WO2014146408A1 - 球形白光led封装结构 - Google Patents

球形白光led封装结构 Download PDF

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Publication number
WO2014146408A1
WO2014146408A1 PCT/CN2013/082637 CN2013082637W WO2014146408A1 WO 2014146408 A1 WO2014146408 A1 WO 2014146408A1 CN 2013082637 W CN2013082637 W CN 2013082637W WO 2014146408 A1 WO2014146408 A1 WO 2014146408A1
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light
led chip
transparent sphere
phosphor film
package structure
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PCT/CN2013/082637
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French (fr)
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董岩
宋立
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东南大学
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Definitions

  • the invention belongs to the field of optoelectronic technology and relates to a white light emitting diode (LED) package structure, in particular to a spherical white light LED package structure.
  • LED white light emitting diode
  • LED is a kind of semiconductor electronic component that can emit light and is widely used in the lighting and display industries.
  • the common white LED technology is to fix a blue LED chip on a mirror or a reflective cup, and apply phosphor on or around the chip.
  • the blue light generated by the chip excites the phosphor, and the phosphor is excited to emit yellow, green or red light, which is combined with the remaining blue light to produce white light.
  • the ultraviolet light generated by the ultraviolet LED chip is used to excite the phosphor coated on or around the chip to emit blue light, green light or red light, and white light is mixed.
  • the chip emits blue light to the phosphor layer to excite the phosphor to emit light.
  • the light emitted by the phosphor layer has no directivity, a part of the light is directed toward the exit direction, and another part of the light is directed toward the chip and the mirror. This portion of the light is partially reflected by the mirror and is again directed toward the phosphor layer.
  • the yellow light that is again directed toward the phosphor layer is again scattered or blocked.
  • the existing white LED packaging technology using the phosphor technology has serious problems, that is, the light loss is large due to the light loss of the mirror and the blocking of the phosphor layer. If this problem can be solved, the light emission efficiency of the white LED can be greatly improved.
  • the spherical white LED package structure of the invention comprises a transparent sphere, a phosphor film disposed at a center of the transparent sphere, an LED chip and a concentrating reflector encapsulated inside the transparent sphere, an electrode connected to the LED chip, and an LED chip and a concentrating light
  • the opening inner side surface of the reflector is adjacent, the opening of the concentrating reflector faces the plane of the phosphor film, and the axis of the concentrating reflector is perpendicular to the plane of the phosphor film and passes through the center of the transparent sphere.
  • the phosphor film is in the form of a flat sheet.
  • the phosphor film is made of a transparent material encapsulated with phosphor or encapsulated directly in a transparent sphere.
  • the light emitted from the LED chip is reflected by the concentrating reflector and then projected onto the phosphor film.
  • the LED film and the concentrating reflector are disposed on both sides of the phosphor film, so that the light emitted from the transparent sphere in all directions is more uniform.
  • the LED chip emits blue light or ultraviolet light.
  • the shape of the concentrating reflector is a trapezoidal cone, a paraboloid or a curved surface.
  • the transparent sphere is made of a silicone resin, a silicone rubber or an epoxy resin transparent material.
  • the invention designs a transparent sphere containing a phosphor film, the phosphor film is located at the center of the transparent sphere, and the blue or ultraviolet LED chip is disposed inside the transparent sphere. Under the concentrated concentrating of the concentrating reflector, all the light emitted by the LED chip is projected on the phosphor film, and the phosphor is excited to emit light. When the product of the diameter of the blue or ultraviolet light projection region and the refractive index of the transparent material is smaller than the diameter of the transparent sphere, the light emitted from both sides of the phosphor film can directly emit the transparent sphere at a time. If an LED chip and a concentrating reflector are disposed on both sides of the plane of the phosphor film, The transparent sphere can be made more uniform in all directions.
  • the invention has the following advantages:
  • the existing white LED technology has a reflection loss of the mirror, and the light loss rate per reflection can reach 5% to 20%.
  • the light emitted from both sides of the phosphor film is directly led out, so that there is no longer a loss of the mirror and a secondary blocking loss of the phosphor layer. Therefore, the first benefit of the present invention is to improve the light extraction efficiency of white LEDs.
  • the existing white light LED is a single-directional light source.
  • a light diffusion cover When manufacturing a lamp, in order to achieve uniform illumination in all directions, a light diffusion cover must be additionally used, and the light diffusion cover causes 10% to 15% of light loss.
  • the transparent spheres emit light in all directions, and are no longer a single-directional illumination source. This means that the spherical white LED is no longer required to use a light diffuser when it is used as a luminaire. Therefore, the second benefit of the present invention is that the light diffusing cover can be omitted when the lamp is made, and the light loss caused by the light diffusing cover is avoided.
  • Another benefit of the present invention is that the distance between the phosphor and the chip is increased, the operating temperature of the phosphor is lowered, the high temperature performance degradation of the phosphor is reduced, and the white light efficiency is further improved.
  • 1a and 1b are respectively a side view and a plan view of a white LED according to Embodiment 1 of the present invention.
  • Embodiment 2 is a side elevational view of a white LED according to Embodiment 2 of the present invention.
  • the LED chip 1, the phosphor film 3, and the concentrating reflector 4 are all located in the transparent sphere 2. Under the reflection of the concentrating reflector 4, all of the light emitted from the LED chip 1 is projected on the phosphor film 3.
  • the shape of the concentrating reflector 4 is a trapezoidal cone, a paraboloid or a curved surface.
  • the LED chip 1 When a voltage is applied to the electrode 5, the LED chip 1 is driven to emit blue light or ultraviolet light. Under the concentrated condensing of the concentrating reflector 4, all the light emitted from the LED chip 1 is projected on the phosphor film 3, and the phosphor is excited to emit light.
  • the product of the diameter of the light projection region and the refractive index of the transparent material is smaller than the diameter of the transparent sphere 2, the light emitted from both sides of the phosphor film 3 can be directly emitted from the transparent sphere 2 at a time.
  • the backscattered light of the phosphor film is directly emitted from the transparent sphere 2, so that there is no mirror loss in the conventional white LED package structure and the barrier loss of the phosphor layer, thereby improving the white LED.
  • Light extraction efficiency the spherical white LED in this embodiment has illumination in all directions of the transparent sphere, and is no longer a single-directional illumination source.
  • a transparent material silicone resin, silicone rubber or epoxy resin or the like can be used.
  • a phosphor film 3 is provided on the plane of the hemisphere.
  • the phosphor film 3 can be directly fabricated on the hemisphere with a transparent material containing phosphor, or can be formed into a phosphor film and placed on the plane of the hemisphere; (d) the other hemisphere is fabricated on the hemisphere, and The LED chip 1, the concentrating reflector 4, and the electrode 5 are packaged together, and the transparent sphere 2 in this embodiment can be obtained.
  • Embodiment 2 is a side elevational view of a white LED according to Embodiment 2 of the present invention.
  • the difference from Embodiment 1 is that the LED chip 1, the concentrating reflector 4 and the electrode 5 are also added at the symmetrical position on the other side of the phosphor film 3, and the opening of the newly added concentrating reflector 4 also faces the transparent sphere 2.
  • the center of the ball and the light emitted from the LED chip 1 are concentrated on the phosphor film 3.
  • the intensity of light emission and the color of light on both sides of the phosphor film 3 are different.
  • the LED chip 1 is provided on both sides of the phosphor film 3, the light emitted from the transparent sphere 2 in all directions is more uniform.
  • the present invention has devised a transparent sphere containing a phosphor film which is located at the center of the transparent sphere.
  • the light emitted by the LED chip is reflected by the concentrating reflector and condensed on the phosphor film to excite the phosphor to emit light.
  • the light emitted from both sides of the phosphor film can directly emit the transparent sphere at one time, eliminating the loss of the mirror and the blocking of the phosphor, thereby improving the white light efficiency. If the LED chip and the concentrating reflector are disposed on both sides of the plane of the phosphor film, the transparent sphere can be made more uniform in all directions.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

一种球形白光LED封装结构，包括透明球体（2）、设置在透明球体（2）中心位置的荧光粉膜（3）、封装在透明球体（2）内部的LED芯片（1）和聚光反射器（4）、与LED芯片（1）连接的电极（5），LED芯片（1）与聚光反射器（4）的开口内侧表面相邻，聚光反射器（4）的开口朝向荧光粉膜（3）的平面，聚光反射器（4）的轴线垂直于荧光粉膜（3）的平面且经过透明球体（2）的球心。可以大幅度提高白光效率，而且弥补了白光LED单方向发光的缺陷。

Description

球形白光LED封装结构 技术领域
本发明属于光电子技术领域，涉及白光发光二极管（LED）封装结构，尤其是一种球形白光LED封装结构。
 背景技术
LED是一种能发光的半导体电子元件，在照明和显示行业得到广泛应用。
目前常见的白光LED技术，是将蓝光LED芯片固定在反射镜上或反射杯中，在芯片的上方或周围涂布荧光粉。芯片产生的蓝光激发荧光粉，荧光粉受激发后发出黄光、绿光或红光，与剩余的蓝光搭配而产生白光。另外还有一种与之相近的技术，是使用紫外LED芯片所产生的紫外光，激发涂布在芯片上方或周围的荧光粉，发出蓝光、绿光或红光，混合出白光。美国专利US005998925A、US006069440A、US005847507A、US005959316A，US006576930B2、US007750359B2，中国专利CN101702421B、CN101521257B、CN102169951A和CN102569558A，均使用了类似的技术。
在上述白光LED技术中，都存在着反射镜损失和荧光粉层对光的散射或阻挡的问题。以最常见的蓝光LED芯片和黄光荧光粉组合为例，芯片发出蓝光照射到荧光粉层，激发荧光粉发光。荧光粉层发出的光没有方向性，一部分光朝着出射方向，另一部分光朝着芯片和反射镜方向。这部分光被反射镜部分反射，再次射向荧光粉层。再次射向荧光粉层的黄光又会被散射或阻挡。被散射回来的黄光重复该过程。由于反射镜存在反射损失，荧光粉颗粒的多次光散射也存在损失，因此最终的光损失较大。对于低色温的白光LED来说，荧光粉层更厚，光损失也更大。
综上所述，现有的使用荧光粉技术的白光LED封装技术存在严重问题，即：由于反射镜的光损失和荧光粉层的阻挡而导致出光损失较多。如若能解决该问题，将能大幅度提高白光LED的光出射效率。
 技术问题
本发明的目的是提供一种可减少反射镜反射损失和荧光粉层的阻挡损失、提高LED光效的白光封装结构。
 技术解决方案
本发明的球形白光LED封装结构，包括透明球体、设置在透明球体中心位置的荧光粉膜、封装在透明球体内部的LED芯片和聚光反射器、与LED芯片连接的电极，LED芯片与聚光反射器的开口内侧表面相邻，聚光反射器的开口朝向荧光粉膜的平面，聚光反射器的轴线垂直于荧光粉膜的平面且经过透明球体的球心。
本发明中，荧光粉膜呈平面片状。荧光粉膜由封装有荧光粉的透明材料制成，或直接封装在透明球体中。
本发明中，LED芯片的出射光经聚光反射器反射聚光后，全部投射到荧光粉膜上。
本发明中，荧光粉膜的两侧均设置有LED芯片和聚光反射器，使透明球体各个方向的出光更加均匀。
本发明中，LED芯片发出的是蓝光或紫外光。
本发明中，聚光反射器的形状为梯形圆锥、抛物面或弧面。
本发明中，透明球体由硅树脂、硅橡胶或环氧树脂透明材料制成。
本发明设计了一个含有荧光粉膜的透明球体，荧光粉膜位于透明球体的中心位置，蓝光或紫外光LED芯片被设置在透明球体的内部。在聚光反射器的反射聚光下，LED芯片发出的光全部投射在荧光粉膜上，并激发荧光粉发光。当蓝光或紫外光投射区域的直径与透明材料的折射率的乘积小于透明球体的直径时，荧光粉膜两侧发出的光均能一次直接射出透明球体。若在荧光粉膜的平面两侧均设置LED芯片和聚光反射器， 则可以使透明球体在各个方向上的出光更加均匀。
 有益效果
本发明与现有技术相比，具有以下优点：
现有的白光LED技术存在着反射镜的反射损失，每次反射的光损失率可达5%至20%。而本发明是将荧光粉膜两侧发出的光都直接导出，因而不再有反射镜损失和荧光粉层的二次阻挡损失。因此，本发明的第一个益处就是能提升白光LED的出光效率。
现有的白光LED为单方向发光光源，在制作成灯具时，为了实现各个方向的均匀发光，必须另外使用光扩散罩，光扩散罩又会造成10%至15%的光损失。在本发明中，透明球体的各个方向均有发光，而不再是单方向发光光源。这意味着该球形白光LED做成灯具时不再需要使用光扩散罩。因此，本发明的第二个益处是，在做成灯具时可以不加光扩散罩，避免了光扩散罩造成的光损失。
本发明的另一益处是增加了荧光粉和芯片的距离，降低了荧光粉的工作温度，减少荧光粉的高温性能劣化，也使得白光效率进一步改善。
 附图说明
图1a、图1b分别是依据本发明的实施例1的白光LED的侧视和俯视示意图。
图2是依据本发明的实施例2的白光LED的侧视示意图。
图中有：1．LED芯片、２．透明球体、3．荧光粉膜、4．聚光反射器、5．电极。
 本发明的实施方式
以下结合附图和具体实施例，对本发明技术方案做进一步具体说明。
图1a、图1b分别是依据本发明的实施例1的白光LED的侧视和俯视示意图。LED芯片1、荧光粉膜3和聚光反射器4均位于透明球体2中。在聚光反射器4的反射下，LED芯片1发出的光全部投射在荧光粉膜3上。聚光反射器4的形状为梯形圆锥、抛物面或弧面。
当电极5上施加电压后时，LED芯片1会被驱动而发出蓝光或紫外光。在聚光反射器4的反射聚光下，LED芯片1发出的光全部投射在荧光粉膜3上，并激发荧光粉发光。当光投射区域的直径与透明材料的折射率的乘积小于透明球体2的直径时，荧光粉膜3两侧发出的光均能一次直接射出透明球体2。
在本实施例中，荧光粉膜反向散射的光是从透明球体2中直接出射的，因此没有传统白光LED封装结构中的反射镜损失和荧光粉层的阻挡损失，因而能提升白光LED的出光效率。另外，本实施例中的球形白光LED在透明球体的各个方向均有发光，而不再是单方向发光光源。
下面是本实施例的一种制作方法：（a）现将LED芯片1使用固晶胶固定在聚光反射器4的内侧面，用金线连接电极后备用；（b）使用透明材料制备一个半球。透明材料可使用硅树脂、硅橡胶或环氧树脂等。（c）在半球的平面上设置荧光粉膜3。该荧光粉膜3可以用含有荧光粉的透明材料在半球上直接制作，也可以制成荧光粉胶膜后放置在半球的平面上；（d）在该半球上完成另外半球的制作，并将LED芯片1、聚光反射器4和电极5一起封装，可得到本实施例中的透明球体2。
图2是依据本发明的实施例2的白光LED的侧视示意图。与实施例1的区别是在荧光粉膜3另一侧的对称位置也增加了LED芯片1、聚光反射器4和电极5，新增加的聚光反射器4的开口也朝向透明球体2的球心，并将LED芯片1发出的光会聚在荧光粉膜3上。
只有一个LED芯片1激发时，荧光粉膜3两侧的发光强度和光色会有不同。在荧光粉膜3两侧均设置有LED芯片1时，透明球体2在各个方向上的出光更加均匀。
综上所述，本发明设计了一个本发明设计了一个含有荧光粉膜的透明球体，荧光粉膜位于透明球体的中心位置。LED芯片的发光经聚光反射器反射后会聚在荧光粉膜上，并激发荧光粉发光。荧光粉膜两侧的出光均能一次直接射出透明球体，消除了反射镜的损失和荧光粉的阻挡，从而提升了白光效率。若在荧光粉膜的平面两侧均设置LED芯片和聚光反射器，可以使透明球体在各个方向上的出光更加均匀。
通过以上具体实施例的描述，可以更加清楚地说明本发明的特征和本质。但上述具体实施形式并不对本发明的范围构成限制。而且，本发明要求保护的范围还包括在权利要求范围内的各种改变和等同特征的替换。

Claims (7)

  1. 一种球形白光LED封装结构，其特征在于，该封装结构包括透明球体（2）、设置在所述透明球体（2）中心位置的荧光粉膜（3）、封装在透明球体（2）内部的LED芯片（1）和聚光反射器（4）、与所述LED芯片（1）连接的电极（5），LED芯片（1）与聚光反射器（4）的开口内侧表面相邻，聚光反射器（4）的开口朝向荧光粉膜（3）的平面，聚光反射器（4）的轴线垂直于荧光粉膜（3）的平面且经过透明球体（2）的球心。
  2. 根据权利要求1所述的一种球形白光LED封装结构，其特征在于，所述荧光粉膜（3）呈平面片状。
  3. 根据权利要求1所述的一种球形白光LED封装结构，其特征在于，所述LED芯片（1）的出射光经聚光反射器（4）反射聚光后，全部投射到荧光粉膜（3）上。
  4. 根据权利要求1任一权利要求所述的球形白光LED封装结构，其特征在于，所述荧光粉膜（3）的平面两侧均设置有LED芯片（1）和聚光反射器（4），使透明球体（2）各个方向的出光更加均匀。
  5. 根据权利要求1至4任一权利要求所述的一种球形白光LED封装结构，其特征在于，所述的LED芯片（1）发出的是蓝光或紫外光。
  6. 根据权利要求1至4任一权利要求所述的一种球形白光LED封装结构，其特征在于，所述聚光反射器（4）的形状为梯形圆锥、抛物面或弧面。
  7. 根据权利要求1至4任一权利要求所述的一种球形白光LED封装结构，其特征在于，所述透明球体（2）由硅树脂、硅橡胶或环氧树脂透明材料制成。
PCT/CN2013/082637 2013-03-19 2013-08-30 球形白光led封装结构 WO2014146408A1 (zh)

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CN201310088025.7 2013-03-19
CN201310088025.7A CN103178196B (zh) 2013-03-19 2013-03-19 球形白光led封装结构

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