WO2009031285A1 - 慣性力センサ - Google Patents

慣性力センサ Download PDF

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Publication number
WO2009031285A1
WO2009031285A1 PCT/JP2008/002359 JP2008002359W WO2009031285A1 WO 2009031285 A1 WO2009031285 A1 WO 2009031285A1 JP 2008002359 W JP2008002359 W JP 2008002359W WO 2009031285 A1 WO2009031285 A1 WO 2009031285A1
Authority
WO
WIPO (PCT)
Prior art keywords
section
angular velocity
detecting element
velocity detecting
force sensor
Prior art date
Application number
PCT/JP2008/002359
Other languages
English (en)
French (fr)
Inventor
Hideo Ohkoshi
Tomohiro Mitani
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to US12/673,870 priority Critical patent/US8646332B2/en
Priority to CN200880105337A priority patent/CN101796374A/zh
Priority to EP08790513A priority patent/EP2187168A4/en
Publication of WO2009031285A1 publication Critical patent/WO2009031285A1/ja
Priority to US14/027,783 priority patent/US8826734B2/en
Priority to US14/459,097 priority patent/US9778279B2/en
Priority to US15/680,604 priority patent/US20170343572A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/003—Details of instruments used for damping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)

Abstract

　振動型の角速度検出素子（３２）と、この角速度検出素子（３２）から出力される出力信号を処理するＩＣ（３４）と、信号処理用のコンデンサ（３６）と、これら角速度検出素子（３２）およびＩＣ（３４）およびコンデンサ（３６）を収納するパッケージ（３８）とを備え、この角速度検出素子（３２）およびＩＣ（３４）は防振部を介してパッケージ（３８）に収納されるとともに、この防振部は、角速度検出素子（３２）を積層したＩＣ（３４）が載置された載置部（４０）と、載置部（４０）の外方に分離して配置されるとともに配線パターン（４２）を介して載置部（４０）と接続された外方部（４４）とを有するＴＡＢテープ（４６）からなる慣性力センサを提供する。
PCT/JP2008/002359 2007-09-03 2008-08-29 慣性力センサ WO2009031285A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US12/673,870 US8646332B2 (en) 2007-09-03 2008-08-29 Inertia force sensor
CN200880105337A CN101796374A (zh) 2007-09-03 2008-08-29 惯性力传感器
EP08790513A EP2187168A4 (en) 2007-09-03 2008-08-29 INERTIA FORCE SENSOR
US14/027,783 US8826734B2 (en) 2007-09-03 2013-09-16 Inertial force sensor
US14/459,097 US9778279B2 (en) 2007-09-03 2014-08-13 Inertial force sensor
US15/680,604 US20170343572A1 (en) 2007-09-03 2017-08-18 Inertial force sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-227742 2007-09-03
JP2007227742 2007-09-03

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/673,870 A-371-Of-International US8646332B2 (en) 2007-09-03 2008-08-29 Inertia force sensor
US14/027,783 Continuation US8826734B2 (en) 2007-09-03 2013-09-16 Inertial force sensor

Publications (1)

Publication Number Publication Date
WO2009031285A1 true WO2009031285A1 (ja) 2009-03-12

Family

ID=40428609

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002359 WO2009031285A1 (ja) 2007-09-03 2008-08-29 慣性力センサ

Country Status (5)

Country Link
US (4) US8646332B2 (ja)
EP (1) EP2187168A4 (ja)
JP (2) JP5434017B2 (ja)
CN (1) CN101796374A (ja)
WO (1) WO2009031285A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010112676A1 (en) * 2009-03-30 2010-10-07 Valtion Teknillinen Tutkimuskeskus A casing of a sensor measuring oscillations, and a sensor for measuring oscillations
JP2011179822A (ja) * 2010-02-26 2011-09-15 Hitachi Automotive Systems Ltd 物理量センサ
EP2876411A1 (en) * 2010-02-18 2015-05-27 Panasonic Corporation Angular speed sensor and composite sensor for detecting angular speed
US20150192602A1 (en) * 2011-09-30 2015-07-09 Panasonic Intellectual Property Management Co., Ltd. Inertial force sensor
WO2015190105A1 (ja) * 2014-06-12 2015-12-17 株式会社デンソー 物理量センサ

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EP2187168A4 (en) * 2007-09-03 2013-04-03 Panasonic Corp INERTIA FORCE SENSOR
JP2012063243A (ja) * 2010-09-16 2012-03-29 Panasonic Corp 角速度および加速度検出用複合センサ
JP5810500B2 (ja) * 2010-09-30 2015-11-11 セイコーエプソン株式会社 センサーデバイス、モーションセンサー、電子機器
US9227835B2 (en) * 2010-11-23 2016-01-05 Honeywell International Inc. Vibration isolation interposer die
JP2013044524A (ja) * 2011-08-21 2013-03-04 Denso Corp 角速度センサ装置
CN102980584B (zh) 2011-09-02 2017-12-19 深圳市大疆创新科技有限公司 一种无人飞行器惯性测量模块
JP6191151B2 (ja) 2012-05-29 2017-09-06 株式会社デンソー 物理量センサ
JP6179074B2 (ja) * 2012-06-13 2017-08-16 セイコーエプソン株式会社 モジュールおよび電子機器
WO2014002416A1 (ja) * 2012-06-25 2014-01-03 パナソニック株式会社 歪センサ
JP6016228B2 (ja) * 2012-07-03 2016-10-26 ソニーセミコンダクタソリューションズ株式会社 センサデバイス
JP6119518B2 (ja) 2013-02-12 2017-04-26 ソニー株式会社 センサ装置、入力装置及び電子機器
CN105190492B (zh) 2013-03-18 2019-09-27 索尼公司 传感器装置、输入装置和电子设备
JP6142745B2 (ja) 2013-09-10 2017-06-07 ソニー株式会社 センサ装置、入力装置及び電子機器
DE102013222966A1 (de) * 2013-11-12 2015-05-28 Robert Bosch Gmbh Inertialsensor
JP2015190859A (ja) 2014-03-28 2015-11-02 ソニー株式会社 センサ装置、入力装置及び電子機器
JP6409351B2 (ja) 2014-06-12 2018-10-24 株式会社デンソー 物理量センサ
JP6256215B2 (ja) * 2014-06-13 2018-01-10 株式会社デンソー 角速度センサ
DE102014213217A1 (de) * 2014-07-08 2016-01-14 Continental Teves Ag & Co. Ohg Körperschallentkopplung an mit Geberfeldern arbeitenden Sensoren
WO2016009635A1 (ja) * 2014-07-16 2016-01-21 セイコーエプソン株式会社 センサーユニット、電子機器、および移動体
JP6464749B2 (ja) * 2015-01-06 2019-02-06 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
JP6372361B2 (ja) * 2015-01-16 2018-08-15 株式会社デンソー 複合センサ
CN108139216B (zh) 2015-04-07 2021-11-05 深圳市大疆创新科技有限公司 用于提供简单而可靠的惯性测量单元的***和方法
JP6572603B2 (ja) 2015-04-13 2019-09-11 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
JP6512006B2 (ja) 2015-07-14 2019-05-15 株式会社デンソー センサ装置
JP6641878B2 (ja) 2015-10-21 2020-02-05 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
JP2019128304A (ja) * 2018-01-26 2019-08-01 セイコーエプソン株式会社 物理量センサー、慣性計測ユニット、電子機器、携帯型電子機器、および移動体
JP2020139879A (ja) * 2019-02-28 2020-09-03 セイコーエプソン株式会社 慣性センサー、電子機器および移動体
JP7331498B2 (ja) * 2019-06-27 2023-08-23 セイコーエプソン株式会社 慣性センサー、電子機器および移動体
JP7310598B2 (ja) * 2019-12-25 2023-07-19 株式会社デンソー 電子装置
KR20210089292A (ko) * 2020-01-07 2021-07-16 삼성전자주식회사 음성 인식 시스템 및 이를 이용한 디스플레이 장치

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010112676A1 (en) * 2009-03-30 2010-10-07 Valtion Teknillinen Tutkimuskeskus A casing of a sensor measuring oscillations, and a sensor for measuring oscillations
EP2876411A1 (en) * 2010-02-18 2015-05-27 Panasonic Corporation Angular speed sensor and composite sensor for detecting angular speed
US9091543B2 (en) 2010-02-18 2015-07-28 Panasonic Intellectual Property Management Co., Ltd. Angular speed sensor for detecting angular speed
US9448068B2 (en) 2010-02-18 2016-09-20 Panasonic Intellectual Property Management Co., Ltd. Angular velocity sensor
JP2011179822A (ja) * 2010-02-26 2011-09-15 Hitachi Automotive Systems Ltd 物理量センサ
US20150192602A1 (en) * 2011-09-30 2015-07-09 Panasonic Intellectual Property Management Co., Ltd. Inertial force sensor
WO2015190105A1 (ja) * 2014-06-12 2015-12-17 株式会社デンソー 物理量センサ
JP2016001156A (ja) * 2014-06-12 2016-01-07 株式会社デンソー 物理量センサ

Also Published As

Publication number Publication date
US20170343572A1 (en) 2017-11-30
US8826734B2 (en) 2014-09-09
EP2187168A1 (en) 2010-05-19
JP5617912B2 (ja) 2014-11-05
JP5434017B2 (ja) 2014-03-05
CN101796374A (zh) 2010-08-04
EP2187168A4 (en) 2013-04-03
US20140020466A1 (en) 2014-01-23
US20140352430A1 (en) 2014-12-04
JP2013101132A (ja) 2013-05-23
US20110036167A1 (en) 2011-02-17
US9778279B2 (en) 2017-10-03
US8646332B2 (en) 2014-02-11
JP2009080107A (ja) 2009-04-16

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