WO2014146408A1 - Structure de boîtier sphérique pour led à lumière blanche - Google Patents

Structure de boîtier sphérique pour led à lumière blanche Download PDF

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Publication number
WO2014146408A1
WO2014146408A1 PCT/CN2013/082637 CN2013082637W WO2014146408A1 WO 2014146408 A1 WO2014146408 A1 WO 2014146408A1 CN 2013082637 W CN2013082637 W CN 2013082637W WO 2014146408 A1 WO2014146408 A1 WO 2014146408A1
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WO
WIPO (PCT)
Prior art keywords
light
led chip
transparent sphere
phosphor film
package structure
Prior art date
Application number
PCT/CN2013/082637
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English (en)
Chinese (zh)
Inventor
董岩
宋立
Original Assignee
东南大学
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 东南大学 filed Critical 东南大学
Publication of WO2014146408A1 publication Critical patent/WO2014146408A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Definitions

  • the invention belongs to the field of optoelectronic technology and relates to a white light emitting diode (LED) package structure, in particular to a spherical white light LED package structure.
  • LED white light emitting diode
  • LED is a kind of semiconductor electronic component that can emit light and is widely used in the lighting and display industries.
  • the common white LED technology is to fix a blue LED chip on a mirror or a reflective cup, and apply phosphor on or around the chip.
  • the blue light generated by the chip excites the phosphor, and the phosphor is excited to emit yellow, green or red light, which is combined with the remaining blue light to produce white light.
  • the ultraviolet light generated by the ultraviolet LED chip is used to excite the phosphor coated on or around the chip to emit blue light, green light or red light, and white light is mixed.
  • the chip emits blue light to the phosphor layer to excite the phosphor to emit light.
  • the light emitted by the phosphor layer has no directivity, a part of the light is directed toward the exit direction, and another part of the light is directed toward the chip and the mirror. This portion of the light is partially reflected by the mirror and is again directed toward the phosphor layer.
  • the yellow light that is again directed toward the phosphor layer is again scattered or blocked.
  • the existing white LED packaging technology using the phosphor technology has serious problems, that is, the light loss is large due to the light loss of the mirror and the blocking of the phosphor layer. If this problem can be solved, the light emission efficiency of the white LED can be greatly improved.
  • the spherical white LED package structure of the invention comprises a transparent sphere, a phosphor film disposed at a center of the transparent sphere, an LED chip and a concentrating reflector encapsulated inside the transparent sphere, an electrode connected to the LED chip, and an LED chip and a concentrating light
  • the opening inner side surface of the reflector is adjacent, the opening of the concentrating reflector faces the plane of the phosphor film, and the axis of the concentrating reflector is perpendicular to the plane of the phosphor film and passes through the center of the transparent sphere.
  • the phosphor film is in the form of a flat sheet.
  • the phosphor film is made of a transparent material encapsulated with phosphor or encapsulated directly in a transparent sphere.
  • the light emitted from the LED chip is reflected by the concentrating reflector and then projected onto the phosphor film.
  • the LED film and the concentrating reflector are disposed on both sides of the phosphor film, so that the light emitted from the transparent sphere in all directions is more uniform.
  • the LED chip emits blue light or ultraviolet light.
  • the shape of the concentrating reflector is a trapezoidal cone, a paraboloid or a curved surface.
  • the transparent sphere is made of a silicone resin, a silicone rubber or an epoxy resin transparent material.
  • the invention designs a transparent sphere containing a phosphor film, the phosphor film is located at the center of the transparent sphere, and the blue or ultraviolet LED chip is disposed inside the transparent sphere. Under the concentrated concentrating of the concentrating reflector, all the light emitted by the LED chip is projected on the phosphor film, and the phosphor is excited to emit light. When the product of the diameter of the blue or ultraviolet light projection region and the refractive index of the transparent material is smaller than the diameter of the transparent sphere, the light emitted from both sides of the phosphor film can directly emit the transparent sphere at a time. If an LED chip and a concentrating reflector are disposed on both sides of the plane of the phosphor film, The transparent sphere can be made more uniform in all directions.
  • the invention has the following advantages:
  • the existing white LED technology has a reflection loss of the mirror, and the light loss rate per reflection can reach 5% to 20%.
  • the light emitted from both sides of the phosphor film is directly led out, so that there is no longer a loss of the mirror and a secondary blocking loss of the phosphor layer. Therefore, the first benefit of the present invention is to improve the light extraction efficiency of white LEDs.
  • the existing white light LED is a single-directional light source.
  • a light diffusion cover When manufacturing a lamp, in order to achieve uniform illumination in all directions, a light diffusion cover must be additionally used, and the light diffusion cover causes 10% to 15% of light loss.
  • the transparent spheres emit light in all directions, and are no longer a single-directional illumination source. This means that the spherical white LED is no longer required to use a light diffuser when it is used as a luminaire. Therefore, the second benefit of the present invention is that the light diffusing cover can be omitted when the lamp is made, and the light loss caused by the light diffusing cover is avoided.
  • Another benefit of the present invention is that the distance between the phosphor and the chip is increased, the operating temperature of the phosphor is lowered, the high temperature performance degradation of the phosphor is reduced, and the white light efficiency is further improved.
  • 1a and 1b are respectively a side view and a plan view of a white LED according to Embodiment 1 of the present invention.
  • Embodiment 2 is a side elevational view of a white LED according to Embodiment 2 of the present invention.
  • the LED chip 1, the phosphor film 3, and the concentrating reflector 4 are all located in the transparent sphere 2. Under the reflection of the concentrating reflector 4, all of the light emitted from the LED chip 1 is projected on the phosphor film 3.
  • the shape of the concentrating reflector 4 is a trapezoidal cone, a paraboloid or a curved surface.
  • the LED chip 1 When a voltage is applied to the electrode 5, the LED chip 1 is driven to emit blue light or ultraviolet light. Under the concentrated condensing of the concentrating reflector 4, all the light emitted from the LED chip 1 is projected on the phosphor film 3, and the phosphor is excited to emit light.
  • the product of the diameter of the light projection region and the refractive index of the transparent material is smaller than the diameter of the transparent sphere 2, the light emitted from both sides of the phosphor film 3 can be directly emitted from the transparent sphere 2 at a time.
  • the backscattered light of the phosphor film is directly emitted from the transparent sphere 2, so that there is no mirror loss in the conventional white LED package structure and the barrier loss of the phosphor layer, thereby improving the white LED.
  • Light extraction efficiency the spherical white LED in this embodiment has illumination in all directions of the transparent sphere, and is no longer a single-directional illumination source.
  • a transparent material silicone resin, silicone rubber or epoxy resin or the like can be used.
  • a phosphor film 3 is provided on the plane of the hemisphere.
  • the phosphor film 3 can be directly fabricated on the hemisphere with a transparent material containing phosphor, or can be formed into a phosphor film and placed on the plane of the hemisphere; (d) the other hemisphere is fabricated on the hemisphere, and The LED chip 1, the concentrating reflector 4, and the electrode 5 are packaged together, and the transparent sphere 2 in this embodiment can be obtained.
  • Embodiment 2 is a side elevational view of a white LED according to Embodiment 2 of the present invention.
  • the difference from Embodiment 1 is that the LED chip 1, the concentrating reflector 4 and the electrode 5 are also added at the symmetrical position on the other side of the phosphor film 3, and the opening of the newly added concentrating reflector 4 also faces the transparent sphere 2.
  • the center of the ball and the light emitted from the LED chip 1 are concentrated on the phosphor film 3.
  • the intensity of light emission and the color of light on both sides of the phosphor film 3 are different.
  • the LED chip 1 is provided on both sides of the phosphor film 3, the light emitted from the transparent sphere 2 in all directions is more uniform.
  • the present invention has devised a transparent sphere containing a phosphor film which is located at the center of the transparent sphere.
  • the light emitted by the LED chip is reflected by the concentrating reflector and condensed on the phosphor film to excite the phosphor to emit light.
  • the light emitted from both sides of the phosphor film can directly emit the transparent sphere at one time, eliminating the loss of the mirror and the blocking of the phosphor, thereby improving the white light efficiency. If the LED chip and the concentrating reflector are disposed on both sides of the plane of the phosphor film, the transparent sphere can be made more uniform in all directions.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une structure de boîtier sphérique pour une LED à lumière blanche, la structure de boîtier comprenant une sphère transparente (2), un film de poudre fluorescente (3) qui est disposé au centre de la sphère transparente (2), une puce de LED (1) et un réflecteur de point de lumière (4) qui sont incorporés dans la sphère transparente (2), et une électrode (5) qui est reliée à la puce de LED (1), la puce de LED (1) étant adjacente à la surface du côté intérieur de l'ouverture du réflecteur de point de lumière (4), l'ouverture du réflecteur de point de lumière (4) faisant face au plan du film de poudre fluorescente (3), et l'axe du réflecteur de point de lumière (4) étant perpendiculaire au plan du film de poudre fluorescente (3) et passant par le centre de la sphère de la sphère transparente (2). Le rendement de la lumière blanche peut ainsi être amélioré de manière significative, et le problème d'une LED à lumière blanche qui émet une lumière dans une seule direction est résolu.
PCT/CN2013/082637 2013-03-19 2013-08-30 Structure de boîtier sphérique pour led à lumière blanche WO2014146408A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310088025.7 2013-03-19
CN201310088025.7A CN103178196B (zh) 2013-03-19 2013-03-19 球形白光led封装结构

Publications (1)

Publication Number Publication Date
WO2014146408A1 true WO2014146408A1 (fr) 2014-09-25

Family

ID=48637929

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2013/082637 WO2014146408A1 (fr) 2013-03-19 2013-08-30 Structure de boîtier sphérique pour led à lumière blanche

Country Status (2)

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CN (1) CN103178196B (fr)
WO (1) WO2014146408A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103178196B (zh) * 2013-03-19 2016-02-10 东南大学 球形白光led封装结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020084749A1 (en) * 2000-12-28 2002-07-04 Ayala Raul E. UV reflecting materials for LED lamps using UV-emitting diodes
CN101358715A (zh) * 2008-09-10 2009-02-04 和谐光电科技（泉州）有限公司 一种白光led的封装工艺
US7686478B1 (en) * 2007-01-12 2010-03-30 Ilight Technologies, Inc. Bulb for light-emitting diode with color-converting insert
CN101737645A (zh) * 2009-12-31 2010-06-16 杭州士兰明芯科技有限公司 一种led白光灯泡及其制作方法
CN103178196A (zh) * 2013-03-19 2013-06-26 东南大学 球形白光led封装结构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7118438B2 (en) * 2003-01-27 2006-10-10 3M Innovative Properties Company Methods of making phosphor based light sources having an interference reflector
JP4491213B2 (ja) * 2003-09-29 2010-06-30 岡谷電機産業株式会社 発光ダイオード及びその製造方法
CN101208811A (zh) * 2005-08-05 2008-06-25 松下电器产业株式会社 半导体发光装置
CN202284728U (zh) * 2011-07-04 2012-06-27 欧司朗股份有限公司 照明装置
CN102751274A (zh) * 2012-07-18 2012-10-24 上海顿格电子贸易有限公司 一种立体包覆封装的led芯片

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020084749A1 (en) * 2000-12-28 2002-07-04 Ayala Raul E. UV reflecting materials for LED lamps using UV-emitting diodes
US7686478B1 (en) * 2007-01-12 2010-03-30 Ilight Technologies, Inc. Bulb for light-emitting diode with color-converting insert
CN101358715A (zh) * 2008-09-10 2009-02-04 和谐光电科技（泉州）有限公司 一种白光led的封装工艺
CN101737645A (zh) * 2009-12-31 2010-06-16 杭州士兰明芯科技有限公司 一种led白光灯泡及其制作方法
CN103178196A (zh) * 2013-03-19 2013-06-26 东南大学 球形白光led封装结构

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CN103178196A (zh) 2013-06-26
CN103178196B (zh) 2016-02-10

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