WO2015000225A1 - 一种柔性显示器的制备方法和柔性显示器 - Google Patents

一种柔性显示器的制备方法和柔性显示器 Download PDF

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Publication number
WO2015000225A1
WO2015000225A1 PCT/CN2013/084047 CN2013084047W WO2015000225A1 WO 2015000225 A1 WO2015000225 A1 WO 2015000225A1 CN 2013084047 W CN2013084047 W CN 2013084047W WO 2015000225 A1 WO2015000225 A1 WO 2015000225A1
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WIPO (PCT)
Prior art keywords
substrate
flexible display
display device
adhesive layer
device body
Prior art date
Application number
PCT/CN2013/084047
Other languages
English (en)
French (fr)
Inventor
周伟峰
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/353,843 priority Critical patent/US9622343B2/en
Publication of WO2015000225A1 publication Critical patent/WO2015000225A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7244—Oxygen barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7246—Water vapor barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B32B2307/7265—Non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/051—Rolled
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the present invention relates to the field of displays, and more particularly to a method of fabricating a flexible display and a flexible display.
  • LCD Liquid crystal display
  • the plastic substrate and the glass substrate are firmly bonded together with a binder of as high a viscosity as possible, and then the display device is prepared. Scanning the adhesive between the plastic substrate and the glass substrate from the back side of the glass substrate by using a laser to make the adhesive age and hard, thereby achieving the effect that the plastic substrate can be easily peeled off from the surface of the glass substrate; secondly, by evaporation, Depositing a layer of parylene on the glass substrate to form a release layer, then coating the polyamic acid solution on the glass substrate, curing into polyimide, and then using the release layer to easily remove the plastic substrate from the glass. Peel off the substrate.
  • the first method because of the use of the laser process, has lower production efficiency and higher cost; the second method, since the release layer is formed by using parylene, and the parylene needs to be prepared by vapor deposition on the glass substrate. Upper, and vapor deposition of parylene is a very expensive process, and the cost is high.
  • the present invention provides a flexible display preparation method and a flexible display.
  • the present invention also provides a flexible display comprising: a display device body, a first substrate, an adhesive layer, and a planarization layer and/or a water and oxygen barrier disposed between the first substrate and the display device body a layer, a first surface of the first substrate is connected to the adhesive layer, and a second surface opposite to the first surface of the first substrate is connected to the planarization layer and/or the water and oxygen barrier layer;
  • the adhesion between the adhesive layer and the second substrate for carrying the adhesive layer is lower than the 5N/20 mm wide adhesive layer.
  • the beneficial effects of the present invention are:
  • the flexible display of the present invention is prepared by forming a low-viscosity 1 adhesive layer on the first substrate, and the bonding force of the adhesive is low, so that the display device body is formed.
  • the first substrate is easily peeled off from the second substrate.
  • the present invention does not require laser back surface treatment, and does not need to prepare an expensive release layer for reducing the Pf force between the first substrate and the second substrate, and the process does not Defects such as substrate wrinkles occur, thereby reducing manufacturing costs and high production efficiency, and are suitable for mass production.
  • FIG. 1 is a flowchart of a method for preparing a flexible display according to an embodiment of the present invention
  • FIG. 2 is a schematic view showing the preparation of an adhesive layer according to an embodiment of the present invention
  • 3 is a schematic view showing bonding of an adhesive layer to a second substrate according to an embodiment of the present invention
  • FIG. 4 is a schematic view showing the preparation of a display device body according to an embodiment of the present invention
  • FIG. 5 is a schematic diagram of a first state of a body of a cutting display device according to an embodiment of the invention.
  • FIG. 6 is a schematic view showing a second state of a body of a cutting display device according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a first state of a split flexible display according to an embodiment of the present invention
  • FIG. 8 is a schematic diagram of a second state of a split flexible display according to an embodiment of the present invention
  • FIG. 10 is a schematic diagram of a circuit for attaching a flexible display according to an embodiment of the present invention.
  • a flowchart of a method for fabricating a flexible display according to an embodiment of the present invention includes the following steps:
  • Step SI 02 forming an adhesive layer on the first surface of the first substrate
  • Step S103 providing a second substrate
  • Step SI 04 attaching a surface of the first substrate having the adhesive layer to the second substrate; wherein, the adhesive layer between the adhesive layer and the second substrate The force is lower than the 5N/20mm wide adhesive layer;
  • Step S106 peeling off the first substrate on which the display device body is formed from the second substrate to obtain the flexible display.
  • the flexible display of the present invention is prepared by forming a low-viscosity adhesive layer on the first substrate, and the first substrate on which the display device body is formed is easily removed from the first substrate due to the lower adhesive force of the adhesive. Peel off on the two substrates.
  • the present invention does not require laser back surface treatment, and does not need to prepare an expensive release layer for reducing the adhesion between the first substrate and the second substrate, which does not occur during the process. Defects such as substrate wrinkles, thereby reducing manufacturing costs, And high production efficiency, suitable for large-scale production.
  • the adhesive layer of the present invention can reduce the adhesion to the second substrate, and can be formed by adding a filler to the silica gel, thereby reducing the silica gel and the first substrate by a material having no adhesion ability or poor adhesion ability. Adhesion.
  • the flexible display made of silica gel can withstand the high temperature of 300 ⁇ 500 °C.
  • the filler in the silica gel is also made of high temperature resistant material, which can withstand the high temperature of 300-500 C.
  • the binder of the present invention may also be formed by adding a filler to an acrylic resin, so that a temperature-resistant 230 ⁇ touch panel can be applied, and the filler is also made of a temperature-resistant 230 C material.
  • the adhesion between the adhesive layer of the present invention and the second substrate for carrying the adhesive layer is less than a 5N/20mm wide adhesive layer, preferably less than a 1N/20mm wide adhesive layer More preferably, it is a 0.03N ⁇ 0.1N/20mm. wide adhesive layer.
  • the comparison of the adhesion force is based on the adhesive Pf force generated by an object 20 mm wide, and the adhesive Pf force is a bond of 20 mm width because the adhesive layer is generated by the Pf force.
  • the agent layer serves as a reference.
  • the second substrate of the present invention is for carrying an adhesive layer and a first substrate, and may be one or more of a glass substrate, a metal substrate, a quartz substrate or an organic substrate. In this embodiment, the second substrate is selected as a glass substrate.
  • the first substrate of the present invention is preferably a plastic substrate having a thermal expansion coefficient in the range of from 1 to 50 ppm/°C, more preferably, a plastic substrate in the range of from 3 to 20 ppm/C.
  • the present invention employs a plastic substrate having a thermal expansion coefficient within the above range to maintain a thermal expansion coefficient similar to that of the glass substrate to reduce thermal shock and to avoid wrinkling of the plastic film in a vacuum high temperature process.
  • the type of plastic substrate may be polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), fiber reinforced plastic (FRP), polyether sulfone resin ( PES), polyarylate (PAR), and polycarbonate (PC)
  • PI polyimide
  • PEN polyethylene naphthalate
  • PET polyethylene terephthalate
  • FRP fiber reinforced plastic
  • PES polyether sulfone resin
  • PAR polyarylate
  • PC polycarbonate
  • FIG. 2 a schematic diagram of preparing an adhesive layer according to an embodiment of the present invention, the adhesive is applied to the first side of the first substrate I made of polyimide as a material through a nozzle 3, and is prepared.
  • Adhesive layer 2 The binder may be an organic or inorganic filler added to the silica gel or the acrylic resin, for example, adding PET (polybutylene plastic), polyurethane, silicon oxide, titanium oxide, etc., so that the formed adhesive layer is adhered. The force is low.
  • the adhesive layer is formed due to its low adhesion
  • the first substrate of the device body can be easily peeled off from the second substrate without using a release layer or laser treatment, which reduces production cost and is convenient to operate.
  • FIG. 3 a schematic view of bonding an adhesive layer to a second substrate according to an embodiment of the present invention. Attaching the surface of the first substrate having the adhesive layer to the second substrate 4, and attaching the first substrate 1 to the second substrate 4 made of glass by the attaching roller 5, so that The adhesive layer 2 is bonded to the second substrate 4.
  • the adhesion of the adhesive layer 2 to the second substrate is not limited to the use of the attaching roller, and the adhesive layer may be applied to the second substrate by other means such as hand pressing or the like.
  • FIG. 4 it is a schematic diagram of preparing a display device body according to an embodiment of the present invention.
  • a planarization layer and/or a water-oxygen barrier layer is formed on the second surface of the first substrate, and then a display is formed on the planarization layer and the Z or water-oxygen barrier layer.
  • Device body 7. wherein, reference numeral 6 denotes a planarization layer and/or a water-oxygen barrier layer, and the binder and the display device body 7 may be a water-oxygen barrier layer, a planarization layer, or both, according to Actual production is configured.
  • FIGS. 5 and 6 a schematic diagram of a dicing display device according to an embodiment of the present invention, in order to realize delamination of a first substrate and a second substrate having a display device body, a planarization layer on an edge of the first substrate Cutting with Z or a water-oxygen barrier layer to form a slit 8 which may be inclined at an angle to the surface of the first substrate, for example, 30-60 degrees; and then using the mechanical force along the slit 8, the body of the display device is formed The first substrate is peeled off from the second substrate to obtain the flexible display. Finally, the first substrate 1 is removed by mechanical force together with the display device body 7 thereon, and the flexible display is completed.
  • a schematic diagram of a split flexible display according to an embodiment of the present invention after forming the display device body on the planarization layer and/or the water-oxygen barrier layer, further includes:
  • the display device is segmented by using the first fracture and the corresponding second fracture.
  • First break 9 and second break! The positions of 0 are almost coincident, allowing each display to be separated from each other.
  • the entire prepared flexible display screen is removed from the glass substrate as shown in FIG.
  • the two fractures are used for division, and the upper and lower fractures are formed, and the requirements for the cutter wheel are lower, and the cutter wheel is specially designed because of the deep cutting depth.
  • the present invention utilizes two fractures for segmentation, which facilitates cutting and produces fewer particles during cutting.
  • the present invention also provides a flexible display comprising: a display device body, a first substrate, an adhesive layer, and a planarization layer and/or a water-oxygen barrier layer disposed between the first substrate and the display device body
  • the first surface of the first substrate is connected to the adhesive layer, and the second surface opposite to the first surface of the first substrate is connected to the planarization layer and/or the water and oxygen barrier layer;
  • the adhesion between the adhesive layer and the second substrate for carrying the adhesive layer is lower than the 5N/20 mm wide adhesive layer.
  • the adhesion between the adhesive layer and the second substrate for carrying the adhesive layer is less than a 0.1 N/20 mm wide adhesive layer.
  • the first substrate is a plastic substrate having a swelling coefficient of ⁇ 50 ppm/O.
  • the first substrate is a plastic substrate having an expansion coefficient of 3 to 20 ppm/C.
  • the material of the first substrate is polyimide, polyethylene naphthalate, polyethylene terephthalate, fiber reinforced plastic, polyether sulfone resin, polyarylate, polycarbonate One or more of the esters.
  • the second substrate is a glass substrate, a metal substrate, a quartz substrate or an organic substrate.
  • the flexible display of the present invention is prepared by forming a low adhesion adhesive layer on the first substrate, and the adhesive body has a low adhesion, thereby forming the display device body.
  • a substrate is easily peeled off from the second substrate.
  • the present invention does not require laser back surface treatment, and does not need to prepare an expensive release layer for reducing the adhesion between the first substrate and the second substrate, which does not occur during the process. Defects such as pleats of the substrate, thereby reducing manufacturing costs and high production efficiency, and are suitable for mass production.

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Abstract

一种柔性显示器的制备方法和柔性显示器。制备方法包括如下步骤：提供一第一基板（1）；在第一基板（1）的第一表面上形成粘结剂层（2）；提供一第二基板（4）；将第一基板（1）的形成有粘结剂层（2）的表面贴附于第二基板（4）上；粘结剂层（2）与第二基板（4）之间的粘附力低于5N/20m宽粘结剂层；在第一基板（1）的第二表面上形成显示器件本体（7）；将形成有显示器件本体（7）的第一基板（1）从第二基板（4）上剥离，得到柔性显示器。柔性显示器的制备是在第一基板（1）上形成低粘附力的粘结剂层（2），由于粘结剂的粘附力较低，从而使得形成有显示器件本体的第一基板（1）很容易从第二基板（2）上剥离，从而降低了制造成本，且生产效率高，适合大规模生产。

Description

本发明涉及显示器领域， 特别是涉及一种柔性显示器的制备方法和柔性 显不器。
液晶显示器 （LCD) 技术在近十年有了飞速地发展， 从屏幕的尺寸到显 示的质量都取得了很大进步。 经过不断的努力， LCD各方面的性能已经达到 了传统 CRT的水平， 大有取代 CRT的趋势。
随着 LCD生产的不断扩大， 各个生产厂商之间的竞争也日趋激烈。各厂 家在不断努力降低产品的生产成本的同时， 也在不断提高产品性能， 以及增 加更多功能， 从而提高产品的附加值和提升市场的竞争力。
随着柔性显示技术的发展， 更加接近传统显示模式的柔性显示产品很快 也将走入寻常百姓家。 由于柔性显示其本身特有的可弯曲的特点， 决定了它 会带来很多特有的用户体验。
目前，在玻璃基板衬底上进行塑料基板贴^的方法主要有两种：第一种， 采用尽量高粘度的粘结剂将塑料基板与玻璃基板牢固粘结在一起， 制备完成 显示器件后再用激光从玻璃基板背面扫描塑料基板与玻璃基板中间的粘结剂 使得粘结剂老化***， 从而达到塑料基板能够轻易从玻璃基板表面剥离的效 果； 第二种， 先通过蒸镀的方式， 在玻璃基板上沉积一层聚对二甲苯， 形成 一层离型层， 然后将聚酰胺酸溶液涂覆在玻璃基板上， 固化成聚酰亚胺后再 利用离型层将塑料基板轻松从玻璃基板上剥离。
这两种方法都有自身无法避免的弊病。第一种方法，由于使用激光工艺， 生产效率较低， 成本较高； 第二种方法， 由于使用聚对二甲苯形成离型层， 而聚对二甲苯需要通过蒸镀的方式制备在玻璃基板上， 而蒸镀聚对二甲苯是 一道很昂贵的工序， 成本较高。 为了解决现有的柔性显示器在制作时， 塑料基板从玻璃基板衬底上进行 剥离需要复杂的工序， 成本较高， 本发明提供了一种柔性显示器的制备方法 和柔性显示器。
本发明采用的技术方案是：一种柔性显示器的制备方法，包括如下步骤： 提供一第一基板；
在所述第一基板的第一面上形成粘结剂层；
提供一第二基板；
将所述第一基板的形成有所述粘结剂层的表面贴附于所述第二基板上； 其中，所述粘结剂层与所述第二基板之间的粘 力低于 5N/20mm宽粘结剂层; 在所述第一基板的第二面上形成显示器件本体， 所述第一基板的第二面 与所述第一基板的第一面相对；
将所述形成有显示器件本体的第一基板从所述第二基板上剥离， 得到所 述柔性显示器。
本发明还提供了一种柔性显示器， 包括： 显示器件本体、 第一基板、 粘 结剂层和设置在所述第一基板和所述显示器件本体之间的平坦化层和 /或水 氧阻隔层， 所述第一基板的第一面与粘结剂层相连接， 与所述第一基板第一 面相对的第二面与所述平坦化层和 /或水氧阻隔层相连接； 所述粘结剂层与用 于承载所述粘结剂层的第二基板之间的粘附力低于 5N/20mm宽粘结剂层。
本发明的有益效果是： 本发明的柔性显示器的制备是在第一基板上形成 低粘 1 力的粘结剂层， 由于粘结剂的粘 1 力较低， 从而使得形成有显示器件 本体的第一基板很容易从第二基板上剥离。 同现有柔性显示器件制备方案相 比， 本发明不需要激光背面处理， 也不需要制备昂贵的 ^于降低第一基板和 第二基板之间 Pf†着力的离型层， 工艺过程中不会发生基板褶皱等不良现象， 从而降低了制造成本， 且生产效率高， 适合大规模生产。
图 i为本发明一种实施例的柔性显示器的制备方法的流程图;
图 2为本发明一种实施例的制备粘结剂层的示意图； 图 3为本发明一种实施例的粘结剂层与第二基板粘合的示意图； 图 4为本发明一种实施例的制备显示器件本体的示意图；
图 5为本发明一种实施例的切割显示器件本体的第一状态示意图;
图 6为本发明一种实施例的切割显示器件本体的第二状态示意图;
图 7为本发明一种实施例的分割柔性显示器的第一状态示意图； 图 8为本发明一种实施例的分割柔性显示器的第二状态示意图； 图 9为本发明一种实施例的分割柔性显示器的第三状态示意图； 图 10为本发明一种实施例的在柔性显示器贴 电路的示意图。
为使本发明要解决的技术问题、 技术方案和优点更加清楚， 下面将结合 附图及具体实施例进行详细描述。
如图 1所示， 本发明一种实施例的柔性显示器的制备方法的流程图， 包 括如下步骤：
步骤 SiOh 提供一第一基板；
歩骤 SI 02: 在所述第一基板的第一面上形成粘结剂层；
步骤 S103 : 提供一第二基板；
歩骤 SI 04: 将所述第一基板的具有所述粘结剂层的表面贴附于所述第二 基板上； 其中， 所述粘结剂层与所述第二基板之间的粘^力低于 5N/20mm宽 粘结剂层；
步骤 S105: 在所述第一基板的第二面上形成显示器件本体， 所述第一基 板的第二面与所述第一基板的第一面相对；
步骤 S106: 将所述形成有显示器件本体的第一基板从所述第二基板上剥 离， 得到所述柔性显示器。
本发明的柔性显示器的制备是在第一基板上形成低粘^力的粘结剂层， 由于粘结剂的粘^力较低， 从而使得形成有显示器件本体的第一基板很容易 从第二基板上剥离。 同现有柔性显示器件制备方案相比， 本发明不需要激光 背面处理， 也不需要制备昂贵的用于降低第一基板和第二基板之间附着力的 离型层， 工艺过程中不会发生基板褶皱等不良现象， 从而降低了制造成本， 且生产效率高， 适合大规模生产。
本发明的粘结剂层能够降低与第二基板的粘附力， 可以是通过在硅胶中 添加填料形成的， 从而由没有粘附能力或者粘附能力差的材料来降低硅胶与 第一基板的粘附力。 采用硅胶制成的柔性显示器能够耐 300〜500°C的高温， 该硅胶中的填料相应也采用耐高温的材料，能够耐 300-500 C高温的材质即可。 本发明的粘结剂还可以是通过在丙烯酸树脂中添加填料形成的， 从而可以应 用到耐温 230Ό的触摸屏， 其填料也采用耐温 230 C的材料。
本发明的粘结剂层与用于承载所述粘结剂层的第二基板之间的粘附力低 于 5N/20mm 宽粘结剂层， 优选地低于 lN/20mm 宽粘结剂层， 更优地， 为 0.03N~0.1N/20mm.宽粘结剂层。（本领域对粘附力的大小比较是以 20mm宽的 物体产生的粘 Pf†力作为依据， 由于产生粘 Pf†力的为粘结剂层， 所以粘 Pf†力是 以 20mm宽的粘结剂层作为基准。 gp , 将 20mm宽的物体通过粘结剂粘 ^在 对象物上后， 从端部将该 20mm宽物体平行于对象物拉开时所需的力。）本发 明的粘结剂层的粘 1 力满足上述数值时， 可以实现第一基板和第二基板的贴 并且能够轻易将第一基板从第二基板上剥离。
本发明的第二基板用于承载粘结剂层和第一基板， 可以为玻璃基板、 金 属基板、 石英基板或者有机基板中的一种或者多种。 本实施例中第二基板选 ^玻璃基板。本发明的第一基板优选地为热膨胀系数在 l〜50ppm/°C范围内塑 料基板， 更优地， 为 3〜20ppm/ C范围内的塑料基板。 本发明采 ^热膨胀系 数在上述范围内的塑料基板， 以保持与玻璃基板的热膨服系数相似， 以降低 热冲击， 避免在真空高温工艺中塑料薄膜褶皱。 塑料基板的种类可以是聚酰 亚胺 （PI)、 聚萘二甲酸乙二酯 （PEN)、 聚对苯二甲酸乙二醇酯 （PET)、 纤 维强化塑料（FRP)、聚醚砜树脂（PES )、聚芳酯（PAR)、以及聚碳酸酯（PC) 寸
如图 2所示， 为本发明一种实施例的制备粘结剂层的示意图， 将粘结剂 通过喷嘴 3涂覆在聚酰亚胺作为材质的第一基板 I 的第一面上， 制备成粘结 剂层 2。该粘结剂可以是在硅胶或者丙烯酸树脂中添加有机物或无机物填料， 例如添加 PET (聚对苯二甲酸类塑料）、 聚氨酯、 氧化硅、 氧化钛等， 使得形 成的粘结剂层粘^力较低。 该粘结剂层由于粘附力较低， 从而使得形成有显 示器件本体的第一基板无需使用离型层或者激光处理就可以很容易从第二基 板上剥离， 降低了生产成本， 操作方便。
如图 3所示，为本发明一种实施例的粘结剂层与第二基板粘合的示意图。 将所述第一基板的具有所述粘结剂层的表面贴 于所述第二基板上 4， 并通 过贴附辊 5将第一基板 1贴^在玻璃材质的第二基板 4上， 使得粘结剂层 2 与第二基板 4贴合在一起。 当然， 粘结剂层 2与第二基板的粘合不局限于采 用贴附辊， 也可以采用其他的方式来将粘结剂层贴^在第二基板上， 例如手 压等。
如图 4所示， 为本发明一种实施例的制备显示器件本体的示意图。 在完 成粘结剂和第二基板的粘合之后， 在第一基板的第二面上形成平坦化层和 /或 水氧阻隔层，然后在平坦化层和 Z或水氧阻隔层上形成显示器件本体 7。其中， 附图标记 6表示平坦化层和 /或水氧阻隔层， 粘结剂和显示器件本体 7之间可 以是水氧阻隔层， 也可以是平坦化层， 还可以两者兼有， 根据实际生产进行 配置。
如图 5和 6所示， 为本发明一种实施例的切割显示器件的示意图， 为了 实现具有显示器件本体的第一基板和第二基板的剥离， 对位于第一基板的边 缘的平坦化层和 Z或水氧阻隔层进行切割， 形成切口 8， 该切口可以与第一基 板表面成一定倾角， 例如 30-60度； 再利用机械力沿所述切口 8， 将所述形成 有显示器件本体的第一基板从所述第二基板上剥离， 得到所述柔性显示器。 最后， 再通过机械力将第一基板 1连同其上的显示器件本体 7—起揭下， 制 备完成柔性显示器。
如图 7至图 9所示， 为本发明一种实施例的分割柔性显示器的示意图， 在平坦化层和 /或水氧阻隔层上形成显示器件本体后还包括：
形成贯穿显示器件本体、 平坦化层和 /或水氧阻隔层、 第一基板、 粘结剂 层的多个第一断口 9;
形成贯穿第二基板的多个第二断口 10; 其中， 所述第一断口 9与所述第 二断口 10—一对应， 且每一个第一断口与第二断口形成一个断面， 得到多个 独立的柔性显示器件， 如图 8所示；
本实施例利用第一断口与相对应的第二断口对所述显示器件进行分割， 如图 8所示。第一断口 9与第二断口！0的位置几乎重合， 使得每个显示屏能 够相互独立分开。 再对每个独立显示屏， 为其贴附集成电路芯片 11和柔性电 路板！ 2等辅助材料， 如图 9所示。 最后， 再将整个制备完成的柔性显示屏从 玻璃基板上揭下， 如图 10所示。 本实施例是利用两个断口进行分割， 形成上 下两个断口， 对切割刀轮的要求较低， 而采用一刀切割日寸由于切割深度较深 需要对刀轮进行特殊设计。 本发明利用两个断口进行分割， 比较容易实现切 割， 且切割时产生的颗粒较少。
本发明还提供了一种柔性显示器， 包括： 显示器件本体、 第一基板、 粘 结剂层和设置在所述第一基板和所述显示器件本体之间平坦化层和 /或水氧 阻隔层， 所述第一基板的第一面与粘结剂层相连接， 与所述第一基板第一面 相对的第二面与所述平坦化层和 /或水氧阻隔层相连接； 所述粘结剂层与用于 承载所述粘结剂层的第二基板之间的粘^力低于 5N/20mm宽粘结剂层。
优选地， 所述粘结剂层与用于承载所述粘结剂层的第二基板之间的粘附 力低于 0.1N/20mm宽粘结剂层。
优选地， 所述显示器件本体上还设有集成电路芯片和柔性电路板。
优选地， 所述第一基板为膨服系数为 〜 50ppm/O的塑料基板。
优选地， 所述第一基板为膨胀系数为 3〜20ppm/ C的塑料基板。
优选地， 所述第一基板的材料为聚酰亚胺、 聚萘二甲酸乙二醇酯、 聚对 苯二甲酸乙二醇酯、 纤维强化塑料、 聚醚砜树脂、 聚芳酯、 聚碳酸酯中的一 种或者多种。
优选地，所述第二基板为玻璃基板、金属基板、石英基板或者有机基板。 由上述技术方案可知， 本发明的柔性显示器的制备是在第一基板上形成 低粘附力的粘结剂层， 由于粘结剂的粘附力较低， 从而使得形成有显示器件 本体的第一基板很容易从第二基板上剥离。 同现有柔性显示器件制备方案相 比， 本发明不需要激光背面处理， 也不需要制备昂贵的用于降低第一基板和 第二基板之间附着力的离型层， 工艺过程中不会发生基板褶皱等不良现象， 从而降低了制造成本， 且生产效率高， 适合大规模生产。
以上所述是本发明的优选实施方式， 应当指出， 对于本技术领域的普通 技术人员来说， 在不脱离本发明所述原理的前提下， 还可以作出若千改进和 润饰， 这些改进 也应视为本发明的保护范围。

Claims

1. 一种柔性显示器的制备方法， 其特征在于， 包括如下步骤： 提供一第一基板；
在所述第一基板的第一面上形成粘结剂层；
提供一第二基板；
将所述第一基板的形成有所述粘结剂层的表面贴附于所述第二基板上； 其中，所述粘结剂层与所述第二基板之间的粘附力低于 5N/20mm宽粘结剂层; 在所述第一基板的第二面上形成显示器件本体， 所述第一基板的第二面 与所述第一基板的第一面相对；
将所述形成有显示器件本体的第一基板从所述第二基板上剥离， 得到所 述柔性显示器。
2. 根据权利要求 1所述的柔性显示器的制备方法， 其特征在于， 所述粘 结剂层是通过在硅胶中添加填料形成的。
3. 根据权利要求 1所述的柔性显示器的制备方法， 其特征在于， 所述粘 结剂是通过在丙烯酸树脂中添加填料形成的。
4.根据权利要求 1-3任一项所述的柔性显示器的制备方法，其特征在于， 所述粘结剂层与所述第二基板之间的粘^力低于 0.1N/20mm宽粘结剂层。
5. 根据权利要求 1-4中任一项所述的柔性显示器的制备方法， 其特征在 于， 在所述第一基板的第二面上形成显示器件本体的歩骤包括：
在第一基板的第二面上形成平坦化层和 /或水氧阻隔层；
在平坦化层和 /或水氧阻隔层上形成显示器件本体。
6. 根据权利要求 5所述的柔性显示器的制备方法， 其特征在于， 将所述 形成有显示器件本体的第一基板从所述第二基板上剥离， 得到所述柔性显示 器的步骤包括：
对位于第一基板的边缘的平坦化层和 /或水氧阻隔层进行切害 形成切口； 利用机械力沿所述切口， 将所述形成有显示器件本体的第一基板从所述 第二基板上剥离， 得到所述柔性显示器。
7. 根据权利要求 5所述的柔性显示器的制备方法， 其特征在于， 在平坦 化层和 /或水氧阻隔层上形成显示器件本体后， 还进行如下步骤： 形成贯穿显示器件本体、 平坦化层和 /或水氧阻隔层、 第一基板、 以及粘 结剂层的多个第一断口；
形成贯穿第二基板的多个第二断口； 其中， 所述第一断口与所述第二断 口 一对应， 且每一个第一断口与第二断口形成一个断面， 得到多个独立的 柔性显示器件；
利用第一断口与相对应的第二断口对所述显示器件进行分割。
8. 根据权利要求 6或者 7所述的柔性显示器的制备方法， 其特征在于, 所述在所述第一基板上形成显示器件本体的步骤还包括： 在显示器件本体上 形成集成电路芯片和柔性电路板。
9. 根据权利要求 8所述的柔性显示器的制备方法， 其特征在于， 在显示 器件本体上形成集成电路芯片和柔性电路板之后， 通过机械力将所述形成有 显示器件本体的第一基板从所述第二基板上剥离， 得到所述柔性显示器。
10. 根据权利要求 1~9中任一项所述的柔性显示器的制备方法， 其特征 在于， 所述第一基板为膨胀系数为 i〜50ppm/O的塑料基板。
11. 根据权利要求 1〜9 中任一项所述的柔性显示器的制备方法， 其特征 在于， 所述第一基板为膨胀系数为 3〜20ppm/O的塑料基板。
12. 根据权利要求 中任一项所述的柔性显示器的制备方法， 其特征 在于， 所述第一基板的材料为聚酰亚胺、 聚萘二甲酸乙二醇酯、 聚对苯二甲 酸乙二醇酯、 纤维强化塑料、 聚醚砜树脂、 聚芳酯、 聚碳酸酯中的一种或者 多种。
13. 根据权利要求 1〜12中任一项所述的柔性显示器的制备方法， 其特征 在于， 所述第二基板为玻璃基板、 金属基板、 石英基板或者有机基板。
14. 一种柔性显示器， 其特征在于， 包括： 显示器件本体、 第一基板、 粘结剂层和设置在所述第一基板和所述显示器件本体之间的平坦化层和 /或 水氧阻隔层， 所述第一基板的第一面与粘结剂层相连接， 与所述第一基板第 一面相对的第二面与所述平坦化层和 /或水氧阻隔层相连接； 所述粘结剂层与 ^于承载所述粘结剂层的第二基板之间的粘附力低于 5N/20mm宽粘结剂层。
15. 根据权利要求 14所述的柔性显示器， 其特征在于， 所述粘结剂层与 用于承载所述粘结剂层的第二基板之间的粘^力低于 0.1N/20m.m 1 粘结剂层。
16. 根据权利要求 14或 15所述的柔性显示器， 其特征在于，
基板为膨胀系数为 l〜50ppm/°C的塑料基板。
17. 根据权利要求 14或 15所述的柔性显示器， 其特征在于，
基板为膨胀系数为 3〜20ppm/°C的塑料基板。
18. 根据权利要求 14或 1 5所述的柔性显示器， 其特征在于， 所述显示 器件本体上还设有集成电路芯片和柔性电路板。
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