JP5395734B2 - 光電気複合基板の製造方法 - Google Patents
光電気複合基板の製造方法 Download PDFInfo
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- JP5395734B2 JP5395734B2 JP2010106956A JP2010106956A JP5395734B2 JP 5395734 B2 JP5395734 B2 JP 5395734B2 JP 2010106956 A JP2010106956 A JP 2010106956A JP 2010106956 A JP2010106956 A JP 2010106956A JP 5395734 B2 JP5395734 B2 JP 5395734B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
本発明の実施形態を説明する前に、本発明に関連する関連技術の問題点について説明する。図1は関連技術の光電気複合基板の製造方法の問題点を説明する断面図である。
図2〜図4は本発明の実施形態の光電気複合基板の製造方法を示す断面図及び平面図、図5は同じく実施形態の光電気複合基板を示す断面図及び平面図である。
Claims (2)
- 上面に、対向する接続パッドを備えた配線基板を用意し、前記配線基板上の接続パッドの間の領域に、前記接続パッドの厚みと同一の厚みの第1クラッド層を形成する工程と、
前記第1クラッド層の上にコア層を形成すると共に、前記コア層の両端側に前記コア層と分離された状態でそれぞれ配置され、前記コア層側に傾斜面を備え、かつ前記接続パッドの上にホールが設けられた周辺樹脂部を前記コア層と同一層から形成する工程と、
前記周辺樹脂部の傾斜面に光路変換ミラーを形成する工程と、
前記コア層を被覆する第2クラッド層を形成して、前記コア層が前記第1クラッド層及び前記第2クラッド層で囲まれた構造の光導波路を得ると共に、前記周辺樹脂部のホールに連通する開口部を前記第2クラッド層に形成して前記接続パッドに到達するビアホールを形成する工程と、
前記接続パッドに接続される接続電極を前記ビアホールに形成する工程とを有し、
前記第1クラッド層、前記コア層及び第2クラッド層は、感光性樹脂層がフォトリソグラフィに基づいてパターン化されて形成されることを特徴とする光電気複合基板の製造方法。 - 前記光導波路の一端側に前記光路変換ミラーによって光結合され、前記一端側の前記接続電極に接続される発光素子と、前記光導波路の他端側に前記光路変換ミラーによって光結合され、前記他端側の前記接続電極に接続される受光素子とを実装する工程をさらに有することを特徴とする請求項1に記載の光電気複合基板の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010106956A JP5395734B2 (ja) | 2010-05-07 | 2010-05-07 | 光電気複合基板の製造方法 |
US13/079,951 US8693815B2 (en) | 2010-05-07 | 2011-04-05 | Optoelectronic composite substrate and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010106956A JP5395734B2 (ja) | 2010-05-07 | 2010-05-07 | 光電気複合基板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011237503A JP2011237503A (ja) | 2011-11-24 |
JP2011237503A5 JP2011237503A5 (ja) | 2013-02-07 |
JP5395734B2 true JP5395734B2 (ja) | 2014-01-22 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010106956A Active JP5395734B2 (ja) | 2010-05-07 | 2010-05-07 | 光電気複合基板の製造方法 |
Country Status (2)
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US (1) | US8693815B2 (ja) |
JP (1) | JP5395734B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104115043B (zh) * | 2011-12-08 | 2019-09-17 | Lg伊诺特有限公司 | 光学印刷电路板及其制造方法 |
JP6168602B2 (ja) * | 2013-10-31 | 2017-07-26 | 日東電工株式会社 | 光電気混載モジュール |
JP6235878B2 (ja) * | 2013-11-25 | 2017-11-22 | 新光電気工業株式会社 | 光導波路装置及びその製造方法 |
US10180548B2 (en) | 2015-04-27 | 2019-01-15 | Kyocera Corporation | Optical transmission substrate and optical transmission module |
US9721812B2 (en) * | 2015-11-20 | 2017-08-01 | International Business Machines Corporation | Optical device with precoated underfill |
JP6623102B2 (ja) * | 2016-03-31 | 2019-12-18 | 古河電気工業株式会社 | 光導波回路装置 |
JP6637368B2 (ja) * | 2016-04-06 | 2020-01-29 | 新光電気工業株式会社 | 光導波路装置及びその製造方法 |
CN114930213A (zh) * | 2019-12-20 | 2022-08-19 | 京瓷株式会社 | 光电路基板 |
JP2023008205A (ja) * | 2021-07-05 | 2023-01-19 | イビデン株式会社 | 配線基板 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4366751B2 (ja) * | 1999-04-13 | 2009-11-18 | 凸版印刷株式会社 | 光・電気配線基板及び製造方法並びに実装基板 |
TWI239798B (en) * | 1999-05-28 | 2005-09-11 | Toppan Printing Co Ltd | Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate |
JP2002277694A (ja) * | 2001-03-19 | 2002-09-25 | Mitsubishi Electric Corp | 光導波路および電気回路を有する基板およびその製造方法 |
JP2003098371A (ja) * | 2001-09-20 | 2003-04-03 | Fujitsu Ltd | 平坦化電気配線を有する光配線基板 |
JP2003240997A (ja) * | 2002-02-21 | 2003-08-27 | Fujitsu Ltd | 空間反射型構造を有する光集積回路の製造方法 |
JP4447428B2 (ja) * | 2004-10-19 | 2010-04-07 | 新光電気工業株式会社 | 光導波路の製造方法 |
TWI390264B (zh) * | 2004-11-17 | 2013-03-21 | Hitachi Chemical Co Ltd | A photoelectric hybrid circuit mounting substrate and a transfer device using the same |
JP2007004043A (ja) * | 2005-06-27 | 2007-01-11 | Nec Corp | 配線基板、配線基板を用いたモジュール、およびモジュール集合体 |
JP5064109B2 (ja) * | 2007-05-11 | 2012-10-31 | 新光電気工業株式会社 | 光導波路及びその製造方法、並びに光電気混載基板及びその製造方法 |
JP2010039082A (ja) | 2008-08-01 | 2010-02-18 | Furukawa Electric Co Ltd:The | 光回路基板およびその製造方法 |
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2010
- 2010-05-07 JP JP2010106956A patent/JP5395734B2/ja active Active
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2011
- 2011-04-05 US US13/079,951 patent/US8693815B2/en active Active
Also Published As
Publication number | Publication date |
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JP2011237503A (ja) | 2011-11-24 |
US8693815B2 (en) | 2014-04-08 |
US20110274388A1 (en) | 2011-11-10 |
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