200920197 九、發明說明： 【明户巧屬 -ts^ 】 技術領域 本發明係有關於由積層複數配線層所構成且核心層安 5裝有電子零件的内藏零件之印刷電路基板及其製造方法。 【先前技術：| 背景技術 近年來隨著電子機器之高機能化、小型化之發展，有 尋求安裝有電子零件之安裝基板的安裝密度更高度化之傾 10向。因此，電子零件之安裝所使用之印刷電路基板係使用 於複數積層有配線層之内層安裝有電子零件的所謂内藏零 件型者（參照例如，專利文獻丨）。 專利文獻1記載之㈣零件型印刷電絲板巾，揭露於 印刷電路基板設有複數層的配線層中，將晶片電容器等晶 I5片零件安裝於内層之例。藉此，可將安裝於印刷電路基板 外層之電子零件的—部分裝入内層，有可實現高密度安裝 之優點。 然而’包含則料利文獻1在Θ，用以促進安裝密度之 高密度化所使用之印刷電路基板具有以下問題。首先，習 20知者中成為内藏對象之零件種類主要多受限為電容器或電 阻等被動零件。因此’對含有半導體零件等基板全體的安 裝密度之高度化仍有限。 又’將半導體零件安裝於内層時，需於基板製造步驟 中經過加工用以收納該等零件之凹六及用以密封零件的步 5 200920197 驟等複雜之步驟。 如此，於習知技術中，並未確立可以簡便之步驟，有 效率地製造内藏零件之印刷電路基板的技術 。因此，正在 尋求新構造之内藏零件之印刷電路基板及其製造方法。 5 【專利文獻丨】特開2007-214230號公報 L發明内容】 發明揭示 本發明内藏零件之印刷電路基板係提供可以簡便之步 驟’有效率地製造的内藏零件之印刷電路基板及内藏零件 10之印刷電路基板之製造方法。 本發明内藏零件之印刷電路基板係由積層具有第1配 線電路且安裝有電子零件的核心層、及具有第2配線電路之 配線層所構成者，且具有以下構造：電子零件焊接於構成 第1配線電路之連接用電極，電子零件與電極之焊接部被樹 15脂覆蓋部包覆，零件固定層形成於核心層，且由周圍包圍 並固定電子零件及樹脂覆蓋部，且連接第】配線電路與第2 配線電路之層間配線部設於核心層及配線層。 又’本發_藏零件之印刷電路基板之製造方法包含 2〇有於構成形成核心層之至少—面的第1配線電路之連接用 2〇電極供應焊膏的焊料供應步驟；於焊料供應步驟後，在核 心層裝载電子零狀零件裝鮮驟；於零件裝鮮驟後; 藉由加熱核心層，焊接電極與電子零件之焊接步驟；於焊 接步驟後’洗淨電極與電子零件之焊接部，去除焊接殘渣 的洗淨步驟；於洗淨步驟後’以樹脂包覆焊接部，形成樹 200920197 脂覆蓋部的樹脂覆蓋步驟；於樹脂覆蓋步驟後，藉由黑色 氧化⑼滅〇xidation)處理核心層，將配線電路表面粗化之 黑色氧化處理步驟’·於黑色氧化處理步驟後，於由周圍包 圍並固定電子零件之零件固定層上形成具有第2配線電路 5之配線層’且形成連接第1配線電路與第2配線電路的層間 配線部之轉電路連接㈣。 ㈣的層間 又，本發明内藏零件之印刷電路基板之製造方法，包 3有將於具有除去谭料之氧化膜的活化作用之熱硬化性 樹脂中含有焊料粒子的焊接材供應至連接用電極，且該連 10接用電極構成形成於核心層之至少一面的第i配線電路之 浑料供應步驟；於焊料供應步驟後，於核心層襄載電子零 件之零件裝載步驟；於零件裝載步驟後，藉由加熱核心層， 焊接電極與電子零件，且以熱硬化性樹脂硬化後之樹脂包 覆電極與電子零件，形成樹脂覆蓋部的焊接步驟；於焊料 15供應步驟後’藉由黑色氧化處理核心層，將第1配線電路表 面粗化之黑色氧化處理步驟；及於黑色氧化處理步驟後， 於由周圍包圍並固定電子零件之零件固定層上形成具有第 2配線電路的配線層，且形成連接第1配線電路與第2配線電 路之層間配線部的配線電路連接步驟。 20 依據該構造，於安裝有電子零件之核心層上，藉由樹 脂包覆電子零件與電極之焊接部，形成樹脂覆蓋部。藉此、， 可於為確保積層複數配線層時與預浸體之密接性所進行之 黑色氧化處理時保護烊接部。因此，可利用對核心層之零 件安裝與使用預浸體之配線層的積層等簡便之步驟，有嗲 200920197 率地製造内藏零件之印刷電路基板。 圖式簡單說明 第1A圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 5 第1B圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 第1C圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 第1D圖係顯示本發明實施形態1内藏零件之印刷電路 10 基板之製造方法的第1步驟說明圖。 第1E圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 第2A圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第2步驟說明圖。 15 第2 B圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第2步驟說明圖。 第2C圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第2步驟說明圖。 第2D圖係顯示本發明實施形態1内藏零件之印刷電路 2〇 基板之製造方法的第2步驟說明圖。 第2E圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第2步驟說明圖。 第3A圖係顯示本發明實施形態2内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 200920197 第3 B圖係I員示本發明實施形態2内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 第3C圖係顯示本發明實施形態2内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 第3D圖係顯示本發明實施形態2内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 【货"施· :¾'式】 實施發明之最佳形態 (實施形態1) 10 15200920197 IX. Description of the Invention: [Ming Family] - ts^ [Technical Field] The present invention relates to a printed circuit board comprising a built-in component comprising a plurality of wiring layers and having a core layer mounted on an electronic component, and a method of manufacturing the same . [Prior Art: | Background Art In recent years, with the development of high-performance and miniaturization of electronic equipment, there has been a tendency to increase the mounting density of mounting substrates on which electronic components are mounted. Therefore, the printed circuit board used for the mounting of the electronic component is used as a so-called built-in component in which an electronic component is mounted on the inner layer in which a plurality of wiring layers are laminated (see, for example, Patent Document). (4) A part-type printed wireboard paper disclosed in Patent Document 1 is disclosed in a wiring layer in which a plurality of layers are provided on a printed circuit board, and a crystal chip such as a chip capacitor is mounted on the inner layer. Thereby, the portion of the electronic component mounted on the outer layer of the printed circuit board can be incorporated into the inner layer, and the advantage of high-density mounting can be achieved. However, the printed circuit board used to promote the density increase of the mounting density has the following problems. First of all, the types of parts that are included in the knowledge of the 20th are mostly limited to passive parts such as capacitors or resistors. Therefore, the height of the mounting density of the entire substrate including the semiconductor component is still limited. Further, when the semiconductor component is mounted on the inner layer, it is necessary to process the concave portion of the component in the substrate manufacturing step and the step of step 5 200920197 for sealing the component. As described above, in the prior art, there is no known technique for efficiently manufacturing a printed circuit board of a built-in component in a simple procedure. Therefore, a printed circuit board having a built-in component of a new structure and a method of manufacturing the same are being sought. [Patent Document] JP-A-2007-214230 SUMMARY OF THE INVENTION The printed circuit board of the built-in component of the present invention provides a printed circuit board and a built-in component of a built-in component that can be efficiently manufactured in a simple step. A method of manufacturing a printed circuit board of the component 10. The printed circuit board of the built-in component of the present invention is composed of a core layer having a first wiring circuit and having an electronic component mounted thereon, and a wiring layer having a second wiring circuit, and has the following structure: electronic component soldering to the structure (1) The electrode for connection of the wiring circuit, the soldering portion of the electronic component and the electrode is covered with the resin covering portion of the tree 15, and the component fixing layer is formed on the core layer, and the electronic component and the resin covering portion are surrounded by the periphery, and the wiring is connected. The interlayer wiring portion of the circuit and the second wiring circuit is provided on the core layer and the wiring layer. Further, the method for manufacturing a printed circuit board of the present invention includes a solder supply step of supplying a solder paste with a second electrode for forming a first wiring circuit forming at least a surface of the core layer, and a solder supply step. After that, the electronic layer is loaded with the electronic zero-shaped parts; after the parts are filled, the welding step is performed by heating the core layer, and the welding electrode and the electronic parts are welded; after the welding step, the welding of the cleaning electrode and the electronic parts is performed. a cleaning step of removing the solder residue; after the cleaning step, 'the resin is covered with the soldering portion to form a resin covering step of the resin covering portion of the 200920197; after the resin covering step, the black oxide is oxidized (9) The core layer is a black oxidation treatment step of roughening the surface of the wiring circuit. After the black oxidation treatment step, a wiring layer having the second wiring circuit 5 is formed on the component fixing layer surrounded by the surrounding and fixed electronic components, and a connection is formed. The first wiring circuit is connected to the switching circuit of the interlayer wiring portion of the second wiring circuit (4). (4) In the method of manufacturing the printed circuit board of the built-in component of the present invention, the package 3 has a solder material containing solder particles contained in the thermosetting resin having an activation function of removing the oxide film of the tan material, and is supplied to the electrode for connection. And the connection electrode of the connection 10 constitutes a data supply step of the ith wiring circuit formed on at least one side of the core layer; after the solder supply step, the component loading step of the electronic component is carried in the core layer; after the component loading step a step of soldering the electrode covering portion by heating the core layer, soldering the electrode and the electronic component, and coating the electrode and the electronic component with the resin cured by the thermosetting resin; after the supply step of the solder 15 'by black oxidation treatment a core layer, a black oxidation treatment step of roughening the surface of the first wiring circuit; and after the black oxidation treatment step, a wiring layer having a second wiring circuit is formed on the component fixing layer surrounded by the surrounding and fixed electronic components, and is formed A wiring circuit connecting step of connecting the first wiring circuit and the interlayer wiring portion of the second wiring circuit. According to this configuration, the resin covering portion is formed by coating the welded portion of the electronic component and the electrode on the core layer on which the electronic component is mounted by the resin. Thereby, the splicing portion can be protected during the black oxidation treatment for ensuring the adhesion to the prepreg when the plurality of wiring layers are laminated. Therefore, it is possible to manufacture a printed circuit board of a built-in component by using a simple step of mounting a core layer and a wiring layer using a prepreg. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a first step explanatory view showing a method of manufacturing a printed circuit board of a built-in component according to a first embodiment of the present invention. 5 is a first step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 1C is a first step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 1D is a first step explanatory view showing a method of manufacturing a substrate for a printed circuit 10 of the built-in component according to the first embodiment of the present invention. Fig. 1E is a first step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 2A is a second step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 2B is a second step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 2C is a second step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 2D is a second step explanatory view showing a method of manufacturing a printed circuit of the built-in component according to the first embodiment of the present invention. Fig. 2E is a second step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 3A is a first step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the second embodiment of the present invention. 200920197 The third step is a description of the first step of the method of manufacturing the printed circuit board of the built-in component according to the second embodiment of the present invention. Fig. 3C is a first step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the second embodiment of the present invention. Fig. 3D is a view showing a first step of the method of manufacturing the printed circuit board of the built-in component according to the second embodiment of the present invention. [Goods "Shi·:3⁄4'] The best form for implementing the invention (Embodiment 1) 10 15
第1A圖〜苐ιέ圖、第2A圖〜第2E圖係顯示本發明實施形 心1内藏零件之印刷電路基板之製造方法的步驟說明圖。換 吕之，係按照步驟顯示製造由積層核心層與複數配線層所 構成’且於核^層安裝有電子零件的内藏零件之印刷電路 基板之方法。 第1A圖中，核心層丨具有分別於絕緣性樹脂基板2之上 面2a下面2b形成配線電路（第！配線電路)3及配線電路㈣ 構造。配線電路3_之端部形成有用以連接電子零件端子 的電極3a。換言之’電極蝴成為形成於核々層1之至少一 面（上面叫之配線電路3的—部分。於細a以包圍電子零 2子之焊接部㈣成1請之配置、雜，就形成阻焊 接者，如第1B圖所示，於構成形成在核心層1之至少-=上=的配線_之_電極3让，藉由網板印刷 或刀注避布等方法供應焊f6(焊料供應步驟）。此處，於 20 200920197 電極33未形成轉部4之露出範圍供應焊膏6。焊膏6係藉於 黏性體之助焊劑此含有焊餘％所構成。因此，藉由助 焊劑时之活化職分，可去除料好&表面、電仙、 端子7a(弟1C圖）表面之氧化膜。 5 10 15 20 之後’如第1C®料，對於電極城縣焊f6之焊料 供應步驟後的核心層卜裝載於兩端部具有端子7a之晶片型 電子零件7(零件«步驟）。_，將裝載有好零件7之核 心層1送至回焊I置，如第1D圖所示，加熱零件裝載步驟後 之核心層。藉此’焊接電極Sa與電子零件7之端子Μ焊接步 驟）。於該焊接步驟中’藉炼融固化焊膏6中之焊料粒子6a， 形成接合電極3a與端子7a並使其電導通的焊接部&。此 時，因炫融狀態之焊料過度地炫融擴張的流動，會被形成 7電極3:樣焊部4關，㈣錢#雜的焊接物。= 、兄的並未為必須若為無因焊料之流動造成不良情 况的疑慮’亦可不形成阻焊部4。此於實施形齡中亦相同。 之後，將焊接步驟後之核心層i送至洗淨裝置。換言 : = = 在核心層1浸潰於洗淨槽之洗淨劑8内 :“、下㈣日波㈣。藉此，洗淨電極城電子零 成八之莖焊接。卩6卜結果’去除殘留於焊接部6旧_助焊劑 成刀專焊接殘渣（洗淨步驟）。 精此，即使於之後步驟中，更在内藏零件之 基板安裝電子零件時所進 j电塔 有再炫融之情況，但藉去二的加熱下’焊接部_ 分殘留造成之不良情況。換2殘渣’可防止因助焊劑成 換5之，可防止因殘留之助焊劑 10 200920197 成分使熔融焊料流動、焊接部&變形之不良情況。 洗淨方法除了於洗淨劑8内浸漬核心層i之洗二方法， 亦可使用將洗淨劑喷射至洗淨對象部位之喷射洗淨Z ’ 方法。 種 接著，對洗淨步驟後之核心層i進行樹脂塗布。換士 之’如第2A圖所示，藉由分注器等於核心層】之電^ 周圍塗布環氧樹脂等樹脂。藉此，填充電子零件7下面，7 間隙，且以樹脂包覆焊接糾，形成樹脂覆蓋部^ 蓋步驟）。 復 10 151A to 2D and 2E to 2E are process explanatory views showing a method of manufacturing a printed circuit board in which the components of the core 1 are incorporated. The method of manufacturing a printed circuit board in which a built-in component of an electronic component is mounted on a core layer by a laminated core layer and a plurality of wiring layers is displayed in steps. In Fig. 1A, the core layer has a structure in which a wiring circuit (the first wiring circuit) 3 and a wiring circuit (4) are formed on the lower surface 2b of the upper surface 2a of the insulating resin substrate 2, respectively. The end portion of the wiring circuit 3_ forms an electrode 3a for connecting the terminals of the electronic component. In other words, the electrode is formed on at least one side of the core layer 1 (the portion of the wiring circuit 3 is referred to above. The soldering portion (four) that surrounds the electron zero 2 in the thin a is arranged and mixed to form a solder resist. As shown in FIG. 1B, the electrode 3 is formed by arranging the wiring _ formed on the core layer 1 at least -==, and the solder f6 is supplied by a method such as screen printing or knife-cutting (the solder supply step). Here, at 20 200920197, the electrode 33 is not supplied with the solder paste 6 in the exposed range of the turn portion 4. The solder paste 6 is composed of the flux of the adhesive body containing the % of the solder. Therefore, by the flux The activation duty can remove the oxide film on the surface of the surface, the electric fairy, and the terminal 7a (the 1C figure). 5 10 15 20 After the '1C® material, the solder supply step for the electrode city f6 soldering The rear core layer is loaded on the wafer-type electronic component 7 having the terminal 7a at both ends (Part «Step). _, the core layer 1 loaded with the good component 7 is sent to the reflow I, as shown in Fig. 1D , heating the core layer after the loading step of the part, thereby soldering the terminal of the welding electrode Sa and the electronic component 7 Step). In the soldering step, the solder particles 6a in the solder paste 6 are melted and melted to form a solder portion & which is electrically connected to the terminal electrode 3a and the terminal 7a. At this time, since the solder in the glare state excessively swells and expands the flow of the expansion, it is formed into the 7 electrode 3: the solder joint 4 is closed, and the solder is mixed. = The brother does not have to worry about the failure of the flow of the solder. The solder mask 4 may not be formed. This is also the same in the implementation age. Thereafter, the core layer i after the soldering step is sent to the cleaning device. In other words: = = In the core layer 1 immersed in the cleaning tank of the cleaning tank 8: ", the next (four) day wave (four). By this, the electrode of the electrode city is zero and the stem is welded. 卩 6 卜 result 'removal Remaining in the soldering section 6 old _ flux forming knives special welding residue (washing step). In this case, even in the subsequent steps, when the electronic components are mounted on the substrate of the built-in parts, the j tower is re-glazed. In the case, but by the heating of the second part of the 'welding part _ residue residue. Change 2 residue' can prevent the flux from being replaced by 5, can prevent the molten solder from flowing and welding due to the residual flux 10 200920197 In the case of the cleaning method, in addition to the method of washing the core layer i in the detergent 8, a spray cleaning Z' method of spraying the detergent onto the cleaning target portion may be used. The core layer i after the washing step is subjected to resin coating. As shown in FIG. 2A, a resin such as an epoxy resin is coated around the electric layer of the core layer by means of a dispenser. Under the part 7, 7 gaps, and coated with resin, Synthetic resin lid covering the step portion ^). Complex 10 15
之後’藉由黑色氧化處理樹脂覆蓋步驟後之核心扪 將電路表面（黑色氧化處理步驟)粗化。換言之，如第四圖 所示，將核心層1浸潰於強酸溶液等處理液中。藉此，氧化 配線電路3之表面3b或喊電路5之表面％而粗化，於該等 表面形成由細微之凹凸構成的缺(anehor pattern)。此時， 焊接物被樹脂覆蓋部9包覆相料。因此，黑色敦化處 理之作料會料焊接物，_焊接物練全之狀態。 黑色氧化處理步驟後進入配線電路連接步驟。黑色氧 化處理v驟後f先’於核心層丨積層用以固定電子零件7 之零件固疋層及複數配線層。換言之，如第％圖所示，將 對應於電子零件7之位置設置有開〇部仙的預浸體丨】，疊 置於核〜層1之上面側（電子零件7側）。此外，將具於預浸體 13之上面側_有作料電層之14構造㈣線層12, 疊置於預浸體11之上㈣卜並且，將具於預浸體16之下面 側貼附有作為導電層之銅㈣！7構造的配線層15，重合於核 20 200920197 心層1之下面側。 換言之，該步驟中，將於黑色氧化處理步驟後之核心 層1中用以形成由周圍包圍並固定電子零件7之零件固定層 的預浸體11、及至少含有形成於零件固定層表面之表面層 5 的配線層12之複數配線層12、15，貼合於核心層1並積層， 形成積層體18(積層步驟）。 然後，如第2D圖所示，藉由熱壓裝置一面以30kg/cm2 左右之壓力加壓，一面以150°C〜200°C左右之溫度加熱由配 線層15、核心層1、預浸體11及配線層12構成之積層體18。 10 藉此，軟化預浸體13、11、16各層中含浸之樹脂，使相接 的界面互相熔接。同時，預浸體11、預浸體16分別密接於 配線電路3之表面3b及配線電路5之表面5a。此時，因黑色 氧化處理步驟中於表面3 b及表面5 a之表面形成微細之錨 紋，可確保良好之密接性。 15 此外，含浸於預浸體13、11中之樹脂藉由加壓、加熱 填充於開口部llh内與電子零件7之間隙部分。藉此，形成 由周圍固定電子零件7或樹脂覆蓋部9之零件固定層11a。換 言之，此處藉由加熱、加壓積層步驟所形成之積層體18， 形成由周圍包圍並固定電子零件7的零件固定層11a。同 20 時，使核心層1與複數配線層12、15固接(熱壓步驟）。藉由 該加熱、加壓，預浸體13、16於融着狀態下熱硬化，對配 線層12、15形成絕緣層。 接著，如第2E圖所示，於貫通積層體18之穿通孔18a 内面形成電鍍層。藉此，於穿通孔18a形成連接核心層1之 12 200920197 配線電路3與配線層12、15 钔消14、17的層間配線部19(層 一線步驟）。此外，藉於配線層12、15之㈣14、銅如 把仃_案成形，形成配線電路（第2配線電路叫、^(電路 形成炎驟）。 轎此，如第2E®所示’完成由積層含有核心、層1之複數 '層卜配_2、15)所構成’且於核心以安裝 電子零件7的内藏零件之印刷電路基板2〇。該内藏零件之 P刷電路基板20中，電子零件7焊接於構成形成核心心之 至少〜面的配線電路3之連接用電極3a。又，配線層仏15 1〇具有於固化有預浸體13、16之絶緣層形成電路Ma、na的 構造。 、此外，内藏零件之印刷電路基板2〇具有藉樹脂包覆於 核^層1電子零件7之端子7a與電極蝴焊接部&所形成之 b樹月曰復蓋部9。並且，内藏零件之印刷電路基板2〇具有藉使 :層1之上面2a(一側之面）所積層之預浸體11固化所形成 、由周圍固定電子零件7及樹脂覆蓋部9之零件固定層 a此外，内藏零件之印刷電路基板2〇具有複數配線層之 1，且作為形成於零件固定層Ua表面之表面層的配線層 教且，内藏零件之印刷電路基板20具有連接含有核心 層1之配線電路3與表面層的配線層12、15之配線電路（第2 配線電路）14a、17a的層間配線部19。 另如此製造之内藏零件之印刷電路基板2〇更成為零件安 對象，且於表面層之配線層12，或更可視需要於下面 層之配線層15安裝電子零件，完成安裝基板。安裝基板之 13 200920197 製造過程如本實施形態所示’藉於多層電路基板之核心層 女裂電子零件，可使安裝密度高度化，減少基板面積，且 可大幅減少基板之製造成本。 (實施形態2) 5 第3A圖〜第3D圖係顯示本發明實施形態2内藏零件之 印刷電路基板之製造方法的步驟説明圖。本實施形態2使用 於具有去除焊料氧化膜之活性作用的熱硬化性樹脂中含有 焊料粒子之焊接材6A’取代實施形態1中用以作為焊接材料 的焊膏6。 10 第3 A圖中’核心層1係與第1A圖顯示之核心層1相同。 如第3B圖所示，於核心層丨之上面2a形成的連接用電極％ 供應焊接材6A(焊料供應步驟）。電極3a與實施形態i同樣地 構成配線電路3之一部分。焊接材6A係於具有去除焊料氧化 膜之活性作用的熱硬化性樹脂6(1中含有焊料粒子如之構 15 ^換5之，藉於環氧樹脂等熱硬化性樹脂中混合有機酸 等活化劑，賦予活化作用。此處，使用焊料粒子^之含有 率為5〇wt%〜88wt%左右的含有低焊料型者作為焊接材6A。 然後’如第3C圖所示，將電子零件7裝載於焊料供應步 驟後之核心層1(零件裝載步驟）。之後，將核心層（送至回焊 2〇裝置’如第3D圖所示，加熱零件裝載後之核心層1。藉此， ¥接電極域電子零件7之端子7a。㈣，以熱硬化性樹脂 Μ硬化後之樹脂包覆電㈣與端子7a的焊接雜形成樹 脂覆蓋部6e(焊接步驟）。此時，樹脂覆蓋部&亦會進入電子 零件7下面側之間隙内’密封間隙。 14 200920197 該焊接步驟中，因使用含有低焊料型者作為焊接材 6A ’故接合電極3a與端子7a之焊接部6c固化後之焊料體積 小’成為容易以樹脂覆蓋部6e完全包覆之形態。此種焊接 部之焊料體積小，於通常之以焊接安裝電子零件7之情形Thereafter, the surface of the circuit (black oxidation treatment step) is roughened by the core 扪 after the step of covering the black oxide treatment resin. In other words, as shown in the fourth figure, the core layer 1 is immersed in a treatment liquid such as a strong acid solution. Thereby, the surface 3b of the oxidized wiring circuit 3 or the surface of the squeaking circuit 5 is coarsened, and an anehor pattern composed of fine concavities and convexities is formed on the surfaces. At this time, the solder is covered with the resin by the resin covering portion 9. Therefore, the black Dunhua treatment will feed the weld, and the welder will be fully trained. After the black oxidation treatment step, the wiring circuit connection step is entered. The black oxidation treatment is performed after the core layer is used to fix the component solid layer and the plurality of wiring layers of the electronic component 7. In other words, as shown in Fig. 100, a prepreg 〇 with a rim portion corresponding to the position of the electronic component 7 is placed on the upper side of the core to layer 1 (on the side of the electronic component 7). In addition, a 14-layer (four) wire layer 12 having a working electrical layer on the upper side of the prepreg 13 is stacked on top of the prepreg 11 (4) and attached to the underside of the prepreg 16. There is copper as a conductive layer (four)! The wiring layer 15 of the 7 structure is superposed on the underside of the core layer 20 200920197. In other words, in this step, the prepreg 11 for forming a component fixing layer surrounding and fixing the electronic component 7 in the core layer 1 after the black oxidation treatment step, and at least the surface formed on the surface of the component fixing layer The plurality of wiring layers 12 and 15 of the wiring layer 12 of the layer 5 are bonded to the core layer 1 and laminated to form a laminated body 18 (layering step). Then, as shown in Fig. 2D, the wiring layer 15, the core layer 1, and the prepreg are heated at a temperature of about 150 ° C to 200 ° C while being pressurized by a pressure of about 30 kg/cm 2 by a hot press device. 11 and a layered body 18 composed of the wiring layer 12. 10 Thereby, the resin impregnated in each layer of the prepregs 13, 11, 16 is softened, and the interfaces at the ends are welded to each other. At the same time, the prepreg 11 and the prepreg 16 are in close contact with the surface 3b of the wiring circuit 3 and the surface 5a of the wiring circuit 5, respectively. At this time, fine anchoring is formed on the surfaces of the surface 3b and the surface 5a in the black oxidation treatment step, and good adhesion can be ensured. Further, the resin impregnated in the prepregs 13 and 11 is filled in the gap portion between the opening portion 11h and the electronic component 7 by pressurization and heating. Thereby, the component fixing layer 11a in which the electronic component 7 or the resin covering portion 9 is fixed by the periphery is formed. In other words, the layered body 18 formed by the heating and pressure laminating step is formed to form a component fixing layer 11a surrounded by the periphery and fixed to the electronic component 7. At the same time as 20, the core layer 1 is fixed to the plurality of wiring layers 12, 15 (hot pressing step). By the heating and pressurization, the prepregs 13 and 16 are thermally cured in a molten state, and an insulating layer is formed on the wiring layers 12 and 15. Next, as shown in Fig. 2E, a plating layer is formed on the inner surface of the through hole 18a penetrating the laminated body 18. Thereby, the interlayer wiring portion 19 which connects the wiring layer 3 of the core layer 1 and the wiring layers 12, 15 and 14, 17 is formed in the through hole 18a (layer-by-line step). In addition, by the four layers 14 and 15 of the wiring layers 12 and 15, the copper is formed into a wiring circuit (the second wiring circuit is called, and the circuit is formed by the circuit). The car is as shown in the second E®. A printed circuit board 2A is formed by laminating a plurality of 'layers _2, 15' of the core 1 and the layer 1 and mounting the built-in parts of the electronic component 7 at the core. In the P-brush circuit board 20 of the built-in component, the electronic component 7 is soldered to the connection electrode 3a constituting the wiring circuit 3 which forms at least the surface of the core core. Further, the wiring layer 仏15 1〇 has a structure in which the insulating layer forming circuits Ma and na of the prepregs 13 and 16 are cured. Further, the printed circuit board 2 of the built-in component has a b-tree cover portion 9 formed by a resin covering the terminal 7a of the electronic component 7 of the core layer 1 and the electrode bonding portion & Further, the printed circuit board 2 of the built-in component has a portion in which the prepreg 11 laminated on the upper surface 2a (the surface of one side) of the layer 1 is cured, and the electronic component 7 and the resin covering portion 9 are fixed by the periphery. In addition, the printed circuit board 2 of the built-in component has a plurality of wiring layers 1 and is a wiring layer formed on the surface layer of the surface of the component fixing layer Ua, and the printed circuit board 20 of the built-in component has a connection. The wiring circuit 3 of the core layer 1 and the interlayer wiring portion 19 of the wiring circuits (second wiring circuits) 14a and 17a of the wiring layers 12 and 15 of the surface layer. The printed circuit board 2 of the built-in component thus manufactured is further provided as a component, and the electronic component is mounted on the wiring layer 12 of the surface layer or the wiring layer 15 which is required to be in the lower layer to complete the mounting of the substrate. Mounting the substrate 13 200920197 The manufacturing process is as shown in the present embodiment. By the core layer of the multilayer circuit board, the mounting density can be increased, the substrate area can be reduced, and the manufacturing cost of the substrate can be greatly reduced. (Embodiment 2) FIG. 3A to FIG. 3D are diagrams showing the steps of a method of manufacturing a printed circuit board of the built-in component according to the second embodiment of the present invention. In the second embodiment, the solder material 6A' containing the solder particles in the thermosetting resin having the activity of removing the solder oxide film is used instead of the solder paste 6 used as the solder material in the first embodiment. 10 In Figure 3A, the core layer 1 is the same as the core layer 1 shown in Figure 1A. As shown in Fig. 3B, the bonding electrode 6A is supplied to the connection electrode % formed on the upper surface 2a of the core layer (solder supply step). The electrode 3a constitutes a part of the wiring circuit 3 in the same manner as in the embodiment i. The solder material 6A is a thermosetting resin 6 having an activity of removing the solder oxide film (1 contains solder particles such as 15), and is activated by mixing an organic acid or the like in a thermosetting resin such as an epoxy resin. The agent is used for the activation. Here, a solder containing material having a low solder type of about 5 〇 wt% to 88 wt% is used as the solder material 6A. Then, as shown in Fig. 3C, the electronic component 7 is loaded. After the solder supply step, the core layer 1 (part loading step). Thereafter, the core layer (send to the reflow soldering device) as shown in Fig. 3D, heats the core layer 1 after the component is loaded. (4) The resin covering portion 6e (welding step) is formed by soldering the resin (4) and the terminal 7a after the thermosetting resin is cured (the soldering step). At this time, the resin covering portion & It will enter the gap in the gap on the lower side of the electronic component 7. 14 200920197 In the soldering step, since the solder containing the low solder type is used as the solder material 6A', the solder portion 6c of the bonding electrode 3a and the terminal 7a is solidified and the solder is small. 'Become easy to The resin covering portion 6e is completely covered. The solder portion of such a soldering portion is small in size, and is usually mounted by soldering the electronic component 7.
10 1510 15
20 下’就固接電子零件之安裝強度方面而言並不佳。然而， 如本貫把开> 恶將電子零件内藏於多層基板中之構造中，電 子令件7被樹脂覆蓋部6e固接於核心層1。此外，於内藏狀 怨下，藉零件固定層lla(參照第2D圖、第2E圖）由周圍固定 電子零件7。由此可知，即使焊接部&之尺寸小時，仍可確 保所需之充分安裝強度。 又’熱硬化性樹脂6d中所含有之活化劑成分係在焊接 後熱硬化性樹脂硬化後之樹脂覆蓋部㈣，於祕之狀態 下存在由此可知，並無因活化劑成分於接觸焊接部6(；之 狀匕、下的殘留所造成的不良影響。因此，不需實施形態1中 斤需之焊接後的洗淨步驟。換言之，可排除步驟負載高之 洗淨步驟，而可期待步驟簡略化。 於該焊接步驟後，與實施形態1同様地含有黑色氧化處 驟步^^之配線電路連接步驟，並依序進行後續之步 、β ’藉由黑色氧化處理焊接步驟後之核心、層（，進 行將配線電路3、5 ,而 衣面3b、5a粗化的黑色氧化處理步驟 於黑色氧化處理步雜之核心層1中 ，將用以形 成由周圍包圍並固 u、及至，丨、人 疋電子零件7之零件固定層的預浸體 —19 ! 成於零件固定層表面之表面層的複數配 綠層12、15，貼人於 、σ '核心層1並積層之積層步驟（第2C圖）。 15 200920197 藉由加熱加壓積層步驟中衫成之積層體18 ’形成由周圍包 圍並固定電子零件7的零件阖定層11a’且固接核心層1與複 數配線層12、15的熱壓步麟（第2D圖）。形成連接核心層丨之 配線電路3與配線層12、15厶導電層14、17的層間配線部19 5之層間配線步驟。於配線層12、15形成配線電路（第2配線 電路）Ma、na之回路形成少驟（第2E圖）。 經由如此步驟，完成與第2E圖顯示之内藏零件之印刷 電路基板20相同構造的内藏零件之印刷電路基板2〇。然 而，本實施形態中，以包覆焊接部&之樹脂覆蓋部&，取 10代實施开乂態1顯示之以塗布後之構成的樹脂覆蓋部9,而成 為形成有於焊接材6A中之熱硬化性樹脂6(1熱硬化後的樹脂 覆蓋部6e的構造。 如W述説明實施形態丨、2中，於製造由積層含有核心 1層之複數配線層所構成，且核心層安裝有電子零件的内藏 零件之印刷電路基板時，藉由樹脂包覆電子零件7與電極^ ^焊接部’以於安裝有電子零件7之核心⑴形成樹脂覆蓋 邛藉此，於用以確保積層複數配線層時預浸體之密接性 ~進仃的黑色氧化處理中’藉由樹脂覆蓋部保護焊接部。 加由此可知’可於核心層！之零件安裝使用焊接。因此，可利 用對核心層1之焊接的零件安裝與使用預浸體之配線層的 積層等簡便之步驟’有效率地製造内藏零件之印刷電路基 板。 產業上利用之可能性 本發明因可以簡便之步驟有效率地製造内藏零件之印 16 200920197 刷電路基板，故可於由積層複數配線層所構成之内藏零件 之印刷電路基板的製造領域中使用。 【圖式簡單說明3 第1A圖係顯示本發明實施形態1内藏零件之印刷電路 5 基板之製造方法的第1步驟說明圖。 第1B圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 第1C圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 10 第1D圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 第1E圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 第2 A圖係顯示本發明實施形態1内藏零件之印刷電路 15 基板之製造方法的第2步驟說明圖。 第2B圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第2步驟說明圖。 第2 C圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第2步驟說明圖。 20 第2D圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第2步驟說明圖。 第2 E圖係顯示本發明實施形態1内藏零件之印刷電路 基板之製造方法的第2步驟說明圖。 第3 A圖係顯示本發明實施形態2内藏零件之印刷電路 17 200920197 基板之製造方法的第1步驟說明圖。 第3B圖係顯示本發明實施形態2内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 第3C圖係顯示本發明實施形態2内藏零件之印刷電路 5 基板之製造方法的第1步驟說明圖。 第3D圖係顯示本發明實施形態2内藏零件之印刷電路 基板之製造方法的第1步驟說明圖。 【主要元件符號說明】 6e, 9...樹脂覆蓋部 7.. .電子零件 7a...端子 8.. .洗淨劑 11,13,16…預浸體 11a...零件固定層 llh...開口部 12,15. •.配 14.17.. .銅箔 18".積層體 18a·.·穿通孔 19.. .層間配線部 20.. .内藏零件之印刷電路基板 1.. .核心層 2…樹脂反 2a____L 面 2b.··下面 3,5,14aJ7a·.·配線電路 3a...電極 3b,5a...表面 4.. .阻焊部 6.. .焊膏 6A…焊接材 6a...焊料粒子 6b...助焊劑 6c...焊接部 0cL·熱硬化性樹脂 1820' is not good in terms of the mounting strength of the fixed electronic parts. However, the electronic component 7 is fixed to the core layer 1 by the resin covering portion 6e as in the configuration in which the electronic component is built in the multilayer substrate. Further, under the built-in grievance, the electronic component 7 is fixed by the periphery by the component fixing layer 11a (see Fig. 2D and Fig. 2E). From this, it can be seen that even if the size of the welded portion & is small, the required sufficient mounting strength can be ensured. Further, the activator component contained in the thermosetting resin 6d is a resin-coated portion (four) after the thermosetting resin is cured after soldering, and it is known in the state of the secret state that there is no activator component in the contact soldering portion. The adverse effects caused by the residue of the crucible and the lower part of the crucible. Therefore, it is not necessary to carry out the washing step after the welding in the form 1 is required. In other words, the washing step with a high step load can be excluded, and the step can be expected. After the soldering step, in the same manner as in the first embodiment, the wiring circuit connecting step of the black oxidation step is performed, and the subsequent step, β' is performed by the black oxidation treatment after the soldering step, The layer (the black oxidation treatment step of roughening the wiring circuits 3, 5 and the clothing surfaces 3b, 5a) is performed in the core layer 1 of the black oxidation treatment step, and is formed to be surrounded by the surrounding and solidified, and , prepreg of the fixed layer of the parts of the electronic parts of the electronic parts - 19 ! The plurality of green layers 12, 15 formed on the surface layer of the surface of the fixed layer of the part, and the lamination step of the layer of the σ 'core layer 1 Figure 2C) 15 200920197 Forming the laminated body 11' of the electronic component 7 by surrounding and fixing the laminated body 11a' of the electronic component 7 and fixing the hot pressing step of the core layer 1 and the plurality of wiring layers 12, 15 by the laminated body 18' formed in the heating and laminating step Lin (Fig. 2D). An inter-layer wiring step of forming the wiring layer 3 connecting the core layer 与 and the wiring layers 12 and 15 and the interlayer wiring portions 194 of the conductive layers 14 and 17. The wiring layers are formed on the wiring layers 12 and 15. 2 Wiring circuit) The circuit of Ma and na is formed in a small number (Fig. 2E). Through such a procedure, the printed circuit board 2 of the built-in component having the same structure as the printed circuit board 20 of the built-in component shown in Fig. 2E is completed. However, in the present embodiment, the resin covering portion 9 which is formed by the opening and closing of the first embodiment is applied to the soldering material 6A by the resin covering portion & The thermosetting resin 6 (the structure of the resin-coated portion 6e after thermosetting). As described in the description of the embodiments 丨, 2, a plurality of wiring layers including a core layer are laminated, and the core layer is mounted. Built-in parts with electronic parts In the case of printing a circuit board, the electronic component 7 and the electrode portion are welded by a resin to form a resin cover on the core (1) on which the electronic component 7 is mounted, thereby prepreging the layer to ensure the lamination of the plurality of wiring layers. In the black oxidation treatment of the adhesion-adhesive treatment, the welded portion is protected by the resin covering portion. It can be seen that the welding can be performed on the parts of the core layer. Therefore, the parts for soldering the core layer 1 can be mounted and used. A printed circuit board in which built-in parts are efficiently manufactured by a simple step such as lamination of a wiring layer of a prepreg. INDUSTRIAL APPLICABILITY The present invention can efficiently manufacture printed parts of printed parts in a simple and easy manner. Since the circuit board is brushed, it can be used in the field of manufacturing a printed circuit board including built-in components including a plurality of wiring layers. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a first step explanatory view showing a method of manufacturing a printed circuit of a built-in component according to a first embodiment of the present invention. Fig. 1B is a first step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 1C is a first step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. 10 is a first step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 1E is a first step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 2A is a view showing a second step of the method of manufacturing the substrate of the printed circuit 15 of the built-in component according to the first embodiment of the present invention. Fig. 2B is a second step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 2C is a second step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 2D is a second step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 2E is a second step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the first embodiment of the present invention. Fig. 3A is a view showing a first step of the manufacturing method of the substrate in the second embodiment of the present invention. Fig. 3B is a first step explanatory view showing a method of manufacturing a printed circuit board of the built-in component according to the second embodiment of the present invention. Fig. 3C is a view showing a first step of the method of manufacturing the substrate of the printed circuit 5 of the built-in component according to the second embodiment of the present invention. Fig. 3D is a view showing a first step of the method of manufacturing the printed circuit board of the built-in component according to the second embodiment of the present invention. [Explanation of main component symbols] 6e, 9... Resin covering part 7.. Electronic part 7a... Terminal 8. Detergent 11, 13, 16... Prepreg 11a... Part fixing layer 11h ...opening 12,15. •.with 14.17.. .copper foil 18".layer 18a·..through hole 19..interlayer wiring part 20... printed circuit board with built-in parts.. Core layer 2...resin reverse 2a____L face 2b.··3,5,14aJ7a·.·wiring circuit 3a...electrode 3b,5a...surface 4.. solder mask 6.. solder paste 6A ...welding material 6a...solder particles 6b...flux 6c...welding part 0cL·thermosetting resin 18