WO2009011022A1 - 圧電薄膜共振素子及びこれを用いた回路部品 - Google Patents
圧電薄膜共振素子及びこれを用いた回路部品 Download PDFInfo
- Publication number
- WO2009011022A1 WO2009011022A1 PCT/JP2007/064015 JP2007064015W WO2009011022A1 WO 2009011022 A1 WO2009011022 A1 WO 2009011022A1 JP 2007064015 W JP2007064015 W JP 2007064015W WO 2009011022 A1 WO2009011022 A1 WO 2009011022A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thin film
- piezoelectric thin
- resonant element
- same
- lower electrode
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title abstract 2
- 239000010408 film Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02118—Means for compensation or elimination of undesirable effects of lateral leakage between adjacent resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/175—Acoustic mirrors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/566—Electric coupling means therefor
- H03H9/568—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0421—Modification of the thickness of an element
- H03H2003/0428—Modification of the thickness of an element of an electrode
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
圧電薄膜共振素子(1)は、楕円の平面形状を有し、外周に所定の角度で傾斜した傾斜部(3a)を有する下面電極(3)と楕円の平面形状を有する上面電極(5)と両電極に挟まれた圧電膜(4)との積層構造からなる共振部を具備する。上面電極(5)の下面電極(3)の傾斜部(3a)が対向する位置の一部に付加膜(8)が設けられ、これにより共振部の下面電極(3)の傾斜部(3a)における積層厚のうち一部の積層厚Hcが共振部の下面電極(3)の傾斜部(3a)より内側部分における積層厚HAよりも厚くなっている。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/064015 WO2009011022A1 (ja) | 2007-07-13 | 2007-07-13 | 圧電薄膜共振素子及びこれを用いた回路部品 |
JP2009523557A JP5009369B2 (ja) | 2007-07-13 | 2008-03-05 | 圧電薄膜共振素子及びこれを用いた回路部品 |
CN2008800232853A CN101689845B (zh) | 2007-07-13 | 2008-03-05 | 压电薄膜共振元件以及利用它的电路部件 |
KR1020097026922A KR101242314B1 (ko) | 2007-07-13 | 2008-03-05 | 압전 박막 공진 소자 및 이를 이용한 회로 부품 |
PCT/JP2008/053920 WO2009011148A1 (ja) | 2007-07-13 | 2008-03-05 | 圧電薄膜共振素子及びこれを用いた回路部品 |
US12/642,048 US8125123B2 (en) | 2007-07-13 | 2009-12-18 | Piezoelectric thin film resonant element and circuit component using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/064015 WO2009011022A1 (ja) | 2007-07-13 | 2007-07-13 | 圧電薄膜共振素子及びこれを用いた回路部品 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009011022A1 true WO2009011022A1 (ja) | 2009-01-22 |
Family
ID=40259371
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/064015 WO2009011022A1 (ja) | 2007-07-13 | 2007-07-13 | 圧電薄膜共振素子及びこれを用いた回路部品 |
PCT/JP2008/053920 WO2009011148A1 (ja) | 2007-07-13 | 2008-03-05 | 圧電薄膜共振素子及びこれを用いた回路部品 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/053920 WO2009011148A1 (ja) | 2007-07-13 | 2008-03-05 | 圧電薄膜共振素子及びこれを用いた回路部品 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8125123B2 (ja) |
KR (1) | KR101242314B1 (ja) |
CN (1) | CN101689845B (ja) |
WO (2) | WO2009011022A1 (ja) |
Cited By (1)
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JP2013123184A (ja) * | 2011-12-12 | 2013-06-20 | Taiyo Yuden Co Ltd | フィルタおよびデュプレクサ |
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JP5563739B2 (ja) * | 2008-02-20 | 2014-07-30 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタ、デュープレクサ、通信モジュール、および通信装置 |
US8830012B2 (en) * | 2010-09-07 | 2014-09-09 | Wei Pang | Composite bulk acoustic wave resonator |
JP5792554B2 (ja) * | 2011-08-09 | 2015-10-14 | 太陽誘電株式会社 | 弾性波デバイス |
KR101856060B1 (ko) | 2011-12-01 | 2018-05-10 | 삼성전자주식회사 | 체적 음향 공진기 |
US9331666B2 (en) * | 2012-10-22 | 2016-05-03 | Qualcomm Mems Technologies, Inc. | Composite dilation mode resonators |
KR101918031B1 (ko) | 2013-01-22 | 2018-11-13 | 삼성전자주식회사 | 스퓨리어스 공진을 감소시키는 공진기 및 공진기 제작 방법 |
JP6336712B2 (ja) * | 2013-01-28 | 2018-06-06 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびデュプレクサ |
JP6185292B2 (ja) * | 2013-06-10 | 2017-08-23 | 太陽誘電株式会社 | 弾性波デバイス |
KR20150023086A (ko) * | 2013-08-22 | 2015-03-05 | (주)와이솔 | 압전 소자 기반 진동 모듈 |
JP6333540B2 (ja) * | 2013-11-11 | 2018-05-30 | 太陽誘電株式会社 | 圧電薄膜共振子、フィルタ、及び分波器 |
JP6325799B2 (ja) | 2013-11-11 | 2018-05-16 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびデュプレクサ |
JP6325798B2 (ja) | 2013-11-11 | 2018-05-16 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびデュプレクサ |
CN105428520A (zh) * | 2015-11-09 | 2016-03-23 | 业成光电(深圳)有限公司 | 压电元件的制造方法及压电基板 |
US10778180B2 (en) * | 2015-12-10 | 2020-09-15 | Qorvo Us, Inc. | Bulk acoustic wave resonator with a modified outside stack portion |
KR102642910B1 (ko) * | 2016-05-18 | 2024-03-04 | 삼성전기주식회사 | 음향 공진기 및 그 제조 방법 |
KR20180018149A (ko) * | 2016-08-12 | 2018-02-21 | 삼성전기주식회사 | 체적 음향 공진기 |
JP6668201B2 (ja) * | 2016-08-31 | 2020-03-18 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびマルチプレクサ。 |
US10903814B2 (en) * | 2016-11-30 | 2021-01-26 | Samsung Electro-Mechanics Co., Ltd. | Bulk acoustic wave resonator |
US10873316B2 (en) * | 2017-03-02 | 2020-12-22 | Samsung Electro-Mechanics Co., Ltd. | Acoustic resonator and method of manufacturing the same |
US10256788B2 (en) * | 2017-03-31 | 2019-04-09 | Avago Technologies International Sales Pte. Limited | Acoustic resonator including extended cavity |
JP6886357B2 (ja) | 2017-07-03 | 2021-06-16 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびマルチプレクサ |
JP7245849B2 (ja) | 2018-01-19 | 2023-03-24 | 武漢衍熙微器件有限公司 | 薄膜圧電共振器 |
US10892730B2 (en) | 2018-05-30 | 2021-01-12 | Vanguard International Semiconductor Singapore Pte. Ltd. | Acoustic filter with packaging-defined boundary conditions and method for producing the same |
WO2020203093A1 (ja) * | 2019-03-29 | 2020-10-08 | 株式会社村田製作所 | 弾性波装置 |
JP7383404B2 (ja) * | 2019-06-05 | 2023-11-20 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびマルチプレクサ |
CN111130492B (zh) * | 2019-12-31 | 2021-06-01 | 诺思(天津)微***有限责任公司 | 悬翼结构具有角部的体声波谐振器、滤波器及电子设备 |
US11381230B2 (en) * | 2020-09-04 | 2022-07-05 | Northeastern University | Microelectromechanical tunable delay line circuit |
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-
2008
- 2008-03-05 CN CN2008800232853A patent/CN101689845B/zh active Active
- 2008-03-05 KR KR1020097026922A patent/KR101242314B1/ko active IP Right Grant
- 2008-03-05 WO PCT/JP2008/053920 patent/WO2009011148A1/ja active Application Filing
-
2009
- 2009-12-18 US US12/642,048 patent/US8125123B2/en active Active
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JP2013123184A (ja) * | 2011-12-12 | 2013-06-20 | Taiyo Yuden Co Ltd | フィルタおよびデュプレクサ |
Also Published As
Publication number | Publication date |
---|---|
US8125123B2 (en) | 2012-02-28 |
KR101242314B1 (ko) | 2013-03-12 |
CN101689845A (zh) | 2010-03-31 |
WO2009011148A1 (ja) | 2009-01-22 |
US20100148636A1 (en) | 2010-06-17 |
CN101689845B (zh) | 2013-01-23 |
KR20100023892A (ko) | 2010-03-04 |
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