WO2012143966A1 - Buse à éjection pour brasage, et dispositif de brasage - Google Patents

Buse à éjection pour brasage, et dispositif de brasage Download PDF

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Publication number
WO2012143966A1
WO2012143966A1 PCT/JP2011/002257 JP2011002257W WO2012143966A1 WO 2012143966 A1 WO2012143966 A1 WO 2012143966A1 JP 2011002257 W JP2011002257 W JP 2011002257W WO 2012143966 A1 WO2012143966 A1 WO 2012143966A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
jet
jet nozzle
groove
molten solder
Prior art date
Application number
PCT/JP2011/002257
Other languages
English (en)
Japanese (ja)
Inventor
秀樹 時本
匡司 松田
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2011/002257 priority Critical patent/WO2012143966A1/fr
Publication of WO2012143966A1 publication Critical patent/WO2012143966A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Definitions

  • the present invention relates to a solder jet nozzle that jets molten solder, and a soldering apparatus that jets molten solder from the solder jet nozzle and solders electronic components to a printed circuit board.
  • the conventional solder jet nozzle has a problem that when a lead component such as a connector and a switch is locally soldered to a printed circuit board, an overflow flow from the solder jet nozzle contacts a lead wire of an adjacent component.
  • a lead component such as a connector and a switch
  • the molten solder blows up inside the cylindrical body of the jet nozzle to the opening edge, and is discharged to the side wall of the cylindrical body that is appropriately lowered from the opening edge. By opening the mouth, the released solder was prevented from contacting the lead wires of adjacent components.
  • the conventional solder jet nozzle is configured as described above, an oxide film is formed on the surface of the molten solder blown to the opening edge of the cylindrical body, and foreign matters such as dross, oxide and carbide are accumulated. In other words, there was a problem of inhibiting soldering.
  • the overflowed solder is caused by partial oxidation and carbonization of the nozzle outer surface. It becomes difficult to fit in the part, corrodes and blackens, and the jet flows in an uncontrollable direction, which becomes an obstacle to soldering.
  • the present invention has been made to solve the above-described problems, and minimizes the influence of disturbance caused by at least one of solder oxidation, carbonization, and jet fluctuation on the outer surface of the solder jet nozzle.
  • the purpose is to suppress jet turbulence and improve the quality of soldering.
  • the solder jet nozzle of the present invention jets the molten solder supplied from the molten solder flow path from the jet opening through the internal flow path, and is applied to one or both of the entire periphery of the jet opening and the outer surface. A groove is provided.
  • the soldering apparatus of the present invention comprises a molten solder tank for storing molten solder, a molten solder flow path formed in the molten solder tank, and the above-described solder jet nozzle.
  • the groove structure provided in the solder jet nozzle can minimize the influence of disturbance caused by at least one of solder oxidation, carbonization, and jet fluctuation on the outer surface. Disturbance is suppressed and the quality of soldering can be improved.
  • FIG. 3 is a perspective view showing an example of a solder jet nozzle used in the soldering apparatus according to Embodiment 1.
  • FIG. It is a perspective view which shows another example of the solder jet nozzle used for the soldering apparatus which concerns on Embodiment 1.
  • FIG. It is a perspective view which shows another example of the solder jet nozzle used for the soldering apparatus which concerns on Embodiment 1.
  • FIG. It is a perspective view which shows another example of the solder jet nozzle used for the soldering apparatus which concerns on Embodiment 1.
  • FIG. It is a perspective view which shows another example of the solder jet nozzle used for the soldering apparatus which concerns on Embodiment 1.
  • FIG. It is a perspective view which shows another example of the solder jet nozzle used for the soldering apparatus which concerns on Embodiment 1.
  • FIG. 3 is a perspective view showing an example of a pyramid-shaped solder jet nozzle used in the soldering apparatus according to Embodiment 1.
  • FIG. 3 is a perspective view showing an example of a cylindrical solder jet nozzle used in the soldering apparatus according to Embodiment 1.
  • FIG. 3 is a perspective view showing an example of a pyramid-shaped solder jet nozzle used in the soldering apparatus according to Embodiment 1.
  • FIG. 1 A soldering apparatus 1 shown in FIG. 1 includes a molten solder tank 3 that stores molten solder 2, a molten solder flow path component 4 that has a molten solder flow path 5 in which molten solder 2 circulates, and a molten solder flow path.
  • a solder jet nozzle 10 attached to the component 4 and jetting the molten solder 2.
  • the solder jet nozzle 10 has a substantially conical shape, a jet port 11 is opened at the apex, and an internal flow path 12 communicating with the molten solder flow path 5 is formed inside.
  • FIG. 1 shows an example in which a plurality of grooves 21 are formed uniformly over the entire periphery of the jet port 11. Details of the groove structure will be described later.
  • FIG. 2 is a view for explaining a soldering method by the soldering apparatus 1 and shows a cross section of the solder jet nozzle 10 and the molten solder flow path component 4.
  • An attachment base 14 is provided on the bottom surface side of the cone of the solder jet nozzle 10, and the attachment base 14 is attached to the end of the molten solder flow path component 4 to communicate the internal flow path 12 and the molten solder flow path 5. .
  • the attachment method may be any method such as screw fastening.
  • the molten solder 2 is sent to the molten solder flow path component 4 at a predetermined jet pressure by a jet generation drive device (for example, a pump) (not shown) provided in the molten solder tank 3 and supplied to the solder jet nozzle 10.
  • a jet generation drive device for example, a pump
  • jet solder The supplied molten solder 2 flows through the internal flow path 12 and jets from the jet port 11, and the overflowed solder flows down the outer surface 13 by its own weight and returns to the molten solder tank 3 again.
  • jet solder the molten solder 2 that has jetted from the jet port 11 and overflowed.
  • a lead component 103 in which lead wires 104 and 105 are inserted into the through holes 101 and 102 of the printed circuit board 100 is disposed at a position facing the jet port 11, and the through holes 101 and 102 are formed by jet solder jetted from the jet port 11.
  • the lead wires 104 and 105 are soldered.
  • a groove is provided in one or both of the entire periphery of the jet port 11 of the solder jet nozzle 10 and the outer surface 13.
  • a configuration example of the groove will be described.
  • FIG.3 (b) is sectional drawing which cut
  • the jet solder is likely to be accumulated in the groove 21, so that it is difficult to oxidize and carbonize at this position. Moreover, since solder becomes easy to adjust when the jet solder accumulates in the groove 21, the overflow flow can flow in the entire circumferential direction without flowing only in a specific direction from the jet port 11, and the jet solder can flow at the edge of the jet port 11. It does not spread greatly when played. Therefore, the jet solder does not oxidize and carbonize by entraining the outside air, and the jet solder does not come into contact with the adjacent parts when the lead part 103 is soldered. As shown in FIGS. 1 and 2, the same effect can be obtained even in the case where only the groove 21 is provided in the solder jet nozzle 10.
  • the vertical groove 22 becomes a path through which the jet solder overflowed. Since this solder jet nozzle 10 has a conical shape, its outer surface area increases as it goes downward. However, a vertical groove 22 is provided partway from the jet port 11 so that the outer surface area is adjusted to be the same between the upper and lower nozzles. Therefore, the thickness in the vertical direction of the overflow flow layer flowing on the outer surface 13 can be kept constant to some extent. Therefore, the overflow flow is not interrupted at a part of the outer surface 13, and oxidation and carbonization of the outer surface 13 at the interrupted portion can be suppressed. Therefore, corrosion and blackening of the outer surface 13 can also be prevented.
  • jet solder is likely to be accumulated in the lateral groove 23, so that it is difficult to oxidize and carbonize at this position. Further, when the jet solder accumulates in the lateral groove 23, the overflowed solder solder becomes easy to be adapted, and the solder accumulated in the lateral groove 23 is transferred and flows down. As a result, the overflow flow is not interrupted at a part of the outer surface 13, and oxidation and carbonization of the outer surface 13, and consequently corrosion and blackening can be suppressed.
  • the solder jet nozzle 10 is provided with three types of grooves, that is, the groove 21, the longitudinal groove 22, and the lateral groove 23.
  • a plurality of types of grooves may be provided in combination.
  • FIG. 4A shows a configuration example in which the groove 21 of the jet port 11 and the vertical groove 22 of the outer surface 13 are provided
  • FIG. 4B shows a cross-sectional view and how the jet solder flows.
  • FIG. 5A shows a configuration example in which the lateral grooves 23 of the outer surface 13 are provided
  • FIG. 5B shows a cross-sectional view and a state in which the jet solder flows.
  • the solder jet nozzle 10 having the configuration shown in FIG. 5 shows the same effect as that of the lateral groove 23 described above can be obtained.
  • the outer surface 13 of the solder jet nozzle 10 is provided with one or both of the longitudinal grooves 22 and the lateral grooves 23, but the present invention is not limited to this, and the spiral grooves are not limited thereto. May be provided.
  • the solder jet nozzle 10 shown in FIG. 6 is provided with a spiral groove 24 having a shape that runs spirally on the outer surface 13.
  • the solder jet nozzle 10 has a conical shape.
  • the present invention is not limited to this, and may be a pyramid shape such as a triangular pyramid or a quadrangular pyramid.
  • the solder jet nozzle 10 may be a column such as a cylinder or a prism instead of a cone.
  • FIG. 7 shows a configuration example when the solder jet nozzle 10 has a quadrangular pyramid shape.
  • This solder jet nozzle 10 has a quadrangular pyramid shape with an internal flow path 12, a jet port 11 is provided at the apex, a groove 21 is formed, an attachment base 14 is formed on the bottom surface, and each of the four surfaces of the outer surface 13.
  • a vertical groove 22 and a horizontal groove 23 are formed in the upper part.
  • the solder jet nozzle 10 has a cylindrical shape (cylindrical shape) in which an internal flow path 12 is formed.
  • the solder jet nozzle 10 is provided with a jet port 11 at one end to form a groove 21, an attachment base 14 at the other end, and an outer surface 13.
  • a vertical groove 22 and a horizontal groove 23 are formed in the upper part.
  • illustration is omitted, in the case of any shape of a cone and a column, at least one of the four types of grooves of the groove 21, the vertical groove 22, the horizontal groove 23, and the spiral groove 24 may be provided. Alternatively, a plurality of types of grooves may be provided in combination. Even in the case of a cone and a column, the same effect as described above can be obtained by providing a groove.
  • the outer surface 13 of the solder jet nozzle 10 may be solder-plated.
  • the overflowing solder flows easily into the outer surface 13, and the overflow flow is difficult to be interrupted at a part of the outer surface 13, thereby suppressing oxidation and carbonization.
  • the grooves (vertical grooves 22, lateral grooves 23, and spiral grooves 24) formed on the outer surface 13 may be formed on a part of the outer surface 13 or on the entire surface.
  • the solder jet nozzle 10 used in the soldering apparatus 1 is configured so as to provide a groove in one or both of the entire peripheral edge of the jet port 11 and the outer surface 13.
  • this groove structure it is possible to minimize the influence of disturbance caused by oxidation or carbonization of the outer surface 13 or fluctuation of jet solder, and to suppress jet turbulence. As a result, it is possible to improve the soldering quality.
  • the frequency of maintenance of the solder jet nozzle can be reduced, and workability can be improved.
  • the soldering apparatus 1 may be configured to include at least one of the molten solder bath 3, the molten solder flow path component 4, and the solder jet nozzle 10, and is used for point dip by using one solder jet nozzle 10.
  • the soldering apparatus 1 may be configured, or a plurality of solder jet nozzles 10 may be used to configure the multi-dip soldering apparatus 1.
  • the solder jet nozzle according to the present invention suppresses jet turbulence from the jet port and improves the quality of soldering. Therefore, the solder jet nozzle is used for a local soldering apparatus for point dip and multi-dip use. Suitable for

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

L'invention concerne une buse à éjection pour brasage (10) qui est équipée d'au moins un type de structure de rainures parmi : des rainures (21) agencées régulièrement sur tout le bord périphérique d'une ouverture d'éjection (11); des rainures longitudinales (22) sur une surface externe (13) qui présentent une forme qui suit la direction d'écoulement d'une brasure qui est éjectée à partir de l'ouverture d'éjection (11), et qui s'écoule sous l'effet de son poids propre; et des rainures latérales (23) sur la surface externe (13) qui présentent une forme allant dans une direction sensiblement perpendiculaire aux rainures longitudinales (22). Cette buse à éjection pour brasage (10) empêche une mauvaise éjection.
PCT/JP2011/002257 2011-04-18 2011-04-18 Buse à éjection pour brasage, et dispositif de brasage WO2012143966A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/002257 WO2012143966A1 (fr) 2011-04-18 2011-04-18 Buse à éjection pour brasage, et dispositif de brasage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/002257 WO2012143966A1 (fr) 2011-04-18 2011-04-18 Buse à éjection pour brasage, et dispositif de brasage

Publications (1)

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WO2012143966A1 true WO2012143966A1 (fr) 2012-10-26

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155058A (ja) * 2010-01-26 2011-08-11 Mitsubishi Electric Corp 半田噴流装置
US20130306711A1 (en) * 2010-09-01 2013-11-21 Alexander J. Ciniglio Soldering nozzle for delivering molten solder to the underside of a pcb, method of reducing the rate of occurence of dewetting of a solder nozzle
WO2014199694A1 (fr) * 2013-06-13 2014-12-18 富士通テン株式会社 Dispositif de soudure et procédé de soudure
EP3785837A1 (fr) * 2019-08-27 2021-03-03 Illinois Tool Works, Inc. Buse, système et procédé

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5386439U (fr) * 1976-12-17 1978-07-15
JPS63127763U (fr) * 1987-02-13 1988-08-22
JPH0287559U (fr) * 1988-12-22 1990-07-11
JPH0447862U (fr) * 1990-08-21 1992-04-23
JP2004195539A (ja) * 2002-12-20 2004-07-15 Tokyo Seisan Giken Kk ハンダ付け装置
JP2006136946A (ja) * 2004-09-21 2006-06-01 Mitsuo Ebisawa 半田付け装置、その製造方法及びその装置を使用した半田付け方法
WO2007138310A2 (fr) * 2006-05-30 2007-12-06 Pillarhouse International Limited Appareil de soudage

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5386439U (fr) * 1976-12-17 1978-07-15
JPS63127763U (fr) * 1987-02-13 1988-08-22
JPH0287559U (fr) * 1988-12-22 1990-07-11
JPH0447862U (fr) * 1990-08-21 1992-04-23
JP2004195539A (ja) * 2002-12-20 2004-07-15 Tokyo Seisan Giken Kk ハンダ付け装置
JP2006136946A (ja) * 2004-09-21 2006-06-01 Mitsuo Ebisawa 半田付け装置、その製造方法及びその装置を使用した半田付け方法
WO2007138310A2 (fr) * 2006-05-30 2007-12-06 Pillarhouse International Limited Appareil de soudage

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155058A (ja) * 2010-01-26 2011-08-11 Mitsubishi Electric Corp 半田噴流装置
US20130306711A1 (en) * 2010-09-01 2013-11-21 Alexander J. Ciniglio Soldering nozzle for delivering molten solder to the underside of a pcb, method of reducing the rate of occurence of dewetting of a solder nozzle
WO2014199694A1 (fr) * 2013-06-13 2014-12-18 富士通テン株式会社 Dispositif de soudure et procédé de soudure
CN105324203A (zh) * 2013-06-13 2016-02-10 富士通天株式会社 钎焊装置以及钎焊方法
CN105324203B (zh) * 2013-06-13 2018-04-17 富士通天株式会社 钎焊装置以及钎焊方法
EP3785837A1 (fr) * 2019-08-27 2021-03-03 Illinois Tool Works, Inc. Buse, système et procédé

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