WO2016175124A1 - 光伝送基板および光伝送モジュール - Google Patents
光伝送基板および光伝送モジュール Download PDFInfo
- Publication number
- WO2016175124A1 WO2016175124A1 PCT/JP2016/062640 JP2016062640W WO2016175124A1 WO 2016175124 A1 WO2016175124 A1 WO 2016175124A1 JP 2016062640 W JP2016062640 W JP 2016062640W WO 2016175124 A1 WO2016175124 A1 WO 2016175124A1
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- WIPO (PCT)
- Prior art keywords
- optical transmission
- core
- photoelectric conversion
- conversion element
- transmission board
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4283—Electrical aspects with electrical insulation means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
Definitions
- the present invention relates to an optical transmission board and an optical transmission module including the optical transmission board.
- the optical transmission board of the present disclosure includes a wiring board and an optical transmission path.
- the wiring board has one main surface including a mounting region for photoelectric conversion elements.
- the optical transmission line includes a layered first cladding portion disposed on the one main surface of the wiring substrate, at least one core portion in a strip shape disposed on the first cladding portion, and a part of the core portion. It has the 2nd clad part distribute
- the optical transmission line has an end portion located in the mounting region, and the end portion has a part of the core portion.
- An optical transmission module includes the above-described optical transmission substrate and a photoelectric conversion element.
- the photoelectric conversion element is disposed in the mounting region of the one main surface of the optical transmission board.
- the distance between the upper surface of the optical transmission board and the lower surface of the photoelectric conversion element is equal to or higher than the height of the end of the optical transmission path of the optical transmission board.
- the optical transmission module may be used with any direction set upward or downward, but in this specification, for the sake of convenience, an orthogonal coordinate system (X, Y, Z) is defined, and the Z-axis direction is defined.
- X, Y, Z orthogonal coordinate system
- the term “upper surface” or “lower surface” is used with the positive side as the upper side.
- FIG. 1 is a cross-sectional view of the optical transmission module according to the present embodiment when cut in the vertical direction (Z-axis direction) along XX ′ shown in FIG.
- FIG. 2 is a top view schematically showing a state in which the photoelectric conversion element is removed from the optical transmission module according to the present embodiment.
- the optical transmission module 1 can, for example, convert an electrical signal from an electrical device into an optical signal and communicate with the external device using the optical signal.
- the optical transmission module 1 is mounted on a product such as an optical transceiver, a server, or a router, for example.
- the optical transmission module 1 includes a photoelectric conversion element 2 and an optical transmission substrate 3 on which the photoelectric conversion element 2 is arranged.
- the photoelectric conversion element 2 can convert an electrical signal into an optical signal or convert an optical signal into an electrical signal. As described above, the photoelectric conversion element 2 is disposed on the optical transmission substrate 3. Specifically, the photoelectric conversion element 2 is mounted on the optical transmission board 3 via the bumps 4. The photoelectric conversion element 2 is flip-chip mounted on the upper surface of the optical transmission substrate 3 by bumps 4. The distance between the lower surface of the photoelectric conversion element 2 and the upper surface of the light transmission substrate 3 may be, for example, 25 ⁇ m or more and 150 ⁇ m or less.
- the photoelectric conversion element 2 various light emitting elements or light receiving elements may be used.
- the light emitting element for example, a vertical cavity surface emitting laser (VCSEL) can be used.
- VCSEL vertical cavity surface emitting laser
- the light receiving element for example, a photodiode can be used.
- the bump 4 can make the photoelectric conversion element 2 and the optical transmission board 3 conductive. Further, the bump 4 can fix the photoelectric conversion element 2 to the optical transmission substrate 3.
- the bump 4 may be formed of a metal material such as gold, silver, copper, or solder. Further, the bump 4 has a spherical or columnar shape. If the bump 4 is spherical, a solder ball or the like is used as the bump 4. When the bumps 4 are columnar, stud bumps made of gold, for example, are used as the bumps 4.
- the thickness of the bump 4 may be, for example, 20 ⁇ m or more and 100 ⁇ m or less.
- the optical transmission board 3 has a wiring board 5 and an optical transmission path 6 arranged on the wiring board 5.
- the photoelectric conversion element 2 is mounted on the upper surface of the wiring board 5.
- a part of the optical transmission line 6 is disposed between the wiring substrate 5 and the photoelectric conversion element 2.
- the photoelectric conversion element 2 and the wiring board 5 are electrically connected.
- the photoelectric conversion element 2 and the optical transmission line 6 are optically connected.
- the photoelectric conversion element 2 has a light receiving surface or a light emitting surface at a position facing the optical transmission path 6 in order to transmit an optical signal through the optical transmission path 6.
- the wiring board 5 can support the photoelectric conversion element 2 and the optical transmission path 6.
- the wiring board 5 is formed by alternately laminating a plurality of insulating layers and a plurality of metal layers, and electrically connects adjacent metal layers in the vertical direction via via conductors that penetrate through one insulating layer. What is necessary is just to be formed.
- the metal layer can function as the wiring of the wiring board 5.
- the wiring board 5 can be produced by a conventionally known method.
- the wiring board 5 is not limited to having a plurality of insulating layers and a plurality of metal layers.
- the wiring board 5 may have, for example, one insulating layer and metal layers disposed on the upper and lower surfaces of the one insulating layer.
- the wiring board 5 may have, for example, a laminated body composed of a plurality of insulating layers and metal layers disposed on the upper and lower surfaces of the laminated body.
- the wiring substrate 5 may be, for example, a mixture of a single insulating layer, a laminate composed of a plurality of insulating layers, and a plurality of metal layers.
- the wiring board 5 has an upper surface (one main surface).
- the upper surface of the wiring board 5 has a mounting area A for the photoelectric conversion element 2. That is, the photoelectric conversion element 2 is mounted in the mounting area A.
- the wiring board 5 has a plurality of connection pads 7 arranged in the mounting area A on the upper surface of the wiring board 5 in order to be electrically connected to the photoelectric conversion element 2.
- the mounting area A is an area immediately below the photoelectric conversion element 2 on the upper surface of the wiring board 5. In other words, it refers to a region of the wiring board 5 that overlaps the photoelectric conversion element 2 when the optical transmission module 1 is viewed from above.
- the thickness of the connection pad 7 may be, for example, 5 ⁇ m or more and 50 ⁇ m or less. Further, the sum of the thickness of the connection pad 7 and the thickness of the bump 4 may be, for example, 25 ⁇ m or more and 150 ⁇ m or less.
- the “distance between the lower surface of the photoelectric conversion element 2 and the upper surface of the optical transmission substrate 3” is synonymous with the sum of the thickness of the connection pad 7 and the thickness of the bump 4.
- the insulating layer of the wiring board 5 may be formed of, for example, a resin material such as an epoxy resin, or a ceramic material such as silica (SiO 2 ), alumina (Al 2 O 3 ), or zirconia (ZrO 2 ). Further, the metal layer, the via conductor, and the connection pad 7 of the wiring board 5 may be formed of a metal material such as copper or aluminum, for example.
- the optical transmission path 6 can transmit an optical signal.
- the optical transmission line 6 has at least one core part 8 through which light passes and a clad part 9 surrounding the core part 8.
- the core portion 8 is disposed inside the cladding portion 9.
- at least one core portion 8 of the optical transmission line 6 of the present disclosure has a plurality of core portions 8.
- the refractive index of the core part 8 is larger than the refractive index of the clad part 9.
- the core portion 8 may be formed of, for example, an epoxy resin.
- the clad portion 9 may be formed of, for example, an epoxy resin, a polyimide resin, a phenol resin, or an acrylic resin.
- the refractive index of the core part 8 should just be 1.5 or more and 1.6 or less, for example.
- the refractive index of the clad part 9 should just be 1.45 or more and 1.55 or less, for example.
- the refractive index of the core part 8 should just be large in the range of 0.1% or more and 0.5% or less with respect to the refractive index of the cladding part 9, for example.
- the clad part 9 of the optical transmission line 6 has a first clad part 10 and a second clad part 11.
- the first clad portion 10 is formed in a layer shape and is laminated on the upper surface of the wiring substrate 5.
- the core portion 8 is formed in a band shape and is disposed on the upper surface of the first cladding portion 10.
- the second cladding part 11 is disposed so as to cover the upper surface and side surfaces of the core part 8.
- the optical transmission line 6 is formed on the upper surface of the wiring substrate 5 by preparing a resin film comprising the first clad part 10, the core part 8 or the second clad part 11, and appropriately performing heating, exposure and development. can do.
- the thickness of the first cladding portion 10 of the optical transmission line 6 may be, for example, 5 ⁇ m or more and 50 ⁇ m or less.
- the thickness of the core part 8 should just be 20 micrometers or more and 50 micrometers or less, for example.
- the thickness of the second cladding part 11 may be, for example, 5 ⁇ m or more and 50 ⁇ m or less.
- the optical transmission line 6 has an end 61 located in the mounting area A of the wiring board 5 for optical connection with the photoelectric conversion element 2.
- the portion of the optical transmission line 6 that overlaps the mounting area A (or the photoelectric conversion element 2) of the wiring substrate 5 is the end 61.
- An end portion 61 of the optical transmission line 6 has a part of at least one core portion 8.
- a part of at least one core portion 8 of the optical transmission line 6 is located in the mounting area A. That is, the height of the end of the optical transmission line 6 is set lower than the height of the connection pad 7 and the bump 4, and the end 61 (the plurality of core parts 8) of the optical transmission line 6 is connected to the wiring substrate 5. It is located between the upper surface and the lower surface of the photoelectric conversion element 2.
- the distance between the photoelectric conversion element 2 and the core part 8 can be reduced as compared with the prior art, and the loss of the optical signal between the photoelectric conversion element 2 and the core part 8 can be reduced. Therefore, it is possible to reduce the loss of the optical signal in the optical transmission board 2 and consequently the loss of the optical signal of the optical transmission module 1.
- the height of the end 61 of the optical transmission line 6 may be, for example, 25 ⁇ m or more and 150 ⁇ m or less. Further, the end 61 of the optical transmission line 6 refers to a portion located in the mounting area A of the wiring substrate 5 of the optical transmission line 6 in this specification. That is, when the light transmission module 1 is seen through the top surface, a part of the light transmission path 6 that overlaps the photoelectric conversion element 2 is the end portion 61 of the light transmission path 6.
- the end 61 of the optical transmission line 6 further has an inclined surface 12 that guides the optical signal from the photoelectric conversion element 2 into the core 8.
- the optical transmission line 6 is optically connected to the photoelectric conversion element 2 by having the inclined surface 12. That is, the optical transmission line 6 reflects light emitted downward from, for example, the photoelectric conversion element 2 by the inclined surface 12 in the plane direction (XY plane direction), and guides the light into the core portion 8. it can.
- the optical transmission line 6 can guide light into the photoelectric conversion element 2 by reflecting light transmitted through the core portion 8 upward.
- the end 61 of the optical transmission path 6 further includes a groove 12a along the width direction of the core section 8 having an opening on the upper surface of the core section 8.
- the inclined surface 12 is the inner surface of the groove 12a.
- the groove 12 a is formed in each of the plurality of core portions 8.
- the inclined surface 12 (groove 12a) can be formed by cutting out a part of the optical transmission line 6 using dicing, laser processing, or the like.
- the thickness of the part located in the mounting area A of the second cladding part 11 may be thinner than the thickness of the part located outside the mounting area A of the second cladding part 11. That is, the second cladding part 11 at the end 61 of the optical transmission line 6 is thinner than the other second cladding parts 11. As a result, the distance between the upper surface of the wiring board 5 and the lower surface of the photoelectric conversion element 2 can be reduced. Therefore, the distance between the core portion 8 of the optical transmission line 6 and the photoelectric conversion element 2 can be further reduced, and the loss of the optical signal of the optical transmission module 1 can be reduced.
- the end portion 61 of the optical transmission line 6 may not have the second cladding portion 11.
- the core portion 8 may not be covered with the second cladding portion 11.
- the end 61 of the optical transmission line 6 may have at least one penetration region B that penetrates the optical transmission line 6 in the vertical direction, as shown in FIG.
- the end portion 61 of the optical transmission line 6 may have a through region B having openings on the upper and lower surfaces of the first cladding portion 10.
- the plurality of connection pads 7 may have the connection pads 7 located in the through region B.
- the penetrating region B is located in a region between the plurality of core portions 8. Further, as a result of penetrating the first cladding portion 10, the penetration region B has openings on the upper and lower surfaces of the first cladding portion 10.
- the through region B of the present disclosure is in a state where only a part of the plurality of connection pads 7 of the wiring board 5 overlaps, but the through region B includes all of the plurality of connection pads 7. It may be overlapped with the connection pad 7.
- the through region B overlaps only a part of the connection pads 7, the through region is formed when the through region B is formed and the connection pad 7 is exposed from the optical transmission path 6.
- the formation region of B can be reduced, and the occurrence of a problem that the connection pad 7 is not exposed can be reduced. Therefore, the connection reliability between the photoelectric conversion element 2 and the optical transmission board 3 can be improved.
- the state in which the through region B overlaps the connection pad 7 is a state in which the connection pad 7 is located in the through region B. That is, at this time, the connection pad 7 is exposed from the optical transmission line 6 (first clad portion 10) through the through region B.
- connection pad 7 may be positioned with the core portion 8 sandwiched in a direction orthogonal to the longitudinal direction of the core portion 8.
- the connection pads 7 of the wiring board 5 may be arranged so as to be sandwiched between the plurality of core portions 8.
- the plurality of connection pads 7 may have a plurality of first connection pads 14 and a plurality of second connection pads 15.
- the plurality of first connection pads 14 are simply for fixing the photoelectric conversion element 2 to the wiring board 5.
- the plurality of second connection pads 15 are for transmitting electrical signals from the wiring substrate 5 to the photoelectric conversion element 2.
- the plurality of first connection pads 14 are not electrically connected to the photoelectric conversion element 2 and are not electrically connected to the photoelectric conversion element 2.
- the plurality of second connection pads 15 are electrically connected to the photoelectric conversion element 2.
- a part of the plurality of connection pads 7 overlapping the through region B of the end 61 of the optical transmission path 6 may be only the plurality of first connection pads 14.
- the optical transmission line 6 does not surround the second connection pad 15, it is possible to reduce the end of the optical transmission line 6 being heated by the second connection pad 15 that easily generates heat due to current flow. . Therefore, the thermal expansion of the optical transmission line 6 can be reduced, and peeling of the optical transmission line 6 can be reduced.
- the plurality of first connection pads 14 of the present disclosure are arranged in a line in a direction (Y-axis direction) orthogonal to the longitudinal direction (X-axis direction) of the core portion 8.
- the plurality of second connection pads 15 are arranged in a line along the plurality of first connection pads 14. In other words, the plurality of first connection pads 14 and the plurality of second connection pads 15 are arranged in two rows.
- the wiring board 5 has a via conductor located immediately below the first connection pad 14, and the first connection pad 14 and the via conductor may be connected. As a result, it is possible to reduce the peeling of the first connection pads 14 as compared with the case where the first connection pads 14 are simply arranged on the wiring substrate 5.
- At least one penetration region B may be a plurality of penetration regions (through holes) 13.
- the penetrating region B is formed by, for example, a concave portion that penetrates from the upper surface to the lower surface of the optical transmission path 6 and is recessed from the end surface of the optical transmission path 6 in the longitudinal direction of the core portion 8. Also good.
- the width of the through hole 13 may be larger than the width of the connection pad 7.
- the width of the through hole 13 may be smaller than the width of the connection pad 7.
- the first clad portion 10 overlaps with the connection pad 7, and peeling of the connection pad 7 can be reduced.
- the first cladding portion 10 may protrude from the mounting region A in a direction orthogonal to the longitudinal direction of the core portion 8. As a result, the contact area between the optical transmission line 6 and the wiring board 5 can be increased, and peeling of the optical transmission line 6 can be prevented.
- the width of the part constituting the end part 61 of the optical transmission line 6 is larger than the width of the part not constituting the end part 61 of the optical transmission line 6 It may be bigger.
- the portion located in the mounting region A may be wider than the portion located outside the mounting region A.
- the contact area between the core part 8 and the first cladding part 10 can be increased, and peeling of the core part 8 can be reduced.
- the width of the core portion 8 disposed in a portion other than the end portion 61 of the optical transmission path 6 is small, the spread of light emitted from the optical transmission path 6 can be reduced. Loss of light can be reduced.
- the end portion 61 of the optical transmission line 6 may connect the ends of the plurality of core portions 8 to one, and may have a bundling portion 16 made of the same material as the core portion 8. As a result, the contact area between the core part 8 and the first cladding part 10 can be increased, and peeling of the core part 8 can be reduced.
- the inclined surface 12 may be formed in the binding portion 16. As a result, since the area of the inclined surface 12 is increased, for example, when the light emitted from the optical transmission path 6 is incident on the photoelectric conversion element 3 as a light receiving element, Loss of incident light can be reduced.
- the plurality of core portions 8 are partially disposed adjacent to the first core portion 81 located in the mounting region A, and adjacent to the first core portion 81, and are located outside the mounting region A. 2 cores 82 may be included.
- the grooves 12a are formed in the plurality of core portions 8 by dicing, cutting water containing cutting waste generated by dicing flows through the grooves 12a, and the cutting waste adheres to the vicinity of the second core portion 82. To do.
- the first core unit 81 is for transmitting an optical signal
- the second core unit 82 is a dummy core unit that does not transmit an optical signal. Therefore, it is possible to reduce the attachment of cutting waste to the inclined surface 12 that contributes to the transmission of the optical signal, and to reduce the loss of light.
- the second core portion 82 may not be located outside the mounting area A.
- a plurality of the second core portions 82 may be provided on one side of the first core portion 81.
- the penetration region B and the groove 12a may be connected.
- cutting water containing cutting waste generated by dicing flows out to the penetration region B, thereby reducing dust from adhering to the inclined surface 12. Light loss can be reduced.
- a light-transmitting underfill 17 is disposed in a vacant gap between the photoelectric conversion element 2 and the wiring board 5. As a result, the connection strength of the photoelectric conversion element 2 to the wiring substrate 5 can be improved.
- the underfill 17 may be formed of a resin material such as a silicone resin or an epoxy resin, for example.
- the underfill 11 covers the portion of the core portion 8 that is not covered by the second cladding portion 11. May be arranged. As a result, the core part 8 can be protected.
- the refractive index of the underfill 17 may be smaller than the refractive index of the core portion 7. As a result, the underfill 17 plays the role of the clad portion 9 at the end of the optical transmission line 6, and the optical signal can be transmitted satisfactorily also at the end of the optical transmission line 6. In addition, the refractive index of the underfill 17 should just be 1.45 or more and 1.55 or less, for example.
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
- Semiconductor Lasers (AREA)
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Abstract
Description
2 光電変換素子
3 光伝送基板
4 バンプ
5 配線基板
6 光伝送路
61 端部
7 接続パッド
8 複数のコア部
81 第1コア部
82 第2コア部
9 クラッド部
10 第1クラッド部
11 第2クラッド部
12 傾斜面
12a 溝
13 貫通孔
14 第1接続パッド
15 第2接続パッド
16 結束部
17 アンダーフィル
A 実装領域
B 貫通領域
Claims (13)
- 光電変換素子の実装領域を含む一主面を有した配線基板と、
前記配線基板の前記一主面上に配された層状の第1クラッド部、前記第1クラッド部上に配された帯状の少なくとも1つのコア部および前記コア部の一部上に配された第2クラッド部を有した光伝送路と、を備え、
前記光伝送路は、前記実装領域内に位置した端部を有しており、
前記端部は、前記コア部の一部を有している、光伝送基板。 - 前記第2クラッド部の前記実装領域内に位置する部分の厚みは、前記第2クラッド部の前記実装領域外に位置する部分の厚みよりも薄い、請求項1に記載の光伝送基板。
- 前記配線基板は、前記一主面の前記実装領域内に配された、光電変換素子が接続可能な少なくとも1つの接続パッドを有しており、
前記端部は、前記第1クラッド部の上下面に開口を有する少なくとも1つ貫通領域を有しており、
前記接続パッドは、前記貫通領域内に位置している、請求項2に記載の光伝送基板。 - 前記少なくとも1つの貫通領域は、複数の貫通領域である、請求項3に記載の光伝送基板。
- 前記複数の貫通領域の幅は、前記接続パッドの幅よりも大きい、請求項4に記載の光伝送基板。
- 前記端部は、前記コア部のそれぞれの上面に開口を有し、前記コア部の幅方向に沿った溝をさらに有しており、
前記溝の内面は、光を反射可能な傾斜面である、請求項2に記載の光伝送基板。 - 前記端部の前記コア部の幅は、その他の前記コア部の幅よりも大きい、請求項2に記載の光伝送基板。
- 前記接続パッドを、第1接続パッドとしたときに、
前記光伝送路と重なっていない、少なくとも1つの第2接続パッドをさらに有している、請求項3に記載の光伝送基板。 - 前記第1接続パッドは、光電変換素子と非電気的に接続されており、
前記第2接続パッドは、光電変換素子と電気的に接続されている、請求項8に記載の光伝送基板。 - 前記コア部は、複数のコア部を有しており、
前記端部は、前記複数のコア部のそれぞれの端に接続した、前記コア部と同様の材料の結束部をさらに有している、請求項2に記載の光伝送基板。 - 前記コア部を第1コア部としたときに、
前記第1コア部の隣に配され、前記実装領域外に位置した少なくとも1つの第2コア部とを有している、請求項2に記載の光伝送モジュール。 - 前記貫通領域は、前記複数のコア部同士の間に配されており、
前記溝は、前記貫通領域に繋がっている、請求項6に記載の光伝送基板。 - 請求項1~12のいずれかに記載の光伝送基板と、
前記光伝送基板の前記一主面の前記実装領域に配された光電変換素子と、を備え、
前記光伝送基板の上面および光電変換素子の下面との距離は、前記光伝送基板の光伝送路の端部の高さ以上である、光伝送モジュール。
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JP2007072307A (ja) * | 2005-09-08 | 2007-03-22 | Matsushita Electric Works Ltd | 光モジュール |
JP2008281624A (ja) * | 2007-05-08 | 2008-11-20 | Hitachi Cable Ltd | 光ファイバ実装導波路素子及びその製造方法 |
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