WO2016113998A1 - 樹脂膜形成用シート、樹脂膜形成用複合シート、及びシリコンウエハの再生方法 - Google Patents

樹脂膜形成用シート、樹脂膜形成用複合シート、及びシリコンウエハの再生方法 Download PDF

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Publication number
WO2016113998A1
WO2016113998A1 PCT/JP2015/082433 JP2015082433W WO2016113998A1 WO 2016113998 A1 WO2016113998 A1 WO 2016113998A1 JP 2015082433 W JP2015082433 W JP 2015082433W WO 2016113998 A1 WO2016113998 A1 WO 2016113998A1
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WIPO (PCT)
Prior art keywords
resin film
sheet
forming sheet
forming
silicon wafer
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PCT/JP2015/082433
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English (en)
French (fr)
Japanese (ja)
Inventor
尚哉 佐伯
山本　大輔
裕之 米山
洋一 稲男
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リンテック株式会社
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Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to KR1020177012554A priority Critical patent/KR102343970B1/ko
Priority to CN201580063556.8A priority patent/CN107001664B/zh
Priority to SG11201704005XA priority patent/SG11201704005XA/en
Priority to JP2016569240A priority patent/JP6464196B2/ja
Publication of WO2016113998A1 publication Critical patent/WO2016113998A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/18—Homopolymers or copolymers of nitriles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to a resin film forming sheet, a resin film forming composite sheet having a structure in which the resin film forming sheet is laminated on a support sheet, and a silicon wafer recycling method.
  • a semiconductor chip (hereinafter simply referred to as “chip”) having electrodes such as bumps is mounted on a circuit surface of a substrate, and the electrodes of the chip are bonded to the substrate. For this reason, the surface of the chip opposite to the side bonded to the substrate (hereinafter also referred to as “the back surface of the chip”) may be exposed.
  • a resin film made of an organic material is formed on the exposed back surface of the chip and may be taken into the semiconductor device as a chip with a resin film.
  • the resin film functions as a protective film for preventing the occurrence of cracks after the dicing process or packaging, and for bonding the obtained chip onto another member such as a die pad part or another semiconductor chip. It can serve as an adhesive film.
  • this chip with a resin film is formed by applying a solution of a resin-containing composition to the back surface of a wafer by spin coating or the like to form a coating film, and then drying and curing the coating film. It is manufactured by forming a film and dicing the obtained wafer with a resin film.
  • the resin film forming sheet is affixed to the back surface of the wafer, and the resin film forming sheet is cured by irradiation with energy rays or heating before and after dicing the wafer to form a resin film.
  • a wafer with a film or a chip with a resin film can be produced.
  • Various materials for forming a resin film have been proposed as a material for forming a resin film that also functions as a protective film and an adhesive film on the back surface of the chip and the back surface of the wafer.
  • Patent Document 1 includes two energy ray-curable protective film forming layers containing a polymer component made of an acrylic copolymer, an energy ray-curable component, a dye or pigment, an inorganic filler, and a photopolymerization initiator.
  • a film for protecting a chip having a configuration sandwiched between release sheets is disclosed.
  • the chip protection film can form a protective film with good laser marking recognizability, hardness, and adhesion to the wafer by irradiation with energy rays. The process can be simplified as compared with conventional film for chip protection.
  • Patent Document 2 discloses a dicing tape having a dicing tape having a base material and an adhesive layer, and a wafer back surface protective film that is colored and has a predetermined elastic modulus on the adhesive layer of the dicing tape.
  • a body-type wafer back surface protective film is disclosed. According to the description in Patent Document 2, the wafer back surface protective film is said to have a good holding force with the semiconductor wafer in the dicing process of the semiconductor wafer.
  • the protective films disclosed in Patent Documents 1 and 2 are intended to improve the adhesion to the wafer at the time of sticking and the holding power to the wafer after the sticking. Because of its high adhesion to the wafer, it is very difficult to rework.
  • the need to re-apply the protective film is not only immediately after the protective film and the wafer are attached, but also in the state of the laminate in which the protective film is attached on the wafer after application. Often noticed after being placed. Since the adhesiveness between the wafer and the protective film improves as time passes after the protective film is attached to the wafer, it is generally difficult to rework the protective film.
  • the present invention has been made in view of the above-described problems, and is a resin film-forming sheet that is excellent in reworkability and end-part adhesion, and a resin having a configuration in which the resin film-forming sheet is laminated on a support sheet.
  • An object of the present invention is to provide a film forming composite sheet and a silicon wafer recycling method.
  • the inventors of the present invention have a surface roughness and an adhesive force to the silicon wafer on the surface to be bonded to the silicon wafer, and an adhesive layer of a general adhesive sheet on the other surface opposite to the surface.
  • the present inventors have found that a resin film-forming sheet with an adjusted adhesive strength can solve the above-mentioned problems, and completed the present invention.
  • the present invention provides the following [1] to [10].
  • [1] A sheet for resin film formation that is affixed to a silicon wafer to form a resin film on the silicon wafer and satisfies the following requirements (I) to (III).
  • Requirement (I) The surface roughness (Ra) of the surface ( ⁇ ) of the resin film forming sheet on the side attached to the silicon wafer is 50 nm or less.
  • the surface ( ⁇ ) of the sheet for forming a resin film on the side opposite to the side to be bonded to the silicon wafer with respect to the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet formed of the pressure-sensitive adhesive and having a pressure-sensitive adhesive layer having a thickness of 10 to 50 ⁇ m Has an adhesive strength ( ⁇ 1) of 4.0 N / 25 mm or more.
  • the resin film forming sheet of the present invention is excellent in reworkability and end portion adhesion. For this reason, when the resin film forming sheet of the present invention is once attached to the silicon wafer, and it becomes necessary to reattach, the silicon wafer is not damaged, and one of the attached resin film forming sheets is used.
  • the resin film forming sheet can be reworked from the silicon wafer while suppressing the portion from adhering to and remaining on the silicon wafer. As a result, the silicon film after reworking the resin film forming sheet can be reused.
  • “reworking the resin film forming sheet” refers to re-peeling the resin film forming sheet once pasted on the silicon wafer.
  • reworkability of the resin film forming sheet means that a part of the resin film forming sheet is placed on the silicon wafer without damaging the silicon wafer during rework after being attached to the silicon wafer. It refers to the property of being able to be removed again without remaining.
  • the values of the weight average molecular weight (Mw) and the number average molecular weight (Mn) of each component are values in terms of standard polystyrene measured by a gel permeation chromatography (GPC) method. Is a value measured based on the method described in Examples.
  • GPC gel permeation chromatography
  • (meth) acrylate” is used as a term indicating both “acrylate” and “methacrylate”, and the same applies to other similar terms.
  • energy beam refers to, for example, ultraviolet rays or electron beams, and ultraviolet rays are preferable.
  • the sheet for forming a resin film of the present invention is a sheet that is affixed to a silicon wafer and forms a resin film on the silicon wafer, and satisfies the following requirements (I) to (III).
  • the adhesive force ( ⁇ 1) of the surface ( ⁇ ) of the resin film forming sheet to the silicon wafer (hereinafter, also simply referred to as “adhesive force ( ⁇ 1) of the surface ( ⁇ ))” is 1.0 to 7 0.0 N / 25 mm.
  • Adhesive strength ( ⁇ 1) (hereinafter also simply referred to as “surface ( ⁇ ) adhesive strength ( ⁇ 1)”) is 4.0 N / 25 mm or more.
  • the surface ( ⁇ ) of the resin film forming sheet of the present invention is the surface to be attached to the silicon wafer, and the surface ( ⁇ ) is reworked from the silicon wafer after being attached to the silicon wafer. It is a sticking surface with the adhesive layer of the general purpose adhesive sheet affixed in order to do.
  • the form of the resin film forming sheet of the present invention is not particularly limited, and may be in the form of, for example, a long tape or a single-leaf label.
  • the resin film-forming sheet of one embodiment of the present invention may be a single-layer body formed of one kind of composition or a multilayer composed of two or more layers formed of two or more kinds of compositions. It may be a body.
  • a composition ( ⁇ ′) that is a material for forming a surface ( ⁇ ) side layer and a surface ( ⁇ ) With respect to the composition ( ⁇ ′) which is a material for forming the side layer, it is preferable to adjust the types and blending amounts of the respective components so as to satisfy the above requirements (I) to (III). For this reason, the composition ( ⁇ ′) and the composition ( ⁇ ′) are preferably different from each other.
  • the resin film formation sheet of this invention suppresses generation
  • the cleaning water used during dicing enters the interface between the resin film forming sheet and the silicon wafer to contaminate the surface of the silicon wafer, It may also cause chipping during dicing.
  • the surface roughness (Ra) of the surface ( ⁇ ) of the resin film-forming sheet of one embodiment of the present invention is preferably 40 nm or less, more preferably 35 nm or less, still more preferably 30 nm or less, and still more preferably Is 25 nm or less. Further, from the viewpoint of forming a resin film-forming sheet with improved reworkability, the surface roughness (Ra) of the surface ( ⁇ ) is preferably 5 nm or more, more preferably 10 nm or more, and even more preferably 15 nm or more. .
  • the surface roughness (Ra) of the surface ( ⁇ ) is a value measured according to JIS B0601: 2001, and more specifically, measured by the method described in the examples. Means the value.
  • the surface roughness (Ra) of the surface ( ⁇ ) can be determined by appropriately selecting, for example, the types of fine particle components such as inorganic fillers and colorants that can be contained in the resin film-forming sheet, the average particle diameter, and the content. It can be adjusted by setting. Moreover, it can adjust also by bonding the uneven surface of the peeling film which has a rough uneven surface on the surface ((alpha)) of the sheet
  • the resin film-forming sheet of the present invention can be reworked even after about 24 hours while maintaining good adhesion after bonding to a silicon wafer, in particular, edge adhesion.
  • the conventional resin film forming sheets as disclosed in Patent Documents 1 and 2 are often intended to improve adhesion and retention with a silicon wafer, and are defined by the requirement (II).
  • Material design has been made to increase the value of the adhesive strength of the surface ( ⁇ ).
  • the adhesive force ( ⁇ 1) of the surface ( ⁇ ) exceeds 7.0 N / 25 mm, it tends to be difficult to rework the obtained resin film forming sheet after being attached to a silicon wafer.
  • the adhesion between the silicon wafer and the resin film forming sheet improves, so when trying to forcibly rework the resin film forming sheet from the silicon wafer, The silicon wafer may be damaged by the force to rework.
  • the adhesive force ( ⁇ 1) of the surface ( ⁇ ) is less than 1.0 N / 25 mm, the adhesiveness with the silicon wafer is insufficient, and in particular, the obtained resin film forming sheet is stuck on the silicon wafer. At this time, the end of the silicon wafer is likely to be lifted or peeled off, and the end adhesion is poor. Therefore, in the resin film forming sheet of the present invention, the adhesive strength ( ⁇ 1) of the surface ( ⁇ ) is adjusted to a range specified by the requirement (II).
  • the adhesive force ( ⁇ 1) of the surface ( ⁇ ) of the resin film-forming sheet of one embodiment of the present invention is improved in adhesion with a silicon wafer, particularly with improved end-part adhesion after bonding to the silicon wafer. From the viewpoint of forming a sheet for use, it is preferably 1.3 N / 25 mm or more, more preferably 1.5 N / 25 mm or more, still more preferably 1.8 N / 25 mm or more, and still more preferably 2.0 N / 25 mm or more.
  • the adhesive strength ( ⁇ 1) of the surface ( ⁇ ) means a value measured by the method described in Examples.
  • the adhesive force ( ⁇ 1) of the surface ( ⁇ ) is a polymer component, a curable component, an inorganic filler, and a composition that is a forming material of the layer on the surface ( ⁇ ) side of the resin film forming sheet, and
  • the type and content of additives and the like can be appropriately selected and adjusted to be in the above range. Specifically, it can be easily adjusted by considering the items in the respective component items contained in the resin film forming sheet in an appropriate combination.
  • the resin film forming sheet of the present invention can be reworked even after about 24 hours.
  • a general-purpose adhesive sheet is formed on the surface ( ⁇ ) of the resin film forming sheet.
  • the resin film forming sheet can be reworked from the silicon wafer by attaching an adhesive layer and pulling the adhesive sheet.
  • the adhesive force ( ⁇ 1) of the surface ( ⁇ ) is less than 4.0 N / 25 mm, the adhesive layer of the adhesive sheet is attached to the surface ( ⁇ ), and the resin film is formed together with the adhesive sheet. Even if an attempt is made to peel off the working sheet, a part of the resin film forming sheet tends to remain on the silicon wafer, and the reworked silicon wafer cannot be reused.
  • the adhesive force ( ⁇ 1) of the surface ( ⁇ ) of the resin film-forming sheet of one embodiment of the present invention is preferably 4.5 N / 25 mm or more, more preferably 5.0 N / 25 mm or more.
  • the adhesive force ( ⁇ 1) of the surface ( ⁇ ) is usually 20 N / 25 mm or less.
  • the adhesive force ( ⁇ 1) of the surface ( ⁇ ) of the resin film-forming sheet defined in requirement (III) has structural units derived from butyl acrylate and acrylic acid, and has a mass average molecular weight of 600,000 to 1,000,000
  • the composition of this pressure-sensitive adhesive defines a commercially available general acrylic pressure-sensitive adhesive, and the requirement (III) is the surface ( ⁇ ) for the pressure-sensitive adhesive layer formed from a general acrylic pressure-sensitive adhesive.
  • the adhesive strength is specified.
  • the pressure-sensitive adhesive satisfying the requirement (III) is a very general acrylic pressure-sensitive adhesive widely distributed in the market. Therefore, the selectivity of the pressure-sensitive adhesive sheet used when reworking the resin film-forming sheet of the present invention from a silicon wafer is extremely wide, and the pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer made of a general acrylic pressure-sensitive adhesive is used for reworking. Is possible.
  • the adhesive force ( ⁇ 1) of the surface ( ⁇ ) means more specifically a value measured by the method described in the examples.
  • the adhesive force ( ⁇ 1) of the surface ( ⁇ ) is a polymer component, a curable component, an inorganic filler, and a composition that is a material for forming a layer on the surface ( ⁇ ) side of the resin film-forming sheet, and
  • the type and content of additives and the like can be appropriately selected and adjusted to be in the above range. Specifically, it can be easily adjusted by considering the items in the respective component items contained in the resin film forming sheet in an appropriate combination.
  • the surface ( ⁇ ) adhesive force ( ⁇ 1) is the surface ( ⁇ ) adhesive force ( It is preferable that the value is higher than the adhesive strength of ⁇ 1).
  • the difference [( ⁇ 1) ⁇ ( ⁇ 1)] between the adhesive strength ( ⁇ 1) and the adhesive strength ( ⁇ 1) is preferably 0 to 8.0 N / 25 mm, more preferably 0.1 to 7.0 N. / 25 mm, more preferably 0.5 to 6.0 N / 25 mm, and still more preferably 1.5 to 5.5 N / 25 mm.
  • the storage elastic modulus at 23 ° C. of the resin film forming sheet of one embodiment of the present invention is preferably 0.10 to 20 GPa, more preferably 0.15 to 15 GPa, still more preferably 0.20 to 10 GPa, and still more preferably. 0.30 to 5.0 GPa. If the storage elastic modulus is 0.10 GPa or more, when the resin film forming sheet is attached to a silicon wafer and then peeled again, the resin film forming sheet is prevented from being deformed by pulling a thread. The resin film forming sheet can be peeled without leaving a part of the resin film forming sheet on the wafer. On the other hand, if the storage elastic modulus is 20 GPa or less, the adhesion to the silicon wafer can be improved. In the present specification, the storage elastic modulus of the resin film-forming sheet means a value measured by the method described in Examples.
  • the contact angle with respect to water on the surface ( ⁇ ) of the resin film-forming sheet of one embodiment of the present invention is preferably 70 to 110 °, more preferably from the viewpoint of obtaining a resin film-forming sheet with further improved reworkability. It is 75 to 100 °, more preferably 80 to 95 °, and still more preferably 83 to 93 °.
  • seat for resin film formation means the value measured by the method as described in an Example.
  • the resin film-forming sheet of one embodiment of the present invention is not particularly limited as long as it has a surface ( ⁇ ) and a surface ( ⁇ ) that satisfy the requirements (I) to (III), but the polymer component (A) And a curable component (B). Further, the resin film-forming sheet of one embodiment of the present invention is a range that does not impair the effects of the present invention from the viewpoint of forming the surface ( ⁇ ) and the surface ( ⁇ ) that satisfy the requirements (I) to (III) 1 selected from inorganic filler (C), colorant (D), coupling agent (E), leveling agent (F), and general-purpose additive (G) together with the components (A) and (B). It may contain more than seeds.
  • the components (A) to (G) that can be constituent components of the resin film-forming sheet of one embodiment of the present invention will be described.
  • the “polymer component” means a compound having a mass average molecular weight (Mw) of 20,000 or more and having at least one repeating unit.
  • the resin film-forming sheet used in one embodiment of the present invention contains the polymer component (A), thereby imparting flexibility and film-forming property and improving sheet-like shape maintenance. .
  • the storage elastic modulus at 23 ° C. of the resin film forming sheet can be adjusted to the above range.
  • the mass average molecular weight (Mw) of the polymer component (A) is preferably 20,000 or more, more preferably 2 from the viewpoint of adjusting the storage elastic modulus at 23 ° C. of the obtained resin film-forming sheet to the above range. It is 10,000 to 3,000,000, more preferably 50,000 to 2,000,000, still more preferably 100,000 to 1,500,000.
  • the content of the polymer component (A) in the resin film-forming sheet of one embodiment of the present invention is preferably 5 to 50% by mass, more preferably relative to the total amount (100% by mass) of the resin film-forming sheet. Is 8 to 40% by mass, more preferably 10 to 35% by mass, and still more preferably 15 to 30% by mass.
  • “content of component (A) relative to the total amount of the resin film-forming sheet” means “component (A) relative to the total amount of active ingredients in the composition that is a material for forming the resin film-forming sheet”.
  • the term “relative to the total amount (100% by mass) of the resin film-forming sheet” in the definition of the content of each component means “the total amount of active ingredients of the composition that is a material for forming the resin film-forming sheet” Even if it is replaced with the word “to (100% by mass)”, the definition of the content is synonymous.
  • the above “active ingredient” means a component excluding substances that do not directly or indirectly affect the physical properties of the formed sheet, such as a solvent in the composition, specifically, , Meaning components other than solvents such as water and organic solvents.
  • the polymer component (A) preferably contains an acrylic polymer (A1), but other than the acrylic polymer (A1), polyester, phenoxy resin, polycarbonate, polyether, polyurethane, polysiloxane, rubber-based A non-acrylic polymer (A2) such as a polymer may be contained. These polymer components may be used alone or in combination of two or more.
  • the content of the acrylic polymer (A1) with respect to the total amount (100% by mass) of the polymer component (A) contained in the resin film-forming sheet of one aspect of the present invention is preferably 50 to 100% by mass. More preferably, it is 60 to 100% by mass, still more preferably 70 to 100% by mass, and still more preferably 80 to 100% by mass.
  • the mass average molecular weight (Mw) of the acrylic polymer (A1) gives flexibility and film-forming property to the resin film-forming sheet, and the storage elastic modulus at 23 ° C. of the resin film-forming sheet is in the above range. From the viewpoint of adjustment, it is preferably 20,000 to 3,000,000, more preferably 100,000 to 1,500,000, still more preferably 150,000 to 1,200,000, still more preferably 250,000 to 1,000,000.
  • the acrylic polymer (A1) is an acrylic having a structural unit (a1) derived from an alkyl (meth) acrylate from the viewpoint of adjusting the adhesive strength ( ⁇ 1) and ( ⁇ 1) of the resin film-forming sheet to the above range.
  • Polymers are preferred, and in particular, from the viewpoint of adjusting the adhesive strength ( ⁇ 1) of the resin film-forming sheet to the above range, an acrylic polymer having the structural unit (a1) and the structural unit (a2) derived from the nitrile monomer. More preferably, it is a copolymer.
  • the acrylic polymer (A1) used in one embodiment of the present invention is derived from other monomers not corresponding to the alkyl (meth) acrylate and the nitrile monomer in addition to the structural units (a1) and (a2).
  • the structural unit (a3) may be included.
  • an acrylic polymer (A1) individually or in combination of 2 or more types.
  • the form of the copolymer may be any of a block copolymer, a random copolymer, an alternating copolymer, and a graft copolymer. Good.
  • the number of carbon atoms of the alkyl group of the alkyl (meth) acrylate constituting the structural unit (a1) is preferably 1 to 18 from the viewpoint of imparting flexibility and film forming property to the resin film forming sheet. Preferably it is 1 to 12, more preferably 1 to 8.
  • alkyl (meth) acrylate examples include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and isooctyl ( Examples include meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, and the like. In addition, you may use these alkyl (meth) acrylates individually or in combination of 2 or more types.
  • an alkyl (meth) acrylate having an alkyl group having 1 to 3 carbon atoms is preferable, and methyl (meth) acrylate is more preferable.
  • the content of the structural unit (a1-1) derived from the alkyl (meth) acrylate having an alkyl group having 1 to 3 carbon atoms in the acrylic polymer (A1) is the total structural unit of the acrylic polymer (A1).
  • the amount is preferably 5 to 99% by mass, more preferably 10 to 98% by mass, still more preferably 20 to 97% by mass, and still more preferably 25 to 97% by mass with respect to (100% by mass).
  • the content of the structural unit (a1) in the acrylic polymer (A1) is preferably 50% by weight or more, more preferably 50%, based on all the structural units (100% by weight) of the acrylic polymer (A1). It is ⁇ 99 mass%, more preferably 55 to 98 mass%, still more preferably 60 to 97 mass%.
  • nitrile monomer constituting the structural unit (a2) examples include (meth) acrylonitrile, ⁇ -chloro (meth) acrylonitrile, ⁇ -ethoxy (meth) acrylonitrile, fumaronitrile and the like. These nitrile monomers may be used alone or in combination of two or more. Among these, (meth) acrylonitrile is preferable.
  • the content of the structural unit (a2) derived from the nitrile monomer in the acrylic polymer (A1) is preferably 1 to 50 with respect to the total structural units (100% by mass) of the acrylic polymer (A1).
  • the content is 5% by mass, more preferably 5 to 45% by mass, more preferably 10 to 42% by mass, still more preferably 15 to 40% by mass, and still more preferably 20 to 35% by mass.
  • content of a structural unit (a2) is 1 mass% or more, it will be easy to adjust the adhesive force ((alpha) 1) of the surface ((alpha)) of the resin film formation sheet obtained to the said range.
  • the content of the structural unit (a2) is 50% by mass or less, it is easy to adjust the adhesive force ( ⁇ 1) of the surface ( ⁇ ) of the resin film-forming sheet to the above range.
  • esters monomers examples include esters monomers; olefin monomers such as ethylene, propylene and isobutylene; aromatic vinyl monomers such as styrene, methylstyrene and vinyltoluene; diene monomers such as butadiene and isoprene;
  • the acrylic polymer (A1) used in one embodiment of the present invention is a structural unit derived from a hydroxy group-containing monomer ( a3-1) is preferably included.
  • the hydroxy-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl (meth) )
  • hydroxyalkyl (meth) acrylates such as 4-hydroxybutyl (meth) acrylate; and unsaturated alcohols such as vinyl alcohol and allyl alcohol.
  • 2-hydroxyethyl (meth) acrylate is preferable.
  • the content of the structural unit (a3-1) derived from the hydroxy group-containing monomer in the acrylic polymer (A1) is a viewpoint of adjusting the adhesive strength ( ⁇ 1) and ( ⁇ 1) of the resin film-forming sheet to the above range. From 0.5 to 30% by mass, more preferably from 1 to 25% by mass, still more preferably from 2 to 20% by mass, based on all structural units (100% by mass) of the acrylic polymer (A1). The content is more preferably 3 to 15% by mass, particularly preferably 3.5 to 12% by mass.
  • the content of the structural unit (a3-2) derived from the epoxy group-containing monomer in the acrylic polymer (A1) used in one embodiment of the present invention is, from the above viewpoint, the entire configuration of the acrylic polymer (A1).
  • the amount is preferably 0 to 15% by mass, more preferably 0 to 10% by mass, still more preferably 0 to 5% by mass, and still more preferably 0 to 3.5% by mass with respect to the unit (100% by mass).
  • epoxy group-containing monomer examples include glycidyl (meth) acrylate, ⁇ -methylglycidyl (meth) acrylate, (3,4-epoxycyclohexyl) methyl (meth) acrylate, and 3-epoxycyclo-2-hydroxypropyl (meth).
  • epoxy group-containing (meth) acrylic acid esters such as acrylate; non-acrylic epoxy group-containing monomers such as glycidyl crotonate and allyl glycidyl ether; and the like.
  • the carboxyl group reacts with the epoxy group in the epoxy thermosetting component, so that the acrylic polymer (A1)
  • the content of the structural unit derived from the carboxyl group-containing monomer is preferably as small as possible.
  • the content of the structural unit (a3-3) derived from the carboxy group-containing monomer used in one embodiment of the present invention is such that the acrylic polymer (A1) Is preferably 0 to 10% by mass, more preferably 0 to 5% by mass, still more preferably 0 to 2% by mass, and still more preferably 0% by mass (constituent unit (100% by mass). a3-3) is not included).
  • an acrylic polymer having a structural unit derived from an epoxy group-containing monomer and having a mass average molecular weight of 20,000 or more has thermosetting properties, but the curable component (B) And included in the concept of the polymer component (A).
  • carboxy group-containing monomer examples include (meth) acrylic acid, maleic acid, fumaric acid, itaconic acid and the like.
  • the content of the structural unit (a3) in the acrylic polymer (A1) used in one embodiment of the present invention is preferably 0 to the total structural unit (100% by mass) of the acrylic polymer (A1). 30% by mass, more preferably 1 to 20% by mass, still more preferably 2 to 10% by mass.
  • Non-acrylic resin (A2) The resin film-forming sheet of one embodiment of the present invention may contain a non-acrylic polymer (A2) as a polymer component other than the acrylic polymer (A1) as necessary.
  • a non-acrylic polymer (A2) examples include polyester, phenoxy resin, polycarbonate, polyether, polyurethane, polysiloxane, rubber polymer, and the like. These non-acrylic polymers (A2) may be used alone or in combination of two or more.
  • the mass average molecular weight (Mw) of the non-acrylic polymer (A2) is preferably 20,000 or more, more preferably 20,000 to 100,000, still more preferably 20,000 to 80,000.
  • the curable component (B) serves to cure the resin film-forming sheet to form a hard resin film, and is a compound having a mass average molecular weight (Mw) of less than 20,000.
  • the resin film forming sheet used in the present invention preferably contains at least one of a thermosetting component (B1) and an energy ray curable component (B2) as the curable component (B). It is more preferable that the thermosetting component (B1) is included from the viewpoint of suppressing coloring of the formed resin film, from the viewpoint of sufficiently proceeding the curing reaction, and from the viewpoint of cost reduction.
  • thermosetting component (B1) it is preferable to contain the compound which has a functional group which reacts at least by heating, and it is more preferable to contain the compound (B11) which has an epoxy group.
  • an energy-beam curable component (B2) contains the compound (B21) which has a functional group which reacts by energy beam irradiation. Curing is realized by the functional groups of these curable components reacting to form a three-dimensional network structure.
  • the mass average molecular weight (Mw) of the curable component (B) is used in combination with the component (A), thereby suppressing the viscosity of the composition that is a material for forming the resin film-forming sheet and improving the handleability. From the above viewpoint, it is preferably less than 20,000, more preferably 10,000 or less, and still more preferably 100 to 10,000.
  • thermosetting component (B1)) As the thermosetting component (B1), an epoxy thermosetting component is preferable.
  • epoxy thermosetting component it is preferable to use a combination of a thermosetting agent (B12) together with a compound (B11) having an epoxy group.
  • epoxy compound (B11) examples include novolaks such as polyfunctional epoxy resins, bisphenol A diglycidyl ether and hydrogenated products thereof, and cresol novolac epoxy resins. And epoxy compounds having two or more functional groups in the molecule, such as type epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, and phenylene skeleton type epoxy resin. These epoxy compounds (B11) may be used alone or in combination of two or more.
  • the adhesive strength ( ⁇ 1) and ( ⁇ 1) of the resin film-forming sheet to the above range it is preferable to include at least one selected from a novolac type epoxy resin and a biphenyl type epoxy resin. From the viewpoint of adjusting the adhesive strength ( ⁇ 1) of the resin film-forming sheet to the above range, it is more preferable to include a biphenyl type epoxy resin, and it is more preferable to include a biphenyl aralkyl type epoxy resin.
  • the total content of one or more selected from a novolac type epoxy resin and a biphenyl type epoxy resin is preferably 70 to 100% by mass, more preferably 80 to 100%, based on the total amount (100% by mass) of the epoxy compound (B11).
  • the amount is 100% by mass, more preferably 90 to 100% by mass, and still more preferably 95 to 100% by mass.
  • the content of the biphenyl type epoxy resin is preferably 70 with respect to the total amount (100% by mass) of the epoxy compound (B11). To 100% by mass, more preferably 80 to 100% by mass, still more preferably 90 to 100% by mass, and still more preferably 95 to 100% by mass.
  • the content of the epoxy compound (B11) is preferably 1 to 500 parts by weight, more preferably 3 to 300 parts by weight, still more preferably 5 to 150 parts by weight, even more preferably 100 parts by weight of the component (A). Is 10 to 100 parts by mass.
  • thermosetting agent (B12) functions as a curing agent for the epoxy compound (B11).
  • a thermosetting agent the compound which has 2 or more of functional groups which can react with an epoxy group in 1 molecule is preferable.
  • the functional group include phenolic hydroxyl groups, alcoholic hydroxyl groups, amino groups, carboxyl groups, and acid anhydrides. Among these, a phenolic hydroxyl group, an amino group, or an acid anhydride is preferable, a phenolic hydroxyl group and an amino group are more preferable, and an amino group is still more preferable.
  • thermosetting agent having a phenol group examples include polyfunctional phenol resins, biphenols, novolac-type phenol resins, dicyclopentadiene-type phenol resins, zyloc-type phenol resins, and aralkyl-type phenol resins.
  • amine-based thermosetting agent having an amino group examples include dicyandiamide (DICY).
  • CIEY dicyandiamide
  • thermosetting agents (B12) may be used alone or in combination of two or more. Among these, from the viewpoint of adjusting the adhesive strength ( ⁇ 1) and ( ⁇ 1) of the resin film-forming sheet to the above range, it is preferable to include a phenol-based thermosetting agent.
  • the content of the phenolic thermosetting agent is preferably 50 to 100% by mass, more preferably 70 to 100% by mass, and still more preferably 80 to 100% with respect to the total amount (100% by mass) of the thermosetting agent (B12). % By mass, still more preferably 90 to 100% by mass.
  • thermosetting agent (B12) is preferably 0.1 to 500 parts by mass, more preferably 1 to 200 parts by mass with respect to 100 parts by mass of the epoxy compound (B11).
  • the resin film forming sheet of one embodiment of the present invention from the viewpoint of adjusting the adhesive strength ( ⁇ 1) and ( ⁇ 1) of the resin film forming sheet to the above range, a biphenyl type epoxy resin is used as the epoxy compound (B1).
  • a phenolic thermosetting agent as the thermosetting agent (B12) and use both components in combination.
  • the polymer component (A) includes an acrylic polymer (A1) having a structural unit (a2-1) derived from a nitrile monomer.
  • seat for resin film formation of 1 aspect of this invention may contain a hardening accelerator (B13) from a viewpoint of adjusting the cure rate by the heating of the said sheet
  • the curing accelerator (B13) is preferably used in combination with the epoxy compound (B11) as the thermosetting component (B1).
  • Examples of the curing accelerator (B13) include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, Imidazoles such as 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; tributylphosphine, diphenylphosphine, triphenylphosphine Organic phosphines; tetraphenyl boron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. These curing accelerators (B13) may be used alone or in combination of two or more.
  • the content of the curing accelerator (B13) is 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12) from the viewpoint of improving the adhesiveness of the resin film formed from the resin film forming sheet. On the other hand, it is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 6 parts by mass, and still more preferably 0.3 to 4 parts by mass.
  • the compound (B21) having a functional group that reacts by irradiation with energy rays may be used alone, but the photopolymerization initiator (B22) is combined with the compound (B21). It is preferable to use it.
  • Compound (B21) having a functional group that reacts upon irradiation with energy rays examples include trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate.
  • Energy beam reactive compounds (B21) may be used alone or in combination of two or more.
  • the mass average molecular weight (Mw) of the energy beam reactive compound (B21) is preferably 100 to 30,000, more preferably 300 to 10,000.
  • the content of the energy ray-reactive compound (B21) is preferably 1 to 1500 parts by mass, more preferably 3 to 1200 parts by mass with respect to 100 parts by mass of the component (A).
  • photopolymerization initiator (B22) examples include benzoin compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, thioxanthone compounds, peroxide compounds, and the like. More specific photopolymerization initiators include, for example, 1-hydroxycyclohexyl phenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile.
  • Photopolymerization initiators may be used alone or in combination of two or more.
  • the content of the photopolymerization initiator (B22) is sufficiently advanced with respect to 100 parts by mass of the energy ray-reactive compound (B21) from the viewpoint of sufficiently promoting the curing reaction of the resin film-forming sheet and suppressing the formation of residues.
  • the amount is preferably 0.1 to 10 parts by mass, more preferably 1 to 5 parts by mass.
  • the content of the curable component (B) in the resin film-forming sheet of one embodiment of the present invention is preferably 5 to 50% by mass, more preferably relative to the total amount (100% by mass) of the resin film-forming sheet. Is 8 to 40% by mass, more preferably 10 to 30% by mass, and still more preferably 12 to 25% by mass.
  • hardenable component (B)" is the thermosetting component (B1) containing the above-mentioned epoxy compound (B11), a thermosetting agent (B12), and a hardening accelerator (B13), and The total content of the energy ray-curable component (B2) including the energy ray-reactive compound (B21) and the photopolymerization initiator (B22).
  • the total content of the polymer component (A) and the curable component (B) in the resin film-forming sheet of one embodiment of the present invention is preferably based on the total amount (100% by mass) of the resin film-forming sheet. Is 40% by mass or more, more preferably 50% by mass or more, still more preferably 60% by mass or more, and still more preferably 70% by mass or more.
  • the resin film-forming sheet of one embodiment of the present invention may further contain an inorganic filler (C).
  • an inorganic filler (C) By including the inorganic filler (C), it becomes possible to adjust the thermal expansion coefficient of the resin film formed from the resin film forming sheet to an appropriate range, and optimize the thermal expansion coefficient of the chip with the resin film. Thus, the reliability of the semiconductor device in which the chip is incorporated can be improved. It is also possible to reduce the moisture absorption rate of the resin film formed from the resin film forming sheet.
  • Examples of the inorganic filler (C) include silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride and other powders, beads formed by spheroidizing them, single crystal fibers, glass fibers, and the like. Can be mentioned. These inorganic fillers (C) may be used alone or in combination of two or more. Among these, silica and alumina are preferable.
  • the average particle diameter of the inorganic filler (C) is preferably 400 nm or less, more preferably 300 nm or less, from the viewpoint of adjusting the surface roughness (Ra) of the surface ( ⁇ ) of the resin film-forming sheet to the above range. More preferably, it is 200 nm or less, more preferably 100 nm or less. On the other hand, from the viewpoint of improving the reliability of the chip with resin film produced using the resin film-forming sheet, preferably 10 nm or more, more preferably 20 nm or more.
  • the average particle size of the inorganic filler (C) is a value measured using a laser diffraction scattering particle size distribution measuring apparatus, it means a volume-median particle size (D 50).
  • the content of the inorganic filler (C) in the resin film forming sheet of one embodiment of the present invention is as follows. Preferably 0 to 50% by mass, more preferably 0 to 45% by mass, still more preferably 0 to 40% by mass, and still more preferably 0 to 30% by mass with respect to the total amount (100% by mass) of the resin film forming sheet. %.
  • the layer on the surface ( ⁇ ) side of the resin film-forming sheet It is preferable to adjust the surface roughness (Ra) of the surface ( ⁇ ) by reducing the average particle size of the inorganic filler (C) contained in the composition, which is a forming material, and reducing the content.
  • the composition which is a material for forming the layer on the surface ( ⁇ ) side is an inorganic filling having an average particle diameter of 0.01 ⁇ m or more within a range not affecting the surface roughness (Ra) of the surface ( ⁇ ). You may mix
  • the average particle size of the inorganic filler (C ′) is usually 0.01 to 5 ⁇ m, preferably 0.02 to 3 ⁇ m.
  • the resin film-forming sheet of one embodiment of the present invention may further contain a colorant (D).
  • a colorant (D) By containing the colorant (D) in the resin film forming sheet, when a semiconductor chip having a resin film formed from the resin film forming sheet is incorporated into a device, infrared rays generated from surrounding devices are shielded. Thus, malfunction of the semiconductor chip can be prevented.
  • colorant (D) organic or inorganic pigments and dyes can be used.
  • the dye for example, any dye such as an acid dye, a reactive dye, a direct dye, a disperse dye, and a cationic dye can be used. Moreover, it does not restrict
  • black pigments are preferable from the viewpoints of good shielding properties against electromagnetic waves and infrared rays, and further improving the discriminability by the laser marking method. Examples of the black pigment include carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, and the like. From the viewpoint of improving the reliability of the semiconductor chip, carbon black is preferable. In addition, you may use these colorants (D) individually or in combination of 2 or more types.
  • the average particle diameter of the colorant (D) is preferably 400 nm or less, more preferably 300 nm or less, more preferably from the viewpoint of adjusting the surface roughness (Ra) of the surface ( ⁇ ) of the resin film-forming sheet to the above range.
  • it is 200 nm or less, More preferably, it is 100 nm or less, Preferably it is 10 nm or more, More preferably, it is 20 nm or more.
  • the average particle size of the colorant (D) is a value measured using a laser diffraction / scattering particle size distribution measuring device, and means a volume-median particle size (D 50 ).
  • the content of the colorant (D) in the resin film-forming sheet of one embodiment of the present invention is preferably 0.01 to 30% by mass relative to the total amount (100% by mass) of the resin film-forming sheet.
  • the amount is preferably 0.05 to 25% by mass, more preferably 0.1 to 15% by mass, and still more preferably 0.15 to 5% by mass.
  • the resin film-forming sheet of one embodiment of the present invention may further contain a coupling agent (E).
  • a coupling agent (E) water resistance can also be improved without impairing the heat resistance of the resin film formed from the obtained resin film forming sheet. Moreover, it contributes to the improvement of end part adhesion after sticking with a silicon wafer.
  • the compound which reacts with the functional group which a component (A) or a component (B) has is preferable, and a silane coupling agent is more preferable.
  • the silane coupling agent include ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ - (methacryloxy).
  • an oligomer type coupling agent is preferable.
  • the molecular weight of the coupling agent (E) including the oligomer type coupling agent is preferably 100 to 15000, more preferably 150 to 10,000, more preferably 200 to 5000, still more preferably 250 to 3000, and still more preferably. Is 350-2000.
  • the content of the coupling agent (E) in the resin film-forming sheet of one embodiment of the present invention is preferably as small as possible.
  • the content of the coupling agent (E) in the resin film-forming sheet of one embodiment of the present invention is preferably 3.0% by mass with respect to the total amount (100% by mass) of the resin film-forming sheet. % Or less, more preferably 1.5% by mass or less, still more preferably 0.8% by mass or less, and still more preferably 0.3% by mass or less.
  • the resin film forming sheet is bonded to a silicon wafer. From the viewpoint of making the end edge adhesion good, and from the viewpoint of adjusting the adhesive force ( ⁇ 1) of the surface ( ⁇ ) of the resin film-forming sheet to the above range, preferably 0.01% by mass or more, more preferably Is 0.05 mass% or more, more preferably 0.10 mass% or more.
  • the resin film forming sheet of one embodiment of the present invention may further contain a leveling agent (F).
  • a leveling agent (F) By including the leveling agent (F), the adhesive force ( ⁇ 1) of the surface ( ⁇ ) of the obtained resin film-forming sheet can be easily adjusted to the above range.
  • the leveling agent (F) include a silicone leveling agent, a fluorine leveling agent, an acrylic leveling agent, a vinyl leveling agent, and a leveling agent in which a fluorine type and an acrylic type are combined. These leveling agents (F) may be used alone or in combination of two or more. Among these, it is preferable that a silicone type leveling agent is included from a viewpoint that the adhesive force ((alpha) 1) of the surface ((alpha)) of the resin film formation sheet can be easily adjusted to the said range.
  • the leveling agent (F) When the leveling agent (F) is contained in the resin film forming sheet, it becomes easy to adjust the adhesive strength ( ⁇ 1) of the surface ( ⁇ ) to the above range, but the adhesive strength of the surface ( ⁇ ) ( ⁇ 1) may decrease, and the reworkability of the resin film-forming sheet may decrease. Therefore, it is preferable that the content of the leveling agent is smaller on the surface ( ⁇ ) side of the resin film forming sheet.
  • the content of the leveling agent (F) is the total amount (100% by mass) of the resin film-forming sheet.
  • it is preferably 0.010% by mass or more, more preferably 0.050% by mass or more, and further preferably 0.100% by mass or more.
  • the content of the leveling agent (F) is the total amount (100% by mass) of the resin film forming sheet. Is preferably 0.500% by mass or less, more preferably 0.300% by mass or more, and further preferably 0.200% by mass or more.
  • the resin film-forming sheet of the present invention is a sheet containing a leveling agent
  • it is a multilayer having a layer formed from a composition ( ⁇ ′) containing a leveling agent and a layer formed from a composition ( ⁇ ′) substantially free from a leveling agent.
  • the composition ( ⁇ ′) becomes a forming material for the layer on the surface ( ⁇ ) side of the resin film forming sheet
  • the composition ( ⁇ ′) becomes a forming material for the layer on the surface ( ⁇ ) side of the resin film forming sheet.
  • the content of the leveling agent (F) in the composition ( ⁇ ′) is the total amount of active ingredients contained in the composition ( ⁇ ′) from the viewpoint of adjusting the adhesive strength ( ⁇ 1) of the surface ( ⁇ ) to the above range. (100% by mass) is preferably 0.010 to 10% by mass, more preferably 0.050 to 7% by mass, still more preferably 0.100 to 5% by mass, and still more preferably 0.150 to 2%. % By mass.
  • the content of the leveling agent (F) in the composition ( ⁇ ′) is the active ingredient contained in the composition ( ⁇ ′) from the viewpoint of adjusting the adhesive force ( ⁇ 1) of the surface ( ⁇ ) to the above range.
  • the resin film-forming sheet used in one embodiment of the present invention may contain a general-purpose additive (G) as necessary, in addition to the above components, within a range not impairing the effects of the present invention.
  • a general-purpose additive (G) include a crosslinking agent, a plasticizer, an antistatic agent, an antioxidant, an ion scavenger, a gettering agent, and a chain transfer agent.
  • crosslinking agent examples include an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, a metal chelate crosslinking agent, an amine crosslinking agent, and an amino resin crosslinking agent. These crosslinking agents may be used alone or in combination of two or more.
  • each of these general-purpose additives (G) in the resin film-forming sheet of one embodiment of the present invention is preferably 0 to 10 mass with respect to the total amount (100% by mass) of the resin film-forming sheet. %, More preferably 0 to 5% by mass, still more preferably 0 to 2% by mass.
  • ⁇ Method for Producing Resin Film Forming Sheet> There is no restriction
  • the resin film-forming sheet of one embodiment of the present invention is a multi-layered body having two or more layers
  • a method for producing the resin film-forming sheet for example, two or more support sheets are each resin Examples include a method in which a solution of the film-forming composition is applied to form a coating film, the coating film is bonded to form a coating film, and then dried to produce.
  • the organic solvent used for preparing the resin film-forming composition solution examples include toluene, ethyl acetate, methyl ethyl ketone, and the like.
  • the solid content concentration of the resin film-forming composition solution is preferably 10 to 80% by mass, more preferably 20 to 70% by mass, and still more preferably 30 to 65% by mass.
  • the coating method include spin coating, spray coating, bar coating, knife coating, roll coating, roll knife coating, blade coating, die coating, and gravure coating.
  • the thickness of the resin film-forming sheet of one embodiment of the present invention is appropriately set depending on the application, but is preferably 3 to 300 ⁇ m, more preferably 5 to 250 ⁇ m, and still more preferably 7 to 200 ⁇ m.
  • seat for resin film formation is a multilayer body comprised from two or more layers, it is preferable that the total thickness of the said multilayer body is the said range.
  • the resin film-forming sheet of one embodiment of the present invention can be attached to the back surface of a work such as a silicon wafer such as a face-down chip semiconductor wafer or a semiconductor chip to form a resin film on the work.
  • This resin film has a function as a protective film for protecting the back surface of a workpiece such as a semiconductor wafer or a semiconductor chip.
  • the resin film when affixed to a semiconductor wafer, the resin film has a function of reinforcing the wafer, so that damage to the wafer can be prevented.
  • the resin film forming sheet of one embodiment of the present invention is preferably a protective film forming sheet for forming a protective film on a silicon wafer.
  • the resin film formed from the resin film-forming sheet of one embodiment of the present invention can also have a function as an adhesive film. That is, when the resin film formed using the resin film-forming sheet of one embodiment of the present invention has a function as an adhesive film, the chip having the resin film is a die pad part or another member such as another semiconductor chip. It can be bonded to the top (on the chip mounting portion) and can contribute to the improvement of productivity for manufacturing a semiconductor device. That is, the resin film forming sheet of one embodiment of the present invention can be an adhesive film forming sheet for forming an adhesive film on a silicon wafer.
  • the composite sheet for forming a resin film of the present invention (hereinafter also simply referred to as “composite sheet”) has a structure in which the sheet for forming a resin film of the present invention capable of forming the above-mentioned resin film is laminated on a support sheet. It is.
  • composite sheet has a structure in which the sheet for forming a resin film of the present invention capable of forming the above-mentioned resin film is laminated on a support sheet.
  • limiting in particular about the form of the composite sheet of 1 aspect of this invention For example, forms, such as a long tape shape and a single-leaf label, may be sufficient.
  • FIG. 1 is a cross-sectional view of a composite sheet for forming a resin film of one embodiment of the present invention.
  • a composite sheet 1a having a configuration in which a resin film forming sheet 10 is directly laminated on a support sheet 11 as shown in FIG.
  • the shape of the resin film forming sheet 10 of the composite sheet of one embodiment of the present invention may be any shape that is substantially the same as the silicon wafer that is the adherend or can include the shape of the silicon wafer.
  • the support sheet 11 and the resin film forming sheet 10 have substantially the same shape, but as shown in FIG.
  • the composite sheet 1b whose shape is smaller than the shape of the support sheet 11 may be used.
  • the composite sheet 1c which has the ring-shaped jig
  • the ring-shaped jig adhesive layer 12 is provided for the purpose of improving the adhesive force to a jig such as a ring frame, and has a base material (core material). Or it can form from an adhesive.
  • the composite sheet 1c shown in FIG. 1C shows a configuration in which a jig adhesive layer 12 is further provided to the composite sheet 1a shown in FIG.
  • the composite sheet include a composite sheet having a configuration in which a jig adhesive layer 12 is provided on the surface of the support sheet 11 of the composite sheet 1b in FIG.
  • the composite sheet of one embodiment of the present invention may be a composite sheet 1d having a configuration in which a resin film forming sheet 10 is sandwiched between two support sheets 11 and 11 ′ as shown in FIG. 1 (d). Similar to the structure of the composite sheet 1d, a support sheet different from the support sheet 11 may be provided on the surface of the resin film forming sheet 10 exposed from the composite sheet 1b in FIG. . Similarly, a support sheet different from the support sheet 11 may be provided on the surface of the resin film forming sheet 10 and the surface of the jig adhesive layer 12 of the composite sheet 1c shown in FIG. .
  • the composite sheet of one embodiment of the present invention has a support sheet for protecting the surface of the resin film forming sheet by a peeling sheet that prevents adhesion of dust or the like to the surface of the resin film forming sheet or by a dicing process or the like. It plays the role of a dicing sheet or the like.
  • the support sheet used in the present invention preferably has a structure having a resin film.
  • the resin film include polyethylene films such as low density polyethylene (LDPE) films and linear low density polyethylene (LLDPE) films, ethylene / propylene copolymer films, polypropylene films, polybutene films, polybutadiene films, and polymethylpentene.
  • the support sheet used in one embodiment of the present invention may be a single layer film made of one kind of resin film or a laminated film in which two or more kinds of resin films are laminated.
  • the resin film may be a crosslinked film. Moreover, what colored these resin films, or what gave printing etc. can be used. Furthermore, the resin film may be a sheet formed by extrusion forming a thermoplastic resin, or may be a stretched sheet, and a sheet formed by thinning and curing a curable resin by a predetermined means. May be used.
  • a resin film including a polypropylene film is preferable from the viewpoint that it has excellent heat resistance and has an appropriate flexibility so that it has expandability and the pick-up property is easily maintained.
  • the single layer structure which consists only of a polypropylene film may be sufficient, and the multilayer structure which consists of a polypropylene film and another resin film may be sufficient.
  • the resin film-forming sheet is thermosetting, the resin film constituting the support sheet has heat resistance, so that damage to the support sheet due to heat can be suppressed and occurrence of defects in the manufacturing process of the semiconductor device can be suppressed.
  • the support sheet When the support sheet is used as a release sheet for preventing dust or the like from adhering to the surface of the resin film forming sheet, the support sheet can be easily peeled from the resin film forming sheet at the time of adhering to a silicon wafer or at the dicing process.
  • a resin film is preferred.
  • the resin film which gave the peeling process may be used as the surface of the above-mentioned resin film as the said support sheet.
  • a method for the release treatment a method of providing a release film formed from a release agent on the surface of the resin film is preferable.
  • the release agent include release agents containing resins selected from acrylic resins, alkyd resins, silicone resins, fluorine resins, unsaturated polyester resins, polyolefin resins, wax resins, and the like. .
  • the support sheet When the support sheet is used as a dicing sheet for protecting the surface of the resin film-forming sheet in a dicing process or the like, the support sheet has a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive on the resin film.
  • the adhesive resin contained in the adhesive includes, for example, an acrylic resin, a urethane resin, a rubber resin, a silicone resin, a vinyl ether resin, etc., when focusing on the structure of the adhesive resin.
  • an energy beam curable resin and the like can be mentioned.
  • a pressure-sensitive adhesive containing an energy ray curable resin is preferable from the viewpoint of improving pickup properties.
  • the said adhesive layer when providing the adhesive layer formed from the adhesive containing energy-beam curable resin on a resin film, the said adhesive layer may be the adhesive layer which irradiated and hardened
  • the thickness of the support sheet is appropriately selected depending on the application, but is preferably 10 to 500 ⁇ m, more preferably 20 to 350 ⁇ m, and still more preferably 30 to 200 ⁇ m. Note that the thickness of the support sheet includes not only the thickness of the resin film constituting the support sheet, but also the thickness of the pressure-sensitive adhesive layer or release film when it has an adhesive layer or release film.
  • the jig adhesive layer can be formed from a double-sided pressure-sensitive adhesive sheet having a base material (core material) or a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive.
  • a base material core material
  • the resin film which can be used as the above-mentioned support sheet is mentioned, A polypropylene film is preferable.
  • the pressure-sensitive adhesive include acrylic resins, urethane resins, rubber resins, silicone resins, vinyl ether resins, and the like.
  • the thickness of the jig adhesive layer is preferably 1 to 80 ⁇ m, more preferably 5 to 60 ⁇ m, and still more preferably 10 to 40 ⁇ m.
  • the present invention also provides a method of reworking a resin film-forming sheet by reworking the resin film-forming sheet from a laminate in which the surface ( ⁇ ) of the resin film-forming sheet of the present invention is directly attached to a silicon wafer.
  • the silicon wafer recycling method of the present invention includes the following steps (1) to (2). Step (1): Step of sticking the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet having a substrate and a pressure-sensitive adhesive layer onto the surface ( ⁇ ) of the resin film-forming sheet of the laminate. Step (2): Step (1 ) To rework the resin film forming sheet stuck on the silicon wafer by pulling the adhesive sheet stuck on the surface ( ⁇ ) of the resin film forming sheet.
  • the method for reclaiming a silicon wafer according to the present invention is a method in which the silicon wafer is not damaged when the resin film forming sheet according to the present invention is pasted on the silicon wafer, and the silicon wafer is not damaged. It utilizes the property of the resin film forming sheet of the present invention that rework can be performed while suppressing part of the film forming sheet from adhering to and remaining on the silicon wafer.
  • the silicon wafer reclamation method of one embodiment of the present invention is not limited to the laminate immediately after the surface ( ⁇ ) of the resin film forming sheet of the present invention is directly pasted on the silicon wafer.
  • the present invention can also be applied to a laminate in which the adhesion between the silicon wafer and the resin film forming sheet has been improved after a lapse of time.
  • steps (1) and (2) of the silicon wafer recycling method of the present invention will be described.
  • the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet having a base material and a pressure-sensitive adhesive layer is affixed on the surface ( ⁇ ) of the resin film forming sheet of the laminate.
  • an adhesive sheet used at this process it has a base material and an adhesive layer.
  • a resin film is preferable and the resin film illustrated by the item of the above-mentioned support sheet is mentioned.
  • the pressure-sensitive adhesive layer includes 100 parts by mass of an acrylic resin having a structural unit derived from butyl acrylate and acrylic acid and having a mass average molecular weight of 600,000 to 1,000,000 as defined in requirement (III), and a crosslinking agent
  • a pressure-sensitive adhesive layer having a thickness of 10 to 50 ⁇ m formed from a pressure-sensitive adhesive containing 0.01 to 10 parts by mass is preferable.
  • any pressure-sensitive adhesive that can form a pressure-sensitive adhesive layer having a surface ( ⁇ ) adhesive force ( ⁇ 1) in the above range may be used. it can.
  • the shape of the pressure-sensitive adhesive sheet is not particularly limited, but from the viewpoint of operability in the next step (2), the pressure-sensitive adhesive sheet has the same shape as the resin film-forming sheet or a shape larger than the resin film-forming sheet. Is preferred.
  • this step as a method of attaching the surface ( ⁇ ) and the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, it may be affixed using a machine or may be performed manually.
  • the surface ( ⁇ ) of the resin film forming sheet included in the composite sheet of one embodiment of the present invention is attached to a silicon wafer, and a dicing sheet is already laminated as a support sheet on the surface ( ⁇ ) side
  • the dicing sheet can also be used as an adhesive sheet in this step.
  • Step (2) the resin sheet forming sheet stuck on the silicon wafer is reworked by pulling the adhesive sheet stuck on the surface ( ⁇ ) of the resin film forming sheet in the step (1). It is a process.
  • the resin film-forming sheet of the present invention is used, and the adhesive force ( ⁇ 1) and ( ⁇ 1) of the resin film-forming sheet is in the above-mentioned range. ), The resin film forming sheet is also dragged together, and the resin film forming sheet can be reworked from the silicon wafer.
  • the adhesive sheet may be pulled using a machine, but from the viewpoint of operability, it is preferable to manually pull the adhesive sheet and rework the resin film forming sheet from the silicon wafer.
  • the surface of the silicon wafer may be washed with an organic solvent such as ethanol as necessary.
  • an organic solvent such as ethanol
  • the measuring method of the mass average molecular weight (Mw) or the number average molecular weight (Mn) of each component used in Production Examples 1 to 8 is as follows. ⁇ Mass average molecular weight (Mw), number average molecular weight (Mn)> Using a gel permeation chromatograph (product name “HLC-8220GPC” manufactured by Tosoh Corporation), the measurement was performed under the following conditions, and the value measured in terms of standard polystyrene was used.
  • compositions (1) to (8) (abbreviated as “Compositions (1) to (8)” in Table 1) by mixing the components of the types and amounts shown in Table 1 respectively. After the preparation, it was further diluted with methyl ethyl ketone to prepare a solution of the composition having a solid concentration of 61% by mass.
  • the compounding amount of each component in Table 1 is a ratio (unit: mass% (effective component ratio)) to 100% by mass of the total amount of each composition (the total compounding amount of components (A) to (G)). .
  • the detail of each component of Table 1 is as follows.
  • ⁇ Curable component (B)> (B-1): acryloyl group-added cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name “CNA-147”, an epoxy compound corresponding to the component (B11)).
  • B-2) Biphenyl aralkyl type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name “NC-3000H”, epoxy compound corresponding to the component (B11)).
  • B-3) Bisphenol A type epoxy resin (trade name “jER828” manufactured by Mitsubishi Chemical Corporation, epoxy compound corresponding to the component (B11)).
  • (B-4) Bisphenol A type epoxy resin (trade name “jER1055” manufactured by Mitsubishi Chemical Corporation, an epoxy compound corresponding to the component (B11)).
  • (B-5) Dicyclopentadiene type epoxy resin (manufactured by DIC Corporation, trade name “Epicron HP-7200HH”, epoxy compound corresponding to the component (B11)).
  • C ⁇ Inorganic filler (C)>
  • ⁇ Colorant (D)> (D-1): Carbon black (average particle size 28 nm).
  • Example 1 Resin film prepared in Production Example 2 on the release-treated surface of the first support sheet (trade name “SP-PET3811”, manufactured by Lintec Co., Ltd., thickness: 38 ⁇ m) composed of the resin film subjected to the release treatment
  • a solution of the forming composition (2) was applied and dried to form a coating film ( ⁇ ′).
  • the solution of the resin film-forming composition (1) prepared in Production Example 1 is applied onto the release-treated surface of the second support sheet, which is the same as the first support sheet, and dried to form a coating film. ( ⁇ ′) was formed. Then, the coating films ( ⁇ ′) and ( ⁇ ′) formed on the two support sheets are bonded together, and dried at 120 ° C.
  • a forming sheet was formed, and a composite sheet for forming a resin film composed of a first support sheet / a sheet for forming a resin film / a second support sheet was produced.
  • the surface of the resin film forming sheet that appears when the first support sheet is removed is the “surface ( ⁇ )” on the side to be bonded to the silicon wafer, and the second support The surface of the resin film forming sheet that appears when the sheet is removed is the “surface ( ⁇ )”.
  • Example 2 In Example 1, instead of “the solution of the resin film-forming composition (2) prepared in Production Example 2”, “the solution of the resin film-forming composition (3) prepared in Production Example 3” was used. Except for the above, a composite sheet for forming a resin film was produced in the same manner.
  • Example 3 In Example 1, instead of “the solution of the resin film forming composition (2) prepared in Production Example 2”, “the solution of the resin film forming composition (4) prepared in Production Example 4” was used. Except for the above, a composite sheet for forming a resin film was produced in the same manner.
  • Example 4 In Example 1, instead of “the solution of the resin film forming composition (2) prepared in Production Example 2”, “the solution of the resin film forming composition (5) prepared in Production Example 5” was used. Except for the above, a composite sheet for forming a resin film was produced in the same manner.
  • Example 5 A resin film prepared in Production Example 6 on the release-treated surface of a first support sheet (trade name “SP-PET3811”, manufactured by Lintec Corporation, thickness: 38 ⁇ m) composed of a resin film subjected to a release treatment
  • a solution of the forming composition (6) was applied to form a coating film, followed by drying at 120 ° C. for 2 minutes to form a resin film-forming sheet having a thickness of 25 ⁇ m.
  • the surface of the formed resin film-forming sheet and the release treatment surface of the second support sheet that is the same as the first support sheet are bonded together, and the first support sheet / resin film-forming sheet / A composite sheet for forming a resin film composed of the second support sheet was produced.
  • Example 5 instead of “the solution of the resin film forming composition (6) prepared in Production Example 6”, “the solution of the resin film forming composition (3) prepared in Production Example 3” was used. Except for the above, a composite sheet for forming a resin film was produced in the same manner.
  • Example 5 instead of “the solution of the resin film-forming composition (6) prepared in Production Example 6”, “the solution of the resin film-forming composition (7) prepared in Production Example 7” was used. Except for the above, a composite sheet for forming a resin film was produced in the same manner.
  • Example 5 instead of “the solution of the resin film forming composition (6) prepared in Production Example 6”, “the solution of the resin film forming composition (8) prepared in Production Example 8” was used. Except for the above, a composite sheet for forming a resin film was produced in the same manner.
  • the first support sheet included in the composite sheet prepared in Examples and Comparative Examples was removed, and the surface roughness ( ⁇ ) of the exposed resin film forming sheet was measured against a contact-type surface roughness meter (Mitutoyo Corporation, product Name “SURFTEST SV-3000”), the cut-off value ⁇ c was 0.8 mm, the evaluation length Ln was 4 mm, and the measurement was performed according to JIS B0601: 2001.
  • the first support sheet included in the composite sheet produced in the examples and comparative examples was removed, and the surface ( ⁇ ) of the exposed resin film forming sheet and a # 2000 polished silicon wafer (diameter: 200 mm, thickness: The surface was affixed to a polished surface with a tape mounter (product name “Adwill RAD-3600 F / 12” manufactured by Lintec Corporation) while heating at 70 ° C.
  • the second support sheet of the composite sheet is removed, and the surface ( ⁇ ) of the exposed resin film forming sheet and a commercially available adhesive sheet used as a backing tape (product name “PET50 (A ) PAT1 ”, width: 25 mm) was applied on a hot plate heated to 70 ° C. using a 2 kg roller, and then 24 ° C. under an environment of 23 ° C. and 50% RH (relative humidity). Let stand for hours. After standing, a tensile test was performed using a universal testing machine (manufactured by Shimadzu Corporation, product name “Autograph AG-IS”) at a peeling angle of 180 ° and a peeling speed of 0.3 m / min.
  • a universal testing machine manufactured by Shimadzu Corporation, product name “Autograph AG-IS”
  • the load when the protective film forming sheet and the backing tape were peeled off from the surface of the silicon wafer was measured.
  • the value of this load was taken as the adhesive force of the surface ( ⁇ ) of the resin film forming sheet to the silicon wafer.
  • the commercially available pressure-sensitive adhesive sheet used as the backing tape does not peel off at the interface between the protective film-forming sheet and the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet when performing a tensile test. It has an adhesive strength that can be stably peeled off at the interface with the silicon wafer.
  • BA butyl acrylate
  • AA acrylic acid
  • 5 parts by mass of a tolylene diisocyanate crosslinking agent (trade name “Coronate L”, manufactured by Nippon Polyurethane Industry Co., Ltd.) is blended.
  • a test sample having a thickness of 0.18 mm, a width of 4.5 mm, and a length of 20.0 mm obtained by laminating a plurality of resin film-forming sheets obtained by removing the two support sheets of the composite sheets prepared in the examples and comparative examples. was made.
  • a dynamic viscoelasticity measuring apparatus manufactured by TA instruments, product name “DMA Q800”
  • DMA Q800 dynamic viscoelasticity measuring apparatus
  • the first support sheet included in the composite sheet produced in the examples and comparative examples was removed, and the surface ( ⁇ ) of the exposed resin film forming sheet and a # 2000 polished silicon wafer (diameter: 200 mm, thickness: 600 ⁇ m) was affixed to the polished surface using a tape mounter (product name “Adwill RAD-3600 F / 12” manufactured by Lintec Corporation) while heating to 70 ° C., and 23 ° C., 50% RH (relative (Humidity) environment for 24 hours.
  • a tape mounter product name “Adwill RAD-3600 F / 12” manufactured by Lintec Corporation
  • the second support sheet of the composite sheet After standing, the second support sheet of the composite sheet is removed, and the surface ( ⁇ ) of the exposed resin film forming sheet and a commercially available general-purpose dicing tape (trade name “Adwill D” manufactured by Lintec Corporation) -510T ", the surface of the pressure-sensitive adhesive layer having a pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive defined in the above requirement (III)) was stuck at room temperature (25 ° C.) and allowed to stand for 20 minutes.
  • a commercially available general-purpose dicing tape trade name “Adwill D” manufactured by Lintec Corporation
  • the reworkability of the resin film forming sheet was evaluated according to the following criteria.
  • C A protective film forming sheet that is difficult to wipe off with ethanol on a silicon wafer after reworking even if the silicon wafer breaks during reworking or even if reworking is possible without damaging the silicon wafer. The residue was confirmed.
  • the first support sheet included in the composite sheet produced in the examples and comparative examples was removed, and the surface ( ⁇ ) of the exposed resin film forming sheet and a # 2000 polished silicon wafer (diameter: 200 mm, thickness: (600 ⁇ m) with a tape mounter (product name “Adwill RAD-3600 F / 12” manufactured by Lintec Co., Ltd.) while being heated to 70 ° C., and then a second support sheet
  • the silicon wafer and the resin film forming sheet were pasted.
  • the end of the silicon wafer to which the resin film forming sheet is attached is visually observed, and the end of the resin film forming sheet is adhered according to the following criteria, depending on the number of crevices or chips of 0.5 mm or more. Sex was evaluated.
  • the resin film-forming sheets produced in Examples 1 to 5 which are one embodiment of the present invention were excellent in both reworkability and end portion adhesion.
  • the resin film forming sheet of Comparative Example 1 has a low value of the adhesive force ( ⁇ 1) of the surface ( ⁇ ), and therefore the resin film is used during the rework operation of the resin film forming sheet using the adhesive sheet. A part of the forming sheet remained on the silicon wafer, resulting in poor reworkability.
  • the resin film forming sheet of Comparative Example 3 has a high value of the adhesive strength ( ⁇ 1) of the surface ( ⁇ ), the silicon wafer is in the process of reworking the resin film forming sheet using the adhesive sheet. It was damaged, resulting in poor reworkability.
  • the resin film-forming sheet of Comparative Example 2 had good reworkability, but had poor edge adhesion after the silicon wafer was pasted.
  • the resin film forming sheet of one embodiment of the present invention is suitable as a material for forming a protective film that protects the back surface of a semiconductor chip, or as a material for forming an adhesive film that can be adhered to a die pad portion or other part.

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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PCT/JP2015/082433 2015-01-14 2015-11-18 樹脂膜形成用シート、樹脂膜形成用複合シート、及びシリコンウエハの再生方法 WO2016113998A1 (ja)

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JP2020120073A (ja) * 2019-01-28 2020-08-06 日立化成株式会社 フィルム状接着剤、接着シート、並びに半導体装置及びその製造方法

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JP7025231B2 (ja) * 2018-02-01 2022-02-24 日東電工株式会社 表面保護フィルム
KR102455146B1 (ko) * 2020-02-10 2022-10-17 주식회사 나노인 기판의 구조충진을 위한 가역적 코팅 방법 및 봉지 방법

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JP2020120073A (ja) * 2019-01-28 2020-08-06 日立化成株式会社 フィルム状接着剤、接着シート、並びに半導体装置及びその製造方法
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