，所述第二基板上形成有待封装的光电元件；所述第一基板对应于所述第二基板上环绕所述光电元件的区域为封装区域；
    在所述第一基板的所述封装区域形成权利要求1至6任一项所述的玻璃熔料；或者，在所述第二基板上环绕所述光电元件的区域形成权利要求1至6任一项所述的玻璃熔料；
    对所述玻璃熔料进行热处理；
    将所述第一基板与所述第二基板二者中形成有所述玻璃熔料的一者与另一者相贴合；
    对所述玻璃熔料进行激光照射。
  10. 根据权利要求9所述的封装方法，其特征在于，所述热处理的温度范围为400～450℃；所述热处理的时间范围为10～60min。
  11. 根据权利要求9或10所述的封装方法，其中所述热处理采用阶梯式升温。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110663119A (zh) * 2017-05-31 2020-01-07 东洋铝株式会社 太阳能电池用膏状组合物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105047690B (zh) 2015-08-27 2020-12-04 京东方科技集团股份有限公司 一种玻璃胶、光电封装器件及其封装方法、显示装置
CN105693094B (zh) * 2016-03-24 2019-06-14 福建省南平市三金电子有限公司 一种预烧低熔封接玻璃片及其制备方法
CN106274104B (zh) * 2016-08-12 2017-08-25 京东方科技集团股份有限公司 一种印刷方法
CN107275516B (zh) * 2017-06-21 2019-01-29 苏州卡睿知光电科技有限公司 一种用于光电器件的玻璃密封料、糊剂及其制备方法
JP2021041375A (ja) * 2019-09-13 2021-03-18 株式会社東芝 導電性流体用吐出ヘッド

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101186433A (zh) * 2006-06-02 2008-05-28 株式会社日立显示器 显示装置
CN102548925A (zh) * 2009-07-17 2012-07-04 康宁股份有限公司 用于形成包括玻璃熔料的盖板以及形成包括该盖板的玻璃封装体的方法
CN103492334A (zh) * 2011-02-22 2014-01-01 葛迪恩实业公司 钒基玻璃熔料及其制造方法
CN105047690A (zh) * 2015-08-27 2015-11-11 京东方科技集团股份有限公司 一种玻璃胶、光电封装器件及其封装方法、显示装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6534427B1 (en) * 2001-12-12 2003-03-18 Christian R. Quemere Night glow glaze for ceramics
US20050238803A1 (en) * 2003-11-12 2005-10-27 Tremel James D Method for adhering getter material to a surface for use in electronic devices
KR100645707B1 (ko) * 2006-01-27 2006-11-15 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
CN101807672B (zh) * 2010-04-12 2012-10-24 友达光电股份有限公司 玻璃封装结构及其制造方法
US8658886B2 (en) * 2011-05-13 2014-02-25 Samsung Sdi Co., Ltd. Photoelectric conversion module
US20120298187A1 (en) * 2011-05-23 2012-11-29 Hyun-Chul Kim Photoelectric conversion module
CN103102075B (zh) * 2013-01-21 2015-05-06 京东方科技集团股份有限公司 一种采用玻璃料进行密封的方法、装置及玻璃料
CN104466028A (zh) * 2013-09-18 2015-03-25 群创光电股份有限公司 显示面板的封装方法及封装结构
CN104576707B (zh) * 2015-01-28 2018-04-06 京东方科技集团股份有限公司 Oled面板及其制备方法和显示装置
CN104810484B (zh) * 2015-05-07 2017-01-04 合肥鑫晟光电科技有限公司 封装胶、封装方法、显示面板及显示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101186433A (zh) * 2006-06-02 2008-05-28 株式会社日立显示器 显示装置
CN102548925A (zh) * 2009-07-17 2012-07-04 康宁股份有限公司 用于形成包括玻璃熔料的盖板以及形成包括该盖板的玻璃封装体的方法
CN103492334A (zh) * 2011-02-22 2014-01-01 葛迪恩实业公司 钒基玻璃熔料及其制造方法
CN105047690A (zh) * 2015-08-27 2015-11-11 京东方科技集团股份有限公司 一种玻璃胶、光电封装器件及其封装方法、显示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110663119A (zh) * 2017-05-31 2020-01-07 东洋铝株式会社 太阳能电池用膏状组合物
CN110663119B (zh) * 2017-05-31 2023-08-29 东洋铝株式会社 太阳能电池用膏状组合物

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