WO2009075288A1 - Substrat en silicium et son procédé de fabrication - Google Patents
Substrat en silicium et son procédé de fabrication Download PDFInfo
- Publication number
- WO2009075288A1 WO2009075288A1 PCT/JP2008/072400 JP2008072400W WO2009075288A1 WO 2009075288 A1 WO2009075288 A1 WO 2009075288A1 JP 2008072400 W JP2008072400 W JP 2008072400W WO 2009075288 A1 WO2009075288 A1 WO 2009075288A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silicon substrate
- manufacturing
- same
- concentration
- omega
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract 5
- 229910052710 silicon Inorganic materials 0.000 title abstract 5
- 239000010703 silicon Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000013078 crystal Substances 0.000 abstract 2
- 238000005247 gettering Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 238000001556 precipitation Methods 0.000 abstract 1
- 230000001737 promoting effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
- H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/02—Heat treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14698—Post-treatment for the devices, e.g. annealing, impurity-gettering, shor-circuit elimination, recrystallisation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Thermal Sciences (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
L'invention porte sur un procédé de fabrication d'un substrat en silicium qui comprend une étape de tirage, par le procédé CZ, d'un monocristal de silicium, ayant une concentration B équivalente à une résistivité de 8 mΩ.cm à 10 mΩ.cm, une concentration C de 0,5×1016 à 10×1016 atomes/cm3 et une concentration en oxygène de 1×1018 à 10×1018 atomes/cm3, de façon à effectuer de façon sûre un piégeage ('gettering') et à améliorer sa performance. Le procédé comprend également une étape de traitement thermique consistant à provoquer une précipitation par exécution d'un traitement thermique allant de 600 à 800 °C pendant 0,25 à 3 heures sur un substrat en silicium découpé en tranches à partir du monocristal de silicium tiré.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009545430A JPWO2009075288A1 (ja) | 2007-12-11 | 2008-12-10 | シリコン基板とその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007320129 | 2007-12-11 | ||
JP2007-320129 | 2007-12-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009075288A1 true WO2009075288A1 (fr) | 2009-06-18 |
Family
ID=40755530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/072400 WO2009075288A1 (fr) | 2007-12-11 | 2008-12-10 | Substrat en silicium et son procédé de fabrication |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2009075288A1 (fr) |
TW (1) | TW200937530A (fr) |
WO (1) | WO2009075288A1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110052923A1 (en) * | 2009-09-03 | 2011-03-03 | Sumco Corporation | Method of producing epitaxial wafer as well as epitaxial wafer |
JP2011096979A (ja) * | 2009-11-02 | 2011-05-12 | Sumco Corp | シリコンウェーハ及びその製造方法 |
JP2012059849A (ja) * | 2010-09-08 | 2012-03-22 | Shin Etsu Handotai Co Ltd | シリコンエピタキシャルウェーハおよびシリコンエピタキシャルウェーハの製造方法 |
WO2014200686A1 (fr) * | 2013-06-11 | 2014-12-18 | Sunedison Semiconductor Limited | Précipitation de l'oxygène dans des plaquettes de silicium fortement dopées découpées dans des lingots obtenus par le procédé de czochralski |
JP2019149471A (ja) * | 2018-02-27 | 2019-09-05 | 株式会社Sumco | 半導体ウェーハのゲッタリング能力の評価方法および該評価方法を用いた半導体ウェーハの製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1050715A (ja) * | 1996-07-29 | 1998-02-20 | Sumitomo Sitix Corp | シリコンウェーハとその製造方法 |
JP2000272995A (ja) * | 1999-03-26 | 2000-10-03 | Sumitomo Metal Ind Ltd | シリコン単結晶、シリコンウェーハ及びエピタキシャルウェーハ |
JP2005170778A (ja) * | 2003-11-21 | 2005-06-30 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法 |
JP2007008795A (ja) * | 2004-08-25 | 2007-01-18 | Sumco Corp | シリコンウェーハ及びその製造方法、並びにシリコン単結晶育成方法 |
JP2007145692A (ja) * | 2005-10-24 | 2007-06-14 | Sumco Corp | シリコン半導体基板およびその製造方法 |
JP2007273959A (ja) * | 2006-03-06 | 2007-10-18 | Matsushita Electric Ind Co Ltd | 光検出素子及びその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11204534A (ja) * | 1998-01-14 | 1999-07-30 | Sumitomo Metal Ind Ltd | シリコンエピタキシャルウェーハの製造方法 |
JP2005522879A (ja) * | 2002-04-10 | 2005-07-28 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | 理想的酸素析出シリコンウエハにおいてデヌーデッドゾーン深さを制御する方法 |
JP4604889B2 (ja) * | 2005-05-25 | 2011-01-05 | 株式会社Sumco | シリコンウェーハの製造方法、並びにシリコン単結晶育成方法 |
-
2008
- 2008-12-09 TW TW97147835A patent/TW200937530A/zh unknown
- 2008-12-10 WO PCT/JP2008/072400 patent/WO2009075288A1/fr active Application Filing
- 2008-12-10 JP JP2009545430A patent/JPWO2009075288A1/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1050715A (ja) * | 1996-07-29 | 1998-02-20 | Sumitomo Sitix Corp | シリコンウェーハとその製造方法 |
JP2000272995A (ja) * | 1999-03-26 | 2000-10-03 | Sumitomo Metal Ind Ltd | シリコン単結晶、シリコンウェーハ及びエピタキシャルウェーハ |
JP2005170778A (ja) * | 2003-11-21 | 2005-06-30 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法 |
JP2007008795A (ja) * | 2004-08-25 | 2007-01-18 | Sumco Corp | シリコンウェーハ及びその製造方法、並びにシリコン単結晶育成方法 |
JP2007145692A (ja) * | 2005-10-24 | 2007-06-14 | Sumco Corp | シリコン半導体基板およびその製造方法 |
JP2007273959A (ja) * | 2006-03-06 | 2007-10-18 | Matsushita Electric Ind Co Ltd | 光検出素子及びその製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110052923A1 (en) * | 2009-09-03 | 2011-03-03 | Sumco Corporation | Method of producing epitaxial wafer as well as epitaxial wafer |
JP2011096979A (ja) * | 2009-11-02 | 2011-05-12 | Sumco Corp | シリコンウェーハ及びその製造方法 |
JP2012059849A (ja) * | 2010-09-08 | 2012-03-22 | Shin Etsu Handotai Co Ltd | シリコンエピタキシャルウェーハおよびシリコンエピタキシャルウェーハの製造方法 |
WO2014200686A1 (fr) * | 2013-06-11 | 2014-12-18 | Sunedison Semiconductor Limited | Précipitation de l'oxygène dans des plaquettes de silicium fortement dopées découpées dans des lingots obtenus par le procédé de czochralski |
US9634098B2 (en) | 2013-06-11 | 2017-04-25 | SunEdison Semiconductor Ltd. (UEN201334164H) | Oxygen precipitation in heavily doped silicon wafers sliced from ingots grown by the Czochralski method |
JP2019149471A (ja) * | 2018-02-27 | 2019-09-05 | 株式会社Sumco | 半導体ウェーハのゲッタリング能力の評価方法および該評価方法を用いた半導体ウェーハの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009075288A1 (ja) | 2011-04-28 |
TW200937530A (en) | 2009-09-01 |
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