WO2009011419A1 - 電子部品実装装置及びその製造方法 - Google Patents

電子部品実装装置及びその製造方法 Download PDF

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Publication number
WO2009011419A1
WO2009011419A1 PCT/JP2008/063007 JP2008063007W WO2009011419A1 WO 2009011419 A1 WO2009011419 A1 WO 2009011419A1 JP 2008063007 W JP2008063007 W JP 2008063007W WO 2009011419 A1 WO2009011419 A1 WO 2009011419A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
electronic
manufacturing
component mounted
spacer
Prior art date
Application number
PCT/JP2008/063007
Other languages
English (en)
French (fr)
Inventor
Takao Yamazaki
Shinji Watanabe
Tomoo Murakami
Yuuki Fujimura
Ryoji Osu
Katsuhiko Suzuki
Shizuaki Masuda
Nobuyuki Sato
Kikuo Wada
Original Assignee
Nec Corporation
Nec Accesstechnica, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation, Nec Accesstechnica, Ltd. filed Critical Nec Corporation
Priority to US12/669,423 priority Critical patent/US8120921B2/en
Priority to CN2008800253262A priority patent/CN101755335B/zh
Priority to JP2009523681A priority patent/JP5413971B2/ja
Publication of WO2009011419A1 publication Critical patent/WO2009011419A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　複数の電子部品を積層実装する３次元実装型電子部品実装装置において、発熱量の大きい電子部品の熱から、他の電子部品を保護する。電子部品実装装置１は、第１面２ａに外部端子（不図示）を有すると共に第２面２ｂにヒートスプレッダ６を有する第１電子部品２と、第１電子部品２の第２面２ｂ方向に配置される少なくとも１つの第２電子部品４ｂと、第１電子部品２及び少なくとも１つの第２電子部品４ｂと電気的に接続されると共に、少なくとも１つの第２電子部品４ｂが接続された少なくとも一部が第１電子部品２の第２面２ｂ側に配される可撓性回路基板３と、可撓性回路基板３の少なくとも一部と第１電子部品２の第２面２ｂとの間に配されるスペーサ５と、を備える。スペーサ５により、第１電子部品２の熱が第２電子部品４ｂへ直接的に伝導することを防止することができる。
PCT/JP2008/063007 2007-07-19 2008-07-18 電子部品実装装置及びその製造方法 WO2009011419A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/669,423 US8120921B2 (en) 2007-07-19 2008-07-18 Device having electronic components mounted therein and method for manufacturing such device
CN2008800253262A CN101755335B (zh) 2007-07-19 2008-07-18 电子部件安装装置及其制造方法
JP2009523681A JP5413971B2 (ja) 2007-07-19 2008-07-18 電子部品実装装置及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007188287 2007-07-19
JP2007-188287 2007-07-19

Publications (1)

Publication Number Publication Date
WO2009011419A1 true WO2009011419A1 (ja) 2009-01-22

Family

ID=40259745

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063007 WO2009011419A1 (ja) 2007-07-19 2008-07-18 電子部品実装装置及びその製造方法

Country Status (5)

Country Link
US (1) US8120921B2 (ja)
JP (1) JP5413971B2 (ja)
KR (1) KR101065935B1 (ja)
CN (1) CN101755335B (ja)
WO (1) WO2009011419A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012151173A (ja) * 2011-01-17 2012-08-09 Nec Corp ３次元実装型半導体装置、および電子機器
JP2020194019A (ja) * 2019-05-24 2020-12-03 富士通オプティカルコンポーネンツ株式会社 光モジュール

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5433465B2 (ja) * 2010-03-16 2014-03-05 株式会社ジャパンディスプレイ 表示装置
DE102011107316A1 (de) * 2011-07-06 2013-06-06 Abb Ag Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Steuerungssystems
GB2503407B (en) * 2011-10-10 2015-12-09 Control Tech Ltd Barrier device
WO2014136484A1 (ja) * 2013-03-07 2014-09-12 住友ベークライト株式会社 装置、接着剤用組成物、接着シート
KR102127772B1 (ko) * 2013-05-16 2020-06-29 삼성전자주식회사 방열 판을 갖는 반도체 패키지 및 그 형성 방법
TWM519879U (zh) * 2015-08-03 2016-04-01 Dowton Electronic Materials Co Ltd 電子裝置之改良散熱結構
US10083989B2 (en) 2015-12-10 2018-09-25 Industrial Technology Research Institute Semiconductor device
TWI578505B (zh) * 2015-12-10 2017-04-11 財團法人工業技術研究院 半導體元件
JP6956475B2 (ja) * 2016-09-28 2021-11-02 エルジー ディスプレイ カンパニー リミテッド 電子部品の実装方法、電子部品の接合構造、基板装置、ディスプレイ装置、ディスプレイシステム
JP6726070B2 (ja) 2016-09-28 2020-07-22 エルジー ディスプレイ カンパニー リミテッド 電子部品の実装方法、電子部品の接合構造、基板装置、ディスプレイ装置、ディスプレイシステム

Citations (3)

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JP2000088921A (ja) * 1998-09-08 2000-03-31 Sony Corp 半導体装置
JP2005203486A (ja) * 2004-01-14 2005-07-28 Denso Corp 半導体パッケージおよびその実装構造
JP2007005607A (ja) * 2005-06-24 2007-01-11 Fujitsu Ltd 半導体装置

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JP4135284B2 (ja) * 1999-12-07 2008-08-20 ソニー株式会社 半導体モジュールおよび電子回路装置
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JP4109707B1 (ja) * 2007-05-30 2008-07-02 新藤電子工業株式会社 半導体装置およびその製造方法、ならびにディスプレイ装置およびその製造方法

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Publication number Priority date Publication date Assignee Title
JP2000088921A (ja) * 1998-09-08 2000-03-31 Sony Corp 半導体装置
JP2005203486A (ja) * 2004-01-14 2005-07-28 Denso Corp 半導体パッケージおよびその実装構造
JP2007005607A (ja) * 2005-06-24 2007-01-11 Fujitsu Ltd 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012151173A (ja) * 2011-01-17 2012-08-09 Nec Corp ３次元実装型半導体装置、および電子機器
JP2020194019A (ja) * 2019-05-24 2020-12-03 富士通オプティカルコンポーネンツ株式会社 光モジュール
JP7243449B2 (ja) 2019-05-24 2023-03-22 富士通オプティカルコンポーネンツ株式会社 光モジュール

Also Published As

Publication number Publication date
JP5413971B2 (ja) 2014-02-12
KR101065935B1 (ko) 2011-09-19
US8120921B2 (en) 2012-02-21
CN101755335A (zh) 2010-06-23
CN101755335B (zh) 2012-07-11
US20100188821A1 (en) 2010-07-29
KR20100032452A (ko) 2010-03-25
JPWO2009011419A1 (ja) 2010-09-24

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