WO2014157014A1 - Appareil de mandrin - Google Patents

Appareil de mandrin Download PDF

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Publication number
WO2014157014A1
WO2014157014A1 PCT/JP2014/057922 JP2014057922W WO2014157014A1 WO 2014157014 A1 WO2014157014 A1 WO 2014157014A1 JP 2014057922 W JP2014057922 W JP 2014057922W WO 2014157014 A1 WO2014157014 A1 WO 2014157014A1
Authority
WO
WIPO (PCT)
Prior art keywords
chuck
workpiece
layer
chuck device
movable member
Prior art date
Application number
PCT/JP2014/057922
Other languages
English (en)
Japanese (ja)
Inventor
鈴木　隆太
辰巳　良昭
Original Assignee
株式会社クリエイティブ テクノロジー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社クリエイティブ テクノロジー filed Critical 株式会社クリエイティブ テクノロジー
Priority to JP2015508443A priority Critical patent/JP6281825B2/ja
Publication of WO2014157014A1 publication Critical patent/WO2014157014A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Definitions

  • the present invention relates to a chuck device for holding and transferring a workpiece such as a wafer.
  • the electrostatic chuck device has a structure in which an electrostatic adsorption layer 110 composed of a dielectric 111 and an adsorption electrode 112 is attached on a base 100 formed of a metal such as aluminum. Yes. Thereby, the whole workpiece
  • the adhesive chuck device has a structure in which one adhesive pad 210 is attached on the base 200.
  • work W is adhere
  • another adhesive chuck device as shown in FIG. 18, there is a structure in which a plurality of small adhesive pads 210 ′ are attached in an embossed manner on the base 200. As a result, the workpiece W is partially adhered and conveyed by the plurality of adhesive pads 210 ′.
  • the conventional chuck device described above has the following problems.
  • the first problem is that an optimum chuck becomes difficult when the workpieces have different weights. For example, in the process of laminating a light work and a heavy work, prepare a chuck device with a weak holding force for chucking a light work and a chuck device with a strong holding force for chucking a heavy work. . Thereby, each workpiece
  • the second problem is that an optimum chuck becomes difficult if the workpiece shapes are different. In other words, even with a chuck device that can secure a sufficient contact area for a workpiece having a certain shape, if the shape of the workpiece is different, a sufficient contact area cannot be ensured. It becomes difficult to chuck with the optimum holding force.
  • the third problem is that the dechuck structure is a structure that may damage the workpiece. That is, the conventional electrostatic chuck device or adhesive chuck device has a structure in which the work is dechucked by using lift pins or air purge since the residual adsorption force or adhesive force acts on the workpiece after the work is completed. However, in the electrostatic chuck device and adhesive chuck device, the entire surface of the workpiece is adsorbed and adhered to the electrostatic adsorption layer or adhesive pad. Need to be added to the workpiece. As described above, when an excessive force is applied to the workpiece to dechuck, not only the workpiece is damaged, but also the chuck device itself may be damaged.
  • the present invention has been made to solve the above-described problems, and is capable of chucking a workpiece with an optimum holding force regardless of the weight or shape of the workpiece and dechucking without damaging the workpiece. It is an object of the present invention to provide a chuck device capable of performing the above.
  • the invention of claim 1 is a chuck device comprising a base and a chuck layer for holding a work affixed to the surface of the base and in contact with the surface.
  • the base is composed of a plurality of movable members arranged concentrically, and the plurality of movable members can be moved up and down independently along the center axis by a plurality of actuators.
  • a gap is formed between the workpiece and the chuck layer by vertically moving a movable member close to the center or outer periphery among the plurality of movable members.
  • a second aspect of the present invention is the chuck device according to the first aspect, wherein the chuck layer is adhered to the surface of each movable member entirely or partially so as not to cross the surface of the adjacent movable member.
  • the contact area between the workpiece and the chuck layer can be maximized by raising all of the plurality of movable members and making the surface heights of all the movable members the same. Further, by raising some of the movable members, the contact area between the workpiece and the chuck layer can be adjusted. Furthermore, the contact area between the workpiece and the chuck layer can be finely adjusted by partially attaching the chuck layer to the surface of some of the movable members.
  • a third aspect of the present invention is the chuck device according to the second aspect, wherein the movable member is a movable member for dechucking without attaching the chuck layer to only one movable member of the plurality of movable members.
  • the movable member is a movable member for dechucking without attaching the chuck layer to only one movable member of the plurality of movable members.
  • the chuck device according to the first aspect, wherein one chuck layer is attached to the entire surface of the base.
  • the entire chuck layer can be bent into a shape corresponding to the height of the movable member by moving the plurality of movable members up and down.
  • the chuck layer has an adsorption electrode to which a predetermined voltage can be applied and a dielectric covering the adsorption electrode.
  • the workpiece placed on the dielectric surface is configured to be an electrostatic adsorption layer that can be adsorbed by electrostatic force generated when the adsorption electrode is energized.
  • the chuck layer is a pressure-sensitive adhesive pad that can hold the workpiece placed on the surface by its self-adhesive force. did. With this configuration, only the part of the workpiece that is in contact with the adhesive pad can be adhered to the adhesive pad.
  • a seventh aspect of the present invention is the chuck device according to the second or third aspect, wherein the chuck layer attached to the surface of some of the plurality of movable members is formed of an electrostatic adsorption layer. And the chuck
  • the contact area between the workpiece and the chuck layer is changed in accordance with the weight and shape of the workpiece by moving a part of the plurality of movable members up and down. Since it can be adjusted, there is an excellent effect that the workpiece can be chucked with an optimum holding force regardless of the weight and shape of the workpiece. Further, after the work is completed, a predetermined movable member can be moved up and down to form a partial gap between the workpiece and the chuck layer, so that it can be easily dechucked without damaging the workpiece. There is also an excellent effect.
  • the work can be safely dechucked without using a lift pin or an air purge, so that the number of parts can be reduced. There is an effect that the cost can be reduced.
  • the entire chuck layer can be bent into a shape corresponding to the height of the movable member, so that the chuck layer adheres along the shape of the workpiece, Can be chucked with a more optimal holding force.
  • the workpiece can be held entirely or partially by the electrostatic force of the electrostatic adsorption layer or the adhesive force of the adhesive pad. effective.
  • FIG. 1 is a schematic plan view showing a chuck device according to a first embodiment of the present invention. It is a schematic sectional drawing of the chuck apparatus of 1st Example. It is a schematic sectional drawing which shows the state which hold
  • FIG. 1 is a schematic plan view showing a chuck device according to a first embodiment of the present invention
  • FIG. 2 is a schematic sectional view of the chuck device of the first embodiment.
  • the chuck device of this embodiment includes a base 1 and a chuck layer 2.
  • the base 1 is a base material made of aluminum or the like, and includes four movable members 11 to 14 arranged concentrically around a concentric axis O. Specifically, the innermost movable member 11 is formed in a circular shape in plan view, and the three movable members 12 to 14 outside the movable member 11 are formed in a ring shape. As shown in FIG. 2, these movable members 11 to 14 are assembled so as to be movable up and down independently along a concentric axis O, and are driven up and down (up and down direction in FIG. 2) by four actuators 31 to 34. It has come to be.
  • the actuator 31 supports the movable member 11 by the arm 31a
  • the actuator 32 supports the movable member 12 by the arm 32a
  • the actuator 33 supports the movable member 13 by the arm 33a
  • the actuator 34 moves by the arm 34a.
  • the actuators 31 to 34 move the arms 31 a to 34 a up and down to drive the movable members 11 to 14 up and down.
  • the actuators 31 to 34 are schematically shown in order to facilitate understanding of the embodiment. However, since these are known actuators such as cylinders, detailed description thereof is omitted.
  • the chuck layer 2 is a layer body for holding a workpiece in contact with the surface thereof, and is attached to the surface of the base 1.
  • the chuck layer 2 is composed of an electrostatic adsorption layer 21 and adhesive pads 22 and 24.
  • the circular electrostatic adsorption layer 21 was attached to the entire surface of the movable member 11, and the ring-shaped adhesive pads 22 and 24 were attached to the entire surface of the movable members 12 and 14, respectively.
  • a non-adhesive pad 23 was attached to the entire surface of the movable member 13.
  • the electrostatic adsorption layer 21 includes adsorption electrodes 25 and 25 and a dielectric 26 that covers the adsorption electrodes 25 and 25, and the voltage of the power source 27 is applied to the adsorption electrodes 25 and 25 by turning on the switch 28. be able to.
  • the adhesive pads 22 and 24 are pads that can hold a workpiece by their self-adhesive force, and are pads made of, for example, silicon rubber or ethylene-propylene-diene rubber. In the initial state of the chuck device, the heights of the movable members 11 to 14 are set to be the same, and the surfaces of the electrostatic adsorption layer 21 and the pads 22 to 24 are set to be flush with each other.
  • FIG. 3 is a schematic cross-sectional view showing a state where the work is held on the entire surface
  • FIG. 4 is a schematic cross-sectional view showing a state where the work is partially held.
  • FIG. 5 is a schematic cross-sectional view showing a state where the workpiece W is held only by the electrostatic adsorption layer 21, and FIG. 6 is a schematic cross-sectional view showing a state where the workpiece W is held only by the adhesive pads 22 and 24.
  • FIG. 5 When the size of the workpiece W is small, as shown in FIG. 5, only the movable member 11 is raised by the actuator 31, and the adsorption electrodes 25, 25 of the electrostatic adsorption layer 21 are energized, thereby reducing the size of the workpiece W. The workpiece W can be chucked with an optimum holding force. Further, when the workpiece W is held only by the adhesive pads 22 and 24, the movable members 12 and 14 are raised by the actuators 32 and 34 as shown in FIG. It is possible to chuck with the optimum adhesive force.
  • FIG. 7 is a schematic cross-sectional view illustrating a method for holding workpieces W having different shapes.
  • FIG. 7A when a workpiece W having a convex portion Wa on the upper surface is held on the lower surface Wb side, a sufficient contact area must be ensured between the workpiece W and the chuck layer 2. Can do.
  • FIG. 7B if the workpiece W is held on the upper surface side where the convex portion Wa is, a sufficient contact area cannot be ensured between the workpiece W and the chuck layer 2. Therefore, in such a case, the movable members 12 to 14 are raised by the actuators 32 to 34 as shown in FIG.
  • the concave portion can be formed on the movable member 11, the workpiece W is brought into contact with the chuck layer 2 by fitting the convex portion Wa into the concave portion, thereby electrostatically attracting the workpiece W and the workpiece W.
  • a sufficient contact area can be ensured between the layer 21 and the pads 22 to 24. That is, by making the heights of the movable members 11 to 14 different, the shape of the chuck layer 2 can be changed to a shape corresponding to the shape of the workpiece W.
  • the chuck device can perform chucking with an optimum holding force.
  • FIG. 8 is a schematic cross-sectional view showing a dechucked state.
  • the switch 28 is turned off to stop energization of the suction electrodes 25 and 25.
  • the movable member 13 is raised by the actuator 33.
  • the workpiece W is peeled off from the electrostatic adsorption layer 21 and the pads 22 and 24 by the movable member 13 having the non-adhesive pad 23.
  • the surface of the movable member 13 has a flat ring shape, the contact area with the workpiece W is larger than a pointed lift pin or the like. For this reason, the movable member 13 is raised. Sometimes the work W is not damaged.
  • FIG. 9 is a schematic cross-sectional view showing a chuck device according to a second embodiment of the present invention.
  • the adhesive layer 21 ′ is attached to the surface of the movable member 11 so that the chuck layer 2 is composed of the adhesive pads 21 ′, 22, and 24.
  • the structure of the chuck device can be simplified, and as a result, the cost of the product can be reduced. Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof is omitted.
  • the chuck layer 2 is entirely composed of the adhesive pad, but it is needless to say that the chuck layer 2 can be entirely composed of the electrostatic adsorption layer 21.
  • FIG. 10 is a schematic sectional view showing a chuck device according to a third embodiment of the present invention.
  • the adhesive pad 21 ′ is attached to the surface of the movable member 11 so that all of the chuck layer 2 is composed of the adhesive pads 21 ′, 22, and 24.
  • the adhesive pads 22 and 24 were partially attached to the surfaces of the movable members 12 and 14. Specifically, a plurality of circular adhesive pads 22 were affixed to the surface of the movable member 12 at regular intervals, and a plurality of circular adhesive pads 24 were affixed to the surface of the movable member 14 at regular intervals.
  • a plurality of adhesive pads 22 and 24 having a small area are attached to the movable members 12 and 14, thereby finely adjusting the contact area between the workpiece W and the chuck layer 2. can do. Further, in this embodiment, a plurality of adhesive pads 22 and 24 are affixed to the surface of the base 1 in an embossed manner, thereby reducing the contact area with the workpiece W and reducing the damage to the workpiece W received during chucking. Yes.
  • Other configurations, operations, and effects are the same as those in the first and second embodiments, and thus description thereof is omitted.
  • the adhesive pad 21 ′ is attached to the surface of the movable member 11, but a chuck device having a configuration in which the electrostatic adsorption layer 21 is attached to the movable member 11 instead of the adhesive pad 21 ′ There are substantially the same operations and effects as the chuck device of this embodiment.
  • FIG. 11 is a schematic plan view showing a modified example related to the chuck layer 2 of the chuck device.
  • the chuck device using one movable member 13 among the movable members 11 to 14 as a dechucking member is illustrated.
  • the present invention as shown in FIG. It is also possible to present a chuck device that does not have the above members.
  • each of the adhesive pads 21 ′, 22, 23 ′, and 24 can be attached to the entire surface of each of the movable members 11 to 14 to constitute a chuck device.
  • the chuck device can be configured by attaching an electrostatic adsorption layer to the entire surface of each movable member 11-14.
  • a plurality of circular adhesive pads 21 ′, 22, 23 ′, and 24 are partially attached to the surfaces of the movable members 11 to 14 to constitute a chuck device. You can also
  • the electrostatic adsorption layer 21 is attached to the entire surface of the movable member 11, and the adhesive pads 22, 23 ', and 24 are attached to the entire surface of the movable members 12-14.
  • a chuck device can be configured.
  • the electrostatic adsorption layer 21 is attached to the entire surface of the movable member 11, and a plurality of circular adhesive pads 22, 23 ', 24 are attached to the surfaces of the movable members 12-14.
  • zipper apparatus can be comprised by affixing on a fixed space
  • FIG. 12 is a schematic cross-sectional view showing a chuck device according to a fourth embodiment of the present invention
  • FIG. 13 is a schematic cross-sectional view showing a holding force adjustment state.
  • the chuck device of this embodiment has a configuration in which one adhesive pad 2 ′ as a chuck layer is attached to the entire surface of the base 1. Specifically, one adhesive pad 2 ′ was attached over the entire surface of the movable members 11-14. Accordingly, as shown in FIG. 13, the holding force for the workpiece W can be adjusted by moving the movable members 11 to 14 up and down. Further, by moving the movable members 11 to 14 up and down, the entire adhesive pad 2 ′ can be bent in accordance with the shape of the workpiece W. Therefore, even when the surface of the workpiece W is uneven, the workpiece W The workpiece W can be chucked with an optimum holding force corresponding to the shape.
  • FIG. 14 is a schematic cross-sectional view showing a dechucked state.
  • the movable members 12 to 14 are raised and the movable member 14 is positioned highest so that the central portion of the workpiece W and the adhesive pad 2 Gap G1 can be formed between the Further, as shown in FIG. 14 (b), the movable members 12 to 14 are lowered and the movable member 11 is positioned highest so that a gap G2 is formed between the outer peripheral portion of the workpiece W and the adhesive pad 2 ′. Can be formed.
  • the work W can be dechucked safely and easily without damaging it by pushing up the work W lightly using a lift pin or air purge.
  • the single adhesive pad 2 ′ is applied as the chuck layer, but the chuck device has a configuration in which one electrostatic adsorption layer 21 is attached to the entire surface of the movable members 11 to 14 as the chuck layer. Also, there are substantially the same operations and effects as the chuck device of this embodiment.
  • the electrostatic adsorption layer 21 and the pads 21 ′, 22, 23 ′, and 24 constituting the chuck layer 2 are movable so that they do not cross over the surface of the adjacent movable member.
  • An example of a chuck device in which the surfaces of the members 11 to 14 are affixed to the entire surface or a part thereof is illustrated.
  • a chuck device in which the adhesive pads 22 and 24 constituting the chuck layer 2 are attached so as to extend over the surface of the adjacent movable member is also included in the scope of the present invention. is there.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

Le problème décrit par l'invention est de réaliser un appareil de mandrin qui permette de serrer une pièce d'œuvre avec une force de maintien optimale, quels que soient le poids et la forme de la pièce d'œuvre, et qui permette le desserrage de la pièce d'œuvre sans endommager la pièce d'œuvre. La solution selon l'invention porte sur un appareil de mandrin pourvu d'une base (1) et d'une couche (2) de mandrin. La base (1) est constituée de quatre éléments mobiles (11 à 14) disposés concentriquement, et la base peut être entraînée verticalement au moyen de quatre actionneurs (31 à 34). La couche (2) de mandrin est constituée d'une couche d'attraction électrostatique (21) et de tampons adhésifs (22, 24). La couche d'attraction électrostatique (21) est collée à l'élément mobile (11) et les tampons adhésifs (22, 24) de type annulaire sont respectivement collés aux éléments mobiles (12, 14). Un tampon non adhésif (23) est collé à l'élément mobile (13). La couche d'attraction électrostatique (21) est constituée d'une électrode d'attraction (25) et d'un corps diélectrique (26), et peut appliquer une tension issue d'une alimentation électrique (27) à l'électrode d'attraction (25).
PCT/JP2014/057922 2013-03-29 2014-03-21 Appareil de mandrin WO2014157014A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015508443A JP6281825B2 (ja) 2013-03-29 2014-03-21 チャック装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013071679 2013-03-29
JP2013-071679 2013-03-29

Publications (1)

Publication Number Publication Date
WO2014157014A1 true WO2014157014A1 (fr) 2014-10-02

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PCT/JP2014/057922 WO2014157014A1 (fr) 2013-03-29 2014-03-21 Appareil de mandrin

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JP (1) JP6281825B2 (fr)
TW (1) TWI621209B (fr)
WO (1) WO2014157014A1 (fr)

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* Cited by examiner, † Cited by third party
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JP2017126765A (ja) * 2015-10-13 2017-07-20 ヤス カンパニー リミテッド 帯電処理による基板チャッキング方法及びシステム
US9911636B1 (en) 2016-09-30 2018-03-06 Axcelis Technologies, Inc. Multiple diameter in-vacuum wafer handling
WO2018064302A1 (fr) * 2016-09-30 2018-04-05 Axcelis Technologies, Inc. Pince électrostatique à circonférence réglable
JP2019129213A (ja) * 2018-01-24 2019-08-01 株式会社アルバック 粘着式基板保持装置
JP2021106218A (ja) * 2019-12-26 2021-07-26 エイブリック株式会社 吸着保持装置、吸着保持方法、及び半導体装置の製造方法

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US11384001B2 (en) 2016-10-25 2022-07-12 Corning Incorporated Cold-form glass lamination to a display
JP2018078132A (ja) * 2016-11-07 2018-05-17 信越ポリマー株式会社 精密部品用の保持治具及びその製造方法
TWI771357B (zh) 2017-01-03 2022-07-21 美商康寧公司 具有彎曲的覆蓋玻璃以及顯示器或觸控面板的車輛內部系統及其形成方法
US11016590B2 (en) 2017-01-03 2021-05-25 Corning Incorporated Vehicle interior systems having a curved cover glass and display or touch panel and methods for forming the same
US11685684B2 (en) 2017-05-15 2023-06-27 Corning Incorporated Contoured glass articles and methods of making the same
EP3655282B1 (fr) 2017-07-18 2023-02-15 Corning Incorporated Système d'intérieur de véhicule comprenant un article en verre courbe complexe formé a froid
KR102564868B1 (ko) 2017-09-12 2023-08-09 코닝 인코포레이티드 장식용 유리 상에 터치 패널을 포함하는 디스플레이용 데드프론트 및 관련 방법
TWI806897B (zh) 2017-09-13 2023-07-01 美商康寧公司 用於顯示器的基於光導器的無電面板、相關的方法及載具內部系統
US11065960B2 (en) 2017-09-13 2021-07-20 Corning Incorporated Curved vehicle displays
CN117341302A (zh) 2017-10-10 2024-01-05 康宁股份有限公司 具有改进的可靠性的弯曲覆盖玻璃的交通工具内部***及其形成方法
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JP7274480B2 (ja) 2017-11-30 2023-05-16 コーニング インコーポレイテッド 曲面ミラーを成形する真空成形装置、システム及び方法
JP7361705B2 (ja) 2018-03-13 2023-10-16 コーニング インコーポレイテッド 亀裂抵抗性の湾曲したカバーガラスを有する乗物内装システムおよびその形成方法
EP3823825A1 (fr) 2018-07-16 2021-05-26 Corning Incorporated Systèmes d'intérieur de véhicule pourvus d'un substrat en verre courbé à froid et leurs procédés de formation
KR102636428B1 (ko) * 2018-12-04 2024-02-13 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치를 세정하는 방법
EP3771695A1 (fr) * 2019-07-31 2021-02-03 Corning Incorporated Procédé et système pour verre formé à froid
US11772361B2 (en) 2020-04-02 2023-10-03 Corning Incorporated Curved glass constructions and methods for forming same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162422A (ja) * 1990-10-24 1992-06-05 Fujitsu Ltd 半導体装置の製造装置
JP2001291763A (ja) * 2000-04-06 2001-10-19 Nec Corp 静電チャック及び静電チャックにおける被吸着物離脱方法
JP2003520416A (ja) * 1998-11-10 2003-07-02 セムコ エンジニアリング エス．アー． 静電保持装置
JP2007073802A (ja) * 2005-09-08 2007-03-22 Shin Etsu Polymer Co Ltd 部品保持具
JP2007121474A (ja) * 2005-10-26 2007-05-17 Hitachi Plant Technologies Ltd 基板貼合装置
WO2009013803A1 (fr) * 2007-07-23 2009-01-29 Shin-Etsu Engineering Co., Ltd. Procédé de commande d'un potentiel de surface d'un mandrin électrostatique
JP2013033850A (ja) * 2011-08-02 2013-02-14 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0663943B2 (ja) * 1986-09-29 1994-08-22 株式会社島津製作所 試料台

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162422A (ja) * 1990-10-24 1992-06-05 Fujitsu Ltd 半導体装置の製造装置
JP2003520416A (ja) * 1998-11-10 2003-07-02 セムコ エンジニアリング エス．アー． 静電保持装置
JP2001291763A (ja) * 2000-04-06 2001-10-19 Nec Corp 静電チャック及び静電チャックにおける被吸着物離脱方法
JP2007073802A (ja) * 2005-09-08 2007-03-22 Shin Etsu Polymer Co Ltd 部品保持具
JP2007121474A (ja) * 2005-10-26 2007-05-17 Hitachi Plant Technologies Ltd 基板貼合装置
WO2009013803A1 (fr) * 2007-07-23 2009-01-29 Shin-Etsu Engineering Co., Ltd. Procédé de commande d'un potentiel de surface d'un mandrin électrostatique
JP2013033850A (ja) * 2011-08-02 2013-02-14 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017126765A (ja) * 2015-10-13 2017-07-20 ヤス カンパニー リミテッド 帯電処理による基板チャッキング方法及びシステム
JP2019537243A (ja) * 2016-09-30 2019-12-19 アクセリス テクノロジーズ， インコーポレイテッド 調整可能な周辺静電クランプ
WO2018064302A1 (fr) * 2016-09-30 2018-04-05 Axcelis Technologies, Inc. Pince électrostatique à circonférence réglable
US10186446B2 (en) 2016-09-30 2019-01-22 Axcelis Technology, Inc. Adjustable circumference electrostatic clamp
CN109831924A (zh) * 2016-09-30 2019-05-31 艾克塞利斯科技公司 可调式圆周静电夹盘
US9911636B1 (en) 2016-09-30 2018-03-06 Axcelis Technologies, Inc. Multiple diameter in-vacuum wafer handling
TWI732953B (zh) * 2016-09-30 2021-07-11 美商艾克塞利斯科技公司 具可調整周邊之靜電夾具
JP7183151B2 (ja) 2016-09-30 2022-12-05 アクセリス テクノロジーズ， インコーポレイテッド 調整可能な周辺静電クランプ
CN109831924B (zh) * 2016-09-30 2024-02-13 艾克塞利斯科技公司 可调式圆周静电夹盘
JP2019129213A (ja) * 2018-01-24 2019-08-01 株式会社アルバック 粘着式基板保持装置
JP7078407B2 (ja) 2018-01-24 2022-05-31 株式会社アルバック 粘着式基板保持装置
JP2021106218A (ja) * 2019-12-26 2021-07-26 エイブリック株式会社 吸着保持装置、吸着保持方法、及び半導体装置の製造方法
JP7390889B2 (ja) 2019-12-26 2023-12-04 エイブリック株式会社 吸着保持装置

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